JPH07170032A - Reinforcing sheet sticking method of flexible printed wiring board - Google Patents

Reinforcing sheet sticking method of flexible printed wiring board

Info

Publication number
JPH07170032A
JPH07170032A JP5312327A JP31232793A JPH07170032A JP H07170032 A JPH07170032 A JP H07170032A JP 5312327 A JP5312327 A JP 5312327A JP 31232793 A JP31232793 A JP 31232793A JP H07170032 A JPH07170032 A JP H07170032A
Authority
JP
Japan
Prior art keywords
work
vacuum
plate
vacuum box
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5312327A
Other languages
Japanese (ja)
Inventor
Minoru Tamitsu
穣 田光
Kenji Ninomiya
謙二 二宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP5312327A priority Critical patent/JPH07170032A/en
Publication of JPH07170032A publication Critical patent/JPH07170032A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/001Joining in special atmospheres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45Joining of substantially the whole surface of the articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832Reciprocating joining or pressing tools
    • B29C66/8322Joining or pressing tools reciprocating along one axis
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To stick a reinforcing sheet to a flexible printed wiring board while bubbles between them are eliminated, by a method wherein, after a work is accommodated in a vacuum box having thermal conductivity and installed in a hot pressing equipment, the inside is evacuated, and the work is thermocompression-bonded by applying pressing force and heat via the vacuum box. CONSTITUTION:A work 11 is accommodated in a vacuum box main body 14, and a lid plate 15 is mounted on the work 11. In this state, these are arranged on the lower heating plate 24 of a hot pressing equipment 13. By operating a vacuum pump 20, the inside of a vacuum box is evacuated, and a specific pressure is obtained. By making an upper heating plate 25 on the hot pressing equipment 13 descend, pressing force and heat are applied to a vacuum box 12. A reinforcing sheet 9 is bonded to a PFC 8 via the bottom plate 18 and the lid plate 15 of the vacuum box 12 and a pair of metal molds 21, 23. By the bonding in a vacuum, bubbles generated between the PFC 8 and the reinforcing sheet 9 are eliminated, the effective sticking of a reinforcing sheet is enabled.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電卓、プリンタ等の電
子機器に用いられるフレキシブルプリント配線板を製造
する際に真空環境下で熱圧着を行なうことにより補強板
を貼り合わせる方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for laminating reinforcing plates by thermocompression bonding in a vacuum environment when manufacturing a flexible printed wiring board used in electronic devices such as calculators and printers. .

【0002】[0002]

【従来の技術】近年、電子機器における高密度実装化、
小型化、軽量化、薄形化の動きにはめざましいものがあ
り、このような電子機器にはフレキシブルプリント配線
板(以下、FPCと称する)がよく用いられている。F
PCは各種の電子部品を搭載しながら、その可撓性を生
かして狭い空間内に立体的に高密度実装が実現できるも
のである。また、FPCにおいて接続端子の位置や高い
強度が必要とされる部分には、その強度を高めるために
FPCの片面に補強板を貼り付けることがある。そし
て、補強板貼付方法には、接着剤を用いて接着する等の
他、真空環境下で熱圧着を行なう、いわゆる真空プレス
法があるが、この真空プレス法は、FPCと補強板との
間に存在する気泡の脱泡性が良い、回路埋め込み性が良
い等の利点を有するものである。
2. Description of the Related Art In recent years, high-density mounting in electronic equipment has been achieved,
There are remarkable movements toward miniaturization, weight reduction, and thinning, and flexible printed wiring boards (hereinafter referred to as FPCs) are often used in such electronic devices. F
The PC is capable of mounting three-dimensionally high-density in a narrow space while mounting various electronic components and utilizing its flexibility. In addition, a reinforcing plate may be attached to one surface of the FPC in order to increase the strength of the position of the connection terminal of the FPC and a portion requiring high strength. The reinforcing plate attaching method includes a so-called vacuum pressing method in which thermocompression bonding is performed in a vacuum environment in addition to bonding with an adhesive or the like. This vacuum pressing method is performed between the FPC and the reinforcing plate. It has advantages such as good defoaming property of bubbles existing in, and good circuit embedding property.

