JPH0717072A - Packaging circuit in image processor - Google Patents

Abstract

PURPOSE:To provide a packaging circuit capable of being miniaturized and enhancing reliability by equipping a driver circuit which converts image data inputted from the outside into parallel signals of permutation driven serially in accordance with serial same data and outputs the parallel signals in parallel from the respective output pads. CONSTITUTION:In the packaging circuit of an image processor, a driver IC5 is so arranged horizontally that long sides 3, 4 in the longitudinal direction are parallel to the rows of image processing elements 1. Width of the packaging circuit in the longitudinal direction for the rows of the elements is miniaturized. Output pads 2a, 2b are arranged in series in both sides of the long sides 3, 4 in the same direction. Therefore both sides of the long sides 3, 4 of the driven IC5 are effectively used to arrange the output pads. As a result, the need for concentrating the output pads 2a, 2b on only a conventional one long side is eliminated. A factor for inhibiting densification in a packaging structure is canceled. The number of the output pad formed in one driver IC5 is more increased and densification of the driver IC5 is enabled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting circuit of an image processing apparatus, and more particularly to a printing apparatus such as a thermal print head, a reading apparatus such as a contact type image sensor, and an image display apparatus such as a liquid crystal display apparatus. The present invention relates to a compact and high-density mounting circuit device used in an image processing device.

[0002]

2. Description of the Related Art For example, a thermal print head or an OC
In a so-called image processing device such as a contact image sensor used in an R (Optical Caracter Reader) or a liquid crystal display device, image processing elements are arranged in one row or a plurality of rows. The output pinouts (output pads) of a drive circuit such as a driver IC are connected to each element, respectively.

As an example of such an image processing apparatus, for example, a general thermal print head will be described. As image processing elements, heat generating resistance elements are arranged in an in-line array, and each of the heat generating resistance elements is connected to a wiring for connection. Further, the same number of input pads as the number of elements are drawn out in parallel, and the output pads of the driver IC are connected to the respective input pads one by one. For example, in the case of a thermal print head having a heating resistor element of 1000 dots, an output pad of 1000 pins is required, and each pad of the output pad of 1000 pins is connected to each element of the heating resistor element of 1000 dots. There is a need. Here, the 1000-pin output pad
It's actually difficult to build into C, so at most
By using several to several tens of driver ICs having output pads of about 100 to 200 pins for each chip, the number of output pads of about 1000 pins as described above is secured. At this time, it is desirable that the driver IC is mounted on the peripheral portion of the substrate on which the heat generating resistance element is formed or the like in order to realize the miniaturization of the device.

Therefore, conventionally, as shown in FIG.
The output pad 305 is arranged on one side 302 side of the long side 302, 303 of the driver IC 301 close to the heating resistor element 304, and the logic signal wiring connection pad 306 and the like is arranged on the side of the other long side 303 in the long direction. Are arranged to arrange the heating resistor elements 304 and the driver IC 30.
Driver IC 301 so that the longitudinal direction of 1 is parallel
Is mounted in a so-called horizontal position, and the output pad 305 and the connection pad 307 of the heating resistance element 304, which are arranged in a row on one side 302 in the longitudinal direction of the driver IC 301, are connected in a one-to-one correspondence in the order of arrangement. There is. At this time, the driver IC 301 converts the image data input as a serial signal into a parallel data form in which the time series permutation follows the arrangement order of the heating resistance elements, and the parallel data is output from each output pad. It is formed so as to output the timing in synchronization. Such serial-to-parallel conversion of image data is realized by a circuit using a shift register and a latch as is well known.

Further, in the image reading apparatus, the reverse conversion is generally performed. Ie CCD
An image sensor such as a (Charge Coupled Device) reads an image as parallel data from an external image original, for example. Then, the driver IC converts the parallel image data into serial data in time series.

