JPH07181575A - Built-in substrate for camera - Google Patents

Abstract

PURPOSE:To miniaturize a camera without making the height of the camera high by specifying the position of a substrate on which an IC circuit is placed and a location on which the IC circuit is placed. CONSTITUTION:A data substrate 6 on which an LED driving circuit 7 is placed is positioned between a finder block 10 or a focusing detecting optical system and a photographing optical path reaching an aperture 3 from a photographing lens. The LED driving circuit 7 is placed on the surface of the substrate 6 on the finder block 10 side or a focusing detecting optical system side and on the side of the finder block 10 or the focusing detecting optical system. The data substrate 6 and the finder block are not pushed up by the thickness of the LED driving circuit 7 in terms of the height of the camera 21 in the case of arranging the data substrate 6 in this way. Thus, the camera can be miniaturized without making the height of the camera high.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to miniaturization of a camera.

[0002]

2. Description of the Related Art The prior art will be described with reference to FIG. 5 as an example of the prior art. FIG. 5 is a lens shutter camera, and shows a plan view when viewed from the back cover side of the camera. The camera 24 is a normal wind type camera in which a film for one frame is wound up from a cartridge (not shown) toward the spool 4 after the shooting is completed. Further, the fixed lens barrel 1 of the photographing lens fixed to the body of the camera 24
A finder block 10, which is a finder optical system, is arranged near the spool chamber 16 with respect to 9, and incorporates a date imprinting device including a light source unit for imprinting a date character on a film and a drive circuit therefor. An imprinting optical system for imprinting a date character output from the date imprinting device on the film surface is provided near the spool 4 with respect to the aperture 3 and at a position not interfering with the spool 4.
After filming, the date characters are exposed on the film while winding one frame. The date substrate 6 of the date imprinting apparatus is located between the finder block 10 and the photographing optical path from the photographing lens to the aperture 3 in a shape elongated along the longitudinal direction of the camera 24 as shown in FIG. 6 is a single-sided board in which a circuit exists only on the surface on the photographing optical path side. On the surface of the date substrate 6 on the side of the photographing optical path, there are an LED array 9 for imprinting the date on the film near the spool chamber 16 and an LED near the fixed lens barrel 19.
An LED drive circuit (hereinafter abbreviated as COB) 7 for controlling lighting and extinguishing of the array 9 is arranged. The COB 7 is composed of an IC circuit or the like, and the COB 7 has a thickness A as shown in FIG. COB7 is a fixed lens barrel 1
As shown in FIG. 5, the uppermost end portion 19a of the outermost diameter 9 is close. Therefore, if the COB 7 is arranged so as not to interfere with the uppermost end portion 19a, the position of the date substrate 6 is set to the uppermost end portion 19a.
To the height position where the thickness of COB7 is added. Therefore, the height of the camera 24 is a position obtained by adding the height of the finder block 10 to this position, and the height of the camera is increased by the thickness of the COB 7.

[0003]

In the above-mentioned conventional technique, the height of the camera becomes high, which hinders downsizing. An object of the present invention is to reduce the size of a camera by optimizing the mounting place of IC circuits.

[0004]

1 is a block diagram showing the construction of a built-in substrate of a camera which achieves this object according to a first embodiment of the present invention.
The following is a description with reference to the reference numerals of FIG. In a camera (21) having a built-in substrate (6) on which an IC circuit (7) is mounted, the substrate (6) includes a finder optical system (10) or a focus detection optical system (20) and an aperture (3) from a taking lens. The IC circuit (7) is located on the finder optical system (10) side of the substrate (6) or the focus detection optical system (20) side, and is located between the finder optical system (10) or It is characterized in that it is mounted on the side of the focus detection optical system (20).

[0005]

With the configuration as described above, the camera can be miniaturized without increasing the height of the camera, which is a problem that hinders miniaturization of the camera.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the embodiments shown in the accompanying drawings. FIG. 1 shows a first embodiment of the present invention and is a perspective view of the camera as viewed from the back cover side. FIG. 2 is a plan view of the camera of the embodiment as viewed from the back cover side. In the camera 21 shown in FIGS. 1 and 2, the finder block 10 is arranged near the spool chamber 16 with respect to the fixed lens barrel 19 of the taking lens, and date characters such as the date and time taken as the photographing information are displayed on the film surface. It is a normal wind type lens shutter camera with a built-in date imprinting device.

