JPH07186045A - Dressing device - Google Patents
Dressing deviceInfo
- Publication number
- JPH07186045A JPH07186045A JP33321393A JP33321393A JPH07186045A JP H07186045 A JPH07186045 A JP H07186045A JP 33321393 A JP33321393 A JP 33321393A JP 33321393 A JP33321393 A JP 33321393A JP H07186045 A JPH07186045 A JP H07186045A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- metal bond
- bond grindstone
- dressing
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明はメタルボンドで砥粒を
保持した砥石（以下、メタルボンド砥石という。）の目
立てを行うドレッシング装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dressing device for dressing a grindstone (hereinafter referred to as a metal bond grindstone) holding abrasive grains with a metal bond.
【０００２】[0002]
【従来の技術】従来より、メタルボンド砥石による研削
においては、研削中の電気分解によりメタルボンドを溶
出させ、これにより砥粒を突き出させるための目立てを
行う、いわゆる電解インプロセスドレッシング（ＥＬＩ
Ｄ研削：Electrolytic In-process Dressing）が知られ
ている。2. Description of the Related Art Conventionally, in the case of grinding with a metal bond grindstone, so-called electrolytic in-process dressing (ELI) is performed, in which electrolysis during grinding elutes the metal bond and thereby causes the abrasive grains to protrude.
D grinding: Electrolytic In-process Dressing) is known.
【０００３】この種の電解インプロセスドレッシングを
実行するドレッシング装置はメタルボンド砥石１の砥粒
面１ａに対向して配置した銅等の電極２を具備し、電極
２とメタルボンド砥石１との間には微小隙間が設けられ
ており、この微小隙間にはノズル３から電解研削液を供
給し、また電極２は電源４の負極に接続して負（−）の
電位に、メタルボンド砥石１は電源４の正極に接続して
正（＋）の電位に設定するように構成されている。A dressing apparatus for carrying out this kind of electrolytic in-process dressing is provided with an electrode 2 made of copper or the like which is arranged so as to face the abrasive grain surface 1a of the metal bond grindstone 1, and between the electrode 2 and the metal bond grindstone 1. Is provided with a minute gap. Electrolytic grinding liquid is supplied from the nozzle 3 to the minute gap, and the electrode 2 is connected to the negative electrode of the power source 4 to a negative (-) potential, and the metal bond grindstone 1 is It is configured to be connected to the positive electrode of the power source 4 and set to a positive (+) potential.
【０００４】このドレッシング装置は、メタルボンド砥
石１による被加工物Ｗの研削中に、メタルボンド砥石１
と電極２間が電解研削液を介して通電し、この通電によ
る電気分解でメタルボンド砥石１の砥粒面１ａ側におけ
るメタルボンドを溶出させ、これによりメタルボンド砥
石１の砥粒を突き出させるための目立て（電解ドレッシ
ング）を行う。This dressing device is provided with the metal bond grindstone 1 while the workpiece W is being ground by the metal bond grindstone 1.
Between the electrode and the electrode 2 is energized via an electrolytic grinding liquid, and the electrolysis due to this energization causes the metal bond on the abrasive grain surface 1a side of the metal bond grindstone 1 to elute, thereby protruding the abrasive grains of the metal bond grindstone 1. Dressing (electrolytic dressing).
【０００５】また、電解ドレッシングが一定以上進行
し、メタルボンドの溶出部分に生成される酸化皮膜が成
長し、これにより不導体酸化皮膜がメタルボンド砥石１
の表面（砥粒の部分を除く）に形成されると、メタルボ
ンド砥石１と電極２間の通電が遮断されるとともに、通
電による電気分解が止まることから、電解ドレッシング
が一時停止し、メタルボンド砥石１による研削のみが行
われる。Further, the electrolytic dressing progresses to a certain level or more, and an oxide film formed at the elution portion of the metal bond grows, whereby a non-conductive oxide film is formed on the metal bond grindstone 1.
When it is formed on the surface (excluding the portion of the abrasive grains), the electric current between the metal bond grindstone 1 and the electrode 2 is cut off, and the electrolysis due to the electric current is stopped. Only grinding with the grindstone 1 is performed.
