JPH07183628A - Electronic part - Google Patents

Electronic part

Info

Publication number
JPH07183628A
JPH07183628A JP5329036A JP32903693A JPH07183628A JP H07183628 A JPH07183628 A JP H07183628A JP 5329036 A JP5329036 A JP 5329036A JP 32903693 A JP32903693 A JP 32903693A JP H07183628 A JPH07183628 A JP H07183628A
Authority
JP
Japan
Prior art keywords
solder
electronic component
electrodes
cream solder
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5329036A
Other languages
Japanese (ja)
Other versions
JP3344049B2 (en
Inventor
Seiji Sakami
省二 酒見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP32903693A priority Critical patent/JP3344049B2/en
Publication of JPH07183628A publication Critical patent/JPH07183628A/en
Application granted granted Critical
Publication of JP3344049B2 publication Critical patent/JP3344049B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide an electronic part which does not cause inequality in fusion or a bridge when heating cream solder applied on electrodes so as to fuse it, in a bump formation method which forms bumps on the electrodes made in matrix shape on the surface of the electronic part by screen printing means. CONSTITUTION:In an electronic part 11 where bumps 4 are made by applying cream solder 3 on the electrodes 12 made in matrix shape on the surface and heating this cream solder 3 so as to fuse and harden it, extensions 12 extending outwards are made at the peripheries of the electrodes 12. Accordingly, when the cream solder 3 is fused by heating the electronic part 11 in a heating furnace, the solder 4 flows out sideways, but the solder 4 having flown out is pulled by the extension 12a, so excessive outflow is checked, and the occurrence of inequality in fusion or a bridge can be dissolved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、マトリクス状に形成さ
れた電極上にスクリーン印刷手段によりバンプを形成す
る電子部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component in which bumps are formed on a matrix-shaped electrode by screen printing means.

【０００２】[0002]

【従来の技術】基板やチップなどの電子部品を小型高密
度化するための手段として、電子部品の表面に電極をマ
トリクス状に多数個形成し、この電極上にバンプ（突出
電極）を形成することが知られている。またバンプの形
成方法として、スクリーン印刷手段により電極上にクリ
ーム半田を塗布した後、電子部品を加熱炉で加熱するこ
とにより、クリーム半田を溶融固化させてバンプを形成
する方法が知られている。2. Description of the Related Art As a means for reducing the size and density of electronic parts such as substrates and chips, a large number of electrodes are formed in a matrix on the surface of the electronic parts, and bumps (protruding electrodes) are formed on the electrodes. It is known. As a method for forming bumps, a method is known in which after applying cream solder to the electrodes by screen printing means, the electronic solder is heated in a heating furnace to melt and solidify the cream solder to form bumps.

【０００３】[0003]

【発明が解決しようとする課題】スクリーン印刷手段に
よれば、バンプを低コストで作業性よく形成できる利点
があるが、クリーム半田をリフロー装置の加熱炉で加熱
して溶融させた際に、溶融したクリーム半田が流動して
融合不均一化、又はブリッジを生じ、バンプ形成不良が
発生しやすいという問題点があった。以下、融合不均一
化、又はブリッジが生じる理由について説明する。The screen printing means has an advantage that bumps can be formed at low cost and with good workability. However, when the cream solder is heated and melted in the heating furnace of the reflow apparatus, it is melted. There is a problem in that the cream solder flows to cause non-uniform fusion or a bridge, and defective bump formation easily occurs. Hereinafter, the reason why fusion nonuniformity or bridging occurs will be described.

【０００４】図７は従来の電子部品の平面図であって、
電子部品１の表面には電極２がマトリクス状に多数個形
成されている。この電極２上にスクリーン印刷手段によ
りクリーム半田を塗布した後、このクリーム半田をリフ
ロー装置の加熱炉で加熱して溶融固化させることによ
り、バンプを形成するものである。FIG. 7 is a plan view of a conventional electronic component.
A large number of electrodes 2 are formed in a matrix on the surface of the electronic component 1. After applying the cream solder to the electrode 2 by the screen printing means, the cream solder is heated in a heating furnace of the reflow apparatus to be melted and solidified to form bumps.

