JPH07181220A - Integrated circuit apparatus - Google Patents

Integrated circuit apparatus

Info

Publication number
JPH07181220A
JPH07181220A JP5325611A JP32561193A JPH07181220A JP H07181220 A JPH07181220 A JP H07181220A JP 5325611 A JP5325611 A JP 5325611A JP 32561193 A JP32561193 A JP 32561193A JP H07181220 A JPH07181220 A JP H07181220A
Authority
JP
Japan
Prior art keywords
terminal
inspection
integrated circuit
terminals
diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5325611A
Other languages
Japanese (ja)
Inventor
Naoya Tanaka
直也 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP5325611A priority Critical patent/JPH07181220A/en
Publication of JPH07181220A publication Critical patent/JPH07181220A/en
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To enable the inspection of soldering of terminals to be required to be inspected accurately even when IC devices are connected in parallel in plurality or singly by providing all terminals required to be inspected with a plurality of diodes individually connected internally and a terminal exclusively for inspection to which the plurality of diodes are connected in common. CONSTITUTION:Diodes d1-d7 of a main body part 1 have a cathode connected to respective terminals 2-1-2-7 individually inside and the cathode is connected to the side of an anode in common while being connected to a terminal -8 exclusively for inspection. In this IC apparatus, to inspect the connection of solders 4-1-4-8, for example, the continuity of wire patterns 3-1 and 3-8 is inspected. When continuity is found, it is learned that at least the solder 4-1 is connected. Likewise, the diodes d2-d-7 are connected individually to the respective terminals 2-1-2-7. So, the continuity is checked between the wire pattern 3-8 of the terminal 2-8 exclusively for inspection and the wire patterns of the respective terminals thereby enabling the inspecting of the condition of each soldering accurately.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、集積回路装置(I
C)、特に各端子の半田付け検査が容易になせる集積回
路装置に関する。
This invention relates to an integrated circuit device (I
C), in particular, to an integrated circuit device that facilitates soldering inspection of each terminal.

【0002】[0002]

【従来の技術】従来の集積回路装置は、図4に示すよう
に、本体部41に複数本の端子(ピン)42が設けられ
ており、回路基板上にて、各端子42が配線パターン4
3と半田付けされている。このような集積回路装置にお
いて、端子の半田付け状態を検査するのに、例えば電源
(もしくはGND)パターン43aに、接続される電源
端子42a等で、本体部41の内部に保護用のダイオー
ド成分等があるものは、これを使用して導通検査を行
い、電気的に検査のできないものには目視による検査を
行い、半田付け検査を行うようにしている。
2. Description of the Related Art In a conventional integrated circuit device, a plurality of terminals (pins) 42 are provided on a main body 41 as shown in FIG. 4, and each terminal 42 is provided with a wiring pattern 4 on a circuit board.
Soldered with 3. In such an integrated circuit device, in order to inspect the soldering state of the terminals, for example, a power supply terminal 42a connected to a power supply (or GND) pattern 43a, a diode component for protection inside the main body 41, etc. Some of them have a continuity test using them, and those that cannot be electrically tested are visually inspected to perform a soldering test.

【0003】[0003]

【発明が解決しようとする課題】上記した従来の集積回
路装置の半田付け方法のうち、目視による方法は、半田
が載っているにもかかわらず、電気的にオープンの場合
には、発見ができない場合もあり、また、保護のダイオ
ードを使用して導通検査を行う場合、例えば図5におい
て、アンプ51の入力端、出力端と電源端子52間に、
ダイオードd11、d12が接続され、同じくアンプ51の
入力端、出力端と接地GND間にダイオードd13、d14
が接続されている集積回路装置50が1個の場合は、検
査が可能であるが、図5のように同様の集積回路装置5
0、50Aが並列に接続されると、電気的に導通検査を
行っても、どちらか片方のみのオープンはわからない、
という問題があるし、集積回路装置によっては電気的導
通検査を行えないものもある。
Among the above-mentioned conventional soldering methods for integrated circuit devices, the visual inspection method cannot be found when the solder is placed but is electrically open. In some cases, and when conducting a conduction test using a protective diode, for example, in FIG. 5, between the input terminal and the output terminal of the amplifier 51 and the power supply terminal 52,
The diodes d 11 and d 12 are connected, and similarly, the diodes d 13 and d 14 are connected between the input terminal and the output terminal of the amplifier 51 and the ground GND.
When the number of integrated circuit devices 50 connected to is one, the inspection is possible, but the same integrated circuit device 5 as shown in FIG.
When 0 and 50A are connected in parallel, even if an electrical continuity check is performed, it is not possible to know whether only one of them is open.
However, depending on the integrated circuit device, the electrical continuity test cannot be performed in some cases.