【0003】図4は真空プレス装置1の構成を示す図で
あって、図中符号2は真空チャンバー、3は熱間プレス
部、4はワークである。上熱板5、下熱板6等の要素に
より構成された熱間プレス部3全体が真空チャンバー2
内に設置されており、この真空チャンバー2には内部を
真空排気するための真空ポンプ7等の真空排気手段が接
続されている。また、ワーク4はFPC8と補強板9と
がこれら相互の位置合わせを行なうための一対の金型1
0、10の間に挟持されたものである。
FIG. 4 is a view showing the structure of the vacuum press apparatus 1, in which reference numeral 2 is a vacuum chamber, 3 is a hot press section, and 4 is a work. The entire hot pressing unit 3 including elements such as the upper heating plate 5 and the lower heating plate 6 is a vacuum chamber 2
The vacuum chamber 2 is installed inside, and a vacuum pumping means such as a vacuum pump 7 for vacuuming the inside is connected to the vacuum chamber 2. Further, the work 4 has a pair of molds 1 for the FPC 8 and the reinforcing plate 9 to align these with each other.
It is sandwiched between 0 and 10.

【0004】この真空プレス装置1を用いて補強板9の
貼り合わせを行なう際には、真空チャンバー2を開放し
てワーク4を熱間プレス部3の上熱板5、下熱板6の間
に設置した後、真空チャンバー2を密閉し、真空ポンプ
7により排気を行ない真空チャンバー2内が所定の圧力
となったところで熱間プレス部3によりワーク4の一対
の金型10、10を介してFPC8と補強板9とが熱圧
着される。
When the reinforcing plate 9 is bonded by using this vacuum press device 1, the vacuum chamber 2 is opened and the work 4 is placed between the upper hot plate 5 and the lower hot plate 6 of the hot press part 3. After that, the vacuum chamber 2 is hermetically closed, and the vacuum pump 7 evacuates the interior of the vacuum chamber 2 to a predetermined pressure. The FPC 8 and the reinforcing plate 9 are thermocompression bonded.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、従来の
補強板貼り合わせ方法においては、前記真空プレス装置
1が熱間プレス部3全体を真空チャンバー2内に設置し
た構成となっているため、真空プレス装置1全体が非常
に大型となるため広い設置スペースを要する、真空チャ
ンバー2の容積が大きいため所定の圧力に到達するまで
の排気時間が長くなる、真空プレス装置1のコストが高
くなるのに伴ってFPCの製造コストが高くなる等の問
題があり、このような大掛かりな真空プレス装置1を用
いてFPCの補強板貼り合わせを行なうことは種々の面
において効率の悪いものであった。
However, in the conventional reinforcing plate bonding method, since the vacuum press device 1 has a structure in which the entire hot press part 3 is installed in the vacuum chamber 2, the vacuum press Since the entire apparatus 1 is very large, a large installation space is required. Since the volume of the vacuum chamber 2 is large, the evacuation time until reaching a predetermined pressure is long, and the cost of the vacuum press apparatus 1 is high. However, there is a problem that the manufacturing cost of the FPC becomes high, and the bonding of the reinforcing plate of the FPC by using such a large-scale vacuum press device 1 is inefficient in various aspects.

【0006】本発明は、前記の課題を解決するためにな
されたものであって、効率の良いFPCの補強板貼り合
わせ方法を提供することを目的とする。
The present invention has been made to solve the above problems, and an object of the present invention is to provide an efficient method for attaching a reinforcing plate of an FPC.

【0007】[0007]

【課題を解決するための手段】前記の目的を達成するた
めに、請求項1記載のフレキシブルプリント配線板の補
強板貼り合わせ方法は、フレキシブルプリント配線板と
補強板とを一対の押さえ板の間に載置したワークを作製
し、該ワークに対して低圧環境下で熱間プレスを施すこ
とによってフレキシブルプリント配線板と補強板とを熱
圧着するようにしたフレキシブルプリント配線板の補強
板貼り合わせ方法において、内部を真空排気したときに
気密状態が維持されるとともに、蓋板と底板とが接近す
る方向に相対的に移動自在とされた、熱伝導性を有する
真空ボックスの内部に前記ワークを収納し、ついで、前
記真空ボックスを熱間プレス装置に設置した後、その内
部を排気するとともに、該真空ボックスを介して押圧力
および熱を加えることにより、前記ワークを熱圧着させ
るようにしたことを特徴とするものである。
In order to achieve the above-mentioned object, a method for laminating a reinforcing plate of a flexible printed wiring board according to claim 1 is such that the flexible printed wiring board and the reinforcing plate are mounted between a pair of pressing plates. In a method for laminating a reinforcing plate of a flexible printed wiring board, which is adapted to thermocompression-bond a flexible printed wiring board and a reinforcing plate by hot pressing a workpiece placed under a low-pressure environment for the work, The airtight state is maintained when the interior is evacuated, and the work is stored inside a vacuum box having heat conductivity, which is relatively movable in a direction in which the lid plate and the bottom plate approach each other. Then, after the vacuum box is installed in a hot press machine, the inside of the vacuum box is evacuated and pressing force and heat are applied through the vacuum box. And by, the workpiece is characterized in that so as to thermocompression bonding.

