JPH071627U - Electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] When the piezoelectric oscillator with the piezoelectric oscillator directly fixed to the base is dropped, the piezoelectric oscillator may be broken or broken.
The frequency was changing drastically. The present invention alleviates the impact on the piezoelectric oscillator, suppresses chipping, breakage, and frequency change of the piezoelectric oscillator, and also alleviates the difference in thermal expansion coefficient between the piezoelectric oscillator, mount base, and base, and the amount of frequency change. To improve accuracy by reducing. [Structure] An elastic material mount base and an elastic material pillow are provided on the base, the piezoelectric oscillation piece is cantilevered, and an elastic material is also provided on the lid.
Attach elastic materials above and below the piezoelectric oscillator in the thickness direction. The structure in which the difference in the thermal expansion coefficient between the piezoelectric oscillator and the base is relaxed by the elastic material mount and pillow.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a structure for improving impact resistance of an electronic component using a piezoelectric oscillator.

[0002]

[Prior art]

 A conventional electronic component will be described with reference to the plan view of FIG. 5 and the top view of FIG.

The base 50 is made of an insulating material such as ceramic, and the mount base 51 and the pillow 52 are formed by printing or the like, and a conduction pattern (not shown) to the outside is also formed by printing or the like.

The piezoelectric oscillating piece 53 has an electrode pattern 54 formed of a metal such as Ag using a means such as vapor deposition.

The piezoelectric oscillation piece 53 is placed on the mount base 51 and the pillow 52, and cantilevered on the mount base 51 with a conductive adhesive 55 or the like.

After that, the frequency was adjusted in vacuum using Ag or the like, the lid 56 was covered, and airtight sealing was performed using a low melting point glass 57 or the like in an N ₂ atmosphere to obtain an electronic component 58.

As shown in FIG. 6, electrode patterns 54 are formed on the front and back of the piezoelectric oscillation piece 53, cantilevered by the mount base 51, and connected to an external pattern.

The pillow 52 is provided to create a gap between the base 50 and the piezoelectric oscillation piece 54.

[0009]

However, in the conventional technique, the piezoelectric oscillator is directly fixed to the base. Therefore, when the piezoelectric oscillator is impacted by being dropped or the like, the piezoelectric oscillator is directly impacted by the base. , The piezoelectric oscillation piece was chipped or broken.

Due to the chipping, a frequency shift of the piezoelectric oscillation piece occurs, and if it breaks, the piezoelectric oscillation piece naturally stops oscillating, resulting in a bad electronic component and other adverse effects.

Further, due to the difference in thermal expansion coefficient between the base and the piezoelectric oscillating piece, there is an influence on aging characteristics such as frequency shift due to half-date temperature in a reflow furnace during board mounting and frequency shift over a long period of time. To go.

[0012]

[Means for Solving the Problems]

 In the electronic component of the present invention, three or more first elastic members are provided on the base, one end of the piezoelectric oscillation piece is fixed to two of the first elastic members, and the other end is the remaining first elastic member. A second elastic material is provided inside the lid of the piezoelectric oscillation piece, and the first elastic material is arranged on one side in the thickness direction of the piezoelectric oscillation piece and the second elastic material is arranged on the other side. It is characterized by

Further, a leaf spring having a thickness of 10 to 100 μm is used as the first elastic material and / or the second elastic material.

A resin is used as the first elastic material and / or the second elastic material.

Further, the second elastic material is attached to a position corresponding to a portion other than the electrode at the other end of the piezoelectric oscillation piece.

[0016]

【Example】

 An embodiment of the present invention will be described with reference to a plan view of FIG. 1 and a top view of FIG.

A conductive pattern (not shown) was formed by printing or the like on an insulating base 1 made of ceramic or the like.

The elastic material mount base 2 made of a leaf spring and the elastic material pillow 3 are fixed to the base 1 by welding, an adhesive or the like, and are electrically connected to an external pattern.

It is desirable to select the plate thickness of the elastic material mount base 2 and the elastic material pillow 3 made of a plate spring in the range of 10 to 100 μm. Above this range, the spring property becomes strong and it must be thin and practical. It's difficult.

To obtain a width dimension for mounting the piezoelectric oscillation piece 4, 50 μm or less is effective as an elastic material.

Next, the piezoelectric oscillation piece 4 having the electrode pattern 5 formed of metal such as Ag by vapor deposition is placed on the elastic material mount base 2 and the elastic material pillow 3, and the conductive adhesive material is attached to the elastic material mount base 2. Etc., and fix it by cantilever support.

After that, the frequency is adjusted in vacuum using Ag or the like, the lid 7 is covered, and the electronic component 10 is hermetically sealed using the low melting point glass 9 or the like in the N ₂ atmosphere.

An elastic material 8 made of a leaf spring in advance is fixed to the inside of the lid 7 with an adhesive or the like.

The elastic material 8 is attached to the free end of the piezoelectric oscillation piece 4, the upper portion on the elastic material pillow 3 side, and the inside of the lid 7 so as to contact the portion other than the electrode pattern 5.

That is, when the piezoelectric oscillating piece floats up to the lid 7 side at the time of a shock such as a drop, the elastic material 8 hits the elastic material 8 without hitting the lid 7 to absorb the shock and not damage the electrode. is there.