【０００６】さらに、電解ドレッシングが一時停止した
ままメタルボンド砥石１による研削のみが進行すると、
メタルボンド砥石１の砥粒が摩耗し、これによりメタル
ボンド砥石１の不導体酸化皮膜が被加工物と摺接して剥
離するが、剥離した部分については地金（メタルボン
ド）の導体となることから通電および通電による電気分
解が再開され、これによりメタルボンドが溶出し、そこ
に新たな不導体酸化皮膜が形成される。Further, when only the grinding by the metal bond grindstone 1 proceeds while the electrolytic dressing is temporarily stopped,
The abrasive grains of the metal bond grindstone 1 are abraded, so that the non-conductive oxide film of the metal bond grindstone 1 comes into sliding contact with the work piece and peels off, but the separated part becomes a conductor of the metal (metal bond). From then on, electrolysis is restarted and electrolysis by energization is restarted, whereby the metal bond is eluted and a new non-conductive oxide film is formed there.
【０００７】以上のような形成・剥離のプロセスによ
り、メタルボンド砥石の不導体酸化皮膜は常に一定の厚
さに保たれることにより、一定の高さの砥粒突出量が確
保される。By the above-described forming / peeling process, the non-conductive oxide film of the metal bond grindstone is always kept at a constant thickness, so that the projection amount of the abrasive grains at a constant height is secured.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、上記の
ような従来のドレッシング装置にあっては、研削中に電
解ドレッシングを実行するものであるため、電解ドレッ
シングと研削を連続して行うと、電気分解で溶出したメ
タルボンドの金属イオン、微細な切粉および電解研削液
中に含まれるモリブデン等の潤滑剤が電極２の表面に付
着して厚い皮膜を形成し、しかも、その皮膜は導電性が
なくメタルボンド砥石１と電極２間の通電による電流の
流れを悪くすることから、研削時間が経過するのに従い
次第に電解ドレッシングの効果が失われ、良好な電解ド
レッシングを行うことができず、最終的には電解ドレッ
シングの実行が不可能になるとともに、電極を掃除して
良好な電解ドレッシングを可能とするまでの間、研削作
業の中断が強いられる。However, in the conventional dressing device as described above, electrolytic dressing is performed during grinding, and therefore, when electrolytic dressing and grinding are continuously performed, electrolysis is performed. The metal ions of the metal bond eluted in step 2, fine chips and lubricant such as molybdenum contained in the electrolytic grinding fluid adhere to the surface of the electrode 2 to form a thick film, and the film has no conductivity. Since the current flow due to energization between the metal bond grindstone 1 and the electrode 2 is deteriorated, the effect of electrolytic dressing is gradually lost as the grinding time elapses, and good electrolytic dressing cannot be performed. Electrolysis dressing becomes impossible, and the grinding operation may be interrupted until the electrodes are cleaned and good electrolytic dressing is possible. That.
【０００９】また、上記のような皮膜の厚さは必ずしも
均一となるものでなく、その膜厚にばらつきが生じるこ
とは避けられず、これによると、メタルボンド砥石１と
電極２間に電流がよく流れる部分とその流れの悪い部分
とが生じ、電気分解で溶出するメタルボンドの量が不均
一となり、メタルボンド砥石１の変形が生じることか
ら、研削による被加工物の形状精度が悪化する等の不具
合もある。Further, the thickness of the film as described above is not always uniform, and it is unavoidable that the film thickness varies. According to this, a current flows between the metal bond grindstone 1 and the electrode 2. A well-flowing part and a poorly-flowing part are generated, the amount of metal bond eluted by electrolysis becomes non-uniform, and the metal bond grindstone 1 is deformed, which deteriorates the shape accuracy of the work piece due to grinding. There are also defects.
【００１０】この発明は上述の事情に鑑みてなされたも
ので、その目的とするところはメタルボンド砥石の良好
な目立て（電解ドレッシング）を連続的に行うことがで
きるドレッシング装置を提供することにある。The present invention has been made in view of the above circumstances, and an object thereof is to provide a dressing device capable of continuously performing good dressing (electrolytic dressing) of a metal bond grindstone. .
