JPH07173249A - Low-smoking flame-retardant compound - Google Patents

Abstract

PURPOSE:To obtain a compound having low-smoking properties, excelling in flame retardancy and mechanical and electrical properties and being useful as the material of semiconductor sealing, a flame retardant for synthetic resins or the like by giving thereto a specified structure in which the p-phenylene content is high and the weight-average molecular weight has a specified value. CONSTITUTION:This compound is one represented by formula I [wherein R1 and R2 are each H or a group of formula II or III (wherein Y and Z are each a 1-10C aliphatic or aromatic hydrocarbon group; and i and j are each 0-5 provided that i+j is 5 or less); A is a 1-5C (un)saturated hydrocarbon group; X1 to X4 are each H or a 1-10C aliphatic or aromatic hydrocarbon group; and m is an integer of 0 or greater] and having a p-phenylene selectivity of 40% or above and a weight-average molecular weight of 250000 or below. This compound, being a polycondensate of a bisphenol compound of a highp-phenylene content with an epihalohydrin, has low smoking properties and excels in flame retardancy and mechanical and electrical properties, and therefore it can desirably be used for lamiates, materials for semiconductor sealing, flame retardants for synthetic resins, materials for composite materials, castings, coating materials, etc.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention is excellent in flame retardancy and low smoke emission, and has a laminated plate, a sealing material for semiconductors, a flame retardant for synthetic resins,
The present invention relates to a flame-retardant compound suitable for use in various composite materials, cast products, paints and the like.

[0002]

2. Description of the Related Art In recent years, the development of plastic utilization technology has been remarkable and various structural materials, automobile parts, office supplies, F
Widely used in RP, electronic parts, electric equipment, various paints, adhesives, etc. However, since plastics generally have a tendency to burn easily, various flame retardants may be used to impart flame retardancy to plastics in applications requiring flame retardancy, such as electrical equipment, electronic parts, and various structural materials. Various innovations have been made such as addition. At present, a method of adding a halogen-containing substance such as bromine or introducing a bromine atom into the structure of a plastic is widely used as a flame retardant technique for a plastic.

For example, when imparting flame retardancy to a synthetic resin such as polystyrene, a technique of blending a brominated flame retardant is generally used. Epoxy resins are used in various composite materials because they have excellent heat resistance and adhesiveness. As a general epoxy resin, a bisphenol A-type epoxy resin, which is a polycondensation product of bisphenol A and epichlorohydrin, is used. However, since the bisphenol A-type epoxy resin has a flammable property, it is flame-retardant such as for laminated boards. Brominated epoxy resins of the type in which a bromine atom is bonded to the resin skeleton are used for applications where is required.

[0004]

However, when a brominated epoxy resin is used as a flame retardant for synthetic resins,
There are problems that the brominated epoxy resin is decomposed at the molding stage to generate toxic gas to the human body, and the mold and screw are corroded. Further, the brominated epoxy resin has various problems because it contains highly corrosive bromine. For example, in order to produce a brominated epoxy resin, it is necessary to use equipment of highly corrosion-resistant material in a production line such as a reactor made of glass-lined material, which is not industrially preferable.

When a brominated epoxy resin is used for a laminated plate, a process of drilling holes (through holes) in the laminated plate is performed in the process of finishing the laminated plate into a printed wiring board. Corrosive gas is generated
There are problems such as corrosion of the drill and deterioration of the working environment. Further, the bromine-based compound is excellent in flame retardancy, but has a drawback that it emits toxic gas and a large amount of smoke during combustion.

[0006]

As a result of intensive studies, the present inventor has found that a specific compound solves the above problems, and has completed the present invention. That is, the present invention includes 1) the following general formula (I)

[0007]

[Chemical 3]

[Wherein R ₁ and R ₂ are

[0009]

[Chemical 4]

(Y and Z are aliphatic or aromatic hydrocarbon groups having 1 to 10 carbon atoms, which are the same or different from each other, and i
And j is an integer of 0 to 5, and i + j satisfies 5 or less)
The same or different groups selected from X ₁ , X ₂ , X
₃ , X ₄ are the same or different from each other and are hydrogen or an aliphatic or aromatic hydrocarbon having 1 to 10 carbon atoms, and m is an integer of 0 or more. ] The low smoke generating flame-retardant compound of p-phenylene selectivity of 40% or more and the weight average molecular weight of 250,000 or less. 2) A low smoke-retardant flame-retardant resin composition comprising (1) a low smoke-retardant flame-retardant compound represented by the general formula (I) and (2) a curing agent. 3) A low-smoke-retardant composite material comprising (1) a fiber base material and (2) a low-smoke-retardant compound represented by the general formula (I). 4) Low smoke emitting flame retardant synthetic resin characterized by containing 100 weight parts of the synthetic resin (1) and 5 to 50 weight parts of the low smoke emitting flame retardant compound represented by the general formula (I). It is a composition.

The p-phenylene selectivity in the present invention means the carbon atom directly bonded to the benzene nucleus in the general formula (I) (provided that it is contained in X ₁ , X ₂ , X ₃ and X ₄ in the formula. Except) and the oxygen atom, the ratio (molar ratio) of the structure represented by the formula (II) to the total structure represented by the following formulas (II), (III) and (IV) is meant. To do.

[0012]

[Chemical 5]

The higher the p-phenylene selectivity, the more
High flame retardancy is preferable, and 40% or more and 100% or less,
Preferably 50% or more and 100% or less, more preferably 6
0% to 100%, more preferably 70% to 10
It is 0% or less, particularly preferably 80% or more and 100% or less, and most preferably 90% or more and 100% or less. The low smoke generating flame retardant compound of the present invention has a weight average molecular weight of 250,000 or less.

