JPH07184981A - Divided line processing method for tablet using laser beam - Google Patents

Abstract

PURPOSE:To simplify the production of a punch and matrix and to process the division line of tablet by ideal section shape. CONSTITUTION:A pil W is formed by compressing the powder. The laser beam X is focused on the pill W after the compression at the time of irradiation. The division line L is formed on the tablet W by moving the laser beam X in the XY direction. Thus, the division line L is processed by using the laser beam X and it is unnecessary to form a projected part to carve the division line L on punches 4 and 5 compressing the pill W, resulting in simplifying the production of the punches 4 and 5 and its matrix. The division line L can be processed to the ideal section by setting the processing condition of the laser beam X without being restrained by the conditions on the production.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tablet dividing line processing method using a laser beam, and more specifically, a dividing line for forming a dividing line by irradiating an object similar to a tablet for medicine with a laser beam. It relates to a processing method.

[0002]

2. Description of the Related Art Conventionally, a method of processing a dividing line of a tablet by using this type of laser beam has not been carried out, and the dividing line is generally engraved at the same time when the tablet is compression-molded. FIG. 17 is a partial cross-sectional view showing a tableting machine for compression-molding a conventional tablet, and FIG. 18 is an explanatory view showing a compression-molding procedure for a conventional tablet. The compression molding of tablets is carried out by a rotary powder compression molding machine called a tableting machine. First,
Explaining the structure of this tableting machine, in FIG. 17, 1 is the compression molding section of the tableting machine, 2 is the compression molding section 1 centered on the axis of the tableting machine (located on the left side of the figure) The rotating rotary table 3 includes a plurality of mortars (only one is shown) provided at predetermined intervals in the circumferential direction on the periphery of the rotary table 2.
Numerals 4 and 5 are a pair of upper and lower pestle which are provided on the axis line passing through the arbitrary mortar 3 and can be fitted into the mortar 3 with the tip ends facing each other. As shown in FIG. The tip surfaces of the upper and lower punches 4 and 5 have shapes corresponding to the upper surface and the lower surface of the tablet W to be compression-molded (hereinafter referred to as "tablet surface"), and
A convex portion 6 having a triangular cross-section (only the upper punch 4 side in FIG. 18) corresponding to the dividing line L of the tablet W is formed on one or both of the tablet surfaces.

Reference numerals 7 and 8 designate upper and lower punch holders for holding the upper and lower punches 4 and 5 in a vertically movable manner. An upper punch compression roll and a lower punch compression roll that drive the lower punch 5 along the axis. The compression rolls 9 and 10 are
An ordinary tableting machine is provided with two sets, one for pre-compression for removing air from the powder and granules and one for main compression for compression-molding the powder and granules after the pre-compression.

Next, the steps until the tablet W is compression-molded by the tableting machine thus constructed will be described. First,
The lower punch 5 is placed in the die 3 at a specific position on the rotary table 2.
Is inserted at a predetermined height, and a predetermined amount of powdery material P which is a raw material of the tablet W is filled therein (FIG. 18A). When the mortar 3 moves on the circumferential trajectory along with the rotation of the rotary table 2, the upper pestle compression roll 9 and the lower pestle compression roll 10 drive the upper pestle 4 and the lower pestle 5 in the approaching direction to perform preliminary compression (Fig. 1
8 (b)) and subsequent main compression (FIG. 18 (c)) are performed. After that, the lower punch 5 rises to a level flush with the rotary table 2 and lifts the tablet W (FIG. 18 (d)),
The tablet W interferes with the scraper 11 obliquely arranged on the circumferential trajectory of the mortar 3, and is ejected out of the machine while sliding on the rotary table 2.

The method for manufacturing the upper punch 4 and the lower punch 5 will be described. These punches 4 and 5 are press-molded by a die called a mother die. A predetermined tablet surface shape is machined on the mother die, and during press molding,
First, the base material of the punches 4 and 5 is press-molded by the mother die at a pressure of about 100 tons, the tablet surface shape of the mother die is transferred to the base material, and the base material is cut and processed into predetermined punches 4 and 5 Finished in the shape of. Next, after buffing the tablet surfaces of the punches 4 and 5, heat treatment such as quenching and tempering is performed, hard chrome plating is performed, and buffing is performed again, whereby the manufacturing operation of the punches 4 and 5 is completed.

[0006]

As described above, since the dividing line L is conventionally engraved during the compression molding of the tablet W, there are the following problems. First, it is necessary to form a concave portion corresponding to the dividing line L in the mother die, and a skilled worker manually engraves the recognition code together with the recognition code as described above. Generally, the dividing line L has a line width. 0.5-1.2 mm, depth 0.
Since the angle of the bottom of the groove is 25 to 0.6 mm and the angle of the groove bottom (hereinafter referred to as “cross-sectional angle”) is about 90 °, it is extremely difficult to finish the recess faithfully to the drawing. Further, although the protrusions 6 are formed on the punches 4 and 5 corresponding to the recesses of the mother die, the protrusions 6 have been a factor that makes it difficult to perform the above-described buffing work. Therefore, conventionally, manufacturing of the punches 4 and 5 and the mother die has been very complicated.