【００１１】[0011]
【課題を解決するための手段】上記目的を達成するため
に、請求項１記載の発明は、メタルボンド砥石の砥粒面
に対向配置した電極と、上記メタルボンド砥石と電極と
の隙間に電解研削液を供給する電解研削液供給手段とを
備え、上記メタルボンド砥石で研削しながら、上記電解
研削液供給手段からの電解研削液を介しメタルボンド砥
石と電極間を通電させるとともに、この通電による電気
分解で上記メタルボンド砥石のメタルボンドを溶出さ
せ、これにより目立てを行うドレッシング装置におい
て、上記電極と一体に設けた予備電極と、上記電極と予
備電極との比較により電極の表面が皮膜で覆われている
か否かを判断する皮膜検知手段と、この皮膜検知手段に
おいて電極の表面が皮膜で覆われているものと判断した
とき、上記電極に代えて予備電極をメタルボンド砥石の
砥粒面に対向させる電極移動手段とを設けたことを特徴
とする。In order to achieve the above-mentioned object, the invention according to claim 1 is characterized in that an electrode disposed opposite to an abrasive grain surface of a metal bond grindstone and an electrolysis in a gap between the metal bond grindstone and the electrode. An electrolytic grinding liquid supply means for supplying a grinding liquid is provided, and while the metal bond grindstone is being ground, the metal bond grindstone and the electrodes are energized via the electrolytic grinding liquid from the electrolytic grinding liquid supply means, and In a dressing device that elutes the metal bond of the metal bond grindstone by electrolysis and thereby dresses it, a preliminary electrode provided integrally with the electrode and the surface of the electrode are covered with a film by comparing the electrode with the preliminary electrode. The film detecting means for judging whether or not the film is broken, and when it is judged that the surface of the electrode is covered with the film by the film detecting means, the electrode is replaced by Characterized by providing the electrode moving means for opposing the preliminary electrode abrasive surface of the metal bond grinding wheel.
【００１２】請求項２記載の発明は、皮膜検知手段が比
較部および判断部を備え、比較部はメタルボンド砥石の
砥粒面に電極が対向するときのメタルボンド砥石と電極
間の電流値と、上記電極に代えて予備電極がメタルボン
ド砥石の砥粒面に対向するときのメタルボンド砥石と予
備電極間の電流値とを比較し、判断部は比較部における
比較結果に基づき上記電極の表面が皮膜で覆われている
か否かを判断するものであることを特徴とする。According to a second aspect of the present invention, the film detecting means includes a comparing section and a judging section, and the comparing section indicates a current value between the metal bond grindstone and the electrode when the electrode faces the abrasive grain surface of the metal bond grindstone. , The current value between the metal bond grindstone and the spare electrode when the spare electrode is opposed to the abrasive grain surface of the metal bond grindstone in place of the electrode, and the judgment unit determines the surface of the electrode based on the comparison result in the comparison unit. It is characterized by determining whether or not is covered with a film.
【００１３】[0013]
【作用】この発明によれば、皮膜検知手段が電極と予備
電極との比較により電極の表面が皮膜で覆われているか
否かを判断するとともに、この皮膜検知手段において電
極の表面が皮膜で覆われているものと判断したとき、電
極移動手段が電極に代えて予備電極をメタルボンド砥石
の砥粒面に対向させる。According to the present invention, the film detecting means determines whether or not the surface of the electrode is covered with the film by comparing the electrode and the spare electrode, and the surface of the electrode is covered with the film by the film detecting means. When it is determined that the metal bonding grindstone has been broken, the electrode moving means makes the preliminary electrode, instead of the electrode, face the abrasive grain surface of the metal bond grindstone.
【００１４】[0014]
【実施例】以下、この発明に係るドレッシング装置の一
実施例について図１および図２を基に詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the dressing device according to the present invention will be described below in detail with reference to FIGS.
【００１５】なお、図１に示すドレッシング装置の基本
的な構成、例えばメタルボンド砥石１の砥粒面１ａに対
向して配置した電極２を具備すること、電極２とメタル
ボンド砥石１間の微小隙間には電解研削液が供給される
こと、電極２は電源４の負極に接続され負（−）の電位
に、メタルボンド砥石１は電源４の正極に接続され正
（＋）の電位に設定されていること、並びに、メタルボ
ンド砥石１による被加工物Ｗの研削中に、電解研削液を
介しメタルボンド砥石と電極間が通電し、この通電によ
る電気分解でメタルボンド砥石１のメタルボンドを溶出
させ、これにより目立て（電解ドレッシング）を行うも
のであること等は従来例と同様なため、それと同一部材
には同一符号を付し、その詳細説明は省略する。The basic structure of the dressing device shown in FIG. 1, for example, the electrode 2 disposed facing the abrasive grain surface 1a of the metal bond grindstone 1 and the minute gap between the electrode 2 and the metal bond grindstone 1 are provided. Electrolytic grinding liquid is supplied to the gap, the electrode 2 is connected to the negative electrode of the power source 4 and is set to a negative (-) potential, and the metal bond grindstone 1 is connected to the positive electrode of the power source 4 and set to a positive (+) potential. That is, and during the grinding of the workpiece W by the metal bond grindstone 1, an electric current is applied between the metal bond grindstone and the electrode through the electrolytic grinding liquid, and the metal bond of the metal bond grindstone 1 is electrolyzed by this energization. Since elution and dressing (electrolytic dressing) are performed in the same manner as in the conventional example, the same members as those of the conventional example are denoted by the same reference numerals and detailed description thereof will be omitted.