When the weight average molecular weight is higher than 250,000, the impact resistance and fluidity of the flame-retardant resin composition obtained by blending the low-smoke-resistant flame-retardant compound with a resin are lowered, and the low smoke-storing property is difficult. When a flame-retardant compound is applied to a flame-retardant composite material or a sealing material for electronic parts, the heat resistance of the cured product obtained by curing the low-smoke-resistant flame-retardant compound is lowered or the water absorption rate is increased. To do. When the weight average molecular weight is less than 320, the heat resistance of the flame-retardant resin composition obtained by blending the low-smoke-proof flame-retardant compound with a synthetic resin may decrease.

Therefore, when the low smoke generating flame-retardant compound is blended with a synthetic resin, the weight average molecular weight is preferably 320 or more and 250,000 or less, more preferably 100.
It is 0 or more and 25,000 or less. When applied to a flame-retardant composite material or a semiconductor encapsulating material, a low-smoke-resistant flame-retardant compound having a minimum unit of m = 0 in the general formula (I) may be used, and a preferable range is 250,000 or less, more preferably 100,000.
Or less, more preferably 50,000 or less, and particularly preferably 25,000 or less. The weight-average molecular weight of the low smoke-retardant flame-retardant compound of the present invention is determined by gel permeation chromatography based on a calibration curve using polystyrene as a standard substance. The method for synthesizing the low smoke-retardant compound of the present invention is not particularly limited. It can be obtained by a polycondensation reaction.

[0016]

[Chemical 6]

[Wherein A is a saturated or unsaturated hydrocarbon having 1 to 5 carbon atoms, X ₁ and X ₂ are the same or different from each other, or an aliphatic or aromatic hydrocarbon having 1 to 10 carbon atoms] Hydrogen] A specific method for synthesizing the low-smoke-retardant compound of the present invention is
For example, a new epoxy resin (edited by Hiroshi Kakiuchi, Shokoido, Showa 60)
(Published annually, page 29, line 6 to page 31, bottom to line 7)
It can be synthesized according to any one of various known methods for synthesizing an epoxy resin which are already known, such as the method described in (1). As an example thereof, the bisphenol compound represented by the general formula (V) having a p-position selectivity of 40% or more is added to the bisphenol compound in an amount of 5% or less.
It is dissolved in a double molar equivalent of epichlorohydrin and kept at 40 ° C. to 80 ° C. in the presence or absence of water, and the hydroxyl group in the bisphenol compound and an equivalent amount of alkali or alkaline aqueous solution are added at once or for 15 minutes to 120 ° C.
It is gradually added over a period of 5 minutes, and after the addition of alkali is further reacted for 5 to 60 minutes, the salt produced as a by-product is removed by washing with water, and excess epichlorohydrin is distilled off to obtain the low smoke-producing property of the present invention. Flame-retardant compounds can be obtained.

Further, a low-smoke-retardant compound having a higher molecular weight can be obtained by reacting the low-smoke-retardant compound having an epoxy group at the terminal among the low-smoke-retardant compound with the following reaction. Can be synthesized. For example, the low smoke generating flame-retardant compound obtained by the above method, in the presence or absence of a catalyst, the same or different from the raw material of the above flame retardant, p-position selectivity is 40% or more or 40% The bisphenol compound represented by the following general formula (V) can be obtained by reacting the bisphenol compound represented by the following general formula (V) under blending conditions satisfying a p-phenylene selectivity of 40% or more in the produced flame retardant. Further, at this time, the low smoke-retardant compound having an arbitrary molecular weight can be synthesized by adjusting the equivalent ratio of the epoxy group in the low smoke-retardant compound to be reacted and the phenolic hydroxyl group in the bisphenol compound, Also, those having an epoxy group or a phenolic hydroxyl group at the terminal can be synthesized. Further, the low smoke-retardant flame-retardant compound of the present invention has a p-position selectivity of less than 40% and is obtained by polycondensing a bisphenol compound represented by the general formula (V) with epichlorohydrin in the presence of a catalyst or In the absence of the bisphenol compound represented by the general formula (V) having a p-position selectivity of 40% or more, the low smoke-producing flame-retardant compound is produced under the condition that the p-phenylene selectivity is 40% or more. It can also be obtained by reacting under the compounding conditions that are satisfied.

Alternatively, it can be synthesized by a method generally called a one-step method of a solid epoxy resin. That is, when the p-position selectivity is 40% or more, 4 mol of the bisphenol compound represented by the general formula (V) and 10 wt% NaOH
It can also be obtained by adding 6.43 mol of an aqueous solution and further adding 5 mol of epichlorohydrin to carry out the reaction.
The p-position selectivity in the present invention refers to a carbon atom directly bonded to a benzene nucleus in the structure represented by the following general formula (VI), general formula (VII) or general formula (VIII) contained in the bisphenol compound. Regarding the positional relationship between the hydroxyl groups (excluding those contained in X ₁ and X ₂ in the formula) and the hydroxyl group, the ratios of the structures in the p-positions relative to each other are shown in the general formula (VI), the general formula (VII), and the general formula (VII). The respective molar ratios of formula (VIII) are a,
When defined as b and c, they are defined by the following equation. The molar ratio of the general formula (VI), the general formula (VII), and the general formula (VIII) can be obtained from the area ratio when the bisphenol compound is analyzed by capillary gas chromatography using an FID detector. it can.