【０００５】図８（ａ），（ｂ），（ｃ），（ｄ），
（ｅ）は従来の電子部品のバンプに融合不均一化、又は
ブリッジが生じるプロセスの説明図である。図８（ａ）
は電子部品１の表面の電極２上にスクリーン印刷手段に
よりクリーム半田３を塗布した状態を示している。図８
（ｂ）はこの電子部品１をリフロー装置の加熱炉におい
て加熱を開始して間もなくの予熱状態を示している。こ
の状態でクリーム半田３は次第に軟化して形状が崩れは
じめている。図８（ｃ）は加熱が更に進行し、半田４表
面の酸化膜除去のためにクリーム半田３に混合された液
状ロジン５が液化して流動化するとともに、クリーム半
田３に含まれる半田４が溶融した状態を示している。こ
の状態で、溶融した半田４が側方へ流出することによ
り、相隣る電極２上の半田４同士がつながってくる。図
８（ｄ）は加熱が更に進行して半田４が完全に溶融した
状態を示している。図８（ｃ）に示すように、相隣る電
極２上の溶融した半田４同士がつながった結果、溶融し
た半田４は内圧の低い方（本例では左側の半田４）へ押
し流され、次いで冷却されることにより半田４は固化し
て球形のバンプ４ａになる。その結果、左側の電極２上
には過大なバンプ４ａが形成され、右側の電極２上には
バンプは形成されない。あるいは、図８（ｅ）に示すよ
うに半田４が相隣る電極２上にまたがったまま冷却され
固化するとブリッジ６になる。このようなブリッジ６
は、電子部品１の小型高密度化のために、電極２を狭ピ
ッチ化するほど発生しやすいものである。8 (a), (b), (c), (d),
(E) is explanatory drawing of the process which fusion nonuniformity or the bridge generate | occur | produce in the bump of the conventional electronic component. Figure 8 (a)
Shows a state in which the cream solder 3 is applied to the electrode 2 on the surface of the electronic component 1 by screen printing means. Figure 8
(B) shows a preheating state shortly after heating of the electronic component 1 is started in the heating furnace of the reflow apparatus. In this state, the cream solder 3 is gradually softened and its shape is beginning to collapse. In FIG. 8C, as the heating further progresses, the liquid rosin 5 mixed with the cream solder 3 for removing the oxide film on the surface of the solder 4 is liquefied and fluidized, and the solder 4 contained in the cream solder 3 is removed. The molten state is shown. In this state, the melted solder 4 flows out laterally, so that the solders 4 on the adjacent electrodes 2 are connected to each other. FIG. 8D shows a state in which the heating further progresses and the solder 4 is completely melted. As shown in FIG. 8C, as a result of the melted solders 4 on the adjacent electrodes 2 being connected to each other, the melted solders 4 are swept toward the lower internal pressure (in this example, the solder 4 on the left side), and then When cooled, the solder 4 is solidified into spherical bumps 4a. As a result, an excessive bump 4a is formed on the left electrode 2 and no bump is formed on the right electrode 2. Alternatively, as shown in FIG. 8 (e), when the solder 4 is cooled and solidified while straddling the adjacent electrodes 2, it becomes a bridge 6. Such a bridge 6
Is more likely to occur as the pitch of the electrodes 2 is narrowed in order to reduce the size and density of the electronic component 1.

【０００６】そこで本発明は、バンプの大きさにばらつ
きが生じる融合不均一や、電極同士あるいはバンプ同士
を短絡させるブリッジの発生を解消できるバンプを形成
する電子部品を提供することを目的とする。SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an electronic component for forming bumps which can eliminate the non-uniform fusion that causes variations in bump size and the generation of bridges that short-circuit electrodes or bumps.

【０００７】[0007]

【課題を解決するための手段】このために本発明は、上
記従来の問題点を解決するために、電子部品の電極に、
その周囲から外方へ延出する延出部を形成したものであ
る。Therefore, in order to solve the above-mentioned conventional problems, the present invention provides an electrode for an electronic component,
The extending portion is formed to extend outward from the periphery thereof.

【０００８】[0008]

【作用】上記構成において、加熱炉において電子部品を
加熱して半田を溶融させると、半田は側方へ流出する
が、流出した半田は延出部に吸い付けられることにより
過大な流出は阻止され、融合不均一、又はブリッジが発
生することはない。In the above structure, when the electronic parts are heated in the heating furnace to melt the solder, the solder flows out to the side, but the flowed-out solder is sucked by the extending portion to prevent an excessive outflow. , Non-uniform fusion, or bridging does not occur.