【００１６】同図に示すドレッシング装置は電極２と一
体に設けた予備電極２００を備えており、この予備電極
２００はメタルボンド砥石１の回転軸線Ｏ1 −Ｏ1 に沿
って電極２を複数並べて一体に結合した形状をなしてい
る。The dressing device shown in the figure comprises a preliminary electrode 200 provided integrally with the electrode 2, and this preliminary electrode 200 has a plurality of electrodes 2 arranged along the rotation axis O 1 -O 1 of the metal bond grindstone 1. It has a shape that is connected together.
【００１７】このように電極２と予備電極２００からな
る拡幅電極はメタルボンド砥石１の砥粒面側と対向する
面（電極面）が電極２単独の場合に比し数倍広く設けら
れている。As described above, in the widening electrode composed of the electrode 2 and the preliminary electrode 200, the surface (electrode surface) facing the abrasive grain surface side of the metal bond grindstone 1 is provided several times wider than that of the electrode 2 alone. .
【００１８】メタルボンド砥石１と電源４間には電流検
出手段として電流計５が接続されており、電流計５はメ
タルボンド砥石１の砥粒面と電極２とが対向する場合に
はメタルボンド砥石１と電極２間の電流値を検出し、メ
タルボンド砥石１の砥粒面と予備電極２００とが対向す
る場合にはメタルボンド砥石１と予備電極２００間の電
流値を検出し、また、このような検出結果（電流値）は
皮膜検知部６に送出される。An ammeter 5 is connected as a current detecting means between the metal bond grindstone 1 and the power source 4. The ammeter 5 is a metal bond when the abrasive grain surface of the metal bond grindstone 1 and the electrode 2 face each other. The current value between the grindstone 1 and the electrode 2 is detected, and when the abrasive grain surface of the metal bond grindstone 1 and the preliminary electrode 200 face each other, the current value between the metal bond grindstone 1 and the preliminary electrode 200 is detected. Such a detection result (current value) is sent to the film detection unit 6.
【００１９】皮膜検知部６は電極２と予備電極２００と
の比較により電極２の表面が通電を遮る皮膜で覆われて
いるか否かを判断するもので、上記比較を実行する比較
部６００と上記判断を実行する判断部６０１を備える。The film detection unit 6 judges whether the surface of the electrode 2 is covered with a film that blocks the current flow by comparing the electrode 2 and the preliminary electrode 200. A judgment unit 601 for executing the judgment is provided.
【００２０】比較部６００は、メタルボンド砥石１と電
極２が対向するときのメタルボンド砥石１と電極２間の
電流値と、電極２に代えて予備電極２００がメタルボン
ド砥石１と対向するときのメタルボンド砥石１と予備電
極２００間の電流値とを比較する。The comparison section 600 is for comparing the current value between the metal bond grindstone 1 and the electrode 2 when the metal bond grindstone 1 and the electrode 2 face each other, and when the spare electrode 200 instead of the electrode 2 faces the metal bond grindstone 1. The current value between the metal bond grindstone 1 and the preliminary electrode 200 is compared.
【００２１】このような電流値の比較によると、例えば
通電を遮る皮膜で表面が覆われた電極２とその皮膜で表
面が覆われていない予備電極２００ではメタルボンド砥
石１との間に流れる電流値に差があり、皮膜で表面が覆
われた場合の方が電流値が低下するところから、皮膜で
覆われている場合とそうでない場合との電流値の差に基
づき電極２の表面が通電を遮る皮膜で覆われているか否
かを調査できる。According to the comparison of such current values, for example, the current flowing between the electrode 2 whose surface is covered with a film that blocks current flow and the spare electrode 200 whose surface is not covered with the film flows between the metal bond grindstone 1. There is a difference in the values, and the current value decreases when the surface is covered with the film. Therefore, the surface of the electrode 2 is energized based on the difference in the current value when the film is covered and when it is not. It is possible to investigate whether or not it is covered with a film that blocks the light.