[0020]

[Equation 1]

[0021]

[Chemical 7]

When the low smoke-retardant flame-retardant compound is used as a flame-retardant agent for synthetic resins, the low smoke-retardant flame-retardant compound having an epoxy group as an end group can be used, for example, if necessary. By reacting with a phenol compound represented by the following general formula (IX), compatibility with a synthetic resin can be improved, and as a result, Izod impact strength can be improved.

[0023]

[Chemical 8]

[Wherein Y and Z are aliphatic or aromatic hydrocarbon groups having 1 to 10 carbon atoms and are the same or different from each other, i and j are integers of 0 to 5, and i + j is 5 or less. Satisfying] Further, in the low smoke-retardant flame retardant compound of the present invention, chlorine may remain from the epichlorohydrin used in the production process, but its easily hydrolyzable chlorine content and total chlorine content The preferred range depends on the application. For example, when used as a laminate or encapsulating material for electronic components, the lower the content of easily hydrolyzable chlorine and the total chlorine content, the less the corrosion of the wiring occurs, and the less the electrical resistance during long-term use. It is preferable because the deterioration of the characteristics is small, and the easily hydrolyzable chlorine content is preferably 3000 pp.
m or less, more preferably 1000 ppm or less, further preferably 500 ppm or less, particularly preferably 200 pp.
m is used. The total chlorine content is preferably 5000 ppm or less, more preferably 2000 ppm.
Below, more preferably 1200 ppm or less is used.

When the low smoke generating flame retardant compound is used as a flame retardant for synthetic resins, the lower the easily hydrolyzable chlorine content and the total chlorine content, the more the corrosion of the screw and mold of the molding machine will occur. It is preferable because it has low property. Therefore, easily hydrolyzable chlorine is 5% or less, preferably 1% or less, more preferably 5000 ppm or less, particularly preferably 1000 ppm or less, and particularly preferably 500.
Those below ppm are used. The total chlorine content is 5% or less, preferably 1% or less, more preferably 50%.
The amount used is not more than 00 ppm, particularly preferably 1000 ppm. Further, the diol end group of the present invention refers to a structure represented by the following general formula (X), and the diol end group content is the equivalent number of diol end groups contained in 1 kg of a low smoke emitting flame retardant compound. Is defined.

[0026]

[Chemical 9]

The preferred range of the diol terminal group content of the low smoke-retardant flame-retardant compound of the present invention varies depending on the use of the flame retardant, but, for example, when it is used for a laminate or a sealing material for electronic parts, The lower the content, the higher the flame retardancy of the epoxy cured product, the lower the water absorption, the better the electrical properties such as volume resistivity and relative permittivity, and the mechanical strength such as elastic modulus and glass transition temperature. And copper foil peel strength is improved, and the like, and preferably 500 meq. / K
g, more preferably 100 meq. / Kg or less, particularly preferably 60 meq. / Kg or less, more preferably 30 meq. / Kg is used. Further, when the low smoke emitting flame retardant compound is used as a flame retardant for a synthetic resin, if the diol end group content is too high, the flame retardancy and light resistance of the synthetic resin may be reduced, or the flame retardant may be used. And the compatibility of the synthetic resin is deteriorated, and the Izod strength of the synthetic resin obtained by blending the flame retardant is lowered.
Preferably 2 eq. / Kg, more preferably 0.5e
q. / Kg or less, particularly preferably 0.1 eq. / Kg or less is used.

The low smoke generating flame retardant compound of the present invention may be used as a mixture with a generally used epoxy resin. Examples of the epoxy resin that can be mixed with the present invention include bisphenol A, bisphenol F, bisphenol S, bisphenol AD, tetramethylbisphenol A, tetramethylbisphenol F, tetramethylbisphenol AD, tetramethylbisphenol S, biphenol, Epoxy resin obtained by reaction of dihydric phenols such as tetramethylbiphenol, dihydroxynaphthalene and naphthol with epihalohydrin such as epichlorohydrin, epoxy resin obtained by reaction of trivalent phenols such as trisphenolmethane with epihalohydrin such as epichlorohydrin , Novolac type epoxy resin such as phenol novolac epoxy resin and cresol novolac epoxy resin. The low smoke generating flame retardant compound of the present invention may be used alone or in combination of two or more kinds. The low smoke generating flame retardant compound of the present invention can also be used as a matrix material for a low smoke generating flame retardant composite material when used in combination with a fiber base material.

As the fiber base material, continuous fibers, short fibers, pulp fibers, etc. can be used, and as the fibers to be used, carbon fibers, graphite fibers, glass fibers, glass fiber cloth, glass fiber cloth, carbon fiber cloth and carbonized fiber can be used. Organic and inorganic fibers such as silicon fiber, alumina fiber, titania fiber, ceramic fiber, aromatic polyamide fiber, aromatic polyester fiber, and polybenzimidazole fiber can be exemplified, but not limited thereto.

As in the case where the low-smoke-retardant compound obtained by the present invention is used in a usual application field of a conventional epoxy resin such as a flame-retardant composite material, a sealing material for electronic parts, or a flame-retardant paint. When used as a cured product, usable curing agents include amine curing agents, dicyandiamide, polyaminoamide curing agents, acid and acid anhydride curing agents, and third curing agents.
Examples thereof include amines, imidazoles, Lewis acids, Bronsted acid salts, polymercaptan curing agents, phenol resins, resole resins, urea resins, melamine resins, isocyanate compounds, blocked isocyanate compounds and novolac phenols.

