JPH07191058A - 広帯域マイクロ波本来位置テスト装置 - Google Patents
広帯域マイクロ波本来位置テスト装置Info
- Publication number
- JPH07191058A JPH07191058A JP4256991A JP25699192A JPH07191058A JP H07191058 A JPH07191058 A JP H07191058A JP 4256991 A JP4256991 A JP 4256991A JP 25699192 A JP25699192 A JP 25699192A JP H07191058 A JPH07191058 A JP H07191058A
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- carrier
- line
- microwave frequency
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 51
- 230000008878 coupling Effects 0.000 claims abstract description 17
- 238000010168 coupling process Methods 0.000 claims abstract description 17
- 238000005859 coupling reaction Methods 0.000 claims abstract description 17
- 239000003989 dielectric material Substances 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims description 10
- 238000000605 extraction Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 5
- 230000005684 electric field Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- 230000007246 mechanism Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9111909A FR2681946A1 (fr) | 1991-09-27 | 1991-09-27 | Dispositif pour tests hyperfrequences a large bande realises in situ. |
FR9111909 | 1991-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07191058A true JPH07191058A (ja) | 1995-07-28 |
Family
ID=9417354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4256991A Pending JPH07191058A (ja) | 1991-09-27 | 1992-09-25 | 広帯域マイクロ波本来位置テスト装置 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0534826B1 (en, 2012) |
JP (1) | JPH07191058A (en, 2012) |
DE (1) | DE69216743T2 (en, 2012) |
FR (1) | FR2681946A1 (en, 2012) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6281691B1 (en) | 1998-06-09 | 2001-08-28 | Nec Corporation | Tip portion structure of high-frequency probe and method for fabrication probe tip portion composed by coaxial cable |
US6483304B1 (en) | 1997-03-13 | 2002-11-19 | Ricoh Company, Ltd. | Magnetic field probe having a shielding and isolating layers to protect lead wires extending between a coil and pads |
KR100733103B1 (ko) * | 2003-09-03 | 2007-06-28 | 레이던 컴퍼니 | 가요성 정각 안테나용 내장형 rf 수직 상호 접속체 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6753676B1 (en) * | 2000-09-07 | 2004-06-22 | Lucent Technologies Inc. | RF test probe |
GB2378045A (en) * | 2001-07-25 | 2003-01-29 | Marconi Caswell Ltd | Electrical connection with flexible coplanar transmission line |
DE202008010533U1 (de) | 2008-08-07 | 2008-10-30 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Kontaktlose Schleifensonde |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4894612A (en) * | 1987-08-13 | 1990-01-16 | Hypres, Incorporated | Soft probe for providing high speed on-wafer connections to a circuit |
US4849689A (en) * | 1988-11-04 | 1989-07-18 | Cascade Microtech, Inc. | Microwave wafer probe having replaceable probe tip |
-
1991
- 1991-09-27 FR FR9111909A patent/FR2681946A1/fr active Granted
-
1992
- 1992-09-18 DE DE1992616743 patent/DE69216743T2/de not_active Expired - Fee Related
- 1992-09-18 EP EP19920402570 patent/EP0534826B1/fr not_active Expired - Lifetime
- 1992-09-25 JP JP4256991A patent/JPH07191058A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6483304B1 (en) | 1997-03-13 | 2002-11-19 | Ricoh Company, Ltd. | Magnetic field probe having a shielding and isolating layers to protect lead wires extending between a coil and pads |
US6696834B2 (en) | 1997-03-13 | 2004-02-24 | Ricoh Company, Ltd. | Magnetic field probe having a shielding layer to protect lead wires with an isolating layer |
US6281691B1 (en) | 1998-06-09 | 2001-08-28 | Nec Corporation | Tip portion structure of high-frequency probe and method for fabrication probe tip portion composed by coaxial cable |
US6400168B2 (en) | 1998-06-09 | 2002-06-04 | Nec Corporation | Method for fabricating probe tip portion composed by coaxial cable |
KR100733103B1 (ko) * | 2003-09-03 | 2007-06-28 | 레이던 컴퍼니 | 가요성 정각 안테나용 내장형 rf 수직 상호 접속체 |
Also Published As
Publication number | Publication date |
---|---|
EP0534826A1 (fr) | 1993-03-31 |
FR2681946A1 (fr) | 1993-04-02 |
DE69216743T2 (de) | 1997-05-15 |
FR2681946B1 (en, 2012) | 1995-06-02 |
EP0534826B1 (fr) | 1997-01-15 |
DE69216743D1 (de) | 1997-02-27 |
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