Further, as is well known, in order to divide the tablet W by hand easily and accurately, it is desirable that the sectional angle of the dividing line L be an acute angle. However, if the projections 6 of the punches 4 and 5 and the recesses of the mother die are set to have an acute angle in order to achieve this, the cooling rate during quenching becomes uneven, resulting in localized variations in hardness, quenching cracks, and quenching. Strain or the like occurs, and during press forming of the punches 4 and 5, stress is concentrated in the concave portions of the mother die to break, or the convex portions 6 of the punches 4 and 5 are cracked due to deformation beyond the plastic region. It may cause residual stress. In addition, even if these problems do not occur, the base materials of the punches 4 and 5 do not plastically deform into the same shape as the base mold, so that the tips of the convex portions 6 are slightly curved.
Therefore, conventionally, it was necessary to set the cross-sectional shape such as the cross-sectional angle of the parting line L within the manufacturing constraints of the punches 4 and 5 and the mother die, and the ideal cross-sectional shape could not be realized.

On the other hand, as described above, the punches 4 and 5 are finished by buffing after hard chrome plating, but since they are mechanical polishing and the object to be polished is extremely small, the polishing is insufficient and smooth. The surface may not be obtained in some cases. The punches 4 and 5 are so-called sticking in which the powder P is easily deposited on the surface of the tablet W during compression molding, and thus the surface of the tablet W is rough or the vicinity of the dividing line L falls off. May cause tableting problems. Further, if the protrusions 6 of the punches 4 and 5 are excessively protruded to sharpen the sectional angle of the parting line L as described above, not only double marking occurs in the pre-compression but also the protrusions are formed at the time of compression molding. The pressure acting on 6 increases and wears early. Therefore, conventionally, the quality of the manufactured tablet W has not been sufficiently satisfactory.

In view of the above, the present invention can simplify the production of punches and mother dies, process the dividing lines of tablets with an ideal cross-sectional shape, and prevent tableting obstacles and the like to improve the quality of tablets. It is an object of the present invention to provide a tablet dividing line processing method using a laser beam that can be used.

[0010]

According to a tablet dividing line processing method using a laser beam of claim 1, a laser beam is focused and irradiated onto the tablet, and the laser beam and the tablet are moved relative to each other. Thus, a dividing line is formed on the tablet.

According to a second aspect of the invention, a tablet dividing line processing method using a laser beam comprises a tablet forming step of forming a tablet having a predetermined shape by compressing a powder or granular material which is a raw material of the tablet, and focusing the laser beam. And irradiating the tablet with the laser beam and moving the laser beam and the tablet relative to each other to form a dividing line on the tablet.

In the tablet dividing line processing method using a laser beam according to a third aspect, the dividing line is formed on each of the tablets by irradiating the front surface and the back surface of the tablet with the laser beam.

In the tablet dividing line processing method using a laser beam according to a fourth aspect, the surface and both side surfaces of the tablet are irradiated with the laser beam to form continuous dividing lines from the surface to both side surfaces. .

In the tablet dividing line processing method using a laser beam according to a fifth aspect, the output of the laser beam is changed during irradiation of the tablet with the laser beam.

In the tablet dividing line processing method using a laser beam according to a sixth aspect, the relative speed between the laser beam and the tablet is changed during irradiation of the tablet with the laser beam.

In the tablet dividing line processing method using a laser beam according to a seventh aspect, a preliminary concave groove is formed at the position where the dividing line is to be formed by the laser beam, when the tablet is compression-molded. A laser beam is irradiated along the groove.

In the tablet dividing line processing method using a laser beam according to claim 8, the output form of the laser beam is a pulse output, and the pulse output forms a broken dividing line. is there.

In the tablet dividing line processing method using a laser beam according to a ninth aspect, the output form of the laser beam is a pulse output, and the peak value of the pulse output is set high and the frequency is set low. is there.

In the tablet dividing line processing method using a laser beam according to a tenth aspect, after the dividing line is processed, the tablet is irradiated with a laser beam in a state where the focus is shifted, and the laser beam and the tablet are combined. It moves relatively to melt the surface layer of the tablet.

According to the tablet dividing line processing method using a laser beam of claim 11, a joining part for compressing a powder or granular material as a raw material of the tablet to form a plurality of joining parts each having a divided shape of the tablet. A forming step; and a joining part welding step of arranging the joining parts to form a tablet and irradiating a laser beam along one side of the joining surfaces to partially weld the joining surfaces. It is a thing.

In the tablet dividing line processing method using a laser beam according to claim 12, the output form of the laser beam is a pulse output, and the pulse output forms a discontinuous welded portion having a broken line shape. is there.

[0022]

In the first and second aspects, since the dividing line is processed by using the laser beam, it is not necessary to form a convex portion for marking the dividing line on the punch for compression molding the tablet. Manufacturing of the punch and its master die is simplified, and without being restricted by the manufacturing constraints of the master die and the punch, the laser beam processing conditions are appropriately set to divide the dividing line into an arbitrary cross-sectional shape,
That is, the tablet can be easily divided by hand, and can be processed into a cross-sectional shape with high division accuracy, and furthermore, it is possible to prevent tableting troubles such as sticking when the dividing line is marked by the convex portion of the punch.