Examples of amine-based curing agents include ethylenediamine, 1,3-diaminopropane, 1,4-diaminopropane, hexamethylenediamine, 2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine, diethylenetriamine and iminobis. Propylamine, bis (hexamethylene) triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, aminoethylethanolamine,
Tri (methylamino) hexane, dimethylaminopropylamine, 1,3,6-trisaminomethylhexane,
Polymethylene diamine, trimethyl hexamethylene diamine, diethylene glycol bis propylene diamine,
Examples thereof include chain amines such as diethylaminopropylamine, methyliminobispropylamine, and 2,5-dimethyl-2,5-hexanediamine, and also tris (4-amino-3-methylcyclohexyl) methane, mensendiamine, Examples thereof include isophoronediamine, diaminodicyclohexylmethane, ethylaminopiperazine, hydrogenated products of 1,3,5-tris (aminomethyl) benzene, and cyclic amines such as aminoethylpiperazine.

Further, there may be mentioned aliphatic amines having an aromatic ring such as tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine and the like.
Phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4-diaminoanisole, 2,
4-toluenediamine, 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 2,4-
Diaminodiphenyl sulfone, 4,4′-diaminodiphenyl sulfone, diaminodixylyl sulfone,
Aromatic amines such as 3,3′-diethyl-4,4′-diaminodiphenylmethane, 2,6-diaminopyridine, m-aminophenol, m-aminobenzylamine, 4-chloro-orthophenylenediamine and the like can be mentioned. The secondary and tertiary amines are, for example, triethylamine,
Benzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol, tetramethylguanidine, triethanolamine, N, N-dimethylpiperazine, 1,4
-Diazadicyclo (2,2,2) octane (triethylenediamine), pyridine, picoline, piperidine, pyrrolidine, tris (dimethylaminomethyl) phenol-
Tris-ethylhexylate and the like can be mentioned.

As the polyaminoamide-based curing agent, there are commercially available ones such as Thomaide (Fuji Kasei), Versamide, Dienamide (Henkel White Water), Lacqueramide (Dainippon Ink), Sunmide (Sanwa Kagaku), Polymide (Sanyo). Chemical formation) and the like. Examples of the acid and acid anhydride-based curing agents include dodecenyl succinic anhydride, polyadipic acid anhydride, polyazelaic acid anhydride, polysebacic acid anhydride, poly (ethyloctadecanedioic acid) anhydride, methyltetrahydrophthalic anhydride, and methylhexahexahydrate. Hydrophthalic anhydride, methylhymic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexenedicarboxylic anhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone Examples thereof include tetracarboxylic acid anhydride, ethylene glycol bis trimellitate, het anhydride, and tetrabromophthalic anhydride.

The tertiary amines include tris (dimethylaminomethyl) phenol, dimethylbenzylamine,
1,8-diazacyclo (5,4,0) undecane and the like can be mentioned. Examples of the imidazoles include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2. -Methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-ethyl-4 -Methylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2-methylimidazolium isocyanurate, 2-phenylimidazolium isocyanurate, 2,4-diamino-6- [2-
Methylimidazolyl- (1)]-ethyl-S-triazine, 2,4-diamino-6- [2-ethyl-4-methylimidazolyl- (1)]-ethyl-S-triazine,
2,4-Diamino-6- [2-undecylimidazolyl- (1)]-ethyl-S-triazine, 2-phenyl-
4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole,
1-cyanoethyl-2-phenyl-4,5-di (cyanoethoxymethyl) imidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 1,3
-Dibenzyl-2-methylimidazolium chloride and the like.

Examples of the Lewis acid and Bronsted acid salt include boron trifluoride-amine complex, arsenic pentafluoride-amine complex, antimony pentafluoride-amine complex and the like. As the polymercaptan-based curing agent, commercially available ones include Capcure, Epomate [above Kayoka Shell Epoxy Co., Ltd.], ADEKA HARDNER [Asahi Denka Kogyo Co., Ltd.] and the like. Examples of novolaks include phenol novolac, cresol novolac, and bisphenol A novolac.

These hardeners are not limited to those mentioned above, and one kind of hardener may be used alone.
Alternatively, they may be used in combination of two or more. As the amount of the curing agent used, an appropriate amount can be used depending on the curing agent used. If the amount of the curing agent used is too large or too small, curing of the cured product will be insufficient and heat resistance and Mechanical strength is reduced. Further, when a low smoke generating flame retardant compound obtained in the present invention is a cured product such as when used as a sealing material for laminated plates and electronic parts, imidazoles,
Curing accelerators such as tertiary amines, phosphines and triazoles can be used.

When the low-smoke-retardant and flame-retardant compound of the present invention is used as a cured product such as a laminated plate or a sealing material for electronic parts, various additives can be added if necessary. Examples of various additives include diluents, flame retardant aids, heat stabilizers, fillers, reinforcing agents, and colorants. Examples of flame retardant aids that can be used include Sb ₂ O ₃ , phosphorus compounds, tetrabromobisphenol A type epoxy resins, low brominated epoxy resins, and chlorinated polyethylene compounds. Examples of phosphorus compounds include red phosphorus. , Red phosphorus, triphenyl phosphate, cresyl diphenyl phosphate, tris dichloropropyl phosphate surface-treated with resin or metal oxide, or hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenyl sulfone, dihydroxydiphenyl oxide, Polyphosphoric acid ester oligomers obtained by reacting dihydric phenols such as dihydroxybiphenyl and their halides with phosphorus oxychloride; phenol compounds represented by the following general formula (XI) Glycidyl ethers such as Nord compounds.