【００２２】なお、電流値の低下は上記の如く電極２の
表面を覆う皮膜によるものだけでなく、メタルボンド砥
石１に不導体酸化皮膜が形成されて電解条件が安定した
ときにも電流値は低下するので、上記のような比較を行
わず単に電流値の低下を検出するのみでは電極２の表面
が通電を遮る皮膜で覆われているか否かの調査が困難で
あるところから、このような調査は上記のような比較に
よることとした。Not only the decrease in the current value due to the film covering the surface of the electrode 2 as described above, but also the current value when the electrolysis condition is stabilized by forming the non-conductive oxide film on the metal bond grindstone 1 Since it is difficult to investigate whether or not the surface of the electrode 2 is covered with a film that blocks the current flow, it is difficult to investigate whether the surface of the electrode 2 is covered by simply detecting the decrease of the current value without performing the above comparison. The survey was based on the above comparison.
【００２３】判断部６０１は比較部６００での比較結果
（電流値の差）に基づき電極２の表面が皮膜で覆われて
いるか否かを判断するもので、メタルボンド砥石１と電
極２間の電流値の方がメタルボンド砥石１と予備電極２
００間の電流値より低く、しかもその電流値の差がしき
い値を越えるものであるときは、電気分解に悪影響を及
ぼすほど電極２の表面が皮膜で覆われているものと判断
する。The judgment unit 601 judges whether or not the surface of the electrode 2 is covered with a film based on the comparison result (difference in current value) in the comparison unit 600, and the judgment is made between the metal bond grindstone 1 and the electrode 2. Current value is metal bond grindstone 1 and spare electrode 2
When the current value is lower than the current value between 0 and 00, and the difference between the current values exceeds the threshold value, it is determined that the surface of the electrode 2 is covered with a film so as to adversely affect electrolysis.
【００２４】スライド機構部７および電極変更指示部８
から構成される電極移動手段は判断部６０１において電
極２の表面が皮膜で覆われているものと判断したとき、
上記電極２に代えて予備電極２００をメタルボンド砥石
１の砥粒面に対向させるもので、スライド機構部７はボ
ールネジ等から構成され、かつ電解ドレッシング中にお
いて一定時間ごとに電極２に代えて予備電極２００をメ
タルボンド砥石１の砥粒面に対向させる一方、電極変更
指示部８は判断部６０１において電極２の表面が通電を
遮る皮膜で覆われているものと判断したとき、スライド
機構部７に対して電極変更指示（今後の電解ドレッシン
グは電極２に代えて予備電極２００を使用する旨）を送
出する。Slide mechanism section 7 and electrode change instruction section 8
When the judging unit 601 judges that the surface of the electrode 2 is covered with a film,
In place of the electrode 2, the preliminary electrode 200 is made to face the abrasive grain surface of the metal bond grindstone 1. The slide mechanism portion 7 is composed of a ball screw or the like, and is replaced by the electrode 2 at regular intervals during electrolytic dressing. While the electrode 200 is made to face the abrasive grain surface of the metal bond grindstone 1, when the electrode change instructing unit 8 determines in the determining unit 601 that the surface of the electrode 2 is covered with a film that blocks current flow, the slide mechanism unit 7 An electrode change instruction (indicating that the preliminary electrode 200 will be used in place of the electrode 2 in the future electrolytic dressing) is sent to.
【００２５】また、電極２に代えて予備電極２００をメ
タルボンド砥石１の砥粒面に対向させる際は、スライド
機構部７により電極２および予備電極２００をメタルボ
ンド砥石１の幅と同じ距離だけスライドさせる。When the spare electrode 200 instead of the electrode 2 is made to face the abrasive grain surface of the metal bond grindstone 1, the electrode 2 and the spare electrode 200 are moved by the slide mechanism portion 7 by the same distance as the width of the metal bond grindstone 1. Slide it.
【００２６】次に、上記の如く構成されたドレッシング
装置の動作について図１を基に図２を参照しながら説明
する。Next, the operation of the dressing device configured as described above will be described based on FIG. 1 and with reference to FIG.
【００２７】なお、図２（ａ）に示すようにメタルボン
ド砥石１の砥粒面に電極２を対向させた状態で、メタル
ボンド砥石１と電極２間に電解研削液を供給すると、メ
タルボンド砥石１による被加工物Ｗの研削中に、電解研
削液を介しメタルボンド砥石と電極間が通電し、この通
電による電気分解でメタルボンド砥石１のメタルボンド
を溶出させ、これにより目立て（電解ドレッシング）を
行うことは従来と同様であるため、その詳細説明は省略
する。As shown in FIG. 2A, when the electrolytic grinding liquid is supplied between the metal bond grindstone 1 and the electrode 2 with the electrode 2 facing the abrasive grain surface of the metal bond grindstone 1, the metal bond is bonded. During the grinding of the workpiece W by the grindstone 1, an electric current is applied between the metal bond grindstone and the electrode through an electrolytic grinding liquid, and the electrolysis caused by the energization causes the metal bond of the metal bond grindstone 1 to elute, thereby providing the sharpening (electrolytic dressing ) Is performed in the same manner as in the related art, and detailed description thereof will be omitted.
