JPH0718003B2 - Sputtering target for optical media Ingot material - Google Patents

Sputtering target for optical media Ingot material

Info

Publication number
JPH0718003B2
JPH0718003B2 JP2005139A JP513990A JPH0718003B2 JP H0718003 B2 JPH0718003 B2 JP H0718003B2 JP 2005139 A JP2005139 A JP 2005139A JP 513990 A JP513990 A JP 513990A JP H0718003 B2 JPH0718003 B2 JP H0718003B2
Authority
JP
Japan
Prior art keywords
optical media
sputtering target
alloy
sputtering
ingot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005139A
Other languages
Japanese (ja)
Other versions
JPH0499171A (en
Inventor
一男 吉川
誠治 西
隆 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP2005139A priority Critical patent/JPH0718003B2/en
Publication of JPH0499171A publication Critical patent/JPH0499171A/en
Publication of JPH0718003B2 publication Critical patent/JPH0718003B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、光メディア用スパッタリングターゲット材に
関し、詳細には、レーザー光を利用し、情報の読み出し
或いは書き込み読み出しを行う光ディスク、光磁気ディ
スク等の光メディアに用いられる反射膜を形成するため
のスパッタリングターゲット材に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering target material for optical media, and more specifically, an optical disk, a magneto-optical disk, etc. for reading or writing information using laser light. The present invention relates to a sputtering target material for forming a reflective film used for optical media.

(従来の技術) 光ディスク、光磁気ディスク等の光メディアは高信頼性
が要求され、特に記録されたデータの保存性の確保が重
要である。該データ保存性に対して、主に上記メディア
の主要部を構成する基板上の反射膜の劣化、特に反射膜
の酸化による反射率の経年的低下が大きな影響を及ぼす
ので、該反射率低下の防止が重要課題である。
(Prior Art) Optical media such as optical disks and magneto-optical disks are required to have high reliability, and it is particularly important to secure the storability of recorded data. The deterioration of the reflection film on the substrate, which constitutes the main part of the medium, particularly the deterioration of the reflectance over time due to the oxidation of the reflection film has a great influence on the data storability. Prevention is an important issue.

上記反射膜には従来より純Alが用いられ、これは基板上
に純Alの薄膜を形成したものである。該薄膜形成法とし
てはスパッタリング法又は蒸着法があるが、基板との密
着性向上の点からスパッタリング法が採用される場合が
多い。上記純Alとしては初期には99.9%(3N)純度のも
のが用いられていたが、純度が高いほど耐食性に優れ、
前記反射率の経年的低下が生じ難くなるので、現在では
99.99%(4N)純度のものが使用されている。
Conventionally, pure Al has been used for the reflective film, which is a thin film of pure Al formed on a substrate. The thin film forming method includes a sputtering method and a vapor deposition method, but the sputtering method is often adopted from the viewpoint of improving the adhesion to the substrate. As the above-mentioned pure Al, 99.9% (3N) purity was used at the beginning, but the higher the purity, the better the corrosion resistance,
Since it is difficult for the reflectance to decrease over time,
99.99% (4N) purity is used.

しかしながら上記純Alからなる反射膜は耐食性に限界が
あり、最近の信頼性の高度化の要求を充たし得ず、抜本
的対応策が必要とされている。
However, the reflection film made of pure Al has a limit in corrosion resistance and cannot satisfy the recent demand for higher reliability, and a drastic countermeasure is required.

そこで、Alの合金化による耐食性向上が試みられ、その
結果元素周期表Va族の金属を含有させたAl合金製の反射
膜が提案され、例えば、特開昭64−4938号公報にはAl-T
a合金膜が記載されている。かかる合金膜は下記の如き
スパッタリング法により基板上に形成される。即ち、
(a)純Alのターゲット上にVa族金属の小片を置いたも
の、(b)純AlとVa族金属のブロックをモザイク状に配
列したもの、又は、(c)純AlとVa族金属の粉末を混合
し、焼結したものをスパッタリングターゲット材に用
い、基板上にスパッタする方法により行われる。
Therefore, it was attempted to improve the corrosion resistance by alloying Al, and as a result, a reflective film made of an Al alloy containing a metal of the group Va of the periodic table of elements was proposed, for example, in JP-A-64-4938, Al- T
a Alloy film is described. Such an alloy film is formed on the substrate by the following sputtering method. That is,
(A) A small piece of a Va group metal placed on a target of pure Al, (b) a block of pure Al and Va group metals arranged in a mosaic pattern, or (c) a pure Al and Va group metal This is performed by a method in which powders are mixed and sintered and used as a sputtering target material, and sputtering is performed on a substrate.