[0038]

[Chemical 10]

[In the formula, X ₅ , X ₆ and X ₇ are the same or different and each represents a hydrogen atom or an aliphatic group having 1 to 10 carbon atoms. As the diluent, an organic solvent such as toluene or xylene, or butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, glycidyl ether of an alcohol having 12 to 13 carbon atoms,
Examples thereof include reactive diluents such as phenyl glycidyl ether and polyhydric alcohol glycidyl ether. Examples of the filler include alumina, silica, calcium silicate, magnesium oxide, titanium oxide, magnesium hydroxide, aluminum hydroxide, talc, mica and the like.

When the curing agent is mixed with the low smoke generating flame retardant compound of the present invention, use of a kneader, an extruder, a Brabender mixer, a ball mill, a tumbler mixer, a super mixer, a Banbury mixer, a roll, etc. Alternatively, the varnish can be prepared by dissolving the low smoke-producing flame-retardant compound or the like in a solvent. The solvent that can be used in this case is not particularly limited,
Acetone, methyl ethyl ketone, methyl cellosolve, methyl isobutyl ketone, N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfoxide, xylene, toluene, cellosolve acetate, P
GM and the like, N, N in terms of excellent resin solubility
A polar solvent such as -dimethylformamide or N, N-dimethylacetamide is preferable.

As the synthetic resin to which the low smoke-retardant compound of the present invention can be applied, polyethylene resin, polypropylene resin, polystyrene resin, styrene / butadiene copolymer, styrene / butadiene / acrylonitrile copolymer, styrene / butadiene. Acrylonitrile / maleic anhydride copolymer, ethylene vinyl acetate copolymer, polymethacrylic acid resin, polyvinyl acetate resin, polybutene resin, polyamide resin, polyacetal resin, polycarbonate resin, saturated polyester resin, unsaturated polyester resin, phenol resin, Epoxy resin, polyurethane resin, alkyd resin, melamine resin, urea resin, diallyl phthalate resin, polybutadiene resin, AAS resin, AES resin, AS resin, ABS / PVC resin, polybutylene terephthalate resin Rate resin, polyethylene terephthalate resin, ACS resin, MBS resin, ketone resin, phenoxy resin, polyamideimide resin, polyarylate resin, thermoplastic polyimide resin, thermosetting polyimide resin, polyetherimide resin, polyetheretherketone resin, polyethylene Examples thereof include oxide resins, polysulfone resins, polyphenylene ether resins, regenerated fibers such as cellulose acetate and viscose rayon, and elastic bodies such as acrylonitrile / butadiene rubber.

The low smoke generating flame retardant compound of the present invention is a resin 1
1 to 50 parts by weight, preferably 5 to 4 parts by weight with respect to 00 parts by weight
0 parts by weight, and more preferably 10 to 35 parts by weight are blended. When the amount of the low smoke generating flame retardant compound is less than 1 part by weight, sufficient flame retardancy is not exhibited, and when it is more than 50 parts by weight, mechanical properties such as Izod strength of the resin are deteriorated and practically used. Not preferable. Even when the low smoke-retarding flame-retardant compound of the present invention is used as a flame retardant for a synthetic resin, various additives can be added, if necessary, within a range not impairing the object of the present invention. Examples of various additives include an ultraviolet absorber, a sterically hindered amine-based light resistance stabilizer, a plasticizer, a flame retardant aid, a lubricant, a heat stabilizer, a filler, a reinforcing agent, and a colorant.

Examples of the flame retardant aid in the flame retardant resin composition of the present invention include Sb ₂ O ₃ , phosphorus compounds, tetrabromobisphenol A type epoxy resins and chlorinated polyethylene compounds. Examples of phosphorus compounds are , For example, red phosphorus,
Red phosphorus, triphenyl phosphate, cresyl diphenyl phosphate, trisdichloropropyl phosphate surface-treated with resin or metal oxide, or hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenyl sulfone, dihydroxydiphenyl oxide, di Examples thereof include hydroxybiphenyl, and polyphosphate ester oligomers obtained by reacting divalent phenols such as halides with phosphorus oxychloride. The flame-retardant resin composition of the present invention can be obtained by blending the low-smoke-proof flame-retardant compound of the present invention with a synthetic resin, and if necessary, an additive such as a flame-retardant auxiliary agent. Is not particularly limited,
Tumbler mixer, super mixer, Banbury mixer, kneader, roll, single screw extruder, twin screw extruder,
There is a method such as Brabender mixer.

[0044]

EXAMPLES Next, the present invention will be specifically described with reference to Examples and Comparative Examples. The physical properties and properties shown in the examples are based on the following measuring methods. <P-position selectivity> The p-position selectivity was analyzed by FID using a capillary gas chromatography and determined from the area ratio of each component. Column to be used: Ultra 1 manufactured by Hewlett-Packard Company <Epoxy equivalent> The mass of a resin containing 1 g equivalent of an epoxy group, which was determined according to JIS K-7236.

<Weight Average Molecular Weight> The weight average molecular weight was measured by gel permeation chromatography based on a calibration curve using polystyrene as a standard substance. Solvent: THF column: When weight average molecular weight is less than 2000 When three KF803L manufactured by Showa Denko are connected in series When when weight average molecular weight is 2000 or more KF806L manufactured by Showa Denko was connected in series. Standard substance: polystyrene standard substance Molecular weight: 560, 800, 2000, 4200, 104
00, 91000, 23000, 230000, 560
000 <Softening point> Based on JIS K-7234 (ring and ball method).

