JPH07154092A - Board assembling system - Google Patents

Abstract

PURPOSE:To prevent the rate of operation of a board assembling system from lowering due to the operation for deciding pass/fail of each unit board when a printed board comprising a plurality of unit boards is subjected to a predetermined work. CONSTITUTION:When a parts is being mounted, a photosensor is moved on a transfer arm 17 by means of a moving unit 31. The transfer arm itself 17 is moved by means of a pulse motor 11 thus detecting a bad mark 29 on the unit board in a printed board 5 being carried on a conveyor 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention transfers a printed circuit board composed of a plurality of unit boards from a supply conveyor onto a workbench and performs a predetermined operation only on a good unit board in the board on the workbench. The present invention relates to a board assembling apparatus for applying the above.

[0002]

2. Description of the Related Art A substrate assembling apparatus of this type is disclosed in Japanese Patent Laid-Open No. 4-109.
No. 699 gazette, a mark indicating the quality of a unit board corresponding to each unit board which is each unit board of a multi-section printed circuit board is detected by a detection means, and only a good unit board is provided with a chip component. The technique for mounting is described.

[0003]

However, in the above-mentioned prior art, the mark is detected after the printed circuit board is placed on the XY table which is the work table, and the position of the mark is detected on the XY table. Therefore, there is a drawback that the chip parts, which is a predetermined work, cannot be mounted during that time, and the operation rate of the device is lowered.

Therefore, it is an object of the present invention to prevent the operating rate of the apparatus from decreasing due to the operation of judging the quality of each unit board when a predetermined work is performed on a printed board composed of a plurality of unit boards.

[0005]

Therefore, according to the present invention, a printed circuit board composed of a plurality of unit boards is transferred from a supply conveyor onto a workbench, and a good unit board in the board on the workbench is transferred to the good unit board. In the board assembling apparatus for performing the predetermined work only, the detection means for detecting the quality of each unit board of the board on the supply conveyor is provided.

Further, according to the present invention, a printed circuit board composed of a plurality of unit boards is transferred from a supply conveyor onto a work table by a transfer member, and each unit board attached to the board on the work table. In a board assembling apparatus for performing a predetermined operation only on a good unit board identified by a mark showing good or bad, a detection means for detecting the good or bad of each unit board by the mark showing good or bad of the unit board, and And a moving means for moving the detecting means so that the detecting means can detect marks provided at different positions.

Further, according to the present invention, a printed board composed of a plurality of unit boards is transferred onto a workbench by a transfer member driven by a drive device from a supply conveyor, and is mounted in the board on the workbench. In a substrate assembling apparatus that performs a predetermined operation only on a good unit board identified by a mark indicating the quality of each unit board, each unit board is provided on the transfer member and indicates the quality of each unit board. And a control means for controlling the drive unit to move the transfer member so that the detection means can detect marks attached to different positions on the substrate.

Further, according to the present invention, a printed circuit board composed of a plurality of unit boards is transferred from a supply conveyor for supplying and conveying the board onto a workbench, and the printed boards are arranged in the board side by side in the conveying direction of the supply conveyor. In a board assembling apparatus that performs a predetermined operation only on a good unit board identified by a mark indicating the quality of each unit board, the supply conveyor is fixedly provided at a position corresponding to the mark of the board on the supply conveyor. It is provided with a detection means for detecting the quality of each unit substrate when the respective marks of the substrate conveyed to reach the detection position.

Further, according to the present invention, a printed circuit board composed of a plurality of unit boards is transferred onto a workbench by a transfer member driven by a drive device from a supply conveyor and mounted on the board on the workbench. In a substrate assembling apparatus that performs a predetermined operation only on a good unit board identified by a mark indicating the quality of each unit board, each unit board is provided on the transfer member and indicates the quality of each unit board. Detecting means for detecting the quality of the transfer member, moving means for moving the detecting means on the transferring member, and moving the transferring member so that the detecting means can detect marks attached to different positions on the substrate. Therefore, a control means for controlling the driving device and the moving means is provided.