(発明が解決しようとする課題) ところが、上記(a)及び(b)の方法は、AlとVa族金
属とのスパッタ率及び出射角度が異なるため、得られる
Al基合金製の反射膜(以降、合金膜という)の組成がタ
ーゲットの組成(AlとVa族金属との面積比)よりも小さ
くなり、この差はスパッタ条件や装置により変化するの
で、合金膜の組成を調整し難く、所定の合金膜を常に安
定して得るのが極めて困難である。加えて、ターゲット
材の使用中に前記面積比が連続的に変化するので、所定
の組成の合金膜が得られ難いという問題点がある。
(Problems to be Solved by the Invention) However, the methods (a) and (b) can be obtained because the sputtering rate and the emission angle of Al and the Va group metal are different.
The composition of the reflective film made of Al-based alloy (hereinafter referred to as alloy film) is smaller than the composition of the target (area ratio of Al and Va group metal), and this difference changes depending on the sputtering conditions and equipment. It is difficult to adjust the composition, and it is extremely difficult to always obtain a predetermined alloy film stably. In addition, since the area ratio continuously changes during use of the target material, it is difficult to obtain an alloy film having a predetermined composition.

(c)の方法は、Al粉末とVa族金属粉末とは比重が大き
く異なるため均一に混合され難く、ターゲット材の組成
が不均一になるので、合金膜の組成が不均一になり易い
という問題点がある。又、上記両粉末とも活性であり、
酸素を吸収し易いので、合金膜は多量の酸素を含有し、
そのため反射率が低くなるという問題点がある。
In the method (c), since the Al powder and the Va group metal powder have large specific gravities, it is difficult to mix them uniformly, and the composition of the target material becomes non-uniform, so that the composition of the alloy film tends to become non-uniform. There is a point. Also, both of the above powders are active,
Since it easily absorbs oxygen, the alloy film contains a large amount of oxygen,
Therefore, there is a problem that the reflectance becomes low.

本発明はこの様な事情に着目してなされたものであっ
て、その目的は従来のものがもつ以上のような問題点を
解消し、所定の組成の合金膜を安定して得ることができ
る光メディア用スパッタリングターゲット材を提供しよ
うとするものである。
The present invention has been made in view of such circumstances, and its purpose is to solve the above-mentioned problems of the conventional one and to stably obtain an alloy film having a predetermined composition. It is intended to provide a sputtering target material for optical media.

(課題を解決するための手段) 上記の目的を達成するために、本発明に係る光メディア
用スパッタリングケーゲット溶製材は次のような構成と
している。
(Means for Solving the Problems) In order to achieve the above-mentioned object, the ingot-sputtering material for optical media according to the present invention has the following structure.

即ち、請求項1に記載のスパッタリングケーゲット溶製
材は、元素周期表Va族のTa,Nb,Vの1種又は2種以上を
0.5〜10at%含有するAl基溶製合金より成るとともに、
該Va族元素のAlとの金属間化合物がAlマトリックス中に
均一に分散していることを特徴とする光メディア用スパ
ッタリングターゲット溶製材である。
That is, the sputtered cage material according to claim 1 contains one or more of Ta, Nb, and V of the Va group of the periodic table of elements.
In addition to being composed of Al-based molten alloy containing 0.5-10 at%,
An intermetallic compound of the Va group element with Al is uniformly dispersed in an Al matrix, which is a material for melting a sputtering target for optical media.

請求項2に記載のスパッタリングターゲット溶製材は、
前記金属間化合物の大きさが100μm以下である請求項
1に記載の光メディア用スパッタリングターゲット溶製
材である。
The sputtering target ingot material according to claim 2,
The ingot-melting material for optical media according to claim 1, wherein the size of the intermetallic compound is 100 μm or less.

請求項3に記載のスパッタリングターゲット溶製材は、
前記Al基溶製合金の酸素含有量が200ppm以下である請求
項1に記載の光メディア用スパッタリングターゲット溶
製材である。
The ingot material for sputtering target according to claim 3 is
The sputter target ingot material for optical media according to claim 1, wherein the oxygen content of the Al-based ingot alloy is 200 ppm or less.