【0008】また、請求項2記載の真空ボックスは、請
求項1記載のフレキシブルプリント配線板の補強板貼り
合わせ方法に用いる真空ボックスであって、上端に真空
パッキンが取り付けられ、内部を真空排気するための排
気管が接続された側板と底板とからなるボックス本体と
蓋板とから構成され、前記側板の下端から上端までの高
さが前記ワークの厚みより小さい寸法とされ、前記側板
の下端から前記真空パッキンの上端までの高さが前記ワ
ークの厚みより大きい寸法とされたことを特徴とするも
のである。
A vacuum box according to a second aspect is a vacuum box used in the method for laminating a reinforcing plate of a flexible printed wiring board according to the first aspect, in which a vacuum packing is attached to the upper end to evacuate the inside. A box body composed of a side plate and a bottom plate to which an exhaust pipe is connected and a lid plate, and the height from the lower end to the upper end of the side plate is smaller than the thickness of the work piece, and from the lower end of the side plate. The height to the upper end of the vacuum packing is larger than the thickness of the work.

【0009】[0009]

【作用】請求項1記載のフレキシブルプリント配線板の
補強板貼り合わせ方法では、真空ボックスの内部を真空
排気することによりフレキシブルプリント配線板と補強
板との間に発生する気泡が脱泡されるとともに、熱間プ
レス装置により押圧力および熱が付加されたときに、そ
の押圧力および熱がそれぞれ真空ボックスを介してワー
クに伝達されることによってワーク内のフレキシブルプ
リント配線板と補強板とが熱圧着される。
In the method for laminating a reinforcing plate of a flexible printed wiring board according to the present invention, air bubbles generated between the flexible printed wiring board and the reinforcing plate are removed by evacuating the inside of the vacuum box. When the pressing force and the heat are applied by the hot press device, the pressing force and the heat are respectively transmitted to the work through the vacuum box, so that the flexible printed wiring board and the reinforcing plate in the work are thermocompression bonded. To be done.

【0010】また、請求項2記載の真空ボックスは、ボ
ックス本体の側板下端から側板上端までの高さがワーク
の厚みより小さい寸法とされ、側板下端から真空パッキ
ン上端までの高さがワークの厚みより大きい寸法に設定
されているため、ワークを真空ボックス内に収納した段
階ではワークと蓋板との間には間隙ができるが、真空ボ
ックス内部を真空排気し熱間プレス装置により押圧力を
付加すると、真空パッキンが上下方向に圧縮されること
によりワークと蓋板とが接触して、真空ボックスの底板
と蓋板とを介してワークが上下方向から圧縮され、同時
に熱が伝導される。
Further, in the vacuum box according to claim 2, the height from the lower end of the side plate to the upper end of the side plate of the box body is smaller than the thickness of the work, and the height from the lower end of the side plate to the upper end of the vacuum packing is the thickness of the work. Since it is set to a larger size, there is a gap between the work and the lid plate when the work is stored in the vacuum box, but the inside of the vacuum box is evacuated and a pressing force is applied by the hot press machine. Then, the work is brought into contact with the lid plate by vertically compressing the vacuum packing, and the work is vertically compressed via the bottom plate and the lid plate of the vacuum box, and at the same time, heat is conducted.

【0011】[0011]

【実施例】以下、本発明のフレキシブルプリント配線板
(FPC)の補強板貼り合わせ方法の一実施例について
図1ないし図3を参照して説明する。図1は本実施例の
補強板貼り合わせ方法を示す図であって、本方法は図に
示したワーク11、真空ボックス12、熱間プレス装置
13を用いて行なうものである。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for laminating a reinforcing plate of a flexible printed wiring board (FPC) according to the present invention will be described below with reference to FIGS. FIG. 1 is a diagram showing a method for laminating reinforcing plates according to this embodiment. This method is performed by using the work 11, the vacuum box 12, and the hot pressing device 13 shown in the figure.