Further, according to the present invention, a printed circuit board composed of a plurality of unit boards is transferred onto a workbench by a transfer member driven by a drive device from a supply conveyor, and is mounted in the board on the workbench. In a board assembly apparatus that performs a predetermined operation only on a unit board identified by a mark indicating the quality of each unit board, the transfer direction of the board that is provided outside the transfer member and is transferred to the transfer member Further, a detection means for detecting the quality of each unit substrate by the marks when the marks at different positions reach the detection position is provided.

[0011]

According to the structure of the first aspect, the detecting means detects the quality of each unit board of the printed board on the supply conveyor.
According to the structure of claim 2, the moving means moves the detecting means to detect marks at different positions on the substrate.

According to the structure of claim 3, the control means can detect the mark indicating the quality of each unit board provided in the board by the detection means provided on the transfer member for transferring the board from the supply conveyor. In order to move the transfer member, the drive device of the transfer member is controlled. According to the structure of claim 4, the detecting means is fixedly provided at a position corresponding to the marks provided side by side in the conveyor conveying direction on the board on the supply conveyor, and the detection means for the board conveyed to the supply conveyor is provided. When each mark reaches the detection position, the quality of each unit substrate is detected.

According to the structure of claim 5, the driving means and the moving means for driving the transfer member are controlled by the control means, and the detecting means is moved to detect marks at different positions on the substrate. According to the structure of claim 6, the detection means provided outside the transfer member causes each unit substrate to be detected by a mark at a different position in the transfer direction of the substrate transferred by the transfer member when the mark reaches the detection position. The quality of is detected.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. In FIG. 2, reference numeral 1 is a base of an electronic component automatic mounting apparatus as a board assembly apparatus. Reference numeral 2 denotes a rotary table that rotates intermittently. A mounting head 3 that is vertically movable on the peripheral edge of the table 2 in accordance with the intermittent pitch takes out a chip-shaped electronic component (not shown) from a component supply unit (not shown), and moves in the XY directions. XY table 4 as a work table to move to
The chip component is mounted at a predetermined position on the printed circuit board 5 shown in FIG. 6 is the substrate 5 from the upstream device
Is a supply conveyor for conveying and supplying the substrate 5 to the XY table 4, and 7 is a discharge conveyor for conveying the substrate 5 on which the components are mounted on the XY table 4 to a downstream device and discharging it.

The mechanism for transferring the printed circuit board 5 will be described in detail with reference to FIGS. 1 and 3 to 5. Reference numeral 10 denotes a transfer as a transfer member, which is attached to a timing belt 14 stretched between a drive pulley 12 and a driven pulley 13 which are rotated by the drive of a pulse motor 11.
It is guided by the ball spline 15 and moves in the left-right direction in FIGS. 1 and 3.

A transfer arm 17 and a transfer arm 18 as transfer members are formed on the transfer 10 so as to project therefrom. The transfer claws mounted on the respective arms 17 and 18 as shown in FIG. 19 is engaged with the printed circuit board 5 and the transfer 10 is moved so that the circuit board 5 placed on the supply chute 20 of the supply conveyor 6 becomes X-shaped as shown in FIG.
The substrates 5 are transferred onto the XY table chute 21 provided on the Y table 4 while being guided by the respective chutes 20, 21, and the substrate 5 on the XY table chute 21 is ejected by the ejection conveyor 7. 22 is similarly transferred.

Although not shown in FIGS. 1 and 3, a swing plate 24 is fixedly attached to the end of the ball spline 15, and the swing plate 24 is attached to a rod 26 of a cylinder 25. It is movably connected. Therefore, the ball spline 15 rotatably supported by the support base 27 (not shown in FIGS. 1 and 3) in FIG. 4 rotates counterclockwise in FIG. 4 when the rod 26 projects due to the operation of the cylinder 25. Move. Since the ball spline 15 is provided with a groove extending in the longitudinal direction over the entire circumference and the transfer 10 is fitted in the groove, the transfer 10 is movable in the longitudinal direction of the ball spline 15. However, the ball spline 15 is fixed in the rotational direction, and is oscillated from the position of FIG. 5 to the position of FIG. 4 by the rotation of the ball spline 15 described above.