[0006]

However, in the arrangement of the output pads of the driver IC 301 as shown in FIG. 3, almost all the output pads are concentrated on one long side 302, so that this portion is formed. In this case, the pattern density of the output pads 305 and the like becomes extremely higher than the pattern density of the logic signal wiring connection pads 306 and the like formed on the other long side 303 side. Conversely speaking, the pattern density (wiring density) on the long side 303 side
Therefore, the driver IC 301 and the substrate on which the driver IC 301 is mounted are not effectively used, and there is a large amount of wasted area.
As a result, there is a problem that the improvement of the packaging density is hindered and it becomes difficult to implement high-density packaging and increase the number of pins (the number of pixels). Further, as described above, since the output pads 305 are concentrated on the one long side 302 side at a high density, wire bonding of the output pad 305,
It becomes extremely difficult to make contact with the inspection probe when conducting the IC continuity / function inspection, and the driver IC 305
However, there is a problem in that the reliability of the image processing apparatus using the same or the image processing apparatus using the same deteriorates after its completion. Furthermore, in order to secure the required number of output pads (the number of output pinouts) while maintaining the packaging density within the conventional limit, the driver IC must be formed in a horizontally long shape. There is also a problem in that the production of such a horizontally long IC has a low yield and a low production efficiency when it is produced from a circular wafer which has been conventionally used mainly.

Therefore, as a technique intended to solve such a problem, there has been proposed a technique in which the driver IC 305 is placed vertically, as shown in FIG. That is, the driver IC 301 is arranged so that the rows of the output pads 305 are oriented in the orthogonal direction with respect to the rows of the image processing elements such as the heating resistor elements 304, and the wiring pattern bent at a right angle from the output pad 305. This is a technique in which each of the p-wiring patterns 308 is drawn out one by one and connected to each of the heating resistor elements 304 in the order of arrangement. According to such a technique, the two long sides 302, 3 on both sides of the driver IC 301 are
Since the output pads 305 can be formed on each of the 03, the number of output pinouts is about twice as large as the mounting area of the same IC as in the case where the driver IC 301 shown in FIG. 3 is placed horizontally. Obtainable.

On the other hand, on the other hand, in the technique of vertically placing the driver IC 301, the driver IC 301
Since it is unavoidable that the layout and the wiring pattern 308 become vertically long, the outer dimensions of the substrate for forming such a mounting structure are consequently larger than those in the case of horizontal placement in FIG. There is a problem that it will end up. Also,
As can be seen from FIG. 4, the wiring pattern 3 connected to the output pad 305 at the lower end of the driver IC 301 in the figure.
Since the wiring length of 09 is extremely longer than that of the wiring pattern 308 connected to the output pad 305 at the upper end portion, a wiring defect such as a disconnection defect or a short circuit is likely to occur during pattern formation, and such a mounting circuit is used. There is a problem that the reliability of the image processing device is reduced.

Alternatively, as a driver IC, there is known a technique of using a driver IC such as a so-called QFP (Quad Flat Package) which is formed in a more square shape and has output pinouts in four directions. In this case, as in the case of the vertical installation, the wiring length is locally extremely long and a large difference occurs in the wiring length, which causes a problem that the reliability of the image processing apparatus using such a mounting circuit is deteriorated. .

As described above, in a so-called image processing device such as a thermal print head, a contact type image sensor used in an OCR (Optical Caracter Reader), or a liquid crystal display device, the number of pixels and the definition are increased. Since the number of output pinouts of the driver IC further increases with the progress of the above, there is a problem in that the mounting circuit of the driver IC is inevitably increased in size, which hinders downsizing of the image processing apparatus and improvement in reliability.

The present invention has been made to solve such a problem, and an object thereof is to provide a mounting circuit of an image processing apparatus which realizes miniaturization and improvement of reliability. is there.

[0012]

In order to solve the above-mentioned problems, a mounting circuit of an image processing apparatus according to the present invention comprises a plurality of image processing elements arranged in one row or a plurality of rows and a plurality of long sides in the longitudinal direction. Of the image processing elements are arranged in parallel to each other, and a plurality of output pads are arranged on at least two long sides in the longitudinal direction, and the output pads arranged on one of the long sides of the output pads. The pads and the output pads arranged on the other long side are alternately arranged for each pad or for a plurality of pads while maintaining regularity, one by one in the order of arrangement of the plurality of image processing elements. Serially input image data connected from the outside and converted into permutation parallel signals such that the plurality of image processing elements are driven in a serial order based on the serial image data. Output power It is characterized in that it is provided with a driver circuit for outputting in parallel from each of the pads.