【0012】また、図2は本方法に用いる真空ボックス
12の構成を示す図であって、図中符号14はボックス
本体、15は蓋板、16は排気管である。ボックス本体
14は0.5mm厚の鉄板を用いて形成されており、筒
状に成形された側板17と底板18とが溶接により内部
の気密状態が保持されるように接合され、後述するワー
ク11をその内部に収納し得る大きさのものである。ま
た、側板17の上端には全周にわたって真空パッキン1
9が取り付けられ、側板17の一面には真空ポンプ20
に接続されることにより真空ボックス12の内部を排気
するための排気管16が設けられている。なお、真空パ
ッキン19および排気管16は耐熱性の高い材料で作製
されたものである。そして、このような構成のボックス
本体14とこの上部を覆う平板状の蓋板15とによって
真空ボックス12が構成されている。
FIG. 2 is a view showing the structure of the vacuum box 12 used in this method. In the figure, reference numeral 14 is a box body, 15 is a cover plate, and 16 is an exhaust pipe. The box body 14 is formed by using an iron plate having a thickness of 0.5 mm, and the side plate 17 and the bottom plate 18, which are formed in a cylindrical shape, are joined by welding so as to maintain the internal airtight state, and the work 11 to be described later is described. Is a size that can be stored inside. Further, the vacuum packing 1 is provided on the upper end of the side plate 17 over the entire circumference.
9 is attached, and the vacuum pump 20 is provided on one surface of the side plate 17.
An exhaust pipe 16 for exhausting the inside of the vacuum box 12 is provided by being connected to. The vacuum packing 19 and the exhaust pipe 16 are made of a material having high heat resistance. The vacuum box 12 is constituted by the box main body 14 having such a configuration and the flat plate-like cover plate 15 covering the upper portion thereof.

【0013】補強板貼り合わせ作業においては、まず、
ワーク11を作製する。図1に示すように、ワーク11
はFPC8と補強板9とを位置決め用ピン(図示せず)
が設けられた下金型(押さえ板)21の間に載置し、そ
の上方にクッション材22、上金型(押さえ板)23を
順次配したものである。クッション材22は耐熱性の高
い材料で形成され、FPC8の上方に突出した位置決め
用ピンの先端を覆って両金型21、23間に加えられた
圧力をFPC8と補強板9に均一に伝達するためのもの
である。
In the work of attaching the reinforcing plates, first,
The work 11 is produced. As shown in FIG.
Is a pin for positioning the FPC 8 and the reinforcing plate 9 (not shown)
It is placed between a lower die (pressing plate) 21 provided with, and a cushion material 22 and an upper die (pressing plate) 23 are sequentially arranged above it. The cushion material 22 is made of a highly heat-resistant material, covers the tip of the positioning pin protruding upward of the FPC 8 and uniformly transmits the pressure applied between the molds 21 and 23 to the FPC 8 and the reinforcing plate 9. It is for.

【0014】つぎに、図1に示すように、作製したワー
ク11を真空ボックス本体14内に収納し、その上に蓋
板15を載置した状態で熱間プレス装置13の下熱板2
4上に設置する。ついで、真空ポンプ20を作動させ真
空ボックス12の内部を排気していき圧力を所定の圧力
に到達させるとともに、熱間プレス装置13の上熱板2
5を下降させ、真空ボックス12に押圧力および熱を付
加すると、真空ボックス12の底板18および蓋板15
を介し、さらに一対の金型21、23を介してFPC8
と補強板9との熱圧着が行なわれる。
Next, as shown in FIG. 1, the prepared work 11 is housed in a vacuum box body 14 and a lid plate 15 is placed on the vacuum work body 14, and the lower hot plate 2 of the hot press machine 13 is placed thereon.
Install on top of 4. Then, the vacuum pump 20 is operated to evacuate the inside of the vacuum box 12 so that the pressure reaches a predetermined pressure, and the upper hot plate 2 of the hot press machine 13 is heated.
When 5 is lowered and pressing force and heat are applied to the vacuum box 12, the bottom plate 18 and the lid plate 15 of the vacuum box 12 are
Through the pair of molds 21 and 23, and the FPC8
And the reinforcing plate 9 are thermocompression bonded.