Next, the structure relating to the detection of the bad mark as the mark showing the quality of the unit substrate will be described in detail.
Some of the printed circuit boards 5 are composed of a plurality of unit boards 28 as shown in FIG. 6, and the unit board 28 may have the same component mounting pattern or a mixture of different patterns. Each unit board 28 has a bad mark 2 indicating that the unit board 28 is defective.
9 (black circle in FIG. 6) is attached at a predetermined position, and when the mark 29 is attached at that position, the chip component is not mounted on the unit substrate 28.
The bad mark 29 may be attached with a magic ink such as black or a seal may be attached, but it may be anything as long as it can be detected by a reflective photosensor or may be recognized by a camera. Good. In addition, in FIG. 6, the unit substrate 28 without the bad mark 29 is shown.
Regarding, the position where the bad mark 29 should be attached is shown by a white circle, but it is possible to eliminate such a mark at all, or the operator can put the bad mark in the upstream process. Since there are many cases, unmarked marks may be attached as shown in FIG.

1 and 4, etc., the transfer arm 17
The mobile unit 31 is provided in the
Reference numeral 1 is for moving a photosensor 32 as a detecting means in the longitudinal direction of the transfer arm 17 in which the unit extends. The photo sensor 32 detects the bad mark 29 attached to the printed circuit board 5 on the supply conveyor 6, and emits light toward the board surface as described above, and the reflected light detects the presence or absence of the bad mark 29. Type optical sensor. A camera may be used instead of the photo sensor.

The moving direction is a direction orthogonal to the moving direction of the transfer 10 in FIG. 1, and can be moved in the XY directions by the movement of the transfer 10 and the movement of the photosensor 32 by the moving unit 31. 32 can be moved. As shown in FIG. 5, the XY movement is performed at a position where the transfer claw 19 is rotated so that the transfer claw 19 does not contact the substrate 5, and at this time, the photo sensor 32 is horizontally moved by the movement unit 31 and accordingly, the XY movement is performed. It is designed to move horizontally in the direction. The moving unit 31 may be configured such that the photo sensor 32 is attached to the belt and the photo sensor 32 guided by the guide is moved by a mechanism similar to the moving mechanism of the transfer 10 in which the belt is moved by the motor, or is rotated by the motor. The photo sensor 32 may be attached to the nut portion of the ball screw to be movable in the longitudinal direction of the arm 17 by being guided by the guide.

The control block of the electronic component automatic mounting apparatus will be described with reference to FIG. 40 is C as a control means
Various data and sensors 32, which are PUs and are stored in the RAM 42 according to the programs stored in the ROM 41
Various operations related to mounting the chip component on the printed circuit board 5 are controlled based on signals from sensors such as.

The photo sensor 32 and the like are connected to the CPU 40 through an interface 43, and
Further, the pulse motor 11 and the moving unit 31 are connected via a drive circuit 44. The RAM 42 stores the position in the printed circuit board where the bad mark 29 corresponding to the unit board 28 is to be attached.

The operation will be described below with the above configuration. First, a start key (not shown) on the operation panel is pressed to start automatic operation of the apparatus. Next, the substrate 5 is transferred from the upstream device to the supply conveyor 6, and the conveyor 6 conveys the substrate 5 and stops at the position shown in FIG. Next, CPU4
In the case of 0, the pulse motor 10 and the moving unit 31 are driven through the interface 43 and the drive circuit 44, and RA
Bad mark 29 for each unit substrate 28 stored in M42
The position to be marked is read out, and first, the position to which the bad mark 29 of the unit substrate 28 at the upper left of FIG.
When the rod 26 of the cylinder 25 is pulled in and the transfer claw 19 does not come into contact with the printed circuit board 5 as shown in FIG. 5, the photo sensor 32 moves horizontally and the presence or absence of the bad mark 29 is detected. Since no mark is attached, the absence is detected, and the CPU 40 determines that the unit board 28 is a non-defective product.

