JPH07180086A - Nickel plating method and nickel plating rack - Google Patents

Abstract

PURPOSE:To easily reduce the supply of a plating soln. and to form a good multiple glossy plating by dipping a material to be plated in the preceding plating tank, then pulling up the material, applying spray cleaning and draining and then sending the material to the succeeding plating tank. CONSTITUTION:A rack 16 holding a material 19 to be plated through a hooking member is suspended from a hook 18 fixed to the main body 12 of a conveyor provided with a liq. splash preventive plate 13. This rack conveyor 11 is horizontally moved, and semigloss nickel plating, glossy nickel plating and nonconductive fine particle-dispersed nickel plating are successively conducted. In this triple glossy nickel plating method, when the material 19 is dipped in a glossy nickel plating tank (not shown in the figure), plated with nickel and pulled up with the hook 18, a cleaning soln. and a gas are sprayed from a shower 14 and an air gun 15 to sufficiently clean and drain the material 19. The material 19 is then conveyed to the nonconductive fine particle-dispersed nickel plating tank by the conveyor 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rack-type nickel plating forming method and a nickel-plating rack used in the rack-type nickel plating forming method.

[0002]

2. Description of the Related Art In general, methods for plating on an object to be plated can be roughly classified into electroplating and electroless plating. Among these, electroplating is performed by immersing an object to be plated as a part of a cathode in an aqueous solution or a non-aqueous solution in which a metal salt is dissolved as a plating solution, energizing the electrodes, and electrolyzing the plating solution. A metal, for example, nickel, chromium, copper, or the like is deposited on the object to be plated of the cathode.

Nickel plating, which is one of such electroplating methods, is used on steel, copper, copper alloys, and zinc die castings for anticorrosion and for decoration. However, nickel is usually discolored, so that it is usually over nickel. Is plated with chrome, and is generally used as a base plating for decorative / corrosion protection and industrial chrome plating.

As shown in FIG. 8, the structure of the chrome plating for decoration and anticorrosion equipment is as follows. Copper plating 53, semi-bright nickel plating 54, gloss This is a multi-layer plating in which a nickel plating 55, a non-conductive fine particle dispersed nickel plating 56 and a chromium plating 57 are sequentially formed. In the case of using chrome plating for decoration / corrosion-proof equipment as the exterior material, good corrosion resistance is required as well as the appearance of the plated object after plating.

As a method of improving the corrosion resistance, the thickness of each plating layer is increased, and the number of surface micropores generated in the chromium plating layer is optimized in order to improve the corrosion resistance by dispersing the corrosion current (generally 15000 to 1500). 25,000 pieces / c
m ² ) and optimization of potential control between nickel plating layers.

However, in recent years, due to the increasing needs of customers, it has become necessary to stably maintain the appearance quality and the durability quality required for exterior members of products for a long period of time, and in order to improve the corrosion resistance. In some cases, the surface micropores that should have been formed are pointed out as a defect due to the expansion of the surface micropore diameter 58 (shown in FIG. 8) due to the progress of corrosion, which impairs the appearance and the like. 58
The key is to prevent the expansion.

As a means for preventing the expansion of the surface micropore diameter 58, an additive such as sodium 1,5-naphthalene disulfonate in a bright nickel plating solution is used.
Sodium 1,3,6-naphthalenetrisulfonate, saccharin, etc. are added, and sulfur is contained in the deposited bright nickel plating layer, so that the bright nickel plating layer is less base than the non-conductive fine particle-dispersed nickel plating layer. By forming and maintaining the potential, corrosion in the surface micropores as shown in FIG. 9 is not in the lateral direction (radial direction of the surface micropores) which leads to the expansion of the surface micropore diameter 58, but rather in the vertical direction (surface micropores). It is known that it is effective to proceed in the direction of depth.

