JPH07150013A - Epoxy resin composition and semiconductor sealing material - Google Patents

Abstract

PURPOSE:To obtain an epoxy resin composition essentially comprising each specific polyglycidyl ether and polyphenol compound, highly excellent in moisture resistance, and useful as a semiconductor sealing material highly excellent in both solder cracking resistance and moldability. CONSTITUTION:This epoxy resin composition essentially comprises (A) a polyglycidyl ether bound to a hydroxyaromatic compound with an alicyclic hydrocarbon group as jointing group and (B) a polyphenol compound bound to a phenolic compound with a xylylene linkage as jointing group. It is preferable that the melt viscosity of the component A at 150 deg.C be 0.1-2.0 poise, said hydrocarbon group divalent hydrocarbon group based on the unsaturated bond in the molecular skeleton of dicyclopentadiene, limonene or 3a,4,7,7a- tetrahydroindene, said hydroxyaromatic compound e.g. phenol, cresol, and the xylylene group e.g. p-xylylene.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition containing a specific epoxy resin and a curing agent as essential components and having an excellent balance of water resistance and heat resistance, as well as moldability and solder resistance during surface mounting. The present invention relates to a semiconductor encapsulating material having excellent crackability and the like.

[0002]

2. Description of the Related Art Recently, science and technology have been rapidly advancing mainly in the electronics industry, and in particular, the semiconductor-related technology is advancing remarkably. In semiconductors, wiring has become finer and chips have been made thinner with the increase in the degree of integration of memories. With the improvement in the degree of integration, the mounting method is also shifting from through-hole mounting to surface mounting.

In an automated surface mounting line, a semiconductor package, which has absorbed moisture during lead wire soldering, undergoes a rapid temperature change, which causes cracks in the resin molding portion, leading to mounting failure, and also an interface between lead wire resins. Deteriorates, and as a result, the moisture resistance decreases.

An epoxy resin is mainly used as a semiconductor encapsulating resin used in the resin molding part, and an ortho-cresol novolac type epoxy resin (ECN) is generally used as the epoxy resin. .
However, when ECN is used, the hygroscopicity of the semiconductor package is strong, and as a result, there is a problem that cracks cannot be avoided when the solder bath is immersed as described above.

Therefore, conventionally, in order to improve the moisture resistance of the semiconductor sealing resin, for example, JP-A-61-293219 has been proposed.
Japanese Patent Application Laid-Open No. 2003-242242 proposes a composition comprising a combination of an epoxidized product of a dicyclopentadiene-modified phenol resin (hereinafter abbreviated as "DCP resin") and a phenol novolac resin (hereinafter abbreviated as "PN resin"). .

[0006]

However, although the cured product obtained by combining the epoxidized DCP resin and the PN resin has improved moisture resistance as compared with the ECN-PN resin system, it is still at a satisfactory level. Has not reached.

Further, in the application of epoxy resin composition to semiconductor encapsulation material, the composition obtained by combining the epoxide of DCP resin and PN resin is inferior in solder crack resistance due to its poor moisture resistance. Since the composition has a low fluidity at the time of melting, it is inferior in moldability, which makes it difficult to cope with an increase in the degree of integration of semiconductor chips.

[0008] The problem to be solved by the present invention is to form an epoxy resin composition having extremely excellent moisture resistance, and as a semiconductor encapsulating material, which has excellent solder crack resistance and fluidity, and is molded into a semiconductor chip. Is to provide a semiconductor encapsulating material that is extremely easy to manufacture.

[0009]

Means for Solving the Problems As a result of intensive investigations by the present inventors, the polyglycidyl ether (A) of a compound in which a cycloaliphatic hydrocarbon group is bonded to a hydroxyl aromatic compound as a bonding group and a xylylene bond are formed. It has been found that an epoxy resin composition comprising a polyphenol compound (B) bound to a phenolic compound as a binding group as an essential component has excellent water resistance and fluidity, and further (A) (B ) In addition to both components, a semiconductor encapsulating material characterized by containing an inorganic filler as an essential component was found to have excellent solder crack resistance during surface mounting and moldability, and completed the present invention. It was

That is, the present invention relates to a polyglycidyl ether (A) of a compound having a cycloaliphatic hydrocarbon group as a binding group and a hydroxyl aromatic compound, and a polyphenol having a xylylene bond as a binding group and a phenolic compound. It has been found that an epoxy resin composition comprising a compound (B) as an essential component has an excellent balance of heat resistance, water resistance, curability, etc., and further (A) (B)
The present invention relates to a semiconductor encapsulating material, which contains an inorganic filler as an essential component in addition to both components.

The cycloaliphatic hydrocarbon group constituting the polyglycidyl ether (A) used in the present invention is not particularly limited, but among them, those having a cyclohexane ring or a cyclohexene ring in the skeleton thereof are cured products. It is preferable because it has an excellent effect of improving water resistance. Among these, since this effect is particularly remarkable, specifically, dicyclopentadiene, limonene, or 3a, 4, 7, 7
A divalent hydrocarbon group based on an unsaturated bond in the molecular skeleton of a-tetrahydroindene is preferred. These compounds may be used alone or in combination of two or more kinds. Further, among these, a divalent hydrocarbon group based on an unsaturated bond in the molecular skeleton of dicyclopentadiene is preferable because the heat resistance and moisture resistance of the cured product can be further improved.