In the third aspect, since the dividing lines are formed on the front surface and the back surface of the tablet, it is possible to further improve the tablet dividing accuracy.

According to the fourth aspect, since the dividing line is continuously formed from the surface of the tablet to both side surfaces, it is possible to further improve the tablet dividing accuracy.

In the fifth and sixth aspects, by changing the output of the laser beam during irradiation of the tablet or changing the relative speed of the laser beam and the tablet, for example, the dividing line at both ends of the tablet. Can be formed deeper to further improve the tablet dividing accuracy.

In the present invention, since the dividing line is formed by irradiating the laser beam along the concave groove, cracks generated by thermal shock of the laser beam are concentrated in the direction of the concave groove to divide by the crack. A decrease in accuracy is prevented.

In the eighth aspect, since the irradiation energy per pulse is increased by using the laser beam as the pulse output, the dividing line is formed deeper without increasing the width, and the tablet dividing accuracy is improved. It is possible to raise it further.

In the ninth aspect, the lower the peak value of the pulse output and the higher the frequency, the wider the area affected by heat around the dividing line during irradiation of the laser beam and the more prominent the occurrence of cracks. Therefore, the peak value is high,
Moreover, if the frequency is set low, it is possible to suppress the defect occurrence rate.

In the tenth aspect, the surface layer of the tablet is
When the tablet is ingested into the body, the absorption rate can be arbitrarily delayed because the tablet is once melted by the irradiation of the laser beam with a defocused point and is then transformed into glass and solidified.

In the eleventh aspect, the joint parts are joined in a state where the joint surfaces thereof are partially welded to each other, and when the tablet is manually divided, the non-welded portion of the joint surface functions as a dividing line. To do. And since the dividing line is processed by using the laser beam in this manner, it is not necessary to form a convex portion for marking the dividing line on the punch for compression molding the tablet, and the punch and its mother die can be manufactured. It is simplified, and without being restricted by the manufacturing restrictions of the mother die and punch, it is possible to set the processing conditions of the laser beam appropriately and set the dividing line, that is, the non-welded portion to any shape. It is possible to prevent tableting troubles such as sticking when the dividing line is marked by the convex portion of the punch.

According to the twelfth aspect of the present invention, since the welded portions for joining the respective joined parts are intermittently formed, it is possible to further improve the tablet dividing accuracy.

[0032]

【Example】

 <First Embodiment> A first embodiment of the present invention will be described below.

FIG. 1 is a schematic diagram showing a laser processing apparatus for carrying out a tablet dividing line processing method using a laser beam according to the first embodiment of the present invention, and FIG. 2 is a first embodiment of the present invention. FIG. 3 is a longitudinal sectional view showing a tablet manufactured by the tablet dividing line processing method using the laser beam of the embodiment, and FIG. 3 is manufactured by the tablet dividing line processing method using the laser beam of the first embodiment of the present invention. It is a cross-sectional view showing a broken tablet.

In the dividing line processing method of this embodiment, the dividing line L is not marked at the time of compression molding of the tablet W as in the prior art, but the dividing line L is processed in an independent step after compression molding. . That is, as shown in FIG. 1, the steps of filling the granular material of FIGS. 18 (a) to 18 (c), the preliminary compression, and the main compression described in the prior art (in the figure, simplified to a single step, 18) is finished, the dividing line L is processed, and then the tablet W is discharged by the scraper 11 in FIG. 18D. Therefore, in the tableting machine used in the present embodiment, the upper punch 4 and the lower punch 5 are not provided with the projection 6 for marking the dividing line L.

First, the structure of the laser processing apparatus used in the step of processing the dividing line L will be described.
1 is a machining head disposed at the position of the machining process of the dividing line L on the rotary table 2, 22 is obliquely disposed above the machining head 21 by about 45 °, and mechanically with respect to the machining head 21. Connected reflecting mirrors, 23 and 24 are an X-axis driving motor and a Y-axis driving motor that integrally move the processing head 21 and the reflecting mirror 22 in the XY directions, and 25 is a laser beam disposed on the side of the reflecting mirror 22. The laser beam X output from the oscillator 25 is reflected downward by the reflecting mirror 22, focused by the processing head 21, and irradiated onto the surface of the tablet W located immediately below.

Then, as described in the prior art, the tablets W compression-molded through the steps of filling the powder and granules, pre-compressing, and main-compressing the processing head 21 as the rotary table 2 rotates.
Move to just below. When processing the single dividing line L to divide the tablet W into two equal parts, the processing head 21 and the reflecting mirror 22 are moved in the X direction by the X-axis drive motor 23 to move the tablet W.
A laser beam X is run across the center of the. Also,
When processing a pair of orthogonal dividing lines L to divide the tablet W into four equal parts, the X-axis drive motor 23 and the Y-axis drive motor 2
4, the laser beam X is made to travel in the XY directions. As a result, the surface of the tablet W instantly melts and evaporates,
As shown in FIGS. 2 and 3, a dividing line L having a triangular cross section is formed, and various conditions such as an average output of the laser beam X, a frequency, a duty factor, and a processing speed at this time are appropriately set to obtain a desired line. The dividing line L (width, depth, line type) can be obtained. The tablets W thereafter are transferred to the discharging step and discharged outside the machine by the scraper 11.