However, in the nickel plating production line in the conventional chrome plating for decoration / corrosion protection, as shown in FIG.
As shown in FIG. 3, a copper plating tank 22, a water washing tank 23, a semi-bright nickel plating tank 24, a bright nickel plating tank 25, a non-conductive fine particle dispersed nickel plating tank 26 and a water washing tank 27.
The production line is equipped with a bright nickel plating bath 25 and a non-conductive fine particle dispersed nickel plating bath 26.
There is no washing tank between the lines. In many of these lines, it is difficult to install a water washing tank between the bright nickel plating tank 25 and the non-conductive fine particle dispersion nickel plating tank 26 in terms of equipment layout. Therefore, as a means for preventing the expansion of the surface micropore diameter, Even if an additive is added to the bright nickel plating solution, since the bright nickel plating solution is carried along with the object to be plated and brought into the non-conductive fine particle-dispersed nickel plating bath 26, the effect of the additive is effectively exhibited. However, since the potential of the formed non-conductive fine particle-dispersed nickel plating layer becomes base, the preventive effect cannot be obtained and the surface micropore diameter tends to increase.

Further, in the method of forming nickel plating for performing multiple bright plating on an object to be plated as described above, a plating rack is usually used as an electrode for holding and energizing the object to be plated. . In the present specification, the one using such a plating rack is simply referred to as "rack type".

FIG. 11 is a schematic explanatory view showing an embodiment of a conventional nickel plating rack, and FIG.
FIG. 1 is a schematic explanatory view showing an embodiment of a bright nickel plating apparatus which is one type of conventional rack type nickel plating apparatus using the plating rack of No. 1.

As shown in FIG. 12, a bright nickel plating solution 49 is contained in the rack-type bright nickel plating bath 48. Further, in the anode conductive support 50 located above the bright nickel plating tank 48, an anode case 47 made of a material such as titanium containing a nickel chip 51 as a main component of nickel plating is placed in a plating solution 49. For nickel plating on which the object to be plated 19 is hooked, the cathode conductive support 45, which is suspended until it is immersed, is located above the plating tank 48 and in parallel with the anode conductive support 50. The rack body 41 is suspended until it is immersed in the plating solution 49. In such a state, the electrodes are energized to perform plating. At that time, not only nickel is deposited on the object to be plated 19 by bright nickel plating, but also nickel is deposited on the hooking member 40 of the nickel plating rack 16 by plating. The portions other than the contact portion 46 with the hooking member 40 and the cathode conductive support 45 are coated with a conductive material such as polyvinyl chloride, so that nickel is not deposited by bright nickel plating.

However, in such a conventional nickel plating rack 16 as described above, the nickel deposited by the nickel plating is overlapped and formed on the hooking member 40 by repeated use, so that the object to be plated is coated. Since it is not possible to hook 19, the hook member 4
The nickel plating deposited at 0 had to be removed physically, chemically or electrochemically, and there was also a problem that the number of removal steps and the amount of nickel removed was increased.

[0013]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of the prior art, and is a rack type in which a nickel plating rack is used to perform multiple gloss plating on an object to be plated. In the nickel plating method, the non-conductive fine particle-dispersed nickel plating solution can be used without significantly changing the existing equipment or process that does not have a washing bath between the bright nickel plating tank and the non-conductive fine particle-dispersed nickel plating tank. It is an object of the present invention to provide a method capable of reducing the amount of a bright nickel plating solution brought into a substrate and forming a good multiple bright plating on the surface of an object to be plated. .

Further, according to the present invention, in a nickel plating rack used when performing multi-gloss plating on an object to be plated, the nickel plating attached to the hooking member of the object to be plated can be efficiently removed during the plating operation. It is an object of the present invention to provide a nickel plating rack having the obtained structure.

[0015]

In order to solve the above problems, the present invention provides a rack-type nickel plating method for performing multiple-brightness plating on an object to be plated by using a nickel plating rack. After immersing the object to be plated in a plating tank and nickel-plating the object to be plated, when the object to be plated is lifted up from the nickel plating tank in the preceding stage using a rack transporter, In the bath, a cleaning liquid and gas are sprayed on the object to be plated, the object to be plated is cleaned and drained, and then transferred to a nickel plating tank at a subsequent stage.

Further, according to the present invention, in a rack for nickel plating used in a rack type nickel plating method for performing multiple gloss plating on an object to be plated, a hook member for supporting the object to be plated is used when performing nickel plating. It is characterized in that it is made of the same material as the anode case and is detachably attached to the rack body.

[0017]

According to the constitution of the method of the present invention, after the bright nickel plating is formed on the object to be plated, the object to be plated is placed on the bright nickel plating tank by the liquid spraying device and the gas spraying device installed in the rack transporter. Since the bright nickel plating solution adhered to the water is washed and drained at the same time, the non-conductive fine particle-dispersed nickel is not required to be installed between the bright nickel plating tank and the non-conductive fine particle-dispersed nickel plating tank. The amount of the bright nickel plating solution carried into the plating solution can be significantly reduced, and the formed bright nickel plating layer can be maintained at a base potential lower than that of the non-conductive fine particle-dispersed nickel plating layer.