【0015】そこで、熱圧着が行なわれる際には、図3
に示すように、ワーク11全体の厚みをt1 とすると、
真空ボックス本体14の側板17の下端から上端までの
高さt2 がt1 より小さい寸法に設定され、側板17の
下端から真空パッキン19の上端までの高さt3 がt1
より大きい寸法に設定されているため、ワーク11を真
空ボックス12内に収納した段階ではワーク11と蓋板
15との間には若干の間隙ができているが、真空ボック
ス12内部を排気し熱間プレス装置13により押圧力を
付加すると、t3 がt2 に近づく、すなわち真空パッキ
ン19が上下方向に充分に圧縮され蓋板15が押し下げ
られることによりワーク11と蓋板15とが接触して、
真空ボックス12の底板18と蓋板15とを介してワー
ク11が上下方向から圧縮され、それと同時に真空ボッ
クス12の底板18と蓋板15とを経てワーク11に熱
が伝導されることによりワーク11中のFPC8と補強
板9とが熱圧着されるわけである。
Therefore, when thermocompression bonding is performed, as shown in FIG.
As shown in, when the total thickness of the work 11 is t1,
The height t2 from the lower end to the upper end of the side plate 17 of the vacuum box body 14 is set to be smaller than t1, and the height t3 from the lower end of the side plate 17 to the upper end of the vacuum packing 19 is t1.
Since the size is set to be larger, a slight gap is formed between the work 11 and the lid plate 15 when the work 11 is housed in the vacuum box 12, but the inside of the vacuum box 12 is exhausted to generate heat. When a pressing force is applied by the inter-pressing device 13, t3 approaches t2, that is, the vacuum packing 19 is sufficiently compressed in the vertical direction and the lid plate 15 is pushed down, so that the work 11 and the lid plate 15 come into contact with each other.
The work 11 is vertically compressed via the bottom plate 18 and the cover plate 15 of the vacuum box 12, and at the same time, heat is conducted to the work 11 via the bottom plate 18 and the cover plate 15 of the vacuum box 12 to cause the work 11 to move. The FPC 8 and the reinforcing plate 9 therein are thermocompression bonded.

【0016】本実施例の補強板貼り合わせ方法において
は、真空排気を行なう空間がワーク11より若干大きい
容積の真空ボックス12の内部だけでよいため、熱間プ
レス部を取り囲む大型の真空チャンバー内部を排気して
いた従来の場合に比べて、真空排気を行なう空間の容積
が格段に小さくできる。したがって、真空排気に要する
時間を短縮することができ、ひいては、貼り合わせ作業
全体に要する時間を短縮することができる。
In the method for laminating the reinforcing plates of this embodiment, the space for vacuum evacuation is limited to the inside of the vacuum box 12 having a volume slightly larger than the work 11. Therefore, the inside of a large vacuum chamber surrounding the hot press part is The volume of the space in which the vacuum is evacuated can be significantly reduced compared to the conventional case where the gas is evacuated. Therefore, the time required for vacuum evacuation can be reduced, which in turn can reduce the time required for the entire bonding operation.

【0017】また、本方法においては、用いる装置とし
てはワーク11より若干大きい寸法の真空ボックス12
と熱間プレス装置13のみでよいため、大型の真空チャ
ンバーを必要としていた従来方法に比べて、装置の設置
スペースを低減したり、装置に要するコストを低減する
ことができる。すなわち、本方法によれば、補強板の貼
り合わせ作業に際して、全体の作業時間の短縮、さらに
装置の設置スペースやコストの低減が図れる等、種々の
面にわたって従来方法に比べて効率の良いものとするこ
とができる。
In this method, the apparatus used is a vacuum box 12 having a size slightly larger than the work 11.
Since only the hot press machine 13 is required, the installation space of the machine and the cost required for the machine can be reduced as compared with the conventional method which requires a large vacuum chamber. That is, according to the present method, it is more efficient than the conventional method in various aspects, such as shortening the overall working time, further reducing the installation space and cost of the device when the reinforcing plate is bonded. can do.