(作用) 本発明に係る光メディア用スパッタリングターゲット溶
製材は、前記の如く、元素周期表Va族の中のTa,Nb,Vの
1種又は2種以上(以降、Ta等という)を0.5〜10at%
含有するAl基溶製合金、即ち溶製過程を経て製されたAl
基合金より成るので、前記Ta等のごく一部はAlマトリッ
クス中に固溶して存在し、殆どはAlとの金属間化合物と
なって存在する。前者の固溶したTa等の分布は均一であ
り、後者の金属間化合物も通常均一に分散して存在して
おり、かかる均一分散状態は容易に得られる。故に、前
記Ta等は前記Al基合金中に均一分散して存在し、マトリ
ックスのAlと一体となってターゲット材を形成してい
る。
(Operation) As described above, the melted material for the sputtering target for optical media according to the present invention contains one or more of Ta, Nb, and V in the Va group of the periodic table (hereinafter referred to as Ta) in an amount of 0.5 to 0.5. 10at%
Al-based ingot alloy containing, that is, Al produced through the ingot process
Since it is composed of a base alloy, only a small part of Ta or the like exists as a solid solution in the Al matrix, and most of it exists as an intermetallic compound with Al. The distribution of the solid solution Ta and the like in the former is uniform, and the intermetallic compound in the latter is usually also dispersed uniformly, and such a uniform dispersion state can be easily obtained. Therefore, the Ta and the like exist uniformly dispersed in the Al-based alloy, and form a target material together with Al in the matrix.

かかるターゲット材は、組成的に均一であるため使用中
の組成の経時変化が生じず、又、スパッタ率及び出射角
度が均一であるので、ターゲットの組成と得られる合金
膜の組成とが略一致する。従って、合金膜の組成を調整
し易く、その結果所定の組成の合金膜を安定して得るこ
とができる。又、上記ターゲット材は溶製過程を経て製
されるので酸素含有量を低水準にし得、そのため低酸素
量で、高反射率の合金膜が確実に得られる。
Since such a target material has a uniform composition, the composition does not change with time during use, and since the sputtering rate and the emission angle are uniform, the composition of the target and the composition of the obtained alloy film are substantially the same. To do. Therefore, the composition of the alloy film can be easily adjusted, and as a result, an alloy film having a predetermined composition can be stably obtained. In addition, since the target material is manufactured through a melting process, the oxygen content can be set to a low level, so that an alloy film having a low oxygen content and a high reflectance can be reliably obtained.

前記Ta等の含有量を0.5〜10at%としているのは、0.5at
%未満では耐食性向上効果が小さく、反射率の経年的低
下を充分に防止し得ず、10at%超では第1図に示す如く
必要な反射率:70%を確保し得なくなるからである。
The content of Ta and the like is 0.5 to 10 at% because 0.5 at
This is because if it is less than 10%, the effect of improving the corrosion resistance is small and it is not possible to sufficiently prevent the deterioration of the reflectance over time, and if it exceeds 10 at%, the required reflectance of 70% cannot be secured as shown in FIG.

前記Al基溶製合金の酸素含有量を200ppm超にすると、反
射率が低下する傾向にあるので、200ppm以下にすること
が望ましい。
If the oxygen content of the Al-based ingot-made alloy exceeds 200 ppm, the reflectance tends to decrease, so it is desirable to set it to 200 ppm or less.

前記金属間化合物の大きさが100μm超の場合は、ター
ゲット組成と合金膜組成とに差が生じるが、これを100
μm以下にすると該差が殆ど無くなり、合金膜組成をよ
り調整し易くなる。
When the size of the intermetallic compound is more than 100 μm, there is a difference between the target composition and the alloy film composition.
When the thickness is less than or equal to μm, the difference is almost eliminated, and the alloy film composition can be adjusted more easily.

尚、上記100μm以下にするには、溶解法により得られ
るAlとTa等との均一混合状態の溶湯を、急冷すればよ
い。該急冷の方法としては、該溶湯を、水冷銅鋳型また
は大冷却能を有する鋳型内に鋳造、水冷銅鋳型内で連続
鋳造する、回転する2本のロールの間に注ぎ薄板を作
る、或いは、不活性ガスにより噴霧化する等の方法が挙
げられる。
In order to reduce the thickness to 100 μm or less, the molten metal obtained by the melting method and having a homogeneous mixture of Al and Ta may be rapidly cooled. As the method of quenching, the molten metal is cast in a water-cooled copper mold or a mold having a large cooling capacity, continuously cast in a water-cooled copper mold, poured between two rotating rolls to form a thin plate, or Examples thereof include a method of atomizing with an inert gas.

(実施例) 実施例1 合金3Kgを真空下で誘導溶解し、水冷銅鋳型内に鋳造
し、Ta等を含有するAl基合金鋳塊を得た。該鋳塊のTa等
の含有量を第1表に示す。該鋳塊のミクロ組織を観察し
たところ、金属間化合物は、100μm以下の微細なもの
であり、均一に分散していることが確認された。
(Example) Example 1 3 kg of alloy was induction-melted under vacuum and cast in a water-cooled copper mold to obtain an Al-based alloy ingot containing Ta and the like. Table 1 shows the contents of Ta and the like in the ingot. When the microstructure of the ingot was observed, it was confirmed that the intermetallic compounds were fine particles of 100 μm or less and were uniformly dispersed.