Next, the test results obtained by processing the dividing line L with the laser beam X as described above will be listed for each type of tablet W. First, as a comparative control tablet having the conventional dividing line L engraved therein, a tablet A having the same shape, composition and hardness as the tablet W of the present example which was tested was prepared, and the comparative control tablet was divided in Table 1. The results of the evaluation test are shown below. Also, for reference, tablets B and C, which are more difficult to divide than this tablet A
The results of the evaluation test are also shown. The evaluation was performed by performing a sensory test in which the tablets W of the present example and 10 tablets of each of the comparative controls were subjected to absolute evaluation of the ease of splitting by three randomly selected subjects in three levels, and then split into left and right. 100 divided pieces were weighed with a precision balance and the coefficient of variation (standard deviation ÷ tablet weight × 100
(%), Hereinafter abbreviated as “CV value”) was calculated to evaluate the division accuracy.

[Table 1]

(1) As a typical example of a flat tablet, a diameter of 7 mm,
A white rounded flat tablet with a thickness of 2.6 mm and a weight of 110 mg was tested. The processing conditions are average output 10-300 W, frequency 50-3000 Hz, duty factor 10-10.
Laser beam X in the range of 0%, processing speed 1-40m / se
A single dividing line that crosses the center of the surface of the tablet W by controlling in the range of c and processing at the focus position (just focus method) and processing at a point deviated from the focus position (defocus method). L was processed. Table 2 shows the width, depth and line type of the dividing line L processed according to typical processing conditions by the just focus method, and Table 3 shows the results of the evaluation test when the tablet W is divided.

[Table 2]

[Table 3] Even when the depth of the dividing line L is as shallow as 170 μm, the sectional angle is acute, so that it is evaluated by the sensory test that it is easy to divide, and the result that the CV value is 1/3 or less and the dividing accuracy is good is obtained. Was given.

(2) A diameter of 7
mm, thickness 3.5 mm, weight 120 mg tablets were tested. The irradiation conditions of the laser beam X and the evaluation method were the same as those of the above-mentioned flat tablet. Table 4 shows the width of the parting line L processed according to typical processing conditions by the just focus method,
Table 5 shows the depth and line type, and the results of the evaluation test when the tablet W is divided.

[Table 4]

[Table 5] The lens bare tablets used in the test have a small diameter of 7 mm, and the circumference of the tablet is a curved surface, so the sensory test tends to be more difficult to divide than the flat tablet, but the CV value is superior to the comparative control tablet. It was

(3) As a typical example of the film-coated tablet, a tablet having a diameter of 7 mm, a thickness of 3.55 mm and a weight of 126 mg was tested. The irradiation conditions of the laser beam X and the evaluation method were the same as those of the above-mentioned flat tablet. Table 6 shows the width, depth and line type of the dividing line L processed according to typical processing conditions by the just focus method, and Table 7 shows the results of the evaluation test when the tablet W is divided.

[Table 6]

[Table 7] Regarding the sensory test, it tended to be difficult to divide as compared with the flat tablet, but the CV value was superior to that of the comparative control tablet.

As described above, in this embodiment, since the dividing line L is processed by using the laser beam X, it is constrained by the manufacturing restrictions of the punches 4 and 5 and the die for them as described in the prior art. Without this, it is possible to appropriately set the processing conditions of the laser beam X and to divide the dividing line L into an arbitrary sectional shape, that is, to easily divide the tablet W by hand and to form the sectional shape with high dividing accuracy. Further, it is possible to prevent tableting troubles such as sticking when the dividing line L is marked by the convex portions 6 of the punches 4 and 5.

Next, the influence of the setting of the peak value (peak value) and frequency of the laser beam X in the processing conditions on the defective occurrence rate of the tablet W will be described. FIG. 4 is an explanatory diagram showing the relationship between the pulse peak value and the defect occurrence rate in the tablet dividing line processing method using the laser beam according to the first embodiment of the present invention.
FIG. 4 is an explanatory diagram showing a relationship between a pulse frequency and a defect occurrence rate in the tablet dividing line processing method using the laser beam according to the first embodiment of the present invention. As shown in FIG. 4, the defect occurrence rate tends to increase drastically as the pulse peak value decreases. This is because the lower the pulse peak value is, the wider the area affected by heat around the dividing line L at the time of irradiation with the laser beam X becomes, so that cracks are significantly generated and it is difficult to divide the regular dividing line L. This is because. Therefore, for example, in order to suppress the defect occurrence rate to 20% or less, the pulse peak value is set to 28
It is necessary to set it to 0 W or higher.

As shown in FIG. 5, the defect occurrence rate tends to increase drastically as the pulse frequency increases. This is also because the higher the pulse frequency is, the more the region affected by heat around the dividing line L spreads and the cracks become more prominent. For example, in order to suppress the defect occurrence rate to 20% or less, It is necessary to set the pulse frequency to 400 Hz or less. FIG. 6 is a vertical sectional view showing another example of the tablet manufactured by the tablet dividing line processing method using the laser beam of the first embodiment of the present invention, and FIG. 7 shows the laser beam of the first embodiment of the present invention. It is explanatory drawing which shows the relationship between the formation location of a dividing line and the error of the dividing line processing method of the used tablet.