According to the structure of the rack for nickel plating of the present invention, the hook member is made of the same material as the anode case used for nickel plating and is detachable from the rack body. Before depositing multiple layers and becoming thicker, remove the hooking member from the rack, put it in the anode case and reuse it as a part of the nickel plating anode, that is, peeling off the nickel plating adhering to the hooking member. Can be performed during the nickel plating work, and the nickel plating attached to the hook member can be
There is no need to remove it by chemical or electrochemical methods.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

FIG. 1 is a schematic explanatory view showing an embodiment of a rack carrier used in the rack type nickel plating method according to the present invention. 1 to 12 in the present specification, the same members are allotted with the same reference numerals.

The rack carrier 11 shown in FIG. 1 is provided with a rectangular frame-shaped liquid splash prevention plate 13 extending downward from the outer peripheral surface of the rack carrier body 12, and is provided on both side surfaces. A water-washing shower 14 as a liquid spraying device is installed below the liquid splash prevention plate 13, and an air gun 15 as a gas spraying device is installed near the upper portion of the water-washing shower 14. Further, at the center of the lower surface of the rack carrier body 12, the nickel plating rack 1
A hook 18 for supporting the cathode conductive support 17 of 6 is attached.

Next, FIG. 2 is a schematic explanatory view showing an exterior chrome plating production line including a nickel plating production line when the rack transporter shown in FIG. 1 is used.

As shown in FIG. 2, in the chrome plating production line for exteriors utilizing the present invention, the pretreatment bath 20, the water washing bath 21, the copper plating bath 22, the water washing bath 23, the semi-bright nickel plating bath 2 are used.
4, bright nickel plating tank 25, non-conductive fine particle dispersion nickel plating tank 26, water washing tank 27, chrome plating tank 2
8. The manufacturing line includes a washing bath 29 and a drying chamber 30, and there is no washing bath between the bright nickel plating bath 25 and the non-conductive fine particle dispersion nickel plating bath 26. Further, the first rail member 31 and the second rail member 3 are provided in order above the respective tanks or chambers.
2, the third rail member 33 and the fourth rail member 34 are laid so as not to overlap each other, and the first rack carrier 11a and the second rack carrier 1 are provided for each rail member.
1b, the third rack transporter 11c, and the fourth rack transporter 11d are attached, and among them, the third rack transporter 11c attached to the third rail member 33 is the one described in FIG. The rack carrier 11 used in the rack-type nickel plating method according to the present invention is used.

The laying range of each of the above rail members is not particularly limited, and the entire plating production line can be carried out using only one rail member, but preferably a copper plating solution, nickel. It is desirable that a plurality of rail members be laid as in the embodiment shown in FIG. 2 so that the plating solution and the chrome plating solution do not mix with each other.

Next, in the above-mentioned exterior chrome plating production line, when nickel plating is performed by the nickel plating method according to the present invention, copper plating, water washing, semi-bright nickel plating are performed on the pretreated object to be plated. After further applying the bright nickel plating, as shown in the schematic diagram showing the movement of the rack transporter shown in FIG. 3, the third rail member 3
The following steps (1) to (3) are performed in accordance with the movement of the third rack carrier 11c attached to the No. 3 rack.

First, the third rail member 33 is moved along the third
The rack carrier 11c is laterally moved to above the semi-bright nickel plating tank 24. At this stage, the hook 18 of the third rack carrier 11c is stored in the upper part.

The hook 18 of the third rack carrier 11c is lowered.

Next, along the third rail member 33,
The rack carrier 11c is laterally moved to above the bright nickel plating bath 25, and the hook 18 of the third rack carrier 11c is moved.
Is hooked on the cathode conductive support 17 of the nickel plating rack 16 fixed in the bright nickel plating tank 25.

The hook 18 of the third rack carrier 11c is raised to lift the entire nickel plating rack 16 above the bright nickel plating tank 25.