【0004】この発明は、上記問題点に着目してなされ
たものであって、集積回路装置が複数個並列接続される
場合でも、また単一の装置の場合でも、検査を要する各
端子の半田付け検査を精度良くなし得る集積回路装置を
提供することを目的としている。
The present invention has been made in view of the above problems, and soldering of each terminal requiring inspection is performed even when a plurality of integrated circuit devices are connected in parallel or in the case of a single device. It is an object of the present invention to provide an integrated circuit device capable of performing a mounting inspection with high accuracy.

【0005】[0005]

【課題を解決するための手段及び作用】この発明の集積
回路装置は、入力信号端子、出力信号端子、電源端子等
の複数の端子を有するものにおいて、検査を要する全て
の端子に、内部でそれぞれ個別に接続される複数のダイ
オードと、内部でこれら複数のダイオードが共通的に接
続される検査専用端子とを備えている。
The integrated circuit device according to the present invention has a plurality of terminals such as an input signal terminal, an output signal terminal, and a power supply terminal. It is provided with a plurality of diodes that are individually connected and an inspection-only terminal to which the plurality of diodes are commonly connected inside.

【0006】この集積回路装置では、検査専用端子を設
けるとともに、各端子と、この検査専用端子との間に、
本体部内部にダイオードを設けているので、検査専用端
子と、目的とする端子の検査パッド間の導通検査を行う
ことにより、その端子が半田付けオープンとなっておれ
ば、導通検査における導通が得られないので、確実にこ
れを検出することができる。
In this integrated circuit device, terminals for exclusive use of inspection are provided, and between each terminal and the terminals for exclusive use of inspection,
Since a diode is provided inside the main unit, conduct a continuity test between the inspection-dedicated terminal and the inspection pad of the target terminal, and if that terminal is open by soldering, continuity can be obtained in the continuity test. Since this is not possible, this can be detected reliably.

【0007】[0007]

【実施例】以下、実施例により、この発明をさらに詳細
に説明する。図1は、この発明の一実施例集積回路装置
を示す概略図である。この実施例集積回路装置は、本体
部1と本体部1より外部に導出される複数個の端子
-1、2 -2、…、2-8を備えている。そして、これら端
子2-1、2-2、…、2-8は、回路基板上に構成される回
路パターン3-1、3-2、…、3-8に半田付け4-1
-2、…、4-8が形成され接続される。端子2-1
-2、…、2-8のうち、2-8は検査専用に設けられる端
子であり、端子2-1、2-2、…、2-7は、入力信号端
子、出力信号端子、電源端子等に使用される従来より設
けられている端子である。検査専用端子2-8は、外部的
はオープン状態とされるので、回路パターン3-8、半田
付け4-8はなくてもよい。これら端子2-1、2-2、…、
-7は、図示は省略しているが、本体部1内の各回路部
に接続される。又本体部1には、ダイオードd1
2 、…、d7 が設けられており、これらダイオードd
1 、d2 、…、d7 は、それぞれ本体部1の内部で一端
(カソード)が各端子2-1、2-2、…、2-7に個別に接
続されるとともに、アノード側は共通的に接続され、検
査専用端子2-8に接続されている。この実施例集積回路
装置によれば、各半田付け4-1、…、4 -8の接続状態を
検査するのに、例えば、配線パターン3-1と配線パター
ン3-8の導通を検査することにより、導通があれば、少
なくとも半田付け4-1が、接続されていることを知るこ
とができる。同様に各端子2-2、…、2-7には、個別に
ダイオードd2 、…、d7 が接続されているため、検査
専用端子2-8の配線パターン3-8と、各その他の端子の
配線パターン間の導通を見ることにより、それぞれの半
田付け状態を確実に検査することができる。
The present invention will be described in more detail with reference to the following examples.
Explained. FIG. 1 shows an integrated circuit device according to an embodiment of the present invention.
FIG. The integrated circuit device of this embodiment has a main body
A plurality of terminals led out from the part 1 and the body part 1
Two-1Two -2, ... 2-8Is equipped with. And these ends
Child 2-1Two-2, ... 2-8The times that are configured on the circuit board
Road pattern 3-1Three-2, ... 3-8Solder to 4-1,
Four-2, ... 4-8Are formed and connected. Terminal 2-1,
Two-2, ... 2-8Of which 2-8Is the edge dedicated to inspection
Child and terminal 2-1Two-2, ... 2-7Is the input signal end
Child terminals, output signal terminals, power terminals, etc.
This is the terminal that is marked. Inspection dedicated terminal 2-8Is external
Is open, so circuit pattern 3-8,solder
Append 4-8It does not have to be. These terminals 2-1Two-2, ...
Two-7Although not shown, each circuit section in the main body section 1
Connected to. Further, the body 1 has a diode d1,
d2, ..., d7Is provided, and these diodes d
1, D2, ..., d7Is one end inside the main body 1.
(Cathode) is each terminal 2-1Two-2, ... 2-7Individually contact
The anode side is commonly connected and
Inspection dedicated terminal 2-8It is connected to the. This embodiment integrated circuit
According to the device, each soldering 4-1, ... 4 -8Connection status of
For inspection, for example, the wiring pattern 3-1And wiring putter
3-8If there is continuity,
Without soldering 4-1But knowing that it is connected
You can Similarly, each terminal 2-2, ... 2-7Individually
Diode d2, ..., d7Is connected, so inspection
Dedicated terminal 2-8Wiring pattern 3-8And the other terminals
By checking the continuity between the wiring patterns,
It is possible to reliably inspect the rice paddy condition.