上記鋳塊よりスパッタリングターゲットを採取し、これ
を用いてスパッタリングし、光ディスクの基板上に厚さ
1000Åの反射膜を形成した。ターゲットのTa等の含有量
及び酸素量、また反射膜中のTa等の含有量を第1表に示
す。ターゲットの組成と合金膜の組成とが略一致してい
ることが判る。
A sputtering target was taken from the ingot and sputtered using this to obtain the thickness on the substrate of the optical disc.
A 1000 Å reflective film was formed. Table 1 shows the Ta content and oxygen content of the target, and the Ta content in the reflective film. It can be seen that the composition of the target and the composition of the alloy film are substantially the same.

上記反射膜形成材の中の実験No.1,5及び8のものについ
て、光ディスクを製造し、環境加速試験(温度:105℃,
圧力:1.5atm,湿度:100%)を行った。又、純度4Nの純Al
製ターゲットを用いて上記と同様の反射膜形成、光ディ
スク製造、試験を行った。
Regarding the above-mentioned reflective film forming materials, those of Experiment Nos. 1, 5 and 8 were manufactured into optical disks and subjected to an environmental accelerated test (temperature: 105 ° C,
Pressure: 1.5 atm, humidity: 100%). Also, pure Al with a purity of 4N
The same reflective film formation, optical disc production, and test as described above were carried out using the target made of.

これらの試験結果を第2〜3図に示す。純Al製ターゲッ
トを用いた場合は、試験時間の経過に伴い反射率が急激
に低下し、エラレートが著しく増大している。これに対
し、実験No.1,5及び8のものは、反射率の低下が極めて
緩やかであり、エラレートの増大は殆ど認められず、一
定値を示している。
The results of these tests are shown in FIGS. When a pure Al target is used, the reflectance sharply decreases and the elalate significantly increases as the test time elapses. On the other hand, in Experiment Nos. 1, 5 and 8, the decrease in reflectance was extremely gentle, and the increase in elalate was hardly observed, indicating a constant value.

比較例1 純Al粉末とTa粉末とをVミキサーにて混合した後、HIP
法により400℃で焼結してスパッタリングターゲット材
を製造し、これを用いて前記実施例1と同様の反射膜形
成を行った。
Comparative Example 1 After mixing pure Al powder and Ta powder with a V mixer, HIP
A sputtering target material was manufactured by sintering at 400 ° C. by the method, and using this, the same reflection film formation as in Example 1 was performed.

上記ターゲット材のTa量と酸素量、及び、反射膜のTa量
を第2表に示す。該表から判る如く、ターゲットのTa量
に比し、合金膜のTa量が極めて少ない。
Table 2 shows the Ta amount and oxygen amount of the target material and the Ta amount of the reflective film. As can be seen from the table, the amount of Ta in the alloy film is extremely smaller than that in the target.

実験No.11の反射膜と実施例1の実験No.2の反射膜とを
比較すると、Ta量は同等であるが、前者の反射率は83
%、後者の反射率は71%であり、 両者は大幅に異なる。これは両者の酸素含有量の差に因
るものである。
Comparing the reflective film of Experiment No. 11 with the reflective film of Experiment No. 2 of Example 1, the Ta amounts are the same, but the reflectance of the former is 83
%, The reflectance of the latter is 71%, The two are significantly different. This is due to the difference in oxygen content between the two.

実施例2 Al−3at%Nb合金10Kgを誘導溶解し、この溶湯を双ロー
ル方式のストリップキヤスティングを行ったところ、Al
3Nbの微細析出物が均一に分散した組織を有する薄板が
得られた。これをターゲット板に加工し、スパッタリン
グに用いると、Al−Nbが均一に分布した反射膜が得られ
た。
Example 2 10 kg of Al-3 at% Nb alloy was induction-melted, and the melt was subjected to twin roll type strip casting.
A thin plate having a structure in which fine precipitates of 3 Nb were uniformly dispersed was obtained. When this was processed into a target plate and used for sputtering, a reflective film in which Al-Nb was uniformly distributed was obtained.