At this time, the hook 18 is hooked from the bright nickel plating tank 25 to the cathode conductive support 17 portion of the nickel plating rack 16 by the third rack carrier 11c having the same configuration as that shown in FIG. The rack 16 for nickel plating is controlled by the shower 14 for washing and the air gun 15 which are controlled so as to blow out washing water from the shower 14 for washing and high-pressure air from the air gun 15 only when they are lifted above the bright nickel plating tank 25. And, the bright nickel plating solution adhering to the object to be plated 19 held on the rack 16 is washed off with washing water and drained with air. During the washing with water, the washing water containing the bright nickel plating solution is dropped and collected in the bright nickel plating tank 25 by the spatter prevention plate 13 without being scattered around.

After cleaning, the third rack carrier 11 supports the entire nickel plating rack 16 (including the object to be plated 19) which has been rinsed and drained along the third rail member 33.
c is laterally moved to above the non-conductive fine particle-dispersed nickel plating bath 26.

The hook 18 of the third rack carrier 11c is lowered, and the entire nickel plating rack 16 is moved into the non-conductive fine particle dispersed nickel plating tank 26 and fixed therein.
As the fixing method, for example, both ends of the cathode conductive support 17 of the nickel plating rack 16 are caught on the upper edge of the non-conductive fine particle dispersed nickel plating tank 26,
There is a method in which the rack 16 for nickel plating is suspended and fixed in a plating solution of nickel plating tank 26 in which non-conductive fine particles are dispersed.

The hook 18 of the third rack carrier 11c is removed from the conductive support 17 for cathode of the rack 16 for nickel plating. Thereafter, similarly to the conventional method, non-conductive fine particle dispersed nickel plating, water washing, chrome plating,
Washing and drying are performed.

The hooks 18 of the third rack carrier 11c in the above series of steps are set to the bright nickel plating tank 2
5 is hooked on the cathode conductive support 17 portion of the nickel plating rack 16 fixed to No. 5, and the hook 18 of the third rack carrier 11c is hooked on the nickel plating rack 16.
The operation for removing from the cathode conductive support 17 can be generally performed by moving a load with a forklift. That is, the third rack carrier 1
When hooking the hook 18 of 1c to the cathode conductive support 17 of the nickel plating rack 16 of the bright nickel plating tank 25, the hook 18 of the third rack carrier 11c is used for the cathode of the nickel plating rack 16 in advance. Straight down to a position lower than the conductive support 17 portion, and then horizontally move the hook 18 of the third rack carrier 11c in the same direction as the previous step to move the rack 1 for nickel plating.
The conductive support 17 for cathodes of No. 6 is made to go under, and the hook 18 of the 3rd rack conveyance machine 11c is lifted right above, and the rack 1 for nickel plating is carried out.
The hook 18 of the third rack carrier 11c is hooked on the cathode conductive support 17 of No. 6 (the cathode conductive support 17 of the nickel plating rack 16 is placed on the hook 18 of the third rack carrier 11c, Can be supported). Conversely, when removing the hook 18 of the third rack carrier 11c from the cathode conductive support 17 portion of the nickel plating rack 16, the third rack is attached to the cathode conductive support 17 portion of the nickel plating rack 16. With the hook 18 of the carrier 11c hooked (the conductive support 17 for cathode of the nickel plating rack 16 is placed on the hook 18 of the third rack carrier 11c, and is still supported), straight down and the rack for nickel plating The entire 16 is transferred to a non-conductive fine particle-dispersed nickel plating bath 26 and fixed (specifically, for example, both end portions of the cathode conductive support 17 of the nickel plating rack 16 are dispersed with non-conductive fine particles). The nickel plating rack 16 is caught in the upper edge portion of the nickel plating tank 26, and the main body of the nickel plating rack 16 is coated with non-conductive fine particles of nickel. After being suspended in the plating solution in the bath 26 and being fixed, the hook 18 of the third rack carrier 11c is further lowered, and the cathode conductive support 17 of the nickel plating rack 16 is provided. After releasing the hook 18 of the third rack carrier 11c, the hook 18 of the third rack carrier 11c is released.
While keeping the height as it is, in the direction opposite to the lateral movement in the previous step, laterally moves to a position that does not interfere with pulling up the hook 18 of the third rack transporter 11c in the next step, and then, By pulling the hook 18 of the third rack carrier 11c right above, the hook 18 of the third rack carrier 11c can be removed from the conductive support 17 for cathode of the rack 16 for nickel plating. To perform such an operation, for example, as shown in the schematic diagram showing a part of the plating production line shown in FIG.
A drive wheel 35 is installed above the rail member 33, and the drive wheel 3
By fixing the motor 36 connected to the No. 5 to the upper part of the third rack transporter 11c, the rotation of the motor 36 causes the third
The rack carrier 11c can be freely moved in the front-rear direction along the third rail member 33, and the hook 18 attached to the third rack carrier 11c can be laterally moved. In order to freely move the hook 18 in the vertical direction, the liquid splash prevention member 13 on the side surface of the third rack carrier 11c may be combined with a motor-driven chain (not shown) at both ends of the hook 18. It is also possible to move the hook 18 in the vertical direction by the method.