【0008】図2は、この発明の他の実施例を示す集積
回路装置の回路図を示している。図2において、集積回
路装置10は、外部導出用の端子5-1、5-2、…、5-5
を備え、このうち端子5-5は検査専用の端子であり、検
査専用端子5-5は、内部でダイオードd1 、d2 、…、
4 を介して各端子5-1、5-2、…、5-4に接続されて
いる。この他、本体部には本来のアンプ11の他に保護
用のダイオードd11、d12、…、d14がそれぞれ接続さ
れている。d11は、入力端子5-2と電源端子5 -1間に、
12はアンプ11の出力端子と電源端子5-1間に、また
この実施例装置は、電源と接地GND間に集積回路装置
10と、同種の集積回路装置10Aが並列に接続されて
おり、集積回路装置10の出力端子5-3と入力端子5-2
が、検査パッド6を介して、配線パターンにより互いに
接続されている。この実施例装置は、各保護用ダイオー
ドd11、d12、…、d14は、集積回路装置10と集積回
路装置10Aでそれぞれ互いに並列に接続されることに
なるが、ほかに検査専用端子5-5と各検査用端子5-1
-2、…、5-4間にそれぞれダイオードd1 、d2
…、d4 を個別に接続しているので、例えば検査専用端
子5-5と端子5-1間の導通テストを行った場合に、いず
れかの半田付け状態が不良の場合にオープン状態にな
り、導通があれば少なくとも、端子5-1の半田付け状態
が良好となり、次に端子5-2と検査専用端子5-5間の導
通状態を検査すると、端子5-2の半田付け状態を検査す
ることができる。
FIG. 2 is an integrated circuit diagram showing another embodiment of the present invention.
The circuit diagram of a circuit device is shown. In FIG. 2, the accumulation times
The path device 10 includes a terminal 5 for external lead-out.-15,-2, ... 5-Five
Equipped with terminal 5-FiveIs a dedicated terminal for inspection.
Inspection dedicated terminal 5-FiveIs a diode d1, D2, ...
dFourThrough each terminal 5-15,-2, ... 5-FourConnected to
There is. Besides this, the main body is protected in addition to the original amplifier 11.
Diode d11, D12, ..., d14Are each connected
Has been. d11Is the input terminal 5-2And power terminal 5 -1Between,
d12Is the output terminal of the amplifier 11 and the power supply terminal 5-1In between
This embodiment device is an integrated circuit device between a power supply and ground GND.
10 and an integrated circuit device 10A of the same type are connected in parallel.
And the output terminal 5 of the integrated circuit device 10.-3And input terminal 5-2
But through the inspection pad 6 by the wiring pattern
It is connected. The device of this embodiment is
De d11, D12, ..., d14Is an integrated circuit device 10 and an integrated circuit.
To be connected in parallel with each other in the road device 10A
In addition, it is also a dedicated terminal 5 for inspection-FiveAnd each inspection terminal 5-1,
5-2, ... 5-FourBetween each diode d1, D2,
…, DFourSince they are individually connected,
Child 5-FiveAnd terminal 5-1If a continuity test between
If any soldering condition is bad, it will be open.
If there is continuity, at least terminal 5-1Soldering state of
Is good, and then terminal 5-2And inspection terminal 5-FiveGuidance between
When checking the connection state, terminal 5-2Inspect the soldering condition of
You can