【０００９】[0009]

【実施例】次に、図面を参照しながら本発明の一実施例
を説明する。図１は本発明の一実施例の電子部品の平面
図、図２は同図１のＡ部分の拡大図である。電子部品１
１の表面には電極１２がマトリクス状に多数個形成され
ている。図２に示すように、本実施例の電極１２の平面
形状は円形であり、その周囲から外方へ舌片状の延出部
１２ａが複数個放射状に延出している。図３及び図４は
本発明の一実施例のスクリーン印刷機の断面図、図４は
同部分拡大断面図である。図３において、スクリーン印
刷機のスクリーンマスク７を電子部品１１の上面に近接
させ、スクリーンマスク７上をスキージ８を矢印方向に
摺動させることにより、クリーム半田３を電子部品１１
の電極１２上に塗布する。電子部品１１の表面には上記
電極１２が形成されており、またスクリーンマスク７の
電極１２に対応する箇所にはパターン孔９が開口されて
おり、したがってスキージ８を摺動させることにより、
電極１２上にクリーム半田３が塗布される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will now be described with reference to the drawings. 1 is a plan view of an electronic component according to an embodiment of the present invention, and FIG. 2 is an enlarged view of a portion A of FIG. Electronic component 1
A large number of electrodes 12 are formed in a matrix on the surface of 1. As shown in FIG. 2, the planar shape of the electrode 12 of this embodiment is circular, and a plurality of tongue-shaped extending portions 12a radially extend outward from the periphery thereof. 3 and 4 are sectional views of a screen printing machine according to an embodiment of the present invention, and FIG. 4 is an enlarged sectional view of the same. In FIG. 3, the screen solder 7 of the screen printing machine is brought close to the upper surface of the electronic component 11 and the squeegee 8 is slid on the screen mask 7 in the direction of the arrow to move the cream solder 3 to the electronic component 11.
It is applied on the electrode 12 of. The electrode 12 is formed on the surface of the electronic component 11, and the pattern hole 9 is opened at a position corresponding to the electrode 12 of the screen mask 7. Therefore, by sliding the squeegee 8,
The cream solder 3 is applied on the electrode 12.

【００１０】続いてこの電子部品１１をリフロー装置の
加熱炉へ送り、半田付けを行う。図５（ａ），（ｂ），
（ｃ），（ｄ）および図６（ａ），（ｂ），（ｃ），
（ｄ）は本発明の一実施例の電子部品のバンプの生成プ
ロセスの説明図である。図５は電子部品１１の部分断面
図、図６は電子部品１１の部分平面図であり、図５
（ａ），（ｂ），（ｃ），（ｄ）と図６（ａ），
（ｂ），（ｃ），（ｄ）はそれぞれ対応している。Subsequently, the electronic component 11 is sent to the heating furnace of the reflow apparatus and soldered. 5 (a), (b),
(C), (d) and FIGS. 6 (a), (b), (c),
FIG. 3D is an explanatory diagram of a bump forming process of an electronic component according to an embodiment of the present invention. 5 is a partial sectional view of the electronic component 11, and FIG. 6 is a partial plan view of the electronic component 11.
(A), (b), (c), (d) and FIG. 6 (a),
(B), (c), and (d) correspond to each other.

【００１１】図５（ａ）および図６（ａ）は電子部品１
１の表面の電極１２上にスクリーン印刷手段によりクリ
ーム半田３を塗布した状態を示している。図５（ｂ）お
よび図６（ｂ）はこの電子部品１１をリフロー装置の加
熱炉において加熱を開始して間もなくの予熱状態を示し
ている。図示するようにこの状態でクリーム半田３は次
第に軟化して形状が崩れはじめている。FIG. 5A and FIG. 6A show an electronic component 1.
1 shows a state in which the cream solder 3 is applied onto the electrode 12 on the surface of No. 1 by screen printing means. FIG. 5B and FIG. 6B show a preheating state immediately after the electronic component 11 is heated in the heating furnace of the reflow apparatus. As shown in the figure, in this state, the cream solder 3 gradually softens and begins to lose its shape.