【0018】また、具体例として、従来方法、本方法、
さらに比較対象としての常圧プレス法の3種の方法によ
って補強板を貼り合わせたサンプルを作製し、FPCと
補強板との間の気泡の脱泡性について評価した。本方法
によるサンプルに関しては、まず、FPCに熱硬化性接
着剤を仮止めしておき、ついで、FPCと補強板とを金
型を用いて位置決めを行ないつつこれらを保持したワー
クを作製した後、これを真空ボックスに入れ、真空ポン
プにより真空ボックス内部を減圧するとともに、熱間プ
レス装置により熱圧着を行なった。なお、熱間プレスの
条件は、温度150〜200℃、圧力10〜40Kg/
cm2 、時間30〜60分とした。このとき、真空ボッ
クス内部の圧力をモニターしたところ、真空ポンプ始動
後1分で130mmHgと所望の圧力が得られた。
As a concrete example, the conventional method, the present method,
Further, as a comparative object, a sample in which a reinforcing plate was stuck was prepared by three kinds of methods, that is, an atmospheric pressure pressing method, and the defoaming property of bubbles between the FPC and the reinforcing plate was evaluated. Regarding the sample according to this method, first, a thermosetting adhesive is temporarily fixed to the FPC, and then the FPC and the reinforcing plate are positioned using a mold, and a work holding them is produced, This was placed in a vacuum box, the pressure inside the vacuum box was reduced by a vacuum pump, and thermocompression bonding was performed by a hot press machine. The hot press conditions are a temperature of 150 to 200 ° C. and a pressure of 10 to 40 Kg /
cm @ 2, time 30-60 minutes. At this time, when the pressure inside the vacuum box was monitored, a desired pressure of 130 mmHg was obtained within 1 minute after starting the vacuum pump.

【0019】そして、3つの方法により5個ずつのサン
プルを作製し、顕微鏡により40倍の倍率で各サンプル
について気泡の有無の観察を行なった結果を下表1に示
す。この結果から判るように、常圧プレス法ではサンプ
ル5個とも気泡の発生が見られたのに対して、本方法、
および従来方法ではサンプル5個とも気泡の発生が見ら
れなかった。すなわち、真空ボックス内のみを排気する
本方法では、充分短い排気時間で所望の圧力が得られる
とともに、従来方法と同様、気泡の脱泡性が高いことが
実証された。
Then, five samples were prepared by each of the three methods, and the presence or absence of bubbles was observed in each sample with a microscope at a magnification of 40 times. The results are shown in Table 1 below. As can be seen from these results, in all of the five samples, air bubbles were observed in the atmospheric pressure pressing method.
In addition, in the conventional method, generation of bubbles was not observed in all of the five samples. That is, it has been proved that the present method of exhausting only the inside of the vacuum box can obtain a desired pressure in a sufficiently short exhaust time and has a high bubble defoaming property as in the conventional method.

【表1】 [Table 1]

【0020】なお、本実施例においては、真空ボックス
12をボックス本体14と平板状の蓋板15とで構成し
たが、この構成に代えて、互いに嵌合し合う断面コ字状
のボックス本体と同形状の蓋体とで構成したり、ボック
ス本体と蓋板とを例えば蛇腹状の伸縮自在の側板で連結
した構成としてもよい。ただし、いずれの場合において
も内部の気密状態を保持し得る構造とする必要があるこ
とは勿論である。また、本実施例における一対の金型2
1、23、クッション材22等からなるワーク11の構
成については場合に応じて適宜変更することができる。
In this embodiment, the vacuum box 12 is composed of the box body 14 and the flat lid plate 15. However, instead of this construction, a box body having a U-shaped cross section that fits with each other is used. The lid body may have the same shape, or the box body and the lid plate may be connected by, for example, a bellows-shaped stretchable side plate. However, in any case, it is needless to say that it is necessary to have a structure capable of maintaining an airtight state inside. Further, the pair of molds 2 in this embodiment
The configuration of the work 11 composed of 1, 23, the cushion material 22 and the like can be appropriately changed depending on the case.

【0021】[0021]

【発明の効果】以上、詳細に説明したように、請求項1
記載のフレキシブルプリント配線板の補強板貼り合わせ
方法においては、真空ボックス内部を排気するように構
成されているため、熱間プレス部全体を取り囲む真空チ
ャンバー内部を排気していた従来の場合に比べて、真空
排気を行なう空間の容積が格段に小さくなり、排気時間
を短縮することができ、ひいては、貼り合わせ作業全体
に要する時間を短縮することができる。また、従来の真
空チャンバーに代えて真空ボックスを使用することで装
置の設置スペースや装置に要するコストを低減すること
ができる。すなわち、補強板貼り合わせ作業を行なうに
際して、全体の作業時間の短縮、または装置の設置スペ
ースやコストの低減等、種々の面にわたって従来方法に
比べて、効率の高いものとすることができる。
As described above in detail, the first aspect of the present invention is as follows.
In the method for laminating the reinforcing plate of the flexible printed wiring board described, since it is configured to evacuate the inside of the vacuum box, compared to the conventional case where the inside of the vacuum chamber that surrounds the entire hot press part is evacuated. The volume of the space for vacuum evacuation is remarkably reduced, the evacuation time can be shortened, and the time required for the entire bonding work can be shortened. Further, by using a vacuum box instead of the conventional vacuum chamber, the installation space of the device and the cost required for the device can be reduced. That is, when the reinforcing plate bonding work is performed, the efficiency can be improved as compared with the conventional method in various aspects such as shortening the entire working time, reducing the installation space and cost of the device, and the like.