On the other hand, in the method of processing the dividing line L described above, the dividing line L is formed only on the front surface of the tablet W, but as shown in FIG. 6, the dividing line L may be formed on the back surface as well. it can. In this case, for example, a function of reversing the front and back of the tablet W is added to the place where the dividing line processing step of the tableting machine shown in FIG. 1 is performed, and the tablet W is processed after the dividing line L on the front side is processed.
And the dividing line L may be processed again on the back surface side.
As shown in FIG. 7, the error when the dividing line L is formed only on the front surface (the error of the actual weight with respect to the weight required after the division) varies widely within a range of ± 20%. It can be seen that when the dividing line L is formed, the error is significantly reduced to about ± 4%.

As described above, according to the dividing line processing method of the tablet W using the laser beam X of the present embodiment, the granular material P which is the raw material of the tablet W is compressed to form the tablet W having a predetermined shape, and the compression is performed. A laser beam X is focused and irradiated on the tablet W after molding, and the laser beam X is moved in the XY directions to form a dividing line L on the tablet W. This configuration corresponds to the embodiment of the invention of claims 1 and 2. Therefore, since the dividing line L is processed by using the laser beam X, it is not necessary to form the convex portion 6 for marking the dividing line L on the punches 4 and 5 for compression-molding the tablet W. It is possible to simplify the production of 5 and its master mold. Also, the pestle 4,
5, without being restricted by the manufacturing restrictions of the mother die, the dividing line L can be processed into an ideal cross-sectional shape by appropriately setting the processing conditions of the laser beam X, and the easiness of dividing the tablet W and the dividing accuracy can be improved. Can be increased. Furthermore, tableting troubles such as sticking when the dividing line L is marked by the convex portions 6 of the punches 4 and 5 can be prevented, and the quality of the tablets W can be improved.

Further, in the dividing line processing method for the tablet W using the laser beam X of this embodiment, the dividing line L is formed on each of the front surface and the back surface of the tablet W by irradiating the laser beam X on the front surface and the back surface. . This structure corresponds to the third embodiment of the invention. Therefore, since the dividing line L is formed on the front surface and the back surface of the tablet W, the dividing accuracy of the tablet W can be further improved.

Further, in the dividing line processing method of the tablet W using the laser beam X of the present embodiment, the output form of the laser beam X is pulse output, the peak value of the pulse output is high and the frequency is low. It has been set. This configuration corresponds to the embodiment of the invention of claim 9. Therefore,
By increasing the peak value and decreasing the frequency, the occurrence of cracks during irradiation with the laser beam X is reduced, and the defect occurrence rate can be significantly suppressed.

<Second Embodiment> Next, a second embodiment of the present invention will be described. FIG. 8 is a longitudinal sectional view showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to a second embodiment of the present invention. As shown in the figure, in the parting line processing method of the present embodiment, parting lines L are continuously formed not only on the front surface side of the tablet W but also on both side surfaces. In addition, in order to process the dividing line L in this manner, for example, a function of changing the posture of the tablet W by 90 ° is added to a portion of the tableting machine shown in FIG. The laser beam X may be sequentially irradiated onto one side surface, the front surface, and the other side surface while changing the posture. Then, the tablet W on which the dividing line L is formed in this manner has the dividing line L on the front and back sides of the first embodiment, as shown in FIG.
Similar to the tablet W formed with, the error during division is significantly reduced to about ± 4%.

As described above, according to the method for processing the dividing line of the tablet W using the laser beam X of this embodiment, the surface and both side surfaces of the tablet W are irradiated with the laser beam X, and the dividing line continuous from the surface to both side surfaces. It forms L. This configuration corresponds to the embodiment of the invention of claim 4. Therefore,
Since the dividing line L is continuously formed from the surface of the tablet W to both side surfaces, the dividing accuracy of the tablet W can be further enhanced.

<Third Embodiment> Next, a third embodiment of the present invention will be described. FIG. 9 is a vertical cross-sectional view showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to a third embodiment of the present invention.

As shown in the drawing, in the parting line processing method of this embodiment, the parting lines L are formed deeper at both ends of the tablet W. In order to process the dividing line L in this manner, when the laser beam X is applied to both ends of the tablet W, the average output may be increased as compared with the central part, or the processing speed may be reduced. As described above, according to the dividing line processing method for the tablet W using the laser beam X according to the present embodiment, the average output of the laser beam X is calculated during the irradiation of the tablet W with the laser beam X.
Is to be increased at both ends of. This structure corresponds to the fifth embodiment of the invention. Further, the dividing line processing method of the tablet W using the laser beam X of the present embodiment reduces the processing speed at both ends of the tablet W during irradiation of the tablet W with the laser beam X. This structure corresponds to the embodiment of the invention of claim 6.
Therefore, since the dividing line L is formed deeper at both ends of the tablet W, the dividing accuracy of the tablet W can be further enhanced.

<Fourth Embodiment> Next, a fourth embodiment of the present invention will be described. 10 is a perspective view showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to a fourth embodiment of the present invention, and FIG. 11 is a tablet using a laser beam according to a fourth embodiment of the present invention. It is the ZZ sectional view taken on the line of FIG. 10 which shows the tablet manufactured by the dividing line processing method.

