JPH07167621A - Method for inspecting pin appearance - Google Patents

Method for inspecting pin appearance

Info

Publication number
JPH07167621A
JPH07167621A JP34304393A JP34304393A JPH07167621A JP H07167621 A JPH07167621 A JP H07167621A JP 34304393 A JP34304393 A JP 34304393A JP 34304393 A JP34304393 A JP 34304393A JP H07167621 A JPH07167621 A JP H07167621A
Authority
JP
Japan
Prior art keywords
pin
absence
solder
pins
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34304393A
Other languages
Japanese (ja)
Inventor
Masaru Soga
勝 曽我
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP34304393A priority Critical patent/JPH07167621A/en
Publication of JPH07167621A publication Critical patent/JPH07167621A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To securely inspect the height dimension and the presence/absence of solder at a high speed and in a highly precision by picking up the shape image of pins whose height and position are made uniform while a brazing jig is inclined at a specified angle and the pin are pushed up. CONSTITUTION:A pin 3, whose head part 3a is, for example, 0.45mm in diameter and 0.2mm in thickness, is brazed by a semi-spherical solder 4. A brazing jig 1 of 2.58mm in thickness for example in which the pins 3 is inserted into several thousands of holes 2 is inclined at about 25 degrees. After the pins 3 are pushed up in a manner that their heights and positions will be made uniform, their shape image is picked up at about 30 degrees diagonally from the above by a two-dimensional camera 8, thereby detecting the height dimension and the presence/absence of the solder 4 through image processing. Thus, the error becomes 2X1 picture element (3mum per picture element), so that the judgement accuracy can be improved and the accurate dimensional measurement and the high-speed judgement of presence/absence of the solder 4 can be also realized.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、頭部にろうがろう付け
されたピンの外観検査方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting the appearance of a pin brazed to a head.

【0002】[0002]

【従来の技術】従来、頭部にろうがろう付けされたピン
の高さ寸法、ろうの有無を検査するには、図2に示すよ
うにろう付け治具1の孔2に挿入されているピン3を一
定の高さに押し上げ、頭部3aにろう付けされた半球状
のろう4にハロゲンランプ5の光を当て、その反射光位
置及び反射光量をラインセンサー6にて撮り込み、画像
処理を行っていた。ところで、上記のピンの外観検査方
法では、判定に画像位置、光量をバロメータとする為
に、ランプ光軸とラインセンサー光軸を正確に合わせな
ければならない。また、ハロゲンランプ5が汚れる為、
ランプ光量が変化する。しかしハロゲンランプ5を掃除
すると光軸ずれを起す。さらにろう4の上表面が丸いこ
とと、荒れ(凹凸)ていることとにより、色調差の影響
を受ける。それにより画像位置が異なることとなり、ピ
ン3の高さが異なると誤った判定をする。またろう4の
上表面がつるつるで良く反射すると、画像画素数が多く
なり、ろう無しと誤まった判定をする。従って、ピン3
の高さ差が0.25mm以上でないと、判定できない。また、
実用できる倍率アップでも0.15mm程度の差がないと、判
定できない。
2. Description of the Related Art Conventionally, in order to inspect the height of a pin brazed to a head and the presence / absence of a braze, the pin is inserted into a hole 2 of a brazing jig 1 as shown in FIG. The pin 3 is pushed up to a certain height, the light of the halogen lamp 5 is applied to the hemispherical solder 4 brazed to the head 3a, and the reflected light position and the reflected light amount are photographed by the line sensor 6, and the image processing is performed. Was going on. By the way, in the above-described pin appearance inspection method, the lamp optical axis and the line sensor optical axis must be accurately aligned in order to determine the image position and the light amount by the barometer. Also, since the halogen lamp 5 becomes dirty,
The light intensity of the lamp changes. However, when the halogen lamp 5 is cleaned, the optical axis shifts. Further, the round upper surface of the wax 4 and the rough (uneven) surface of the wax 4 are affected by the color difference. As a result, the image position becomes different, and if the height of the pin 3 is different, an erroneous determination is made. If the upper surface of the wax 4 is smooth and well reflected, the number of image pixels increases, and it is erroneously determined that there is no wax. Therefore, pin 3
It cannot be judged unless the height difference is less than 0.25mm. Also,
Even if the magnification can be increased for practical use, it cannot be judged unless there is a difference of about 0.15 mm.

