JPH07161590A - Plate for holding chip-shaped electronic part - Google Patents

Abstract

PURPOSE:To prevent the turning-up of a peripheral part securely by securely fixing the peripheral part of the elastic member of a plate for holding a chip- shaped electronic part to a frame body. CONSTITUTION:A plate for holding a chip-shaped electronic part has a hard planar frame 12 having a plurality of through holes, a hard frame body 11 formed integrally with the frame 12 and surrounding the frame 12, and an elastic member, which covers the surface of the frame 12 at the inner side of the frame body 11 and has a part holding hole 14 having the diameter smaller than the size of the maximum width of the chip-shaped electronic part under the no-load state at the part of the through hole. A recess part 17, which is made to recess in the thickness direction of the frame 12, is provided between a linking part 19 linked to the frame body 11 of the frame 12 and the frame body 11. The peripheral part of an elastic member 13 is embedded in the recess part 17.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component holding plate used for forming terminal electrodes by applying a paint such as a conductive paste to both ends of a chip-shaped electronic component such as a multilayer chip capacitor. .

[0002]

2. Description of the Related Art In a process of forming terminal electrodes of a chip-shaped electronic component such as a multilayer chip capacitor, a chip provided with a large number of component storage holes so that a large number of chip-shaped electronic components can be formed with terminal electrodes at once. The electronic component holding plate is used. As shown in FIG. 6, the chip-shaped electronic component holding plate includes a frame 2 made of a flat plate-shaped hard member having a plurality of through holes, and a rectangular-shaped hard member integrally provided around the frame 2. And a resilient member 3 that covers the surface of the frame 2. The elastic member 3 has a diameter smaller than the maximum width dimension of the chip-shaped electronic component 5 to be held in the through hole portion of the frame 2 in an unloaded state, that is, in a state where it is not elastically compressed. A holding hole 4 is provided.
The chip-shaped electronic component 5 is inserted into the component holding hole 4 covered with the elastic member 3, and the conductive paste is applied thereto with one end 6 thereof protruding from the elastic member 3.

When the conductive paste a is applied to the end portion 6 of the chip-shaped electronic component 5 using this chip-shaped electronic component holding plate, first, the chip-shaped electronic component 5 has a plurality of component holding holes 4 of the elastic body 3. , And the chip-shaped electronic component 4 is pushed into the component holding hole 4 by the pin 8 so that one end 6 of the chip-shaped electronic component 5 to which the conductive paste a is to be applied is predetermined from the component holding hole 4. Only the height is projected. Then, the end portion 6 of the chip-shaped electronic component 5 protruding from the component holding hole 4 is immersed in the conductive paste a leveled to a certain depth and pulled up. As a result, the conductive paste a is applied to the end portion 6 of the chip-shaped electronic component 5. Then, the applied conductive paste a is dried. Further, when the conductive paste is applied to the other end of the chip-shaped electronic component 5, the chip-shaped electronic component 5 is pushed out by the pin 8 to the opposite side of the component holding hole 4, and the other end of the chip-shaped electronic component 5 is pushed. Make the end protrude. Then, similarly, the conductive paste a is applied to the other end and dried. Then, by baking the applied conductive paste, external electrodes of the chip-shaped electronic component 5 are formed.

In the conventional chip-shaped electronic component holding plate of this type, the elastic member 3 covers the inner frame 2 of the frame body 1. The peripheral portion of the elastic member 3 is the frame peripheral portion. It was inserted in the continuous connecting part 7. In this chip-shaped electronic component holding plate, since the frame 2 and the elastic member 3 are made of different materials, the adhesive force between them is weak. For this reason, when the chip-shaped electronic component 5 is repeatedly fitted and pushed into the component holding hole 4 as described above, there is a problem that the peripheral portion of the elastic member 3 is turned up from the connecting portion 7. . Therefore, as a method for preventing the peripheral portion of the elastic member 3 from being turned up, unevenness is provided on the inner surface of the frame body 1 and the elastic member 3 is formed on the inner surface of the frame body 1.
There has been proposed a structure in which the peripheral portion of the above is fitted, a structure in which the peripheral portion of the elastic member 3 is bonded to the frame body 1 with an adhesive, and the like.

[0005]

However, the fixing means for the peripheral portion of the elastic member 3 as described above attempts to suppress the curling-up force of the peripheral portion of the elastic member 3 and the curling-up of the elastic member 3. The shear force is generated in the elastic member 3 due to the drag force. In the structure in which the peripheral portion of the elastic member 3 is fitted to the unevenness provided on the frame body 1, when the shearing force as described above is generated, the slight fitting portion of the elastic member 3 to the frame body 1 is It comes off or is torn off by the frame 1 which is a hard material. Therefore, it is not possible to prevent the elastic member 3 from turning up, and the life of the elastic member 3 is shortened.