【0009】この実施例装置によれば、各端子に内部で
検査専用端子5-5に接続されるダイオードをそれぞれ個
別に備えているので、いかなる端子の半田付け状態も電
気的試験により、精度良く確実に行うことができる。図
3は、この発明の他の実施例を示す集積回路装置の概略
平面図であり、この実施例集積回路装置20は、四方か
らそれぞれ4本ずつの計16本の端子21-1、…、21
-16 まで設けており、このうち21-16 の1本を検査専
用端子として使用し、その他の端子は通常の端子として
使用される。
According to the apparatus of this embodiment, each terminal is individually provided with a diode internally connected to the inspection-dedicated terminal 5 -5 , so that the soldered state of any terminal can be accurately measured by an electrical test. It can be done reliably. FIG. 3 is a schematic plan view of an integrated circuit device showing another embodiment of the present invention. The integrated circuit device 20 of this embodiment has 16 terminals 21 -1 , ... 21
-16 are provided, and one of them, 21 -16 , is used as an inspection-only terminal, and the other terminals are used as normal terminals.

【0010】[0010]

【発明の効果】この発明によれば、通常の端子の他に検
査専用の端子を設け、この検査専用端子と各端子間の全
てに内部でダイオードを接続し設けているので、いずれ
の端子に対しても、検査専用端子との間で導通テストを
行うことができ、各接続端子の半田付け検査を全て行う
ことができる。また、検査もダイオード成分を測定する
だけなので、簡単な測定で済み、測定時間、コストが大
幅に減少する。その上、並列接続される場合でも、確実
にオープン状態を個別に検査することができる。
According to the present invention, terminals for inspection are provided in addition to ordinary terminals, and diodes are internally connected between the terminals for inspection and each terminal. Contrary to this, a continuity test can be performed with the inspection-dedicated terminals, and all soldering inspections of the connection terminals can be performed. Moreover, since the inspection only measures the diode component, simple measurement is sufficient, and the measurement time and cost are greatly reduced. Moreover, even in the case of parallel connection, the open state can be surely inspected individually.

【0011】また、全ピン半田付け検査が行えるため、
不精度な目視検査もする必要がなくなるという利点もあ
る。
Since all the pins can be soldered,
There is also an advantage that it is not necessary to perform an inaccurate visual inspection.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の一実施例集積回路装置を示す概略図
である。
FIG. 1 is a schematic diagram showing an integrated circuit device according to an embodiment of the present invention.

【図2】この発明の他の実施例集積回路装置を示す回路
接続図である。
FIG. 2 is a circuit connection diagram showing an integrated circuit device according to another embodiment of the present invention.

【図3】この発明の他の実施例集積回路装置を示す概略
平面図である。
FIG. 3 is a schematic plan view showing an integrated circuit device according to another embodiment of the present invention.

【図4】従来の集積回路装置を説明するための平面図で
ある。
FIG. 4 is a plan view for explaining a conventional integrated circuit device.

【図5】従来の他の集積回路装置を示す回路接続図であ
る。
FIG. 5 is a circuit connection diagram showing another conventional integrated circuit device.

【符号の説明】[Explanation of symbols]

1 本体部 2-1、…、2-7 端子 2-8 検査専用端子 d1 、…、d7 ダイオード1 Main body 2 -1 , ..., 2 -7 terminal 2 -8 Inspection dedicated terminal d 1 , ..., d 7 Diode

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】入力信号端子、出力信号端子、電源端子等
の複数の端子を有する集積回路装置において、 検査を要する全ての端子に、内部でそれぞれ個別に接続
される複数のダイオードと、内部でこれら複数のダイオ
ードが共通的に接続される検査専用端子とを備えたこと
を特徴とする集積回路装置。
1. An integrated circuit device having a plurality of terminals such as an input signal terminal, an output signal terminal, a power supply terminal, etc., and a plurality of diodes individually connected internally to all terminals requiring inspection and an internal circuit An integrated circuit device comprising: an inspection-dedicated terminal to which the plurality of diodes are commonly connected.
JP5325611A 1993-12-24 1993-12-24 Integrated circuit apparatus Pending JPH07181220A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5325611A JPH07181220A (en) 1993-12-24 1993-12-24 Integrated circuit apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5325611A JPH07181220A (en) 1993-12-24 1993-12-24 Integrated circuit apparatus

Publications (1)

Publication Number Publication Date
JPH07181220A true JPH07181220A (en) 1995-07-21

Family

ID=18178803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5325611A Pending JPH07181220A (en) 1993-12-24 1993-12-24 Integrated circuit apparatus

Country Status (1)

Country Link
JP (1) JPH07181220A (en)

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