【００２８】このドレッシング装置によれば、上記のよ
うな電極２を用いる電解ドレッシング中に、一定時間ご
とに、スライド機構部７が電極２に代えて予備電極２０
０をメタルボンド砥石１の砥粒面に対向させる（図２
（ａ）（ｂ）参照）。According to this dressing apparatus, during the electrolytic dressing using the electrode 2 as described above, the slide mechanism section 7 replaces the electrode 2 and the preliminary electrode 20 at regular intervals.
0 is opposed to the grain surface of the metal bond grindstone 1 (see FIG. 2).
(See (a) and (b)).
【００２９】この際、メタルボンド砥石１と電極２が対
向しているときのその両者１，２間の電流値、および電
極２に代えて予備電極２００がメタルボンド砥石１と対
向しているときのその両者１，２００間の電流値が電流
計５から皮膜検知部６に送出されるとともに、皮膜検知
部６の比較部６００において上記両電流値の比較が行わ
れる。At this time, when the metal bond grindstone 1 and the electrode 2 face each other, the current value between the two, and when the spare electrode 200 instead of the electrode 2 faces the metal bond grindstone 1. The current value between the both 1,200 is sent from the ammeter 5 to the film detecting unit 6, and the comparing unit 600 of the film detecting unit 6 compares the both current values.
【００３０】そして、比較部６００での比較の結果、メ
タルボンド砥石１と電極２間の電流値の方がメタルボン
ド砥石１と予備電極２００間の電流値より低く、しかも
その電流値の差がしきい値を越えるものであるときは、
判断部６０１において電気分解に悪影響を及ぼすほど電
極２の表面が皮膜で覆われているものと判断する。As a result of comparison in the comparison unit 600, the current value between the metal bond grindstone 1 and the electrode 2 is lower than the current value between the metal bond grindstone 1 and the spare electrode 200, and the difference between the current values is small. If it exceeds the threshold,
The determination unit 601 determines that the surface of the electrode 2 is covered with a film so as to adversely affect electrolysis.
【００３１】このような判断がなされると、電極変更指
示部８がスライド機構部７に対して電極変更指示（今後
の電解ドレッシングは電極２に代えて予備電極２００を
使用する旨）を送出する。これにより、図２（ｂ）に示
す如く電極２に代えて予備電極２００がメタルボンド砥
石１の砥粒面に対向し、未だ被膜で表面が覆われていな
い予備電極２００を用いる電解ドレッシングが行われ
る。When such a determination is made, the electrode change instruction section 8 sends an electrode change instruction to the slide mechanism section 7 (indicating that the spare electrode 200 will be used in place of the electrode 2 for electrolytic dressing in the future). . As a result, as shown in FIG. 2B, the preliminary electrode 200 instead of the electrode 2 faces the abrasive grain surface of the metal bond grindstone 1, and electrolytic dressing is performed using the preliminary electrode 200 whose surface is not yet covered with a coating film. Be seen.
【００３２】なお、比較部６００での比較の結果、メタ
ルボンド砥石１と電極２間の電流値とメタルボンド砥石
１と予備電極２００間の電流値が等しい場合、あるいは
メタルボンド砥石１と電極２間の電流値の方がメタルボ
ンド砥石１と予備電極２００間の電流値より低いときで
も、その電流値の差がしきい値を越えるものでない場合
は、判断部６０１において電気分解に悪影響を及ぼすほ
ど電極２の表面が皮膜で覆われていないものと判断し、
電極２を用いる電解ドレッシングが引続き行われる。As a result of comparison in the comparison unit 600, when the current value between the metal bond grindstone 1 and the electrode 2 is equal to the current value between the metal bond grindstone 1 and the spare electrode 200, or when the metal bond grindstone 1 and the electrode 2 are used. Even when the current value between the two is lower than the current value between the metal bond grindstone 1 and the preliminary electrode 200, if the difference between the current values does not exceed the threshold value, the determination unit 601 adversely affects electrolysis. Judging that the surface of the electrode 2 is not covered with a film,
Electrolytic dressing with electrodes 2 is subsequently carried out.