When the elastic material 8 is made of a leaf spring, the effect will be diminished unless the leaf spring is covered so that the tip of the leaf spring abuts the lid 7 as shown in FIG. .

If the tip of the leaf spring is left floating, the leaf spring also moves when dropped, and the effect of cushioning the impact becomes weak.

As shown in the top view of FIG. 2, an electrode pattern 5 is formed on the front and back of the piezoelectric oscillation piece 4, and is supported by the elastic material mount base 2 in a cantilever manner.

Although the both-end support is more effective against the impact, the end-support is more advantageous in order to bring out the characteristics of the piezoelectric oscillation piece and improve the accuracy.

In the case of holding both ends, since the elastic material mount base 2, the elastic material pillow 3, and the piezoelectric oscillation piece 4 have different coefficients of thermal expansion, the piezoelectric oscillation piece 4 is distorted due to temperature and the oscillation frequency changes. .

Further, since the difference in the coefficient of thermal expansion of the base 1 is also added, the frequency change becomes large. Therefore, the cantilever support is more advantageous for higher accuracy.

FIG. 3 is a plan view showing another embodiment of the present invention.

If an elastic material 8 is attached to the lid 7 instead of a leaf spring and a soft elastic material resin 11 such as a polymer adhesive or a silicon adhesive is attached, an effect similar to a leaf spring can be obtained.

There is also a method of fixing the elastic material mount base 2 and the elastic material pillow 3 using the same soft resin.

In addition, as in the embodiment of FIG. 1, a method in which an elastic material is used as a leaf spring and is attached above and below in the thickness direction of the piezoelectric oscillation piece 4 and an elastic material 8 attached to the lid 7 is made into an elastic material resin 11 and the base 1 is used. There is a method of forming an electronic component by a combination of a leaf spring on the side, a soft resin on the base 1 side by using the elastic material 8 on the lid 7, and a soft resin on both the lid 7 and the base 1 side. .

FIG. 4 is a graph comparing the oscillation failure rates when the electronic component 10 of the present invention and the conventional electronic component are dropped from a height of 2 m by 30.

The conventional electronic component has a 30% oscillation failure at 2 m × 10 times and a 100% oscillation failure at 2 m × 40 times, but the electronic component 10 of the present invention has a large effect on impact resistance at 0% at 2 m × 50 times. It is fulfilling.

The method for hermetically sealing the electronic component 10 of the present invention has been described with the low melting point glass 9, but this is sealed for half a day, or the base 1 is laminated with ceramics and seam-welded. The effect of temperature and gas is reduced, which is effective for high precision.

Although the present embodiment has been described with reference to the piezoelectric oscillation piece, it is needless to say that the present invention can be applied to an electronic component in which an oscillator incorporating the piezoelectric oscillation piece and an IC and other parts for cantilever support are inserted.

[0040]

[Effect of device]

 In the present invention, elastic materials are attached to the base and the lid, and by arranging them above and below in the thickness direction of the piezoelectric oscillation piece, the free end of the piezoelectric oscillation piece largely fluctuates when an electronic component is dropped. Even if each side is touched, the impact force is relieved by touching the elastic material, and it is possible to prevent breakage and chipping of the piezoelectric oscillator, and to suppress frequency stop and frequency shift.

Further, since the supporting portion of the piezoelectric oscillation piece is also supported in a cantilever manner by using the elastic material mount base, it has the effect of mitigating the impact at the time of dropping and mitigating the difference in the coefficient of thermal expansion due to temperature. Since it can be minimized, it is also effective for high precision.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of the present invention.

FIG. 2 is a top view of an embodiment of the present invention.

FIG. 3 is a plan view showing another embodiment of the present invention.

FIG. 4 is a graph showing drop data of a conventional example of the present invention.

FIG. 5 is a plan view of a conventional electronic component.

FIG. 6 is a top view of a conventional electronic component.

[Explanation of symbols]

 1. Base 2. Elastic material mount base 3. Elastic material pillow 4. Piezoelectric oscillator 5. Electrode pattern 6. Conductive adhesive 7. Lid 8. Elastic material 9. Low melting point glass 10. Electronic component 11. Elastic material resin 50. Base 51. Mount base 52. Pillow 53. Piezoelectric oscillation piece 54. Electrode pattern 55. Conductive adhesive 56. Lid 57. Low melting point glass 58. Electronic parts

Claims (4)

[Scope of utility model registration request] 1. A base is provided with three or more first elastic members,
One end of the piezoelectric oscillation piece is fixed to two of the first elastic materials, and the other end is placed on the rest of the first elastic material, and a second elastic material is provided inside the lid of the piezoelectric oscillation piece. An electronic component in which the first elastic material is arranged on one side in the thickness direction of the piezoelectric vibrating piece and the second elastic material is arranged on the other side. 2. The electronic component according to claim 1, wherein a leaf spring having a thickness of 10 to 100 μm is used as the first elastic material and / or the second elastic material. 3. A resin is used as the first elastic material and / or the second elastic material.
Electronic components listed. 4. The electronic component according to claim 1, wherein the second elastic member is attached to a position of the other end of the piezoelectric oscillation piece other than the electrode.