Further, the mounting circuit of the image processing apparatus of the present invention comprises a plurality of image processing elements arranged in one row or a plurality of rows,
The long side in the longitudinal direction is arranged so as to be parallel to the row of the plurality of image processing elements, and a plurality of input pads are arranged in rows on at least the two long sides in the longitudinal direction. The input pads arranged on the long side of the other and the input pads arranged on the other long side are alternately arranged in order with respect to the arrangement order of the plurality of image processing elements while maintaining regularity for each pad or for each plurality of pads. Image data that is connected to each of the image processing elements and that is read in parallel by each of the image processing elements from outside is serially arranged in a time series order based on the permutation of the plurality of image processing elements. A driver circuit for converting into image data is provided.

The present invention is suitable for an image processing apparatus for image recording such as a thermal print head using a heating resistance element as the plurality of image processing elements in the mounting circuit of the image processing apparatus. Is.

Alternatively, the technique is suitable for an image processing apparatus for image reading such as a contact image sensor in which CCD elements are arranged inline as the plurality of image processing elements.

Alternatively, in the mounting circuit of the above image processing apparatus, for example, a plurality of columns of display pixels are arranged as the plurality of image processing elements, and the display pixels are scan-selectively driven row by row or row by row. This is a technique suitable for an image processing device for image display such as a device.

[0017]

In the conventional general driver IC, when the connection pads are arranged in a row on the two long sides in the longitudinal direction, the driver I is used to connect the connection pad and the image processing element with the connection wiring.
Since C is placed vertically, it is difficult to reduce the width of the mounting circuit in the direction orthogonal to the image processing element array.

Therefore, in the mounting circuit of the image processing apparatus of the present invention, the driver ICs are arranged so-called horizontally so that the longitudinal direction thereof is parallel to the image processing element array. The width of the mounting circuit in the orthogonal direction can be reduced.

Moreover, since the connection pads such as the output pads or the input pads are arranged in rows on the two long sides in the longitudinal direction, the two long sides of the driver IC can be effectively used for the arrangement of the connection pads. As a result, the connection pad
Since it is not necessary to concentrate on only one long side, the obstruction factor to high density in the mounting structure is eliminated, and one driver IC
The number of connection pads (the number of outputs or input pinouts) that can be formed therein, that is, the number of driver elements can be further increased to further increase the density of the driver IC.

At this time, the connection wiring between the connection pad of the driver IC and the image processing element has one output pad arranged on one long side and one output pad arranged on the other long side or a plurality of pads. Each of the image processing elements is wired so as to be connected to each of the image processing elements in sequence with respect to the arrangement order of the plurality of image processing elements alternately while maintaining regularity. It can be formed in the lower substrate region, a small substrate area can be effectively used, and high-density wiring can be performed without increasing difficulty in the manufacturing process.

Here, in a general driver IC in which connection pads are arranged on both long sides, image data is processed according to the arrangement order of the connection pads. Therefore, the driver ICs are arranged on one long side as in the present invention. The output pad and the output pad arranged on the other long side are alternately arranged in order with respect to each of the plurality of image processing elements while maintaining regularity for each of the plurality of image processing elements. If they are wired so as to be connected one by one, the time-series processing order of the image data will be out of order. For example, the image data of the connection pad on one long side is connected to the even-numbered pixel, and the image data of the connection pad on the other long-side is connected to the odd-numbered pixel. Every time, image processing that is divided in time series is executed. Therefore, in the present invention, as a driver IC, serial image data input from the outside are arranged in parallel so that the plurality of image processing elements are driven in a serial order based on the serial image data. And a driver circuit for converting each of the output pads into parallel output from each of the output pads. Alternatively, each of the image processing elements uses a driver circuit for converting image data read in parallel from the outside into serial image data in a time series order based on the permutation of the plurality of image processing elements.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a mounting circuit of an image processing apparatus according to the present invention will be described below in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a diagram showing a mounting circuit of an image processing apparatus according to a first embodiment of the present invention. The mounting circuit of this image processing apparatus is arranged so that the heat generating resistance elements 1 as a plurality of image processing elements arranged in a row and the longitudinal direction thereof are substantially parallel to the row of the plurality of heat generating resistance elements 1. A plurality of output pads 2a, 2b are arranged in rows on each of the two long sides in the longitudinal direction, and the output pad 2a arranged on the long side 3 side of one of the output pads 2a, 2b and the other Output pads 2b arranged on the long side 4 side
And the driver ICs 5 connected to the pads one by one in sequence with respect to the arrangement order of the plurality of heat generating resistance elements 1 alternately while maintaining regularity for each pad, and the ends drawn from the heat generating resistance elements 1. The main part is composed of lead (connection) wirings 7a and 7b in which connection pads 6a and 6b are arranged.