【0003】[0003]

【発明が解決しようとする課題】そこで本発明は、反射
光位置、反射光量を測定して検査するのをやめ、ピン全
体の形状画像を撮り込み、画像処理により、確実、高速
に高さ寸法、ろうの有無を精度良く検査できるようにし
たピンの外観検査方法を提供しようとするものである。
Therefore, the present invention stops measuring and inspecting the reflected light position and the reflected light amount, takes a shape image of the entire pin, and performs image processing to surely and quickly measure the height. The present invention is intended to provide a method for inspecting the appearance of pins, which enables accurate inspection for the presence or absence of wax.

【0004】[0004]

【課題を解決するための手段】上記課題を解決するため
の本発明のピンの外観検査方法は、頭部にろうがろう付
けされたピンが多数の孔に入ったろう付け治具を約20〜
45度傾け、ピンを下から押し上げ、高さ、位置を揃え、
斜め上方から2次元カメラによりピンの形状画像を撮り
込み、画像処理により高さ寸法及びろうの有無を検査す
ることを特徴とするものである。
In order to solve the above problems, the pin appearance inspection method of the present invention uses a brazing jig in which the pins brazed to the head are placed in a large number of holes.
Tilt 45 degrees, push up the pin from below, align the height and position,
It is characterized in that a pin-shaped image is photographed from a diagonally upper side with a two-dimensional camera and the height dimension and the presence or absence of wax are inspected by image processing.

【0005】[0005]

【作用】上記のように本発明のピンの検査方法は、ピン
の形状画像を2次元カメラにより撮り込み、画像処理に
より高さ寸法及びろうの有無を検査するのであるから、
光量、ろう部分の色調差に影響を受けなくなり、正確な
光軸合わせも必要なくなって、作業が簡素となり、従っ
て、確実、高速にピンの高さ寸法及びろうの有無を精度
良く検査できる。
As described above, in the pin inspection method of the present invention, the pin shape image is photographed by the two-dimensional camera and the height dimension and the presence or absence of the wax are inspected by image processing.
It is not affected by the light amount and the color tone difference of the brazing part, and accurate optical axis alignment is not necessary, and the work is simplified. Therefore, the pin height dimension and the presence or absence of the brazing can be accurately and accurately inspected.

【0006】[0006]

【実施例】本発明のピンの検査方法の一実施例を図1に
よって説明する。直径0.45mm、厚さ 0.2mmの頭部3aに
半球状のろう4がろう付けされたピン3が 2.5mm間 隔
に90×42=3780個配設された孔2に入っている。厚さ2.
58mmのろう付け治具1を25度傾け、ピン3を下から押し
上げ、高さ、位置を揃え、30度斜め上方から2次元カメ
ラ8によりピン3の形状画像を撮り込み、画像処理によ
り高さ寸法及びろう4の有無を検査した。このようにピ
ン3の形状画像を2次元カメラ8により撮り込み、画像
処理により高さ寸法及びろう4の有無を検査したので、
誤差は2×1画素(1画当り3μm)となり、判定精度
が向上し、確実な寸法測定、ろう4の有無の判定が高速
に行うことができた。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the pin inspection method of the present invention will be described with reference to FIG. A head 3a having a diameter of 0.45 mm and a thickness of 0.2 mm is brazed with a hemispherical brazing wire 4 into a hole 2 in which 90 × 42 = 3780 pins 3 are arranged at 2.5 mm intervals. Thickness 2.
The 58 mm brazing jig 1 is tilted 25 degrees, the pin 3 is pushed up from the bottom, the height and position are aligned, and the shape image of the pin 3 is captured by the two-dimensional camera 8 from 30 degrees diagonally above and the height is processed by image processing. The dimensions and the presence of wax 4 were inspected. In this way, the shape image of the pin 3 is photographed by the two-dimensional camera 8 and the height dimension and the presence or absence of the wax 4 are inspected by image processing.
The error was 2 × 1 pixel (3 μm per image), the determination accuracy was improved, and reliable dimension measurement and the presence / absence of the wax 4 could be performed at high speed.

【0007】[0007]

【発明の効果】以上の通り本発明のピンの外観検査方法
によれば、ピンの高さ寸法、ろうの有無を確実に且つ高
速に精度良く検査でき、従って、ろう不足による製造時
の歩留り低下を防げる。
As described above, according to the pin appearance inspection method of the present invention, the pin height dimension and the presence / absence of brazing can be accurately and accurately inspected at a high speed. Can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のピンの外観検査方法の一実施例を示す
図である。
FIG. 1 is a diagram showing an embodiment of a pin appearance inspection method of the present invention.

【図2】従来のピンの外観検査方法を示す図である。FIG. 2 is a diagram showing a conventional pin appearance inspection method.