In addition to the above-mentioned method, a schematic cross-sectional view showing a state in which the cathode conductive support 17 of the nickel plating rack 16 shown in FIG. 5 is hooked on the hook 18 of the third rack carrier 11c. As shown in, the hook 18 of the third rack carrier 11c is attached to the bright nickel plating tank 2
5 is hooked on the cathode conductive support 17 portion of the nickel plating rack 16 fixed to No. 5, and the hook 18 of the third rack carrier 11c is hooked on the nickel plating rack 16.
As an operation of removing from the cathode conductive support 17 part, for example, an inverted L-shaped arm portion 37 is formed on a part of the cathode conductive support 17 part of the nickel plating rack 16 and the corresponding third When the L-shaped arm portion 38 is attached to and hooked on the hook 18 of the rack transporter 11c, the arm portions 37, 38 are hooked in the same manner as described above.
In addition to the method described above, a joint portion (not shown) is provided so that the shape of one of the arm portions becomes a straight I-shape when removing it, and this is removed from the control device outside the system. It can also be removed by activating it by a signal from the shell or the like.

The liquid spraying device and the gas spraying device used in the present invention are not limited to the washing shower 14 and the air gun 15 as shown in FIG. it can. Further, the shape of the nozzle of the washing shower 14 and the nozzle of the air gun 15 are not particularly limited, and can be appropriately selected according to the shape of the object to be plated 19.

Further, regarding the cleaning and draining methods by the liquid spraying device and the gas spraying device, depending on the mounting positions of the liquid spraying device and the gas spraying device,
It can be appropriately selected and used. For example, when the shower 14 for washing and the air gun 15 are appropriately installed at a constant interval from the upper side to the lower side on both sides of the plate 13 for preventing liquid splash, once the nickel plating is performed. After pulling up the rack 16 for water, after washing the entire rack 16 for nickel plating with the shower 14 for washing with water, the washing with water is stopped, and then the water attached to the entire rack 16 for nickel plating is blown off by the air gun 15 to remove water. A method such as performing may be used, but preferably, the method shown in the above embodiment is
It is desirable because the time required for the cleaning process can be short.

The cleaning liquid used in the present invention is one of the compositions of the bright nickel plating solution used, and is formed by bringing this cleaning solution into a non-conductive fine particle-dispersed nickel plating bath. There is no particular limitation as long as the potential of the non-conductive fine particle-dispersed nickel plating layer does not become base, and for example, water or warm water equivalent to the washing water used in the previous step of semi-bright nickel plating can be used. Can be used. Further, the blowing gas that can be used in the present invention is not particularly limited,
From the economical aspect, it is desirable to use purified air.

The blowing amount and blowing pressure of the cleaning liquid and gas can be increased or decreased according to the shape of the object to be plated 19, and it is desirable that the amount and pressure can be controlled.

The pipe for supplying the cleaning liquid to the liquid spraying device such as the shower 14 for washing with water and the air gun 1
As the pipe for supplying the gas to the gas spraying device such as 5, as shown in FIG. 4 described above, for example, a flexible hose that can expand and contract is used. By suspending the flexible hose 39b at a proper interval at a hook (not shown) running in a groove rail separately provided on the lower surface of the third rail member 33, the front portion of the rail member 33 (the front portion is (Not shown) and by extending from the rear part to the respective liquid spraying device and gas spraying device, the third rack carrier 11c can be followed without disturbing the movement of the third rack carrier 11c. Can be expanded and contracted. Further, the supply of the cleaning liquid and the gas to the flexible hoses 39a and 39b is performed by, for example, branching a part of water and air pipes (not shown) installed for the purpose of using the plating production line. By attaching the flexible hoses 39a and 39b to a portion (not shown), cleaning liquid and gas (water and air) can be supplied. Further, a valve adjusting mechanism (not shown) that opens and closes by a signal from a control device outside the system is provided at the branch portion, and the valve adjusting mechanism is controlled to open only when the nickel plating rack 16 is pulled up. Thereby, the shower 14 for washing with water and the air gun 15 can be operated only at the time of pulling up.