【００３３】したがって、上記実施例のドレッシング装
置によれば、電気分解で溶出したメタルボンドの金属イ
オン、微細な切粉および電解研削液中に含まれるモリブ
デン等の潤滑剤が電極の表面に付着して皮膜を形成し、
この皮膜で電極が覆われた場合には電極を掃除しなくて
も予備電極を用いる目立て（電解ドレッシング）が実行
されるので、電極の掃除による研削作業の中断という不
具合がなくなり、メタルボンド砥石の良好な電解ドレッ
シングを連続的に行うことができる。Therefore, according to the dressing apparatus of the above-described embodiment, the metal ions of the metal bond eluted by electrolysis, the fine chips and the lubricant such as molybdenum contained in the electrolytic grinding liquid adhere to the surface of the electrode. To form a film,
When the electrode is covered with this film, dressing (electrolytic dressing) using the preliminary electrode is performed without cleaning the electrode, so there is no problem of interruption of the grinding work due to cleaning of the electrode, and Good electrolytic dressing can be continuously performed.
【００３４】しかも、このドレッシング装置によると、
上記のように予備電極を用いる電解ドレッシングが実行
されたときには、メタルボンド砥石と予備電極間に良好
な通電による電流の流れが得られ、電気分解で溶出する
メタルボンドの量が均一となることから、メタルボンド
砥石の変形を防止することができ、研削による被加工物
の形状精度の向上を図るのに好適である。Moreover, according to this dressing device,
When electrolytic dressing using a spare electrode is performed as described above, a current flow is obtained between the metal bond grindstone and the spare electrode by good current flow, and the amount of metal bond eluted by electrolysis becomes uniform. It is possible to prevent the deformation of the metal bond grindstone, and it is suitable for improving the shape accuracy of the workpiece by grinding.
【００３５】[0035]
【発明の効果】この発明に係るドレッシング装置にあっ
ては、上記の如く電極と一体に設けた予備電極、皮膜検
知手段および電極移動手段を備え、皮膜検知手段におい
て電極の表面が皮膜で覆われているものと判断したと
き、電極移動手段が電極に代えて予備電極をメタルボン
ド砥石の砥粒面に対向させるものであるため、電極の表
面が皮膜で覆われたときには電極を掃除しなくても予備
電極を用いる目立て（電解ドレッシング）が実行される
ので、電極の掃除による研削作業の中断という不具合が
なくなり、メタルボンド砥石の良好な電解ドレッシング
を連続的に行うことができる。The dressing device according to the present invention is provided with the preliminary electrode integrally formed with the electrode as described above, the film detecting means and the electrode moving means, and the surface of the electrode is covered with the film in the film detecting means. When it is determined that the electrode is moved, the electrode moving means replaces the electrode with the preliminary electrode facing the abrasive grain surface of the metal bond grindstone, and therefore the electrode should not be cleaned when the surface of the electrode is covered with a film. Also, since dressing (electrolytic dressing) using a preliminary electrode is performed, there is no problem of interruption of grinding work due to cleaning of the electrode, and good electrolytic dressing of the metal bond grindstone can be continuously performed.
【００３６】しかも、このドレッシング装置によれば、
上記のように予備電極を用いる電解ドレッシングが実行
されたときには、メタルボンド砥石と予備電極間に良好
な通電による電流の流れが得られ、電気分解で溶出する
メタルボンドの量が均一となることから、メタルボンド
砥石の変形を防止することができ、研削による被加工物
の形状精度の向上を図るのに好適である。Moreover, according to this dressing device,
When electrolytic dressing using a spare electrode is performed as described above, a current flow is obtained between the metal bond grindstone and the spare electrode by good current flow, and the amount of metal bond eluted by electrolysis becomes uniform. It is possible to prevent the deformation of the metal bond grindstone, and it is suitable for improving the shape accuracy of the workpiece by grinding.
【００３７】請求項２記載の発明にあっても上記と同様
な効果が得られる。In the invention according to claim 2, the same effect as described above can be obtained.
【図１】この発明に係るドレッシング装置の一実施例の
説明図。FIG. 1 is an explanatory diagram of an embodiment of a dressing device according to the present invention.
【図２】図１に示すドレッシング装置の動作説明図。FIG. 2 is an operation explanatory view of the dressing device shown in FIG.
【図３】従来のドレッシング装置の説明図。FIG. 3 is an explanatory view of a conventional dressing device.