【符号の説明】[Explanation of symbols]

1 ろう付け治具 2 孔 3 ピン 3a 頭部 4 ろう 7 押し上げプレート 8 2次元カメラ 1 brazing jig 2 holes 3 pins 3a head 4 brazing 7 push-up plate 8 two-dimensional camera

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 頭部にろうがろう付けされたピンの入っ
たろう付け治具を約20〜45度傾け、ピンを下から押し上
げ、高さ、位置を揃え、斜め上方から2次元カメラによ
りピンの形状画像を撮り込み、画像処理により高さ寸法
及びろうの有無を検査することを特徴とするピンの外観
検査方法。
1. A brazing jig containing a pin brazed to a head is tilted by about 20 to 45 degrees, the pin is pushed up from below, the height and position are aligned, and the pin is diagonally viewed from above by a two-dimensional camera. A method for inspecting the appearance of pins, which is characterized by taking a shape image of the above and inspecting the height dimension and the presence or absence of brazing by image processing.
JP34304393A 1993-12-15 1993-12-15 Method for inspecting pin appearance Pending JPH07167621A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34304393A JPH07167621A (en) 1993-12-15 1993-12-15 Method for inspecting pin appearance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34304393A JPH07167621A (en) 1993-12-15 1993-12-15 Method for inspecting pin appearance

Publications (1)

Publication Number Publication Date
JPH07167621A true JPH07167621A (en) 1995-07-04

Family

ID=18358503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34304393A Pending JPH07167621A (en) 1993-12-15 1993-12-15 Method for inspecting pin appearance

Country Status (1)

Country Link
JP (1) JPH07167621A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019132601A1 (en) * 2017-12-28 2019-07-04 주식회사 고영테크놀러지 Method for inspecting insertion state of plurality of pins included in connector inserted into substrate, and substrate inspection device
CN111527804A (en) * 2017-12-28 2020-08-11 株式会社高迎科技 Method for inspecting insertion state of a plurality of pins included in connector inserted into substrate and substrate inspection apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019132601A1 (en) * 2017-12-28 2019-07-04 주식회사 고영테크놀러지 Method for inspecting insertion state of plurality of pins included in connector inserted into substrate, and substrate inspection device
CN111527804A (en) * 2017-12-28 2020-08-11 株式会社高迎科技 Method for inspecting insertion state of a plurality of pins included in connector inserted into substrate and substrate inspection apparatus
CN111527804B (en) * 2017-12-28 2021-05-28 株式会社高迎科技 Method for inspecting insertion state of a plurality of pins included in connector inserted into substrate and substrate inspection apparatus
US11547033B2 (en) 2017-12-28 2023-01-03 Koh Young Technology Inc. Method for inspecting insertion states of plurality of pins included in connector inserted into substrate, and substrate inspection apparatus

Similar Documents

Publication Publication Date Title
US6278797B1 (en) Apparatus for inspecting land-attached circuit board
US6028673A (en) Inspection of solder bumps of bump-attached circuit board
US5247344A (en) Optical inspection system for solder joints and inspection method
US20090123060A1 (en) inspection system
JPH0610694B2 (en) Automatic focusing method and device
EP1017962B1 (en) Three dimensional inspection of electronic leads with optical element attached to the top surface of a transparent reticle
JP2003139523A (en) Surface defect detecting method and surface defect detecting device
JP4434417B2 (en) Inspection equipment for printed wiring boards
JP2000112151A (en) Mark for positioning, positioning method and aligning method
JP2011158363A (en) Soldering inspection device for pga mounting substrate
JP4151306B2 (en) Inspection method of inspection object
JP2000131037A (en) Apparatus for inspecting shape of body
JPH07167621A (en) Method for inspecting pin appearance
CA1318414C (en) Optical inspection system for solder joints and inspection method
JPH05231837A (en) Method and device for measuring shape
JPH10144748A (en) Wafer stage
JP2001004348A (en) Method and device for inspecting roughness on outer peripheral surface of glass vessel
JP2000101298A (en) Part position matching device and part position matching method using the same
JP2620992B2 (en) Inspection method for soldered parts of electronic components
JPH04208803A (en) Apparatus for inspecting mounting of printed circuit board
JPS6250605A (en) Inspecting instrument for body to be inspected
JPS61193007A (en) Inspecting method for rod type projection body
KR0150623B1 (en) Testing method for soldering part
JP2001513594A (en) Method and apparatus for position detection and / or coplanarity inspection and / or separation inspection of device terminals
JPH03197802A (en) Label shift inspection instrument