JPH0717593A - Tray for semiconductor chip - Google Patents

Abstract

PURPOSE:To turn over semiconductor chips contained in a tray without using another tray by constituting the tray from a body and a detachable cover that can be attached either side of the body. CONSTITUTION:The slide rail 5 of a container 1 is fitted to the slide groove 8 of a cover 2 and the slide rail 7 is fitted to the slide groove 9. The cover is slid while being fitted to combine the container 1 with the cover 2. In this time, the clearance between the face 41 of the container 1 and the face 40 of the cover 2 is set about 0.2mm. In this state, semiconductor chips can be contained in a pocket 3. When the slide groove 8 is fitted to the slide rail 4 and the slide groove 9 is fitted to the slide rail 6, the face 40 of cover 2 is confronted by the face 42 of container 1 and the cover 2 is fitted to the reverse face of the container 1. Accordingly, the cover 2 can be fitted to both faces of container 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip storage tray used in a semiconductor manufacturing apparatus or the like.

[0002]

2. Description of the Related Art As conventional techniques, FIG. 4, FIG. 5 and FIG.
There is one shown in. In FIG. 4A, the semiconductor chip storage tray 20 is composed of one component, and a pocket 21 for storing the semiconductor chip is formed on one surface thereof. FIG. 4B shows in detail the state in which the semiconductor chip 22 is stored in the storage pocket 21.

FIG. 5 shows a state in which the semiconductor chips stored in the semiconductor chip storage tray are inverted by 180 °, that is, the semiconductor chip back surface 34 where the semiconductor chip and the semiconductor chip storage tray are in contact with each other and the semiconductor chip front surface 35.
Shows the work of reversing 180 ° so that the back surface 34 can be seen from the direction of the arrow 36. This is because it is necessary to inspect the back surface of the semiconductor chip and to store the semiconductor chip in the semiconductor chip storage tray before the back surface of the semiconductor chip can be seen and to ship it. This is done because the semiconductor chips cannot be directly stored in the semiconductor chip storage tray in a state where they can be seen. In FIG. 5A, the semiconductor chip storage tray 20
The semiconductor chips 26, 25, 24 are housed in the pockets 28, 30, 32 formed in the above. In this state, it has the same shape as the semiconductor chip storage tray 20,
The semiconductor chip storage tray 23, in which the pockets 29, 31, 33 are formed and the semiconductor chips are not stored, is stacked on the semiconductor chip storage tray 20 as shown in the figure. However, at this time, the respective pockets of the semiconductor chip storage trays 23 and 20 are aligned so as to be in symmetrical positions. In this combined state, the two semiconductor chip storage trays are turned over 180 ° in the rotation direction 27. FIG. 5B shows a state in which the inversion work is completed. After flipping, semiconductor chip 2
4, 25 and 26 are transferred and stored in the semiconductor chip storage tray 23, and the work is completed when the semiconductor chip storage tray 20 in which the semiconductor chips are not stored is removed. In this way, the 180 ° inversion of the semiconductor chips is realized by transferring between the semiconductor chip storage trays.

[0004]

However, in the above-mentioned prior art, as shown in FIG. 5A, the pockets 28, 30, 32 of the semiconductor chip storage tray 20 and the pockets 29, 31 of the semiconductor chip storage tray 23 are provided. , 33 is difficult to align symmetrically, and a jig or device for aligning them symmetrically is required if necessary.

As shown in FIG. 5B, the transferred semiconductor chip does not fit in the 180 ° inverted state but the semiconductor chips 25 and 26 can be placed in the 90 ° inverted state, or the semiconductor chip is mounted in the pocket. However, there is a problem in that The cause of the occurrence will be described in detail with reference to FIG. In FIG. 6A, the semiconductor chip storage tray 2
The pocket 28 formed in 0 has a pocket entrance dimension D larger than the pocket bottom dimension C. This is because it is easy to insert the semiconductor chip into the pocket in the semiconductor manufacturing apparatus. Further, in the dimensions A and B on one side of the semiconductor chip 26, A> B was used to cause a difference, but in recent years, there is a tendency of A≈B or A ≦ B. Under these conditions, the semiconductor chip storage trays 20 and 23
FIG. 6B shows a state in which the pockets 28 and 29 are combined with each other. 6C shows the state in the middle of further rotation in the reversing direction 27, but the pockets 28, 29
The space created by has a space in which the semiconductor chip 26 can freely rotate. This factor is influenced by the dimensions A and B of the semiconductor chip described above being A≈B or A ≦ B. For this reason, there is a problem in that the semiconductor chips that have been transferred do not fit in a 180 ° inverted state, and some of them are placed in a 90 ° inverted state, and some of them are mounted in a pocket.

Therefore, the present invention solves such a problem, and an object thereof is to reverse the front and back of the semiconductor chips stored in the semiconductor chip storage tray without transferring them between the semiconductor chip storage trays. The present invention provides a semiconductor chip storage tray.