【００１２】図５（ｃ）および図６（ｃ）は加熱が更に
進行し、半田４表面の酸化膜除去のためにクリーム半田
３に混合された液状ロジン５が液化して流動化するとと
もに、クリーム半田３に含まれる半田４が溶融した状態
を示している。この状態で、溶融した半田４は側方へ流
出しようとするが、半田４は延出部１２ａに吸い付けら
れるので、過大に流出して相隣る電極１２上の半田４同
士がつながって融合不均一、又はブリッジが生じるのは
避けられる。5 (c) and 6 (c), heating further progresses, and the liquid rosin 5 mixed in the cream solder 3 for removing the oxide film on the surface of the solder 4 is liquefied and fluidized, and The solder 4 contained in the cream solder 3 is melted. In this state, the melted solder 4 tries to flow out to the side, but since the solder 4 is adsorbed by the extending portion 12a, it excessively flows out and the solders 4 on the adjacent electrodes 12 are connected and fused. Non-uniformity or bridging is avoided.

【００１３】図５（ｄ）および図６（ｄ）は加熱が更に
進行して半田４が完全に溶融し、溶融した半田４の表面
張力により略球形のバンプ４ａが生成された状態を示し
ている。上述したように相隣る電極１２上の半田４同士
はつながらないので、各電極１２上には半田４自身の表
面張力により球形のバンプ４ａが生成する。5 (d) and 6 (d) show a state in which the solder 4 is completely melted by further heating and the surface tension of the melted solder 4 produces the substantially spherical bump 4a. There is. As described above, since the solders 4 on the adjacent electrodes 12 are not connected to each other, the spherical bumps 4a are generated on the electrodes 12 by the surface tension of the solder 4 itself.

【００１４】以上のように、本実施例によれば、クリー
ム半田３が加熱されて溶融しても、溶融した半田４同士
がつながってブリッジを生じることはなく、各電極１２
上に確実に所望形状のバンプ４ａを形成することができ
る。As described above, according to this embodiment, even if the cream solder 3 is heated and melted, the melted solder 4 does not connect to each other to form a bridge, and each electrode 12
The bump 4a having a desired shape can be reliably formed on the upper surface.

【００１５】[0015]

【発明の効果】以上説明したように本発明は、電子部品
の電極に、その周囲から外方へ延出する延出部を形成し
ているので、加熱炉において電子部品を加熱して半田を
溶融させると、半田は側方へ流出するが、流出した半田
は延出部に吸い付けられることにより過大な流出は阻止
され、したがって融合不均一やブリッジの発生を解消で
き、各電極上に略同寸、同形の大きさの揃った所望形状
のバンプを形成することができる。As described above, according to the present invention, the electrode of the electronic component is formed with the extending portion extending outwardly from the periphery thereof, so that the electronic component is heated in the heating furnace to solder the electronic component. When melted, the solder flows out to the side, but the outflowing solder is sucked by the extension part to prevent an excessive outflow, thus eliminating the non-uniform fusion and the occurrence of bridges. It is possible to form bumps of a desired shape having the same size and shape.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例の電子部品の平面図FIG. 1 is a plan view of an electronic component according to an embodiment of the present invention.

【図２】本発明の一実施例の電子部品の図１のＡ部分の
拡大図FIG. 2 is an enlarged view of portion A of FIG. 1 of an electronic component according to an embodiment of the present invention.

【図３】本発明の一実施例の電子部品のスクリーン印刷
機の断面図FIG. 3 is a sectional view of a screen printing machine for electronic parts according to an embodiment of the present invention.

【図４】本発明の一実施例の電子部品のスクリーン印刷
機の部分拡大断面図FIG. 4 is a partially enlarged sectional view of a screen printing machine for electronic parts according to an embodiment of the present invention.

【図５】（ａ）本発明の一実施例の電子部品のバンプの
生成プロセスの説明図 （ｂ）本発明の一実施例の電子部品のバンプの生成プロ
セスの説明図 （ｃ）本発明の一実施例の電子部品のバンプの生成プロ
セスの説明図 （ｄ）本発明の一実施例の電子部品のバンプの生成プロ
セスの説明図5A is an explanatory diagram of a bump producing process of an electronic component according to an embodiment of the present invention. FIG. 5B is an explanatory diagram of a bump producing process of an electronic component according to an embodiment of the present invention. Explanatory drawing of the bump production | generation process of the electronic component of one Example (d) Explanatory drawing of the bump production | generation process of the electronic component of one Example of this invention.