On the other hand, even in the structure in which the peripheral portion of the elastic member 3 is fixed to the frame body 1 with an adhesive, the adhered portion is easily peeled off, and also the peripheral portion of the elastic member 3 is prevented from turning up. I couldn't. Therefore, in view of the above-mentioned problems of the prior art, it is an object of the present invention to provide a chip-shaped electronic component holding plate capable of securely fixing the peripheral portion of an elastic member to a frame body and reliably preventing the peripheral portion from flipping up. And

[0007]

[Means for Solving the Problems] That is, in order to achieve the above-mentioned object, the means adopted in the present invention are, firstly, a flat frame having a plurality of through holes, which is made of a hard member, and this frame. And a frame made of a hard member that surrounds the periphery of the frame and covers the surface of the frame inside the frame, and the through-hole portion of the maximum width dimension of the chip-shaped electronic component in an unloaded state In a chip-shaped electronic component holding plate having an elastic member having a component holding hole of a small diameter, between the connecting portion and the frame body connected to the frame body of the frame, a recessed portion recessed in the thickness direction of the frame is provided,
A peripheral portion of the elastic member is embedded in the recess.

Secondly, in the above-mentioned chip-shaped electronic component holding plate, a slope is formed on the wall surface of the recess. Thirdly, in the above-mentioned chip-shaped electronic component holding plate, fine irregularities are formed on the wall surface of the concave portion. Fourthly, in the chip-shaped electronic component holding plate, the recess is a hole penetrating the frame in its thickness direction.

[0009]

According to the first means of the present invention, the recessed portion which is recessed in the thickness direction of the frame is provided between the frame body and the connecting portion,
Since the peripheral part of the elastic member is embedded in this recess,
When the peripheral part of the elastic member is pulled in the plane direction of the frame and the peripheral part tries to turn up from the connecting part, the peripheral part of the elastic member embedded in this recess becomes, so to speak, an anchor and acts as an anchor of the elastic member. The periphery is fixed so that it does not move. Therefore, it is possible to reliably prevent the peripheral portion of the elastic member from being turned up.

Further, like the above-mentioned second and third means, by forming a gradient or fine unevenness in the concave portion,
The drag force for fixing the peripheral portion of the elastic member in the concave portion is further increased, and the curling up of the peripheral portion of the elastic member can be suppressed more reliably. In addition, like the fourth means,
If the recess is formed so as to penetrate in the thickness direction of the frame and elastic members are filled therein, the elastic members on both sides of the frame are integrated with each other and resist the force of turning up, The curling up of the peripheral portion of the elastic member is surely suppressed.

[0011]

Embodiments of the present invention will now be described in detail with reference to the drawings. As shown in FIG. 1, the chip-shaped electronic component holding plate has a rectangular plate shape as a whole. The outer peripheral portion is a rectangular frame body 1, and a frame 12 not shown in FIG. 1 is integrally stretched inside the frame body 1. The frame 11 and the frame 12 are made of a hard material such as aluminum or stainless steel. Through holes are arranged in the frame 12 in the vertical and horizontal directions. The entire surface of the frame 12 is covered with an elastic member 13 made of silicone rubber, natural rubber, butadiene styrene rubber, butadiene acrylate nitrile rubber, polychloroprene, chlorosulfonated polyethylene, fluorine rubber, butyl rubber or the like. The frame 13 has a component holding hole 14 in the through hole portion of the frame 12.

FIG. 2 is a cross-sectional view of the vicinity of the frame 11 of the chip-shaped electronic component taken along the arrangement direction of the component holding holes 14. As is clear from this figure, the elastic member 13 covers the entire surface of the frame 12. The diameter of the component housing hole 14 formed in the elastic member 13 is such that the elastic member 13 has no load, that is, is not elastically compressed.
It is smaller than the maximum width dimension of the chip-shaped electronic component 15 to be held. Chip-shaped electronic component 15 here
The maximum width dimension of is the maximum dimension in the width direction of the chip-shaped electronic component, for example, its diameter in the case of a cylindrical chip-shaped electronic component, and the diagonal dimension of the end face in the case of a prismatic-shaped chip component.

Although the frame body 11 and the frame 12 are integrated, a peripheral portion of the frame 12, that is, a portion outside a portion having a through hole is connected to the frame body 11 as a connecting portion 19. In the embodiment of FIG. 2, a recess 17 is formed between the connecting portion 19 and the frame 11 in the thickness direction of the frame 12, and the recess 17 is filled with the peripheral portion of the elastic member 13. . The recesses 17 are provided on both sides of the connecting portion 19, and the vertical wall surfaces 16 thereof are provided with a slope such that the width of the recesses 17 becomes wider as it goes deeper.

As described above, since the peripheral portion of the elastic member 13 is embedded in the concave portion 17 of the connecting portion 19, the elastic member 1
When the peripheral portion of the elastic member 13 is pulled in the plane direction of the frame 12 and the peripheral portion of the elastic member 13 tries to turn up from the connecting portion 19, the elastic member 13 is fixed so as not to move.
It is possible to prevent the peripheral part of 3 from being turned up. Furthermore, since the vertical wall surface 16 of the recess 17 is formed with a gradient, the drag force for fixing the peripheral portion of the elastic member in the recess 17 is further increased.