[0007]

In order to solve the above problems, the present invention relates to a semiconductor chip storage tray, which comprises two parts, a storage part and a lid part, the lid part being detachable, and the top surface of the storage part. The structure is detachable on both sides of the lower surface.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1A, a pocket 3 for accommodating a semiconductor chip is formed in the accommodating portion 1, and slide rails 4, 5, 6, and 7 are further formed on both side surfaces and protrude. However, the pocket 3 has a shape penetrating from the surface 42 to the surface 41 in the storage section 1. The lid portion 2 is formed with slide grooves 8 and 9, and the slide groove 8 and the slide rail 5 are fitted to each other.
And the slide rail 7 are fitted to each other.
Then, the state where the accommodating portion 1 and the lid portion 2 are combined by sliding in the sliding direction 10 in the fitted state is shown in FIG.
Becomes At this time, the surface 40 of the lid portion and the surface 41 of the storage portion are aligned with a clearance of about 0.2 mm. The semiconductor chip can be stored in the pocket 3 in the state of FIG. In addition, slide groove 8
The surface 40 of the lid portion 2 and the surface 42 of the storage portion are fitted by fitting the slide groove 9 to the slide rail 6 so that the lid portion 2 can be attached to the opposite surface of the storage portion 1. In this case, the semiconductor chip is stored from the surface 41 side of the storage section.

FIG. 2 is a cross-sectional view showing a state in which a semiconductor chip is stored. Pocket 3 formed in the storage part 1
Are provided with tapers 12 and 13 so that the semiconductor chip 11 can be easily inserted from the direction 43. Taper 14, 1
Reference numeral 5 is provided for facilitating the insertion of the semiconductor chip 11 into the opposite surface of the housing 1 from the mounting direction 44.

FIG. 3 is a diagram showing a method of inverting the semiconductor chips stored in the semiconductor chip storage trays without transferring them between the semiconductor chip storage trays. Figure 3
In (a), the lid portion 2 is attached to the storage portion 1 through the fitting with the slide rails 5 and 7 formed in the storage portion 1. The semiconductor chip 11 is inserted into the pocket 3 formed in the storage portion 1, and the back surface 1 of the semiconductor chip 11 is
8 is grounded to the lid portion 2 and the surface 17 is housed in such a posture that the surface 17 can be seen on the surface. In FIG. 3B, FIG.
From this state, the lid portion 16 is attached via the slide rails 4 and 6 formed in the storage portion 1. In this manner, the semiconductor chip 11 cannot rotate in the pocket 3 when the two lids are attached to the single housing. Therefore, the structure in which the lid 2 is removed by rotating it 180 degrees in the rotation direction 19 and the lid 16 is attached is shown in FIG.
It is (c). In the state of FIG. 3 (c), the front surface 17 of the semiconductor chip 11 is grounded to the lid portion 16 and the back surface 18 is housed in a posture in which it can be seen and exposed. In order to make the surface 17 visible again, the operation shown in FIG. 3 may be repeated.

In this way, by forming the semiconductor chip storage tray into a two-part configuration of the storage portion and the lid portion, it is difficult to reverse the front and back of the semiconductor chips stored in the semiconductor chip storage tray by transferring them between the semiconductor chip storage trays. It can be performed without any work and without being influenced by the shape of the semiconductor chip.

[0012]

As described above, according to the present invention, the semiconductor chip storage tray has a two-part construction of the storage portion and the lid portion, and the lid portion is removable on both sides of the storage portion.
There is an effect that the front and back of the semiconductor chips stored in the semiconductor chip storage tray can be easily and reliably reversed. Furthermore, this effect enables backside inspection of semiconductor chips,
Moreover, there is an effect that the semiconductor chips can be shipped in a state where the back surface can be seen.

[Brief description of drawings]

FIG. 1 is an explanatory view of a semiconductor chip storage tray of the present invention.

FIG. 2 is a sectional view of a semiconductor chip storage tray of the present invention.

FIG. 3 is an explanatory view of a method of reversing the front and back of the semiconductor chips stored in the semiconductor chip storage tray of the present invention.

FIG. 4 is an explanatory view of a conventional semiconductor chip storage tray.

FIG. 5 is an explanatory diagram of a method of reversing the front and back of the semiconductor chips stored in the semiconductor chip storage tray of the related art.

FIG. 6 is a detailed view of the pocket portion of the semiconductor chip storage tray when the semiconductor chips stored in the conventional semiconductor chip storage tray are turned upside down.

[Explanation of symbols]

1 Storage Section 2, 16 Lid Section 3 Pockets 4, 5, 6, 7 Slide Rails 8, 9 Slide Grooves 10 Sliding Direction 11, 22, 24, 25, 26 Semiconductor Chips 12, 13, 14, 15 Taper 17, 35 Surface 18, 34 Back surface 19, 27 Rotational direction 20, 23 Semiconductor chip storage tray 21, 28, 29, 30, 31, 32, 33 Pocket 36 Arrow view 40, 41, 42 Surface 43, 44 direction A, B dimension C Bottom dimension D pocket entrance dimensions

Claims (1)

[Claims] 1. A storage tray for storing a semiconductor chip has a two-part construction of a storage part and a lid part, and the lid part is made removable so that it can be attached to either the upper surface or the lower surface of the storage part. A semiconductor chip storage tray that is capable of storing semiconductor chips from both the top and bottom surfaces.