The projection optical system is provided near the spool 4 with respect to the aperture 3 and at a position where it does not interfere with the spool 4. The date substrate 6 of the date imprinting device is located between the finder block 10 and its photographing optical path in a shape elongated along the longitudinal direction of the camera 21, and circuits are present on both surfaces of the date substrate 6. It is a double-sided board. An LED for imprinting the date on the film near the spool chamber 16 on the surface of the date substrate 6 on the side of the photographing optical path.
Array 9 and finder block 10 on date board 6
On the side surface, a COB 7 for controlling lighting and extinguishing of the LED array 9 is arranged near the fixed lens barrel 19 of the photographing lens fixedly mounted on the main body of the camera 21. COB7 is an IC
It is composed of a circuit or the like, and has a thickness A as shown in FIG. Further, the date substrate 6 is arranged so as to be close to the outermost upper end portion 19a of the fixed lens barrel 19 in order to reduce the size of the camera 21.

When the date substrate 6 is arranged in this way, the height of the camera 21 does not raise the date substrate 6 and the finder block 10 by the thickness A of the COB 7 shown in FIG.
Therefore, the height of the camera 21 is lower than the height of the camera 24 by the thickness A of the COB 7 when compared with the height of the camera 24 of FIG. By arranging the date substrate 6 in this way, the camera can be downsized without increasing the height of the camera.

FIG. 3 shows a second embodiment of the present invention,
It is a top view when it sees from the case back side of a camera. The camera 22 shown in FIG. 3 is a lens shutter camera. Further, the camera 22 has two types, a prewind and a normal wind, in which all the films are wound on the spool 4 at a time after the film is loaded and one frame of film is rewound to a film patrone (not shown) at each shooting. It can be selected with a selection switch. Camera 22
Incorporates a date imprinting device, which is a device for imprinting date characters such as the date and time of photographing as photographing information.

The date substrate 6a of the camera 22 is arranged between the finder block 10 which is a finder optical system and its photographing optical path so as to extend in the longitudinal direction of the camera 22 as shown in FIG. The date substrate 6 is a double-sided substrate having circuits on both sides. Further, as shown in FIG. 3, on the surface of the date substrate 6a on the side of the photographing optical path, a prewind LED array 9a is provided near the cartridge chamber 18.
The normal wind LED array 9b is arranged near the spool chamber 16 on the same surface. On the surface of the date substrate 6 on the finder block 10 side, L is arranged near the fixed lens barrel 19.
A COB 7a, which is a drive circuit for driving the ED arrays 9a and 9b to light, is arranged. There is a projection optical system corresponding to these LED arrays. LED array 9a
The optical system near the cartridge chamber 17 is for prewind, and corresponds to the LED array 9b.
The optical system near 6 is for normal wind. This prewind optical system measures the timing of lighting and extinguishing so that the date characters are correctly formed on the film during the rewinding of one frame of film to the film patrone each time it is photographed, and the film surface is For the reason that the date characters are exposed, it is closer to the Patrone room 17 and the Patrone room 17
It is placed in a position that does not interfere with. Here, for example, in the imprinting operation when the prewind side is selected by the selection switch, first, a selection signal in which the prewind side is selected is input to the date substrate 6a via the flexure 8. CO on the finder block 10 side of the date substrate 6a
B7a switches the circuit to drive the LED array 9a for lighting. In addition, the detector central control circuit detects the film winding speed. And LED so that the characters to be imprinted on the film are formed correctly
A signal for lighting any one of the seven segments of the array 9a is output to the COB 7a. Here, the seven segments are arranged so as to be parallel to the optical axis of the photographing optical system. When the LED array 9a is turned on, the light flux passes through the prewind optical system and reaches the film surface to expose the film. That is, the date is imprinted on the film surface. Therefore, in the camera 22 in which two types of prewind and normal wind can be selected, when the IC circuit as shown in FIG. 5 of the conventional example is mounted, the thickness A of the COB 7a and the date substrate 6a are lifted. Not suitable for miniaturization. As a result, the height of the camera 22 does not raise the date substrate 6a and the finder block 10 by the thickness A of the COB 7a. Therefore, even if the camera 22 is applied to such a camera, the height of the camera is not increased. The size can be reduced.