１ メタルボンド砥石 ２ 電極 ６ 皮膜検知部 ７ スライド機構部 ８ 電極変更指示部 ２００ 予備電極 ６００ 比較部 ６０１ 判断部 DESCRIPTION OF SYMBOLS 1 Metal bond grindstone 2 Electrode 6 Film detection unit 7 Slide mechanism unit 8 Electrode change instruction unit 200 Spare electrode 600 Comparison unit 601 Judgment unit
Claims (2)
た電極と、上記メタルボンド砥石と電極との隙間に電解
研削液を供給する電解研削液供給手段とを備え、上記メ
タルボンド砥石で研削しながら、上記電解研削液供給手
段からの電解研削液を介しメタルボンド砥石と電極間を
通電させるとともに、この通電による電気分解で上記メ
タルボンド砥石のメタルボンドを溶出させ、これにより
目立てを行うドレッシング装置において、 上記電極と一体に設けた予備電極と、上記電極と予備電
極との比較により電極の表面が皮膜で覆われているか否
かを判断する皮膜検知手段と、この皮膜検知手段におい
て電極の表面が皮膜で覆われているものと判断したと
き、上記電極に代えて予備電極をメタルボンド砥石の砥
粒面に対向させる電極移動手段とを設けたことを特徴と
するドレッシング装置。1. A metal bond grindstone is provided with an electrode arranged opposite to a grain surface of a metal bond grindstone, and an electrolytic grinding liquid supply means for supplying an electrolytic grinding liquid to a gap between the metal bond grindstone and the electrode. While energizing between the metal bond grindstone and the electrode through the electrolytic grinding liquid from the electrolytic grinding liquid supply means, the metal bond of the metal bond grindstone is eluted by electrolysis due to this energization, and thereby dressing is performed. In the apparatus, a preliminary electrode integrally provided with the electrode, a film detecting means for judging whether or not the surface of the electrode is covered with a film by comparing the electrode and the auxiliary electrode, and the film detecting means for detecting the electrode When it is determined that the surface is covered with a film, an electrode moving means for causing the preliminary electrode to face the abrasive grain surface of the metal bond grindstone instead of the above electrode. Dressing apparatus is characterized by providing.
え、比較部はメタルボンド砥石の砥粒面に電極が対向す
るときのメタルボンド砥石と電極間の電流値と、上記電
極に代えて予備電極がメタルボンド砥石の砥粒面に対向
するときのメタルボンド砥石と予備電極間の電流値とを
比較し、判断部は比較部における比較結果に基づき上記
電極の表面が皮膜で覆われているか否かを判断するもの
であることを特徴とする請求項１記載のドレッシング装
置。2. The film detecting means includes a comparing section and a judging section, and the comparing section is a current value between the metal bond grindstone and the electrode when the electrode faces the abrasive grain surface of the metal bond grindstone, and is replaced with the electrode. The current value between the metal bond grindstone and the spare electrode when the spare electrode faces the abrasive grain surface of the metal bond grindstone is compared, and the judging unit covers the surface of the electrode with a film based on the comparison result in the comparing unit. The dressing device according to claim 1, wherein the dressing device determines whether or not there is any.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05333213A JP3106274B2 (en) | 1993-12-27 | 1993-12-27 | Dressing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05333213A JP3106274B2 (en) | 1993-12-27 | 1993-12-27 | Dressing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07186045A true JPH07186045A (en) | 1995-07-25 |
| JP3106274B2 JP3106274B2 (en) | 2000-11-06 |
Family
ID=18263586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05333213A Expired - Fee Related JP3106274B2 (en) | 1993-12-27 | 1993-12-27 | Dressing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3106274B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011200956A (en) * | 2010-03-25 | 2011-10-13 | Fuji Heavy Ind Ltd | Grinding method and device |
| CN105150105A (en) * | 2015-10-13 | 2015-12-16 | 成都精密光学工程研究中心 | Diamond grinding wheel offline electrolytic dressing device for optical element grinding and dressing method thereof |
-
1993
- 1993-12-27 JP JP05333213A patent/JP3106274B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011200956A (en) * | 2010-03-25 | 2011-10-13 | Fuji Heavy Ind Ltd | Grinding method and device |
| CN105150105A (en) * | 2015-10-13 | 2015-12-16 | 成都精密光学工程研究中心 | Diamond grinding wheel offline electrolytic dressing device for optical element grinding and dressing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3106274B2 (en) | 2000-11-06 |
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