Next, the photo sensor 32 detects the bad mark 29, and the CPU 40 judges that the unit board 28 is defective, although it moves to the position of the bad mark 29 of the unit board 28 on the right side of FIG. In this way, the photosensor 32 moves as shown in FIG. 1 and the detection operation is repeated for each unit substrate 28, and the quality of each unit substrate 28 is determined.

Next, when the detection of the bad mark 29 is completed, the transfer 10 is moved to the outside of the left end of the substrate 5 on the supply conveyor 6 in FIG.
The cylinder 25 operates to cause the rod 26 to project and the swing plate 24
The ball spline 15 is rotated through this, and as a result, the transfer 10, that is, the moving arms 17 and 18 swing as shown in FIG.

Next, when the pulse motor 11 is rotated and the transfer 10 is moved to the left side in FIG. 1, the moving arm 17 is moved.
The transfer claw 19 of the substrate 5 engages with the substrate 5 on the supply conveyor 6 and is guided by the chutes 20 and 21 so that the substrate 5 is moved to the XY table 4.
It is transferred as shown in FIG. Next, the XY table 4 is lowered so as to be movable in the XY directions by the lowering of the rod of the cylinder (not shown), and the intermittent rotation of the rotary table 2 is started. The mounted chip component is mounted at a predetermined position on the printed circuit board 5 by the movement of the XY table, but the CPU 40 operates so that the chip component is not mounted on the unit substrate 28 with the bad mark 29. Control is made.

In parallel with this component mounting operation, the cylinder 2
When the rod 10 of FIG. 5 is pulled in and the transfer 10 in the state of FIG. 5 is rotated in the opposite direction of the pulse motor 10,
Moving to the right side of FIG. 3, the next substrate 5 is the feed conveyor 6
And is stopped at a position where it can be transferred to the XY table 4. Next, similarly to the above, the photo sensor 32 is sequentially moved to the position where the bad mark 29 of each unit substrate 28 stored in the RAM 42 is moved, and the presence or absence of the bad mark 29, that is, the quality of the unit substrate 28 is determined. Done.

This detecting operation is performed in parallel with the component mounting operation, but when the detecting operation is completed and the component mounting is completed next, the XY table 4 moves up the rod of the cylinder (not shown) and the XY table. The bull chute 21 is made to have the same height as the supply chute 20 and the discharge chute 22, the transfer board 10 moves the printed circuit board 5 from the supply chute 20 to the XY table chute 21, and the XY table. The transfer claw 19 of the transfer arm 18 engages with the printed circuit board 5 on the chute 2 so that the discharge chute 2
2 as shown in FIG.

In this way, the operation of detecting the bad mark 29 and the component mounting operation are repeated. Then the second
As an example, as shown in FIG. 8, when the positions of the bad marks 29 on the substrate 5 are arranged in three rows in the transport direction of the printed circuit board 5, that is, the moving direction of the transfer 10,
The substrate 5 formed on the transfer 10 is supplied to the supply conveyor 6
From the XY table 4 to the bad mark row of the transfer arm 46, the photosensors 32 are fixedly provided by the cylinder 25 at the three positions aligned in the state of FIG.
In the same manner as described above, the transfer mark 10 may be sequentially moved during the component mounting operation with the cylinder 25 in the state of FIG. 5 to detect the bad mark 29. At this time, the fixing position of each sensor 32 may be adjusted by the operator in the longitudinal direction of the arm 46 according to the position where the bad mark 29 for each substrate type should be attached.

Next, a third embodiment will be described with reference to FIG. An X-direction moving unit 49 that moves the Y-direction moving unit 48 in the X-direction, which is the substrate transfer direction, is provided above the printed circuit board 5 that has been stopped by the transfer 10 on the supply conveyor 6 before the transfer. 48
Is for moving the photo sensor 32 in a direction orthogonal to the transport direction. In this way, the bad mark 29 at an arbitrary position on the substrate 5 can be detected in parallel with the component mounting operation.