【0022】また、請求項2記載の真空ボックスにおい
ては、真空ボックス内部を排気し熱間プレス装置により
押圧力および熱を付加すると、真空パッキンが上下方向
に圧縮されることによりワークと蓋板とが接触して、真
空ボックスを介して押圧力と熱とがワークに伝導され、
フレキシブルプリント配線板と補強板とを確実に熱圧着
することができる。したがって、請求項1記載の補強板
貼り合わせ方法に用いて好適なものであり、本発明の効
果を充分に発揮させることができる。
Further, in the vacuum box according to the second aspect, when the inside of the vacuum box is evacuated and the pressing force and heat are applied by the hot pressing device, the vacuum packing is compressed in the vertical direction so that the work and the cover plate are separated. Contact and the pressing force and heat are conducted to the work through the vacuum box,
The flexible printed wiring board and the reinforcing plate can be reliably thermocompression bonded. Therefore, it is suitable for use in the reinforcing plate laminating method according to the first aspect, and the effects of the present invention can be sufficiently exhibited.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明のフレキシブルプリント配線板の補強
板貼り合わせ方法の一実施例を示す断面図である。
FIG. 1 is a cross-sectional view showing an embodiment of a method for laminating a reinforcing plate of a flexible printed wiring board according to the present invention.

【図2】 本実施例に用いる真空ボックスを示す斜視図
である。
FIG. 2 is a perspective view showing a vacuum box used in this embodiment.

【図3】 同真空ボックスおよびワークの寸法の関係を
示す図である。
FIG. 3 is a diagram showing a relationship between dimensions of the vacuum box and a work.

【図4】 従来の補強板貼り合わせ方法に用いる真空プ
レス装置を示す図である。
FIG. 4 is a view showing a vacuum press device used in a conventional reinforcing plate bonding method.

【符号の説明】[Explanation of symbols]

8…フレキシブルプリント配線板、9…補強板、11…
ワーク、12…真空ボックス、13…熱間プレス装置、
14…ボックス本体、15…蓋板、16…排気管、17
…側板、18…底板、19…真空パッキン、21…下金
型(押さえ板)、23…上金型(押さえ板)
8 ... Flexible printed wiring board, 9 ... Reinforcing board, 11 ...
Work, 12 ... vacuum box, 13 ... hot press machine,
14 ... Box body, 15 ... Lid plate, 16 ... Exhaust pipe, 17
... Side plate, 18 ... Bottom plate, 19 ... Vacuum packing, 21 ... Lower mold (holding plate), 23 ... Upper mold (holding plate)