As shown in the figure, in the dividing line processing method of this embodiment, the dividing line L is formed on the bottom of the concave groove Wa formed on the surface of the tablet W. The manufacturing procedure is as follows:
A convex portion corresponding to the concave groove Wa is provided on the upper punch 4 of the tableting machine to form a concave groove Wa having a square cross section at the same time when the tablet W is compression-molded, and then a laser beam is applied along the concave groove Wa. Irradiation forms a dividing line L on the bottom. As is well known, if the processing speed is increased due to the manufacturing efficiency and the like, a higher output is required for the laser beam X, for example, 1200 W
Although cracks due to thermal shock are generated at a certain degree and the division accuracy is lowered, when the division line L is formed along the concave groove Wa as described above, the cracks are concentrated in the direction of the concave groove Wa, It is possible to prevent the above-mentioned deterioration of the division accuracy. As described above, according to the dividing line processing method of the tablet W using the laser beam X of the present embodiment, the preliminary concave groove Wa is formed at the position where the dividing line L should be formed by the laser beam X when the tablet W is compression-molded. And the laser beam X along the groove Wa.
To irradiate. This structure corresponds to the embodiment of the invention of claim 7. Therefore, since the cracks generated by the thermal shock of the laser beam X are concentrated in the direction of the concave groove Wa, it is possible to prevent deterioration of the division accuracy due to the cracks.

<Fifth Embodiment> Next, a fifth embodiment of the present invention will be described. 12 and 13 are longitudinal sectional views showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to a fifth embodiment of the present invention.

As shown in the figure, in the dividing line machining method of this embodiment, the dividing line L is intermittently formed so as to form a broken line. In addition, in order to process the dividing line L in this way, the pulse peak value is set high (duty factor is small) and the pulse frequency is set low, and the laser beam X is output as a pulse. Can include the latter processing conditions in Tables 2, 4, and 6 described in the first embodiment. Then, since the irradiation energy per pulse is increased by thus outputting the laser beam X as a pulse output, the dividing line L can be formed deeper without expanding the width. In addition, in the example of Table 6, it is shown that the dividing line L having a width / depth dimensional ratio of 1: 4 or more can be formed. As described above, in the dividing line processing method of the tablet W using the laser beam X of the present embodiment, the output form of the laser beam X is a pulse output, and the pulse output forms a broken dividing line L. To do. This constitution corresponds to the embodiment of the invention of claim 8. Therefore, as the irradiation energy per pulse increases, the dividing line L can be formed deeper without increasing the width, and the dividing accuracy of the tablet W can be further improved. Further, when this dividing line processing method is applied to a film-coated tablet, there is also an advantage that the film coating film is less damaged than the continuous dividing line L.

<Sixth Embodiment> Next, a sixth embodiment of the present invention will be described. FIG. 14 is a perspective view showing an implementation state of a tablet dividing line processing method using a laser beam according to a sixth embodiment of the present invention.

As shown in the figure, in the dividing line processing method of this embodiment, after the dividing line L is processed, the surface of the tablet W is irradiated with the laser beam X with the focus shifted toward the front side. is doing. Then, by this irradiation, the surface layer of the tablet W is once melted and then changed into glass and solidified.
Therefore, when the tablet W is ingested into the body, the original component of the tablet W is not absorbed into the body until the glass is completely melted, and the absorption rate can be delayed.

Since the thickness of the vitreous material formed varies depending on the processing conditions, the processing conditions can be changed as appropriate to adjust the absorption rate into the body. As described above, the method of processing the parting line of the tablet W using the laser beam X of the present embodiment is such that after the parting line L is processed, the surface of the tablet W is irradiated with the laser beam X in a defocused state, Tablet W
The surface layer of is melted. This structure is claim 1.
0 corresponds to the embodiment of the invention. Therefore,
Due to the irradiation of the laser beam X, the surface layer of the tablet W is once melted and then changed into glass and solidified.
The absorption rate when ingested can be arbitrarily delayed, and the application of the tablet W can be expanded.

<Seventh Embodiment> Next, a seventh embodiment of the present invention will be described. FIG. 15 is a perspective view showing an implementation state of a tablet dividing line processing method using a laser beam according to a seventh embodiment of the present invention, and FIG. 16 is a tablet dividing line using a laser beam according to a seventh embodiment of the present invention. It is a cross-sectional perspective view which shows the tablet manufactured by the processing method.

As shown in the figure, in the dividing line processing method of this embodiment, the joint parts Wp which are divided into four and compression molded are arranged so as to form the tablet W, and the joint surface is irradiated with the laser beam X. And are welded to each other, and the non-welded portion on the back surface side is defined as the dividing line L. Hereinafter, the processing procedure will be described in detail. First, the die 3, upper punch 4, and lower punch 5 of the tableting machine are manufactured in a shape corresponding to the joining parts Wp, and the powder P is used by using the tableting machine.
The four joined parts Wp are compression molded. Next, when the joining parts Wp are arranged so as to form the tablet W, one side of the joining surfaces intersects each other in a cross shape on the surface side of the tablet W, and the laser beam X is irradiated along the one side. Partially weld the joint surface. As a result, each joint part W
p is joined to each other via the welded portion T to form a tablet W, and when the tablet W is manually divided, the non-welded portion on the back surface side functions as the dividing line L. When the joining parts Wp are joined, if the laser beam X is pulsed as in the fifth embodiment, the welded portion T is formed intermittently.