実施例3 Al−3at%Nb合金10Kgを誘導溶解し、この溶湯をガスア
トマイズして得られた急冷粉末を堆積させることによ
り、Al3Vの微細析出物が均一に分散した組織を有する薄
板が得られた。これをターゲット板に加工し、スパッタ
リングに用いると、Al−Vが均一に分布した反射膜が得
られた。
Example 3 10 kg of Al-3 at% Nb alloy was induction-melted, and a quenching powder obtained by gas atomizing this molten metal was deposited to obtain a thin plate having a structure in which fine Al 3 V precipitates were uniformly dispersed. Was given. When this was processed into a target plate and used for sputtering, a reflective film in which Al-V was uniformly distributed was obtained.

(発明の効果) 本発明に係る光メディア用スパッタリングターゲット材
によれば、所定の組成の合金膜(Al基合金製の反射膜)
を安定して得ることができるようになる。従って、耐食
性に優れ、劣化し難く、反射率の経年的低下を生じ難い
反射膜が得られ、そのため光メディアのデータの保存性
を向上し、信頼性を高めることができるようになる。
(Effect of the Invention) According to the sputtering target material for optical media of the present invention, an alloy film having a predetermined composition (a reflective film made of an Al-based alloy)
Will be able to get stable. Therefore, it is possible to obtain a reflective film that is excellent in corrosion resistance, is not easily deteriorated, and is unlikely to cause a decrease in reflectance over time. Therefore, it is possible to improve the storability of data on an optical medium and enhance the reliability.

【図面の簡単な説明】[Brief description of drawings]

第1図は、Al基溶製合金からなるスパッタリングターゲ
ット材のTa,Nb,Vの含有量と、該ターゲット材のスパッ
タリングにより得られる反射膜の反射率との関係を示す
図、第2図は,実施例1に係る光ディスクの環境加速試
験での試験時間と反射膜の反射率との関係を示す図、第
3図は,前記加速試験での試験時間とエラレートとの関
係を示す図である。
FIG. 1 is a diagram showing the relationship between the Ta, Nb, and V contents of a sputtering target material made of an Al-based alloy and the reflectance of a reflective film obtained by sputtering the target material, and FIG. FIG. 3 is a diagram showing the relationship between the test time in the environmental acceleration test of the optical disk according to Example 1 and the reflectance of the reflective film, and FIG. 3 is a diagram showing the relationship between the test time in the acceleration test and the error rate. .

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】元素周期表Va族のTa,Nb,Vの1種又は2種
以上を0.5〜10at%含有するAl基溶製合金より成るとと
もに、該Va族元素のAlとの金属間化合物がAlマトリック
ス中に均一に分散していることを特徴とする光メディア
用スパッタリングターゲット溶製材。
1. An intermetallic compound comprising an Al-based melted alloy containing 0.5 to 10 at% of one or more of Ta, Nb, and V of the Va group of the periodic table of elements, and an intermetallic compound with Al of the Va group of elements. Is a sputtering target ingot for optical media, in which is uniformly dispersed in the Al matrix.
【請求項2】前記金属間化合物の大きさが100μm以下
である請求項1に記載の光メディア用スパッタリングタ
ーゲット溶製材。
2. The material for melting a sputtering target for optical media according to claim 1, wherein the size of the intermetallic compound is 100 μm or less.
【請求項3】前記Al基溶製合金の酸素含有量が200ppm以
下である請求項1に記載の光メディア用スパッタリング
ターゲット溶製材。
3. The material for melting a sputtering target for optical media according to claim 1, wherein the oxygen content of the Al-based melted alloy is 200 ppm or less.
JP2005139A 1990-01-11 1990-01-11 Sputtering target for optical media Ingot material Expired - Fee Related JPH0718003B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005139A JPH0718003B2 (en) 1990-01-11 1990-01-11 Sputtering target for optical media Ingot material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005139A JPH0718003B2 (en) 1990-01-11 1990-01-11 Sputtering target for optical media Ingot material

Publications (2)

Publication Number Publication Date
JPH0499171A JPH0499171A (en) 1992-03-31
JPH0718003B2 true JPH0718003B2 (en) 1995-03-01

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4197579B2 (en) * 1997-12-24 2008-12-17 株式会社東芝 Sputtering target, Al wiring film manufacturing method using the same, and electronic component manufacturing method
KR100600908B1 (en) 1998-06-29 2006-07-13 가부시끼가이샤 도시바 Sputter target
JP4678062B2 (en) 2008-09-22 2011-04-27 Tdk株式会社 Optical media and manufacturing method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62240736A (en) * 1986-04-11 1987-10-21 Nippon Mining Co Ltd B-and c-containing aluminum alloy for semiconductor wiring material
JPS644938A (en) * 1987-06-26 1989-01-10 Mitsubishi Chem Ind Magneto-optical recording medium

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