【図６】（ａ）本発明の一実施例の電子部品のバンプの
生成プロセスの説明図 （ｂ）本発明の一実施例の電子部品のバンプの生成プロ
セスの説明図 （ｃ）本発明の一実施例の電子部品のバンプの生成プロ
セスの説明図 （ｄ）本発明の一実施例の電子部品のバンプの生成プロ
セスの説明図6A is an explanatory diagram of a bump producing process of an electronic component according to an embodiment of the present invention. FIG. 6B is an explanatory diagram of a bump producing process of an electronic component according to an embodiment of the present invention. Explanatory drawing of the bump production | generation process of the electronic component of one Example (d) Explanatory drawing of the bump production | generation process of the electronic component of one Example of this invention.

【図７】従来の電子部品の平面図FIG. 7 is a plan view of a conventional electronic component.

【図８】（ａ）従来の電子部品のバンプに融合不均一、
又はブリッジが生じるプロセスの説明図 （ｂ）従来の電子部品のバンプに融合不均一、又はブリ
ッジが生じるプロセスの説明図 （ｃ）従来の電子部品のバンプに融合不均一、又はブリ
ッジが生じるプロセスの説明図 （ｄ）従来の電子部品のバンプに融合不均一、又はブリ
ッジが生じるプロセスの説明図 （ｅ）従来の電子部品のバンプに融合不均一、又はブリ
ッジが生じるプロセスの説明図FIG. 8 (a) Non-uniform fusion with conventional bumps of electronic parts,
Or (b) an explanatory view of a process in which bumps of a conventional electronic component are fused or non-uniform, or a process in which a bridge occurs, (c) a process of producing non-uniform fusion or bumps in a bump of a conventional electronic component Explanatory drawing (d) Explanatory drawing of the process in which fusion nonuniformity or bridge occurs in the bump of the conventional electronic component (e) Explanatory drawing of process in which fusion nonuniformity or the bridge occurs in bump of conventional electronic component

【符号の説明】[Explanation of symbols]

３ クリーム半田 ４ａ バンプ １１ 電子部品 １２ 電極 １２ａ 延出部 3 Cream Solder 4a Bump 11 Electronic Component 12 Electrode 12a Extension Part

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】マトリクス状に形成された電極上にクリー
ム半田を塗布し、このクリーム半田を加熱して溶融固化
させることによりバンプを形成する電子部品であって、
前記電極にその周囲から外方へ延出する延出部を形成し
たことを特徴とする電子部品。1. An electronic component for forming bumps by applying cream solder to electrodes formed in a matrix and heating and melting and solidifying the cream solder.
An electronic component, wherein an extension portion is formed on the electrode so as to extend outward from the periphery thereof.
JP32903693A 1993-12-24 1993-12-24 Electronic components Expired - Fee Related JP3344049B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32903693A JP3344049B2 (en) 1993-12-24 1993-12-24 Electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32903693A JP3344049B2 (en) 1993-12-24 1993-12-24 Electronic components

Publications (2)

Publication Number Publication Date
JPH07183628A true JPH07183628A (en) 1995-07-21
JP3344049B2 JP3344049B2 (en) 2002-11-11

Family

ID=18216889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32903693A Expired - Fee Related JP3344049B2 (en) 1993-12-24 1993-12-24 Electronic components

Country Status (1)

Country Link
JP (1) JP3344049B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998033212A1 (en) * 1997-01-23 1998-07-30 Seiko Epson Corporation Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998033212A1 (en) * 1997-01-23 1998-07-30 Seiko Epson Corporation Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment
US6175151B1 (en) 1997-01-23 2001-01-16 Seiko Epson Corporation Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument
US6414382B1 (en) 1997-01-23 2002-07-02 Seiko Epson Corporation Film carrier tape, semiconductor assembly, semiconductor device and method of manufacturing the same, mounted board, and electronic instrument
US6646338B2 (en) 1997-01-23 2003-11-11 Seiko Epson Corporation Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument

Also Published As

Publication number Publication date
JP3344049B2 (en) 2002-11-11

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