As described above, according to the dividing line processing method of the tablet W using the laser beam X of the present embodiment, the granular material P which is the raw material of the tablet W is compressed and the tablet W is divided into four parts. Each of the joining parts Wp is formed, and the joining parts Wp are arranged so as to form the tablet W, and the joining surface is partially welded by irradiating the laser beam X along one side of the joining surfaces. To do. This structure corresponds to the embodiment of the invention of claim 11.

Therefore, since the non-welded portion of the joint surface of each joint part Wp functions as the dividing line L and the dividing line L is processed by using the laser beam X in this way, the punch for compressing the tablet W is used. Since it is not necessary to form the convex portion 6 for marking the dividing line L on the 4,5, it is possible to simplify the manufacturing of the punches 4, 5 and the die. Further, the processing conditions of the laser beam X can be appropriately set and the dividing line L, that is, the non-welded portion can be set to an ideal shape without being restricted by the manufacturing restrictions of the punches 4, 5 and the mother die. It is possible to increase the ease of division and the precision of division. Furthermore, the dividing line L
It is possible to prevent tableting troubles such as sticking when the mark is stamped, and improve the quality of the tablet W. Further, in the parting line processing method of the tablet W using the laser beam X of the present embodiment, the output form of the laser beam X is a pulse output, and the pulse output forms the intermittent welded portion T having a broken line shape. It is a thing. This structure corresponds to the embodiment of the invention of claim 12. Therefore, the welded portions T for joining the respective joining parts Wp are intermittently formed, so that the dividing accuracy of the tablet W can be further improved.

[0063]

As described above, according to the tablet dividing line processing method using the laser beam of claims 1 and 2, since the dividing line is processed by using the laser beam, the tablet is compression molded. Since it is not necessary to form a convex portion for marking a dividing line on the punch to be manufactured, it is possible to simplify the manufacturing of the punch and its mother die. Further, without being restricted by the manufacturing restrictions of the mother die and the punch, the dividing line can be processed into an ideal sectional shape by appropriately setting the processing conditions of the laser beam, and the easiness of dividing the tablet and the dividing accuracy are improved. be able to. Further, it is possible to prevent tableting troubles such as sticking when the dividing line is marked by the convex portion of the punch, and improve the quality of the tablet.

According to the tablet dividing line processing method using the laser beam of claim 3, since the dividing lines are formed on the front surface and the back surface of the tablet, the tablet dividing accuracy can be further improved.

According to the tablet dividing line processing method using a laser beam of claim 4, since the dividing line is continuously formed from the surface of the tablet to both side surfaces, the tablet dividing accuracy can be further enhanced. .

According to the tablet dividing line processing method using the laser beam of claims 5 and 6, the output of the laser beam during irradiation of the tablet is changed, or the relative speed of the laser beam and the tablet is changed. By doing so, for example, the dividing line is formed deeper at both ends of the tablet, and the tablet dividing accuracy can be further enhanced.

According to the tablet dividing line processing method using a laser beam of claim 7, since the dividing line is formed by irradiating the laser beam along the concave groove, cracks due to thermal shock of the laser beam are generated. By concentrating in the direction of the groove, it is possible to prevent deterioration of the division accuracy due to cracks.

According to the tablet dividing line processing method using a laser beam of claim 8, since the irradiation energy per pulse is increased by using the laser beam as a pulse output, the division is performed without expanding the width. The line can be formed deeper to further improve the tablet dividing accuracy.

According to the tablet dividing line processing method using the laser beam of claim 9, since the peak value of the pulse output is set to be high and the frequency is set to be low, the occurrence of cracks during irradiation of the laser beam is prevented. The rate of occurrence of defects can be significantly reduced by reducing the number.

According to the tablet dividing line processing method using a laser beam of claim 10, since the surface layer of the tablet is once melted by irradiation of the laser beam with a defocused point, it is transformed into glass and solidifies. The absorption rate when the tablet is ingested into the body can be arbitrarily delayed, and the application of the tablet can be expanded.

According to the tablet dividing line processing method using the laser beam of claim 11, since the dividing line is processed by using the laser beam, the dividing line is marked on the punch for compression molding the tablet. Since it is not necessary to form a convex portion, it is possible to simplify the manufacturing of the punch and its master block. Also, without being restricted by the manufacturing restrictions of the mother die and the punch, the dividing line, that is, the non-welded portion can be set to an arbitrary shape by appropriately setting the processing conditions of the laser beam, and it is easy to divide the tablet and divide it. The accuracy can be increased. Further, it is possible to prevent tableting troubles such as sticking when the dividing line is marked by the convex portion of the punch, and improve the quality of the tablet.

According to the tablet dividing line processing method using a laser beam of claim 12, since the welded portions for joining the respective joining parts are intermittently formed, the tablet dividing accuracy can be further enhanced.