<Easily hydrolyzable chlorine content> 5 g of 1 g of sample
After dissolving in 0 ml of toluene, adding 20 ml of 0.1 NKOH-methanol solution and boiling for 15 minutes,
Titrate with aqueous silver nitrate solution. <Total chlorine content> 1 g of the sample was dissolved in 25 ml of ethylene glycol monobutyl ether, and 1 NKOH-
After adding 25 ml of a propylene glycol solution and boiling for 20 minutes, titration is performed with an aqueous silver nitrate solution. <Diol end group content> 3 g of the sample was dissolved in 25 ml of chloroform, 25 ml of ammonium benzyltrimethyl periodate solution was added, and the reaction was carried out for 2.5 hours and a half.
Sulfuric acid aqueous solution 5 ml, 20% potassium iodide aqueous solution 15 ml
Was added and titrated with a 0.1N sodium thiosulfate solution.

<Volume resistivity, relative permittivity, dielectric loss tangent> JI
According to S C-6481. <Glass transition temperature (Tg)> Measured with TMA (SSC5200 TMA / SS120 manufactured by Seiko Instruments Inc.). <Flame Retardancy> It was based on the vertical flammability test and horizontal flammability test specified in UL94 of the US UL standard. <Oxygen Index (OI)> Dicyandiamide was added to the flame retardant, which was impregnated into glass cloth and heat-cured to prepare a laminated plate, which was measured according to JIS K7201 using a No. A-1 test piece.

<Smoke Emission Property> According to JIS D 1201.

Sample size 3.1 * 6.0 * 127
(Mm) <Copper foil peeling strength> The strength when the copper foil was vertically peeled off from the laminate was measured by a tensile tester (manufactured by Shimadzu Corporation, Autograph AG-5000D). <Izod strength> According to ASTM D 256.
Test thickness 6.4 mm, with notch <Heat deformation temperature (HDT)> According to ASTM D648.

Test thickness: 6.4 mm, no annealing Bending stress: 18.6 kg / cm ² <Melt flow rate> According to ISO R 1133. Temperature 200 ° C, load 5 kg <Metallic corrosivity> Resin flat plate (10 cm x 10 cm x 5
cm) degreased metal piece (rolled steel plate SS4)
00, 3 cm × 5 cm × 2 mm), and further cover the metal piece with a glass Petri dish, and in an oven at 250 ° C. for 8 hours.
After heat treatment for a period of time, the corrosion state of the surface of the metal piece is observed.

The evaluation is as follows: ○: no change, Δ: partial corrosion is recognized, ×: general corrosion is recognized.

<Water Absorption> Using a disk (cured product) test piece having a thickness of 3 mm and a diameter of 50 mm, the water absorption rate is determined from the weight increase rate of the test piece after the moisture resistance test. Moisture resistance test: 120 ° C./2 atmosphere, 200 hours <Tensile strength> In accordance with JIS K-6911. <Elastic modulus> Based on JIS K-6911. <Solder heat resistance> The laminate was immersed in a solder bath at a specified temperature for 30 seconds, and blister on the surface of the laminate was observed. Evaluation: ○: no blistering, Δ: blistering area less than 10%, x: blistering area 1
It was set to 0% or more. <Light resistance> The degree of discoloration of the test piece after 300 hours using a xenon arc weatherometer was measured with a color difference meter and is shown by the difference from the unexposed sample.

[0053]

【Example】

Example 1 2 liters equipped with a dropping funnel capable of continuously dropping an alkaline aqueous solution, a stirring blade, a thermometer, and a condenser connected to a line for discharging the aqueous phase of the condensate out of the system in a timely manner and returning the organic phase into the system. P-selectivity of 10 for glass reactor
200 g of 0% bisphenol F and 925 g of epichlorohydrin were added and uniformly dissolved, then 162 g at 60 ° C.
48.5% NaOH aqueous solution was continuously added dropwise over 90 minutes, and the reaction was further continued for 30 minutes. During that time, the system was kept at a reduced pressure, epichlorohydrin and water were azeotroped, epichlorohydrin was constantly returned to the system, and the aqueous phase was discharged to the outside of the system in a timely manner.
Then, the salt produced as a by-product is removed by washing with water, and excess epichlorohydrin is distilled off under reduced pressure to obtain a hydrolyzable chlorine content of 30.
00 ppm of crude resin was obtained. The obtained crude resin 100
g and 100 g of methyl isobutyl ketone were added to a 500 ml glass reactor, uniformly dissolved and then set to 50 ° C., 0.7 g of 48.5% NaOH aqueous solution was added, and the reaction was carried out for 2 hours. Then, after washing with water, methyl isobutyl ketone was distilled off under reduced pressure to obtain a compound A.

Example 2 Instead of bisphenol F having a p-position selectivity of 100%,
A hydrolyzable chlorine content of 2900 was obtained in the same manner as in Example 1 except that bisphenol F having a p-position selectivity of 75% was used.
ppm of crude resin was obtained. The obtained crude resin was used in Example 1.
Compound B was obtained by treating in the same manner as. Example 3 Instead of bisphenol F having a p-position selectivity of 100%,
A hydrolyzable chlorine content of 3100 was obtained in the same manner as in Example 1 except that bisphenol F having a p-position selectivity of 50% was used.
ppm of crude resin was obtained. The obtained crude resin was used in Example 1.
Compound C was obtained by treating in the same manner as.