Further, various logic signal connection pads 8 for driving the driver IC 5 are provided at both ends of the long side on the lower side of the driver IC 5 in the figure, and timing signals and control signals are inputted from the outside. It

The output pads 2a, 2 of the driver IC 5 are also
Bonding wires 9a and 9b, which are general Au wires, are used to connect b to the connection pads 6a and 6b.

The driver IC 5 is arranged in such a permutation that serial image data input from the outside is driven in a serial order based on the serial image data. It is converted into a parallel signal and is output in parallel from each of the output pads 2a and 2b. That is, as an example of data conversion according to the first embodiment, the driver ICs 5 are arranged in a row on the long side 3 on the upper side in the figure in a time-series order of serial image data input from the outside. The serial image data are paralleled in order from the left end of the output pad 2a in the order of 1st, 3rd, 5th ... (The numbers attached to the vicinity of the output pad in FIG. 1 indicate such an order). Convert to a signal and output. Also, the serial image data are converted into parallel signals in the order of the second, fourth, sixth ... From the left end of the output pads 2b arranged in a row on the lower long side 4 in the figure, and the output pads are output. 2a and pads are alternately output one by one.

As described above, in the mounting circuit of the image processing apparatus according to the present invention, the driver IC 5 is so-called laterally arranged such that the long sides 3 and 4 in the longitudinal direction thereof are parallel to the rows of the image processing elements 1. Since they are arranged at intervals, the width of the mounting circuit in the direction orthogonal to the row of the image processing elements 1 can be reduced. Moreover, since the output pads 2a and 2b are arranged in rows on the two long sides 3 and 4 in the longitudinal direction, the two long sides 3 and 4 of the driver IC 5 are effectively used to arrange the output pads. be able to. As a result, since it is not necessary to concentrate the output pads 2a and 2b on only one long side as in the conventional case, the obstacles to high density in the mounting structure are eliminated, and the output pads that can be formed in one driver IC5 are eliminated. The number (or the number of input pads), that is, the number of driver elements can be further increased to further increase the density of the driver IC 5, and the mounting circuit can be downsized.

In particular, when the same number of output pads are provided on both the long sides 3 and 4 of the driver IC 5 as in this embodiment, the output pads 2a and 2b on both sides of the long sides 3 and 4 have the same pitch. The lead wires (connection) 7a and 7b can be formed to have the same size, and the lead wires 7a and 7b can also be formed into a repeating pattern having a substantially uniform pitch and a wire length with a small difference in length. In practice, high-density wiring with an extremely short wiring distance can be realized practically, and a small substrate area can be effectively used.

(Embodiment 2) FIG. 2 is a diagram showing a mounting circuit of an image processing apparatus according to a second embodiment of the present invention. In the second embodiment, the output pads 2a are arranged in a staggered manner on the long side 3 on the upper side of the driver IC 5 in the drawing, and the output pads 2b on the long side 4 on the lower side of the driver IC 5 in the drawing are arranged.
It is characterized by arranging twice the number of output pads and arranging various logic signal connection pads 8 in the margins of the mounting area obtained on both wings of the long side 4 on the lower side in the figure. At this time, as shown in FIG. 2, the driver ICs 5 are arranged two by two in order from the left of the output pads 2a arranged on the upper long side 3 in the figure from the left, and the output pads 2b on the lower long side 4 in the figure It is formed so that image processing is performed in such an order that individual pieces are inserted. That is, to show an example of data conversion according to the second embodiment, the driver ICs 5 are arranged in the long side 3 on the upper side in the figure according to the time series order of serial image data input from the outside. From the left end of the output pad 2a, the serial image data is converted into a parallel signal and output in the order of first, second, fourth, fifth ...
Also, from the output pads 2b arranged in a row on the lower long side 4 in the figure, the serial image data are converted into parallel signals in the order from the left end to the third, sixth, ninth ... Every other pad 2a is alternately output. The other parts are almost the same as the mounted circuit of the image processing apparatus of the first embodiment. 2 and the description of the second embodiment, for simplification of description, the same parts as those of the first embodiment are designated by the same reference numerals.

By forming such a structure as well, it is possible to realize miniaturization of the mounting circuit of the image processing apparatus and also to improve reliability.

