JPH0717157Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0717157Y2 JPH0717157Y2 JP1988090753U JP9075388U JPH0717157Y2 JP H0717157 Y2 JPH0717157 Y2 JP H0717157Y2 JP 1988090753 U JP1988090753 U JP 1988090753U JP 9075388 U JP9075388 U JP 9075388U JP H0717157 Y2 JPH0717157 Y2 JP H0717157Y2
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- semiconductor device
- out terminal
- protrusions
- mos
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 22
- 239000004020 conductor Substances 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 229910000896 Manganin Inorganic materials 0.000 claims description 2
- 101150015217 FET4 gene Proteins 0.000 description 2
- 101100484930 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) VPS41 gene Proteins 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 101150073536 FET3 gene Proteins 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988090753U JPH0717157Y2 (ja) | 1988-07-08 | 1988-07-08 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988090753U JPH0717157Y2 (ja) | 1988-07-08 | 1988-07-08 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0213745U JPH0213745U (enrdf_load_stackoverflow) | 1990-01-29 |
| JPH0717157Y2 true JPH0717157Y2 (ja) | 1995-04-19 |
Family
ID=31315265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988090753U Expired - Lifetime JPH0717157Y2 (ja) | 1988-07-08 | 1988-07-08 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717157Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07120738B2 (ja) * | 1990-05-29 | 1995-12-20 | 株式会社三社電機製作所 | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181654A (ja) * | 1983-03-31 | 1984-10-16 | Toshiba Corp | 半導体モジユ−ル用端子板 |
-
1988
- 1988-07-08 JP JP1988090753U patent/JPH0717157Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0213745U (enrdf_load_stackoverflow) | 1990-01-29 |
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