Example 4 A dropping funnel capable of continuously dropping an alkaline aqueous solution, a stirring blade, a thermometer, and a condenser connected to a line for discharging the aqueous phase of the condensate to the outside of the system in a timely manner and returning the organic phase to the inside of the system. A 2-liter glass reactor has a p-position selectivity of 10
After 200 g of 0% bisphenol F, 925 g of epichlorohydrin and 53 g of glycidol were added and uniformly dissolved, 162 g of 48.5% NaOH aqueous solution was added at 60 ° C.
The solution was continuously added dropwise over 0 minutes, and the reaction was continued for 30 minutes. During that time, the system was kept at a reduced pressure, epichlorohydrin and water were azeotroped, epichlorohydrin was constantly returned to the system, and the aqueous phase was discharged to the outside of the system in a timely manner. Then, the salt produced as a by-product was removed by washing with water, and excess epichlorohydrin was distilled off under reduced pressure to obtain a crude resin having a hydrolyzable chlorine content of 3100 ppm. 100 g of the obtained crude resin and 10 methyl isobutyl ketone
0 g was added to a 500 ml glass reactor, uniformly dissolved and then set to 50 ° C., 0.7 g of 48.5% NaOH aqueous solution was added, and the reaction was carried out for 2 hours. Then, after washing with water, methyl isobutyl ketone was distilled off under reduced pressure to obtain a compound D.

Example 5 A crude resin having a hydrolyzable chlorine content of 3000 ppm was obtained in the same manner as in Example 4 except that 200 g of glycidol was used instead of 53 g of glycidol. The obtained crude resin was treated in the same manner as in Example 1 to obtain compound E. Example 6 Compound F was obtained in the same manner as in the method for obtaining the crude resin in Example 1 except that 165 g of 48.5% NaOH aqueous solution was added dropwise in the first step reaction. Example 7 Compound G was obtained in the same manner as in the method for obtaining the crude resin of Example 1, except that 132 g of 48.5% NaOH aqueous solution added dropwise in the first reaction was used.

Example 8 1 k of Compound A was placed in a 2 liter glass separable flask equipped with a cooling tube and a nitrogen inflow line with adjustable flow rate.
After charging and setting the temperature to 80 ° C, 10 wt% Na
0.2 g of an OH aqueous solution and 330 g of bisphenol F having a p-position selectivity of 100% were added, the temperature was gradually raised to 180 ° C., and the reaction was performed for 5 hours to obtain a compound H. Example 9 Compound I was prepared in the same manner as in Example 9 except that compound B was used instead of compound A, and bisphenol F having a p-position selectivity of 100% was used instead of compound B. Obtained.

Example 10 In the same manner as in Example 8 except that Compound C was used instead of Compound A, and bisphenol F having a p-position selectivity of 100% was used instead of Bisphenol F having a p-position selectivity of 100%. Compound J was obtained. Example 11 A compound K was obtained in the same manner as in Example 8 except that the compound D was used instead of the compound A. Example 12 A compound L was obtained in the same manner as in Example 8 except that the compound E was used instead of the compound A. Example 13 A compound M was obtained in the same manner as in Example 8 except that the compound F was used instead of the compound A.

Example 14 A compound N was obtained in the same manner as in Example 8 except that the compound G was used in place of the compound A. Example 15 The amount of bisphenol F having a p-position selectivity of 100% was 5
Compound O was obtained in the same manner as in Example 8 except that the reaction time was 8 hours and the reaction time was 30 g. Example 16 A compound P was prepared in the same manner as in Example 15 except that the compound B was used instead of the compound A, and the bisphenol F having a p-position selectivity of 100% was used instead of the bisphenol F having a p-position selectivity of 100%. Obtained. Example 17 A compound Q was prepared in the same manner as in Example 15 except that the compound C was used instead of the compound A, and the bisphenol F having a p-position selectivity of 100% was used instead of the bisphenol F having a p-position selectivity of 100%. Obtained. Example 18 The p-position selectivity was 100% and the amount of bisphenol F used was 59.
Compound R was obtained in the same manner as in Example 8 except that the reaction time was changed to 2 g and the reaction time was changed to 10 hours.

Comparative Example 1 Instead of bisphenol F having a p-position selectivity of 100%,
A hydrolyzable chlorine content of 2900 was obtained in the same manner as in Example 1 except that bisphenol F having a p-position selectivity of 75% was used.
ppm of crude resin was obtained. The obtained crude resin was used in Example 1.
Compound S was obtained by treating in the same manner as. Comparative Example 2 A compound T was obtained in the same manner as in Example 8 except that instead of the compound A, bisphenol F having a p-position selectivity of 100% was used, and bisphenol F having a p-position selectivity of 30% was used. It was

Comparative Example 3 In the same manner as in Example 15 except that the compound S was used in place of the compound A, and the bisphenol F having a p-position selectivity of 30% was used in place of the bisphenol F having a p-position selectivity of 100%. Compound U was obtained. Comparative Example 4 When the p-position selectivity was 100%, the amount of bisphenol F used was 61%.
Compound V was obtained in the same manner as in Example 8 except that the reaction time was set to 0 g and the reaction time was set to 18 hours. Tables 1 to 5 show the physical properties and properties of the compounds A to V.

[0062]

[Table 1]

[0063]

[Table 2]

[0064]

[Table 3]

[0065]

[Table 4]

[0066]

[Table 5]

The following examples and comparative examples were carried out using the low smoke emitting flame retardant compounds having the properties shown in Tables 1 to 5.