FIG. 6 is a schematic explanatory view showing one embodiment of the nickel plating rack according to the present invention, and FIG. 7 is a schematic explanatory view showing the whole plating apparatus using the nickel plating rack of FIG. is there. 6, the rack 16 for nickel plating uses the hook member 40 made of a material such as titanium which is the same material as the anode case 47 shown in FIG. 7, and the nickel plating rack body 41 and the hook member 40 are attachable and detachable. By using a screw type mechanism, the hooking member 40 can be attached to and detached from the rack body 41 for nickel plating. Further, the hook member 40 has a brim 42.
And plating the sealing material 43 made of polyvinyl chloride or the like between the nickel plating rack body 41 and the nickel plating rack body 41 shown in FIG. In addition, the plating solution 49 is prevented from entering the threaded portion 44 that is the joint between the rack body 41 for nickel plating and the hooking member 40. Note that the configuration other than these is similar to that of FIG.
It has the same structure as.

The hook member 4 used in the present invention.
As the material of the same material as the anode case 47 forming 0, a titanium-based material or the like is usually used, but the material is not particularly limited thereto, and for example, industrial pure titanium or 0.15-
Titanium alloys such as 0.20Pd-Ti and 6Al-4V-Ti, high-purity electric nickel plates, and nickel carbide can also be used according to their characteristics.

Further, the detachable connecting structure of the rack body 41 for nickel plating and the hooking member 40 used in the present invention is not limited to the above-mentioned screw type mechanism, and for example, the connecting portion of the hooking member 40 can be used. Is a convex structure provided with a leaf spring-like protrusion, and the corresponding coupling portion on the nickel plating rack main body 41 side has a concave structure provided with an insertion hole having a protrusion in the vicinity of the inlet of the insertion hole. The leaf spring type mechanism or the coupling portion of the hooking member 40 has a convex structure provided with a leaf spring-shaped protrusion, and a corresponding drop portion is provided in the nickel plating rack main body 41 side coupling portion. It is also possible to use a drop-down mechanism or the like having a concave structure in which a projection is provided at the lower part of the drop groove,
With respect to these mechanisms as well, it is desirable to attach a collar 42 of an appropriate shape and similarly incorporate a sealing material 43 of an appropriate shape between the nickel plating rack body 41 and the seal material 43.

[0044]

As described above, according to the rack type nickel plating method according to the present invention, the nickel plating solution (bright nickel plating solution) in the former stage attached to the rack for nickel plating and the object to be plated is treated in the latter stage. Of the nickel plating solution (non-conductive fine particle-dispersed nickel plating solution) can be reduced, and a plating layer (non-conductive fine particles) formed after the plating layer (bright nickel plating layer) formed earlier can be reduced. Since it can be maintained at a base electric potential lower than that of the dispersed nickel plating layer), it is possible to prevent the expansion of the surface micropore diameter, and it is possible to obtain excellent appearance aesthetics and good corrosion resistance, and to maintain the appearance quality and durability quality for a long period of time. In addition to being able to maintain the cleaning solution, the cleaning solution used for cleaning is collected in the bright nickel plating solution tank without scattering and is reused. The burden of wastewater treatment can be reduced compared to the case where a water washing tank is installed between the nickel plating tank and the non-conductive fine particle-dispersed nickel plating tank. Conventionally, it was evaporated from the bright nickel plating solution in the tank. It has an excellent effect that it is possible to reduce the number of man-hours for replenishment and adjustment by using an appropriate amount of warm water for the cleaning liquid, which required man-hours for separately replenishing water to adjust the composition and temperature. It is a thing.

Further, according to the nickel plating rack of the present invention, when nickel is thickly deposited on the hooking member due to repeated use, the hooking member is removed and placed in the anode case to remove the nickel plating anode. It can be used as a part, and it is possible to reduce the number of man-hours for peeling nickel deposited on the hooking member.
It has an excellent effect that the discarded nickel component can be recovered and used.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view of a rack transporter having a nickel plating water washing mechanism of the present invention.