Next, as a fourth embodiment, as shown in FIG. 10, the photosensor 3 is provided only in the direction orthogonal to the substrate carrying direction.
A moving unit 51 that moves 2 is provided on the supply conveyor 6, and the conveyor 6 is moved to perform alignment in the conveying direction. The moving unit 51 moves the photosensor 32 in a direction orthogonal to the conveying direction and conveys it to the conveyor 6. The photo sensor 32 is aligned at a position where an arbitrary bad mark 29 of the printed circuit board 5 is to be attached, and the mark 2
The presence or absence of 9 may be detected.

Next, a fifth embodiment will be described with reference to FIGS. 11 and 12. A moving unit 53 that moves the photosensor 32 in a direction orthogonal to the substrate conveying direction is provided between the supply conveyor 6 and the XY table 4, and the transfer unit 10 moves from the initial state of FIG. The movement unit 53 moves the photo sensor 32 to the position where the bad mark 29 of the printed circuit board 5 should be attached in accordance with the movement of the transfer arm 17 while being moved to the transfer arm 17 as shown in FIG. Photo sensor 32
Can also be moved. In this case, the photo sensor 32 may be moved above the transfer 32 in the state of FIG. 5 so as not to hit the transfer 32.

Next, FIG. 13 and FIG. 1 as a sixth embodiment.
As shown in FIG. 4, a plurality of positions where the bad marks 29 of the substrate 5 should be attached are set on a straight line in the conveyance direction of the printed circuit board 5, and the photo sensor 32 is provided above the row of the bad marks 29 of the supply conveyor 6. Fixedly installed, conveyor 6
(FIG. 13) or the transfer arm 17 transfers (FIG. 14), the presence or absence of the mark 29 at the position where the mark 29 reached the detection position of the sensor 32 should be detected. Good. If the bad mark 29 is provided in a plurality of rows as shown in FIG. 8, a plurality of this sensor may be provided.

In this embodiment, the electronic component automatic mounting apparatus for mounting the electronic component on the printed circuit board has been described. However, in order to temporarily fix the chip-shaped electronic component, an adhesive is used as an upstream device of the electronic component automatic mounting apparatus. The adhesive applying device for applying to the position corresponding to the mounting position is also provided with the same supply conveyor, XY table as a workbench, and discharge conveyor mechanism. Since it is not necessary to apply an adhesive to a certain unit substrate 28, it is necessary to similarly detect the presence or absence of the bad mark 26, and the same detection mechanism as in this embodiment can be applied.

[0035]

As described above, according to the present invention, the quality of each unit substrate is determined on the supply conveyor or during transfer from the conveyor. It is possible to prevent the operating rate of work from decreasing.
Further, since the detecting means can be moved by the moving means, it is possible to detect even if marks are attached to different positions on the substrate.

Further, since the detection means is provided on the transfer member for transferring the substrate from the supply conveyor to detect the mark by the movement of the transfer member, it is possible to provide a wide range without providing a driving member for driving the detection means. Marks can be detected.
Further, since the mark is detected by the detecting means for the substrate moving by the conveyance of the conveyor, it is possible to detect the mark even if the mark is present at different positions in the plural conveying directions.

Further, since the moving means for moving the detecting means on the transfer member is provided, it is possible to detect the mark at any position on the plane.

[Brief description of drawings]

FIG. 1 is a plan view showing a conveyance mechanism of a printed circuit board.

FIG. 2 is a perspective view of an electronic component automatic mounting device.

FIG. 3 is a plan view showing a conveyance mechanism for a printed circuit board.

FIG. 4 is a side view showing a mechanism for moving a transfer up and down.

FIG. 5 is a side view showing a mechanism for vertically moving a transfer.

FIG. 6 is a plan view showing a printed circuit board having multiple surfaces.

FIG. 7 is a control block diagram of the electronic component automatic mounting apparatus.