Examples 19 to 22 and Comparative Examples 5 to 7 Triethylenetetramine was used as a curing agent, compounded in the proportions shown in Table 6, and cured to obtain a cured product, which was evaluated. Curing conditions: room temperature x 24 hours + 160 ° C x 2 hours

[0069]

[Table 6]

Examples 23 to 26, Comparative Examples 8 to 10 Phenol novolac was used as a curing agent, and a low smoke generating flame retardant compound and a curing agent were blended in the proportions shown in Table 7 to obtain by transfer molding. The obtained test pieces were evaluated. Transfer molding condition: 150 ° C. × 180 seconds Post cure condition: 160 ° C. × 2 Hr + 180 ° C.
× 8 Hr

[0071]

[Table 7]

Examples 27 to 43, Comparative Examples 11 to 15 Epoxy resin varnishes were prepared according to the formulations shown in Tables 8 to 10. Use this varnish with a glass cloth (made by Asahi Schebel 2
16 L AS450 treatment thickness 0.1 mm) was impregnated and coated, and dried at 160 ° C. to obtain a prepreg having a resin content of about 40%. A copper foil having a thickness of 35 μ was placed on both sides of the eight prepregs and molded under heat and pressure of 170 ° C. × 30 kg / cm ² for 60 minutes to obtain a copper clad laminate and evaluated. However, except for the peel strength of the copper foil, it was evaluated after peeling the copper foil.

[0073]

[Table 8]

[0074]

[Table 9]

[0075]

[Table 10]

Examples 44 to 60, Comparative Examples 16 to 20 Low smoke generating and flame retardancy in proportions shown in Tables 11 to 14 with respect to ABS resin [<Trademark> Stylac 783 manufactured by Asahi Kasei Kogyo KK]. The compounds and the like were blended, mixed with a tumbler mixer, and then pelletized using a twin-screw extruder. Then
A test piece was prepared with a pressure molding machine and its physical properties were measured.

[0077]

[Table 11]

[0078]

[Table 12]

[0079]

[Table 13]

[0080]

[Table 14]

Examples 61 to 63, Comparative Examples 21 to 23 Low smoke emitting flame retardant compounds at a ratio shown in Table 15 with respect to impact-resistant polystyrene [<Trademark> Stylon 495 manufactured by Asahi Chemical Industry Co., Ltd.]. And the like were mixed and mixed with a tumbler mixer, and then pelletized using a twin-screw extruder. Then, a test piece was prepared with a pressure molding machine and its physical properties were measured.

[0082]

[Table 15]

From Tables 6 and 7, the low smoke-retardant flame-retardant compound of the present invention having a p-phenylene selectivity of 40% or more has a p-phenylene selectivity of 4 when it is used as a cured product using a curing agent.
The flame retardancy is excellent as compared with the matrix resin of less than 0%. Further, the low smoke generating flame-retardant compound having a weight average molecular weight of 250,000 or less has higher heat resistance and lower water absorption than the resin having a weight average molecular weight of more than 250,000, and has a UL9
The flame retardancy seen from 4 tests is also high. In addition, it is far superior to the brominated flame retardant in smoke emission and metal corrosion.

From Tables 8 to 10, when the laminated plate was prepared using the low smoke-producing flame-retardant compound of the present invention, the flame retardancy was excellent as compared with p-phenylene selectivity of less than 40%.
In addition, the low smoke-retardant flame-retardant compound having a weight average molecular weight of 250,000 or less has higher heat resistance and electrical characteristics, lower water absorption, and U than the resin having a weight average molecular weight of more than 250,000.
The flame retardancy seen from the L94 test is also high. Further, it is significantly superior in smoke emission property to the brominated flame retardant. Table 11-
According to 15, when the low smoke generating flame retardant compound of the present invention is used as a flame retardant for a synthetic resin, p-phenylene selectivity is superior to that of less than 40%. Further, the low smoke generating flame retardant compound having a weight average molecular weight of 250,000 or less has higher impact strength and fluidity as compared with a resin having a weight average molecular weight of more than 250,000. In addition, it is far superior to the brominated flame retardant in smoke emission and metal corrosion.

[0085]

EFFECTS OF THE INVENTION As is clear from the above, the low-smoke-retardant compound of the present invention is excellent in flame-retardancy, low-smoke-emission property, mechanical and electrical properties, so that it can be used for encapsulating laminates and semiconductors. material,
Flame retardants for synthetic resins, various composite materials, cast products,
It can be suitably used for paints and the like.

Claims (4)

[Claims] 1. The following general formula (I): [Wherein R ₁ and R ₂ are as follows: (Y and Z are aliphatic or aromatic hydrocarbon groups having 1 to 10 carbon atoms and are the same or different from each other, and i and j are 0.
Is an integer of 5 to 5, i + j is the same or different group selected from 5 or less), A is a saturated or unsaturated hydrocarbon having 1 to 5 carbon atoms, and X ₁ , X ₂ , X ₃ , X ₄ are the same or different from each other and represent hydrogen, an aliphatic or aromatic hydrocarbon having 1 to 10 carbon atoms, and m is an integer of 0 or more. ] The low smoke generating flame-retardant compound which is shown by these, and whose p-phenylene selectivity is 40% or more and whose weight average molecular weight is 250,000 or less. 2. A low smoke emitting flame retardant resin composition comprising (1) the low smoke emitting flame retardant compound according to claim 1 and (2) a curing agent. 3. A low-smoke-retardant composite material comprising (1) a fiber substrate and (2) the low-smoke-retardant compound according to claim 1 as an essential component. 4. (1) 100 parts by weight of a synthetic resin, and (2) a low smoke generating flame retardant compound 5 to 50 according to claim 1.
A low-smoke-retardant flame-retardant synthetic resin composition, characterized by containing parts by weight.