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 フレキシブルプリント配線板(8)と補
強板(9)とを一対の押さえ板(21、23)の間に載
置したワーク(11)を作製し、該ワークに対して低圧
環境下で熱間プレスを施すことによってフレキシブルプ
リント配線板と補強板とを熱圧着するようにしたフレキ
シブルプリント配線板の補強板貼り合わせ方法におい
て、 内部を真空排気したときに気密状態が維持されるととも
に、蓋板(15)と底板(18)とが接近する方向に相
対的に移動自在とされた、熱伝導性を有する真空ボック
ス(12)の内部に前記ワークを収納し、 ついで、前記真空ボックスを熱間プレス装置(13)に
設置した後、その内部を排気するとともに、該真空ボッ
クスを介して押圧力および熱を加えることにより、前記
ワークを熱圧着させるようにしたことを特徴とするフレ
キシブルプリント配線板の補強板貼り合わせ方法。
1. A work (11) having a flexible printed wiring board (8) and a reinforcing plate (9) mounted between a pair of pressing plates (21, 23) is prepared, and a low-pressure environment is applied to the work. In a method for laminating a flexible printed wiring board and a reinforcing board, wherein the flexible printed wiring board and the reinforcing board are thermocompression-bonded to each other by hot pressing below, a hermetic state is maintained when the inside is evacuated. The work is stored inside a vacuum box (12) having thermal conductivity, which is relatively movable in a direction in which the lid plate (15) and the bottom plate (18) approach each other, and then the vacuum box. Is installed in a hot press machine (13), the inside of the machine is evacuated, and pressing force and heat are applied through the vacuum box so that the work piece is thermocompression bonded. Reinforcing plate bonding method of the flexible printed wiring board, characterized in that the.
【請求項2】 請求項1記載のフレキシブルプリント配
線板の補強板貼り合わせ方法に用いる真空ボックス(1
2)であって、 上端に真空パッキン(19)が取り付けられ、内部を真
空排気するための排気管(16)が接続された側板(1
7)と底板(18)とからなるボックス本体(14)と
蓋板(15)とから構成され、前記側板の下端から上端
までの高さが前記ワーク(11)の厚みより小さい寸法
とされ、前記側板の下端から前記真空パッキンの上端ま
での高さが前記ワークの厚みより大きい寸法とされたこ
とを特徴とする真空ボックス。
2. A vacuum box (1) used in the method for laminating a reinforcing board of a flexible printed wiring board according to claim 1.
2) which is a side plate (1) to which a vacuum packing (19) is attached at the upper end and an exhaust pipe (16) for evacuating the inside is connected.
7) and a bottom plate (18) and a box body (14) and a lid plate (15), and the height from the lower end to the upper end of the side plate is smaller than the thickness of the work (11), A vacuum box characterized in that a height from a lower end of the side plate to an upper end of the vacuum packing is larger than a thickness of the work.
JP5312327A 1993-12-13 1993-12-13 Reinforcing sheet sticking method of flexible printed wiring board Pending JPH07170032A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5312327A JPH07170032A (en) 1993-12-13 1993-12-13 Reinforcing sheet sticking method of flexible printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5312327A JPH07170032A (en) 1993-12-13 1993-12-13 Reinforcing sheet sticking method of flexible printed wiring board

Publications (1)

Publication Number Publication Date
JPH07170032A true JPH07170032A (en) 1995-07-04

Family

ID=18027906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5312327A Pending JPH07170032A (en) 1993-12-13 1993-12-13 Reinforcing sheet sticking method of flexible printed wiring board

Country Status (1)

Country Link
JP (1) JPH07170032A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1303646C (en) * 2003-03-12 2007-03-07 夏普株式会社 Sticking device and method for reinforcing plate
KR100718212B1 (en) * 2003-07-01 2007-05-15 샤프 가부시키가이샤 Method for bonding reinforcing plate
JP2008030316A (en) * 2006-07-28 2008-02-14 Optrex Corp Method for sticking plate-shaped members
WO2009095347A2 (en) * 2008-01-28 2009-08-06 Tesa Se Method for gluing flexible circuit boards to polymer materials for partial or complete stiffening
CN106990543A (en) * 2017-03-23 2017-07-28 张家港康得新光电材料有限公司 The preparation method of 3D display devices
CN113477799A (en) * 2021-06-22 2021-10-08 淮安帝泰华懋精密科技有限公司 Production process and equipment of porous special-shaped SUS reinforced steel sheet

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1303646C (en) * 2003-03-12 2007-03-07 夏普株式会社 Sticking device and method for reinforcing plate
US7290580B2 (en) 2003-03-12 2007-11-06 Sharp Kabushiki Kaisha Reinforcement combining apparatus and method of combining reinforcement
KR100718212B1 (en) * 2003-07-01 2007-05-15 샤프 가부시키가이샤 Method for bonding reinforcing plate
JP2008030316A (en) * 2006-07-28 2008-02-14 Optrex Corp Method for sticking plate-shaped members
WO2009095347A2 (en) * 2008-01-28 2009-08-06 Tesa Se Method for gluing flexible circuit boards to polymer materials for partial or complete stiffening
WO2009095347A3 (en) * 2008-01-28 2009-10-29 Tesa Se Method for gluing flexible circuit boards to polymer materials for partial or complete stiffening
CN106990543A (en) * 2017-03-23 2017-07-28 张家港康得新光电材料有限公司 The preparation method of 3D display devices
CN113477799A (en) * 2021-06-22 2021-10-08 淮安帝泰华懋精密科技有限公司 Production process and equipment of porous special-shaped SUS reinforced steel sheet

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