FIG. 4 shows a third embodiment and is a plan view as seen from the back cover side of the camera. The camera 23 shown in FIG. 4 is a lens shutter camera, and includes a focus detection optical system 20 for focus detection. Also the camera 23
Is a normal wind type camera with a built-in date imprinting device that imprints date characters such as the date and time of photographing as photographing information on the film surface.

The projection optical system is provided near the spool 4 at a position where it does not interfere with the spool 4. The date substrate 6b of the date imprinting device is located between the focus detection optical system 20 and its photographing optical path in a shape that extends along the longitudinal direction of the camera 23 as shown in FIG.
It is a double-sided board with circuits on both sides of b. An LED array 9b for imprinting the date on the film near the spool chamber 16 on the surface of the date substrate 6b on the side of the photographing optical path.
On the surface of the date substrate 6b on the side of the focus detection optical system 20, the fixed lens barrel 1 of the photographing lens fixed to the body of the camera 23.
A COB 7b for controlling lighting and extinguishing of the LED array 9b is arranged nearer to 9. The COB 7b is composed of an IC circuit or the like and has a thickness A as shown in FIG. The date substrate 6b is arranged close to the outermost uppermost end 19a of the fixed lens barrel 19 as shown in FIG. When the IC circuit is mounted as shown in FIG. 5 of the conventional example, the date substrate 6b is lifted by the thickness A of the COB 7b, which is not suitable for downsizing. As a result, the height of the camera 22 is set between the date substrate 6b and the focus detection optical system 20 by CO
Since it is not lifted by the thickness A of B7b, the size of the camera can be reduced without increasing the height of the camera even when applied to such a camera.

In the above-described embodiment, the lens shutter camera of the normal wind type and the lens shutter camera capable of switching between the normal wind type and the prewind type are used, but the present invention described above is applicable to the lens shutter camera of the prewind type. It can be applied. Further, although the lens shutter camera is used in the above-described embodiment, the present invention described above can be applied to a single lens reflex camera.

Although the prism is used in the optical system for changing the direction of the optical axis in the embodiments, it may be a mirror.

[0015]

According to the above-mentioned structure, the height of the camera, which has been a problem that prevents the challenge of miniaturization of the camera by arranging the board on which the IC circuit is mounted, is not increased. In addition, the camera can be downsized.

[Brief description of drawings]

FIG. 1 is a perspective view of a camera according to a first embodiment of the present invention, as viewed from a case back side.

FIG. 2 is a plan view of the camera according to the first embodiment of the present invention when viewed from the back cover side of the camera.

FIG. 3 is a plan view of the camera according to the second embodiment of the present invention when viewed from the case back side.

FIG. 4 is a plan view of the camera according to the third embodiment of the present invention when viewed from the case back side.

FIG. 5 is an example of a conventional example

[Explanation of symbols for main parts]

 1 ... Film 2 ... Inner rail 3 ... Aperture 4 ... Spool 5 ... Arrows 6, 6a, 6b ... Date board 7, 7a, 7b ... LED drive circuit (COB) 8 ... ...... Flexible 9 ...... LED array 9a ...... LED array for prewind 9b ...... LED array for normal wind 10 ............ Finder block 13 ......... Open window 13a ...... Open window for prewind 13b ...... Open for normal wind Window 14 ………… Prism 15 ………… Optical axis 16 ………… Spool chamber 17 ………… Patrone chamber 18 ………… Optical axis 19 ………… Fixed lens barrel 19a …… Top end 20 ……… Focus detection optics System 21, 22, 23, 24 …… Camera A ………… Thickness of LED drive circuit

Claims (2)

[Claims] 1. A camera having a built-in substrate on which an IC circuit is mounted, wherein the substrate is located between a finder optical system or a focus detection optical system and a photographing optical path extending from a photographing lens to an aperture. A built-in substrate for a camera, which is a surface of the substrate on the side of the finder optical system or the focus detection optical system, which is mounted on the side of the finder optical system or the focus detection optical system. 2. The IC circuit is a drive circuit for driving a photographing information imprinting light source unit for imprinting photographing information on a film, and the photographing information imprinting light source unit is a surface of the substrate on the photographing optical path side. The camera built-in substrate according to claim 1, wherein the built-in substrate is mounted on the substrate.