In the above embodiments, in order to make the description concrete and concise, a thermal print head is taken as an example of the image processing apparatus, and the case where the present invention is applied thereto is described. It goes without saying that the application of the invention is not limited to this. In addition to this, if the image processing device has a structure in which the image processing elements are arranged inline, for example, an EL (ELECTRO-LUMI
NESSENT) An image recording device using a light emitting element, an image display device using a liquid crystal display element in which liquid crystal pixels are arranged in a matrix as an image processing element, and an image reading such as a contact image sensor using a CCD The present invention can be applied to devices and the like. However, in the case of an image reading device such as a contact image sensor using the above CCD, an input pad is used instead of the output pad in the above embodiment, and a driver IC converts a serial signal into a parallel signal. Instead of this, a driver IC that reversely converts a parallel signal to a serial signal is used. Alternatively, for example, in the case of an image display device using a liquid crystal display element in which liquid crystal pixels are provided in a matrix as the image processing element as described above, the image processing elements are arranged in a plurality of rows (in a matrix), and a single row is used. It goes without saying that it is necessary to use not only the signal processing of (1) but also a driver IC for scanning and driving the column of the image processing element over a plurality of rows.

In the above embodiment, the output pads 2a and 2b of the driver IC 5 and the connection pads 6a and 6b provided at the ends of the lead-out (connection) lines 7a and 7b of the heating resistance element 1 as an image processing element are provided. Although Au bonding wires 9a and 9b were used for the connection, the connection method at this portion is not limited to this. In addition to this, it is suitable for high density such as a flip chip method in which connection bumps are formed on the driver IC 5 and the connection bumps are directly connected to the connection pads 6a and 6b, and a TAB (Tape Automated Bonding) method. It goes without saying that the mounting method can also be suitably used.

In addition, it goes without saying that various changes can be made to the material for forming each part of the mounting circuit of the image processing apparatus of the present invention without departing from the scope of the present invention.

[0034]

As described above in detail, according to the present invention, it is possible to provide a mounting circuit of an image processing apparatus which realizes miniaturization and improvement in reliability.

[Brief description of drawings]

FIG. 1 is a diagram showing a mounting circuit of an image processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a mounting circuit of an image processing apparatus according to a second embodiment of the present invention.

FIG. 3 is a diagram showing a mounting circuit of a conventional image processing apparatus.

FIG. 4 is a diagram illustrating a mounting circuit of a conventional image processing apparatus of a driver IC vertical installation type.

[Explanation of symbols]

1 ... Heating resistance element, 2a, 2b ... Output pad, 3, 4 ...
Long sides of driver IC 5 ... Driver ICs 6a, 6b ...
Connection pads, 7a, 7b ... Drawer (connection) wiring, 8 ...
Various logic signal connection pads, 9a, 9b ... Bonding wires

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location B41J 2/345 H04N 1/024 8721-5C

Claims (2)

[Claims] 1. A plurality of image processing elements arranged in one row or a plurality of rows, and arranged such that a long side in a longitudinal direction is parallel to a row of the plurality of image processing elements, and at least the plurality of image processing elements in the longitudinal direction. A plurality of output pads are arranged in a row on the two long sides, and the output pad arranged on one long side of the output pads and the output pad arranged on the other long side are provided for each pad or for each plurality of pads. The plurality of image processing elements are connected to each one of the image processing elements in turn with respect to the arrangement order of the plurality of image processing elements while maintaining regularity, and serial image data input from the outside is supplied to the plurality of image processing elements. Is converted into a parallel signal of a permutation that is driven in a serial order based on the serial image data and is output in parallel from each of the output pads. Mounting circuit of the image processing apparatus. 2. A plurality of image processing elements arranged in one row or a plurality of rows, and arranged such that a long side in a longitudinal direction is parallel to a row of the plurality of image processing elements, and at least the plurality of image processing elements in the longitudinal direction are arranged. A plurality of input pads are arranged in rows on the two long sides, and one input pad arranged on one long side of the input pad and one input pad arranged on the other long side Image data that is alternately connected while maintaining regularity to each of the image processing elements in the order of arrangement of the plurality of image processing elements, and that each of the image processing elements is read in parallel from the outside. And a driver circuit for converting the image data into serial image data in a time series order based on the permutation of the plurality of image processing elements.