Further, in this embodiment, a recess 15 similar to the connecting portion 19 is also provided in a portion between the through holes of the frame 12 and the recess 15 is filled with the elastic member 13. There is. Thereby, even in the central portion of the frame 12, the displacement due to the deformation of the elastic member 12 is prevented. The vertical wall surface of the recess 15 in the central portion of the frame 12 is also provided with the same slope as that of the recess 17 in the peripheral portion.

Next, the embodiment shown in FIG. 3 will be described. In this embodiment, the vertical wall surface 1 of the recesses 17 and 15 is described.
6 has fine irregularities. Due to these fine irregularities,
The elastic member 13 filled in the recesses 17 and 15 does not slip therein and is firmly held. Therefore, the elastic member 1
It is possible to prevent the peripheral portion of 3 from being turned up and the elastic member 13 from being displaced at the central portion of the frame 12.

Next, the embodiment shown in FIG. 4 will be described. In this embodiment, in addition to the recess 17, another recess 18 is provided on the central portion side in the connecting portion 19. Further, in the central portion of the frame 12, recesses 15 are provided on both sides of the portion between the through holes. These recesses 17, 18 and 15 hold the elastic member 13 filled therein, and prevent the peripheral portion of the elastic member 13 from curling up and the elastic member 13 from shifting in the central portion of the frame 12. It

Next, the embodiment shown in FIG. 5 will be described. In this embodiment, the recess 17 of the connecting portion 19 penetrates through both sides of the frame 12. That is, the recess 17 is a through hole as a whole, and the elastic members 13 on both surfaces of the frame 12 are connected in this portion. For this reason, the elastic members 13 on both sides of the frame 12 pull each other to resist the force of the peripheral portion of the frame 12 to be turned up. In this embodiment, the central portion of the frame 12 between the through holes has a simple rectangular cross section and is not provided with a recess.

In the embodiment shown in FIGS. 2 and 4, the vertical wall surface 16 of the recess 17 has a slope such that the width of the recess 17 becomes gradually wider as it goes deeper. In the embodiment of FIG. 5, the vertical wall surface of the recess 17 is perpendicular to the plane direction of the frame 12. Further, in the embodiment of FIG. 3, the vertical wall surface of the recess 17 has irregularities, but the wall surface is vertical to the plane direction of the frame 12 as a whole. This is because if the vertical wall surface 16 of the recess 17 has a slope such that the width of the recess 17 becomes gradually narrower as it goes deeper, the edge of the elastic member 13 is likely to flip up from the frame 12. . In the above-described embodiment, the edge of the elastic member 13 is unlikely to come off the concave portion 16, and the curling up can be reliably prevented.

[0020]

As described above, according to the present invention, the peripheral portion of the elastic member for holding the frame body is filled in the concave portion provided around the frame 12, so that the peripheral portion of the elastic member is turned up. The rise can be effectively suppressed, and the life of the elastic member can be extended.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a chip-shaped electronic component holding plate according to an embodiment of the present invention.

FIG. 2 is a vertical sectional side view in the vicinity of a frame body of a chip-shaped electronic component holding plate according to the embodiment.

FIG. 3 is a vertical sectional side view in the vicinity of a frame body of a chip-shaped electronic component holding plate according to another embodiment of the present invention.

FIG. 4 is a vertical sectional side view in the vicinity of a frame body of a chip-shaped electronic component holding plate according to still another embodiment of the present invention.

FIG. 5 is a vertical sectional side view in the vicinity of a frame body of a chip-shaped electronic component holding plate according to still another embodiment of the present invention.

FIG. 6 is a vertical cross-sectional side view of the vicinity of a frame body in a state where a conductive paste is applied to an end portion of a chip-shaped electronic component using a chip-shaped electronic component holding plate according to a conventional example.

[Explanation of symbols]

 Reference Signs List 11 frame body 12 frame 13 elastic member 14 component holding hole 16 vertical wall surface of recess of connecting portion 17 recess of connecting portion 19 connecting portion

Claims (4)

[Reference number] 0050356-01 [Claims] 1. A flat plate frame made of a hard member having a plurality of through holes, a frame body made of a hard member surrounding the frame and provided integrally with the frame, and a frame inside the frame body. In the chip-shaped electronic component holding plate, which covers the surface and has an elastic member having a component holding hole having a diameter smaller than the maximum width dimension of the chip-shaped electronic component in a no-load state in the through hole portion, A chip-shaped electronic component holding plate, characterized in that a recessed portion that is recessed in the thickness direction of the frame is provided between the connecting portion connected to the frame and the frame body, and the peripheral portion of the elastic member is embedded in this recessed portion. 2. The chip-shaped electronic component holding plate according to claim 1, wherein a wall surface of the concave portion is formed with a slope. 3. The chip-shaped electronic component holding plate according to claim 1 or 2, wherein fine irregularities are formed on a wall surface of the concave portion. 4. The chip-shaped electronic component holding plate according to claim 1, wherein the recess is a hole that penetrates the frame in its thickness direction.