[Brief description of drawings]

FIG. 1 is a configuration diagram schematically showing a laser processing apparatus for carrying out a tablet dividing line processing method using a laser beam according to a first embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to the first embodiment of the present invention.

FIG. 4 is an explanatory diagram showing a relationship between a pulse peak value and a defect occurrence rate in the tablet dividing line processing method using the laser beam according to the first embodiment of the present invention.

FIG. 5 is an explanatory diagram showing a relationship between a pulse frequency and a defect occurrence rate in the tablet dividing line processing method using the laser beam according to the first embodiment of the present invention.

FIG. 6 is a vertical cross-sectional view showing another example of the tablet manufactured by the tablet dividing line processing method using the laser beam according to the first embodiment of the present invention.

FIG. 7 is an explanatory diagram showing a relationship between a dividing line formation position and an error in the tablet dividing line processing method using the laser beam according to the first embodiment of the present invention.

FIG. 8 is a vertical cross-sectional view showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to a second embodiment of the present invention.

FIG. 9 is a vertical cross-sectional view showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to a third embodiment of the present invention.

FIG. 10 is a perspective view showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to a fourth embodiment of the present invention.

FIG. 11 is a sectional view taken along line ZZ of FIG. 10 showing a tablet manufactured by the tablet dividing line processing method using a laser beam according to the fourth embodiment of the present invention.

FIG. 12 is a longitudinal sectional view showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to a fifth embodiment of the present invention.

FIG. 13 is a longitudinal sectional view showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to a fifth embodiment of the present invention.

FIG. 14 is a perspective view showing an implementation state of a tablet dividing line processing method using a laser beam according to a sixth embodiment of the present invention.

FIG. 15 is a perspective view showing an implementation state of a tablet dividing line processing method using a laser beam according to a seventh embodiment of the present invention.

FIG. 16 is a sectional perspective view showing a tablet manufactured by a tablet dividing line processing method using a laser beam according to a seventh embodiment of the present invention.

FIG. 17 is a partial cross-sectional view showing a tableting machine for compression-molding a conventional tablet.

FIG. 18 is an explanatory view showing a conventional compression molding procedure for tablets.

[Explanation of symbols]

 X Laser beam W Tablet L Dividing line P Granule Wp Joining part Wa Recessed groove

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Sadano Miwa 54-23 Fuji Village, Mishima City, Shizuoka Prefecture (72) Inventor Yu Kanaoka 5-1-1 Yata Minami, Higashi-ku, Aichi Prefecture Mitsubishi Electric Corporation Nagoya Works (72) Inventor Tsuyoshi Kato 3-28-12 Meieki, Nakamura-ku, Nagoya-shi, Aichi Mitsubishi Electric Corporation Chubu branch office

Claims (12)

[Claims] 1. A laser beam is focused and irradiated onto a tablet,
A dividing line processing method for a tablet using a laser beam, characterized in that the dividing line is formed on the tablet by relatively moving the laser beam and the tablet. 2. A tablet forming step of compressing a powder or granular material which is a raw material of a tablet to form a tablet having a predetermined shape; and concentrating a laser beam to irradiate the tablet, the laser beam and the tablet being relatively opposed to each other. And a dividing line processing step of moving the tablet to form a dividing line on the tablet. 3. The dividing line of a tablet using a laser beam according to claim 1, wherein the laser beam is applied to the front surface and the back surface of the tablet to form a dividing line on each of them. Processing method. 4. The laser beam according to claim 1, wherein the laser beam is applied to the surface and both side surfaces of the tablet to form continuous dividing lines from the surface to both side surfaces. Method of dividing line of tablets used. 5. During the irradiation of the tablet with the laser beam,
The tablet dividing line processing method using a laser beam according to any one of claims 1 to 4, wherein the output of the laser beam is changed. 6. During the irradiation of the tablet with the laser beam,
5. The tablet dividing line processing method using a laser beam according to claim 1, wherein a relative speed between the laser beam and the tablet is changed. 7. The laser device is characterized in that a preliminary concave groove is engraved at the time of compression molding of a tablet at a position where a dividing line should be formed by the laser beam, and the laser beam is irradiated along the concave groove. A tablet dividing line processing method using the laser beam according to claim 1. 8. The output form of the laser beam is a pulse output, and the pulse output forms an intermittent dividing line having a broken line shape. A parting line processing method for tablets using a laser beam according to. 9. The output form of the laser beam is a pulse output, and the peak value of the pulse output is set high and the frequency is set low.
A tablet dividing line processing method using the laser beam according to any one of 1. 10. After the processing of the dividing line, the tablet is irradiated with a laser beam in a defocused state, and the laser beam and the tablet are relatively moved to melt the surface layer of the tablet. A tablet dividing line processing method using a laser beam according to any one of claims 1 to 9. 11. A powdery material as a raw material for tablets is compressed,
A joint part forming step of forming a plurality of joint parts each having a divided tablet shape, and arranging each joint part so as to form a tablet, and irradiating a laser beam along one side of the mutual joint surfaces. And a joining part welding step of partially welding the joining surfaces by means of a laser beam. 12. The tablet using the laser beam according to claim 11, wherein the output form of the laser beam is a pulse output, and the pulse output forms an intermittent welded portion having a broken line shape. Dividing line machining method.