2 is a schematic explanatory view showing a chromium plating production line for exterior including a nickel plating production line when the rack transporter shown in FIG. 1 is used,

FIG. 3 is a schematic diagram showing the movement of the rack transporter,

FIG. 4 is a schematic view showing a part of a plating production line,

FIG. 5 is a schematic cross-sectional state diagram when the cathode conductive support portion of the nickel plating rack is hooked on the hook of the third rack transporter,

FIG. 6 is a schematic explanatory view showing an embodiment of a nickel plating rack according to the present invention,

FIG. 7 is a schematic explanatory view showing the entire plating apparatus using the rack for nickel plating of FIG.

FIG. 8 is a schematic diagram of exterior chrome plating,

9 is a schematic diagram showing the progress of corrosion of the exterior chrome plating shown in FIG.

FIG. 10 is a schematic explanatory view showing a line configuration of exterior chrome plating,

FIG. 11 is a schematic explanatory view showing a conventional nickel plating rack,

FIG. 12 is a schematic explanatory view showing a conventional plating apparatus.

[Explanation of symbols]

11 ... Rack transporter, 11a ... 1st rack transporter, 11b ... 2nd rack transporter, 1
1c ... 3rd rack carrier, 11d ... 4th rack carrier,
12 ... Rack carrier main body, 13 ... Liquid splash prevention plate, 14 ... Water washing shower, 15 ... Air gun, 16 ... Nickel plating rack, 17 ... Cathode conductive support, 18 ...
Hook, 19 ... Object to be plated, 20 ...
Pretreatment tank, 21 ... Water washing tank, 22
… Copper plating tank, 23… Washing tank,
24 ... Semi-bright nickel plating tank, 25 ... Bright nickel plating tank, 26 ... Non-conductive fine particle dispersion nickel plating tank,
27 ... water washing tank, 28 ... chrome plating tank, 29 ... water washing tank, 30 ...
Drying room, 31 ... First rail member, 32 ...
2nd rail member, 33 ... 3rd rail member,
34 ... 4th rail member, 35 ... Drive wheel,
36 ... Motor, 37 ... Inverted L-shaped arm part,
38 ... L-shaped arm part, 39a ... Flexible hose for water 39b ... Flexible hose for air, 40 ... Hooking member, 41 ... Rack body for nickel plating, 42 ... Collar,
43 ... sealing material, 44 ... screw part,
45 ... Conductive support for cathode, 46 ...
Contact portion, 47 ... Anode case, 48 ... Bright nickel plating bath, 49 ... Bright nickel plating solution, 50 ... Anode conductive support,
51 ... Nickel chip, 52 ... Object to be plated,
53 ... Copper plating, 54 ... Semi-bright nickel plating, 55 ... Bright nickel plating, 56 ... Non-conductive fine particle dispersed nickel plating, 57 ... Chrome plating,
58 ... Surface micropore diameter.

Claims (5)

[Claims] 1. A rack-type nickel plating method for performing multiple-brightness plating on an object to be plated using a rack for nickel plating, wherein the object to be plated is immersed in a nickel plating tank in the preceding stage to perform nickel plating on the object to be plated. After that, when the object to be plated is lifted up from the nickel plating tank of the preceding stage using a rack carrier, on the nickel plating tank of the preceding stage, a cleaning liquid and a gas are sprayed onto the object to be plated, and the object to be plated is The method of nickel plating is characterized in that it is washed and drained, and then transferred to a nickel plating tank in the subsequent stage. 2. The nickel plating method according to claim 1, wherein the multiple bright plating is triple bright plating of semi-bright nickel plating, bright nickel plating and non-conductive fine particle dispersed nickel plating. 3. The nickel plating method according to claim 1, wherein the nickel plating bath in the preceding stage is a bright nickel plating bath. 4. A rack for nickel plating used in a rack-type nickel plating method for performing multi-gloss plating on an object to be plated, wherein a hooking member for supporting the object to be plated is the same as an anode case used when performing nickel plating. A rack for nickel plating, which is made of a material and is detachably attached to the rack body. 5. A rack type nickel plating method using the rack for nickel plating according to claim 4,
A nickel plating method, characterized in that the hooking member on which nickel plating is deposited by use is removed from a nickel plating rack and used as a part of a nickel plating anode.