FIG. 8 is a plan view showing a printed board carrying mechanism according to a second embodiment.

FIG. 9 is a plan view showing a conveyance mechanism for a printed circuit board according to a third embodiment.

FIG. 10 is a plan view illustrating a printed board carrying mechanism according to a fourth embodiment.

FIG. 11 is a plan view showing a conveyance mechanism for a printed circuit board according to a fifth embodiment.

FIG. 12 is a plan view showing a printed board carrying mechanism of a fifth embodiment.

FIG. 13 is a plan view showing a printed board carrying mechanism of a sixth embodiment.

FIG. 14 is a plan view showing a printed board carrying mechanism of a sixth embodiment.

[Explanation of symbols]

 4 XY table (work table) 5 printed circuit board 6 supply conveyor 7 discharge conveyor 10 transfer (transfer member) 11 pulse motor (driving device) 17 transfer arm (transfer member) 28 unit board 29 bad mark (mark) 31 moving unit 32 photo sensor (detection means) 40 CPU (control means)

Claims (6)

[Claims] 1. A board assembly apparatus in which a printed circuit board composed of a plurality of unit boards is transferred from a supply conveyor onto a workbench, and predetermined work is performed only on good unit boards in the board on the workbench. A board assembling apparatus comprising: a detection unit that detects the quality of each unit board of the boards on the supply conveyor. 2. A printed circuit board composed of a plurality of unit boards is transferred from a supply conveyor onto a work table by a transfer member to indicate the quality of each unit board attached in the board on the work table. In a board assembling apparatus that performs a predetermined operation only on a good unit board identified by a mark, a detection unit that detects the quality of each unit board by the mark indicating the quality of each unit board and a different position on the board. A substrate assembling apparatus comprising: a moving unit that moves the detection unit so that the detection unit can detect the attached mark. 3. A printed circuit board composed of a plurality of unit boards is transferred onto a workbench by a transfer member driven by a drive device from a supply conveyor, and is attached to the inside of the board on the workbench. In a board assembling apparatus that performs a predetermined operation only on a good unit board identified by a mark showing the quality of the unit board, the quality of each unit board is judged by the mark provided on the transfer member and showing the quality of each unit board. Substrate assembly comprising: detection means for detecting; and control means for controlling the drive device to move the transfer member so that the detection means can detect marks provided at different positions on the substrate. apparatus. 4. A unit provided by arranging a printed circuit board composed of a plurality of unit boards on a work table from a supply conveyor for supplying and transferring the boards, and arranging the printed boards in the board in the carrying direction of the supply conveyor. In a board assembling apparatus that performs a predetermined work only on a good unit board that is identified by a mark indicating the quality of the board, the board is fixedly provided on the supply conveyor at a position corresponding to the mark of the board and is conveyed to the supply conveyor. A board assembling apparatus, comprising: a detection unit that detects the quality of each unit board when each mark of the incoming board reaches a detection position. 5. A printed board composed of a plurality of unit boards is transferred onto a workbench by a transfer member driven by a drive device from a supply conveyor, and is attached to the board on the workbench. In a board assembling apparatus that performs a predetermined operation only on a good unit board identified by a mark showing the quality of the unit board, the quality of each unit board is judged by the mark provided on the transfer member and showing the quality of each unit board. Detecting means for detecting, moving means for moving the detecting means on the transfer member, and the drive for moving the transferring member so that the detecting means can detect marks attached to different positions on the substrate. A substrate assembling apparatus comprising a device and a control means for controlling the moving means. 6. A printed circuit board composed of a plurality of unit boards is transferred onto a work table by a transfer member driven by a drive device from a supply conveyor, and is attached to the board on the work table. In a substrate assembling apparatus that performs a predetermined operation only on a unit substrate that is identified by a mark indicating the quality of the unit substrate, a position that is provided outside the transfer member and that is different in the transfer direction of the substrate that is transferred to the transfer member. 2. A substrate assembling apparatus, comprising: a detection unit that detects the quality of each unit substrate by the mark when the mark reaches the detection position.