The hydroxyaromatic compound constituting the polyglycidyl ether (A) has one or two hydroxyl groups.
A benzene ring substituted with one or more, a naphthalene ring or an anthracene ring is shown, for example, phenol or,
Bisphenols such as bisphenol A and bisphenol F, alkyl-substituted phenols such as cresol and p-tert-butylphenol, aromatic hydrocarbons containing two or more phenolic hydroxyl groups such as resorcin,
Examples thereof include naphthols such as 1-naphthol, 2-naphthol, 1,6-dihydroxynaphthalene and 2,7-dihydroxynaphthalene, and hydroxyanthracenes such as 1-hydroxyanthracene and 2-hydroxyanthracene, but are not particularly limited. In particular, phenol or cresol is particularly preferable because of its low melt viscosity and excellent fluidity of polyglycidyl ether.

The above polyglycidyl ether (A) is
Although the production method thereof is not particularly limited, for example, a hydroxyl aromatic compound and an alicyclic unsaturated hydrocarbon represented by dicyclopentadiene, limonene and 3a, 4,7,7a-tetrahydroindene are used. A method of obtaining a polyglycidyl ether (A) by polymerizing using a catalyst to obtain a polymer containing a phenolic hydroxyl group (first step), and then subjecting the polymer to glycidylation with epichlorohydrin (second step) To be

The catalyst that can be used in the first step is, for example, AlCl ₃ , BF ₃ , ZnCl ₂ , H ₂ S.
Lewis acids such as O ₄ , TiCl ₄ and H ₃ PO ₄ can be mentioned.
As a specific method of the first step, for example, a hydroxyl aromatic compound is heated and melted, a catalyst is added thereto and uniformly dissolved, and then 50 to 180 ° C., preferably 80 to 15 ° C.
Alicyclic unsaturated hydrocarbons are added dropwise at 0 ° C. The use ratio of each raw material is not particularly limited, but 0.001 to 0.1 mol of the catalyst relative to 1 mol of the alicyclic unsaturated hydrocarbon,
It is preferably 0.005 to 0.10 mol, and the hydroxyl aromatic compound is 0.1 to 10.0 mol, preferably 0.3 to 4 mol. Further, in the first step, the hydroxyl aromatic compound may be added to the place where the alicyclic unsaturated hydrocarbon and the catalyst are melt-mixed.

Then, in the second step, for example, the polymer obtained in the first step is dissolved in 1 to 20 times, preferably 2 to 10 times, epichlorohydrin of the polymer,
A method of reacting in the presence of a basic catalyst under a temperature condition of 120 ° C., preferably 50 to 90 ° C. can be mentioned. The basic catalyst is not particularly limited, but quaternary ammonium salts such as collected tetramethylammonium, collected benzyltriethylammonium and tetraethylammonium chloride,
Examples include tertiary amines such as trimethylamine, phosphonium halide salts, alkali metal halides such as potassium bromide and sodium chloride, and the like. The amount of the basic catalyst used is preferably 0.05 to 5.0 parts by weight with respect to 100 parts by weight of the polymer obtained in the first step.

The polyglycidyl ether (A) thus obtained preferably has a melt viscosity of 0.1 to 10 poises at 150 ° C. in view of the fluidity when used as a sealing material and the fillable amount of the filler. Above all, the range of 0.1 to 2.0 poise is preferable from the viewpoint that this effect becomes remarkable.

The xylylene group constituting the polyphenol compound (B) used in the present invention is a divalent linking group in which a benzene ring is disubstituted with a methylene group, an ethylidene group or the like, and is not particularly limited. In particular, a p-xylylene group or an α, α′-dimethylxylylene group is specifically preferred because it has a remarkable effect of improving the heat resistance of the cured product.

As the polyphenol compound (b-1) having a p-xylylene group, for example, a compound in which a hydroxy aromatic compound is linked with a p-xylylene group as a binding group, that is, a phenol nucleus, a methylene group, a benzene nucleus is used. , A synthetic resin having a repeating unit of a structure in which methylene groups are linked in this order, and more specifically, a resin represented by the following general formula (1) is preferred.

[0019]

[Chemical 1]

(In the formula, R is a hydrogen atom which may be the same or different, an alkyl group having 1 to 4 carbon atoms or a hydroxyl group, and n is an integer of 0 to 5.) This polyphenol compound (b- The method for producing 1) is not particularly limited, but for example, a hydroxy aromatic compound and a bifunctional aralkyl halide, a bifunctional aralkyl dialkyl ether or xylylene glycol,
A method of reacting in the presence of a catalyst under a temperature condition of 130 to 200 ° C can be mentioned.

The hydroxyaromatic compound is not particularly limited, and may be phenol, bisphenols such as bisphenol A and bisphenol F, alkyl-substituted phenols such as cresol and p-tertiarybutylphenol, and phenolic hydroxyl groups such as resorcin. Examples thereof include aromatic hydrocarbons containing 1 or more, 1-naphthol, 2-naphthol, naphthols such as 1,6-dihydroxynaphthalene, and 2,7-dihydroxynaphthalene. Among them, the above general formula (1) is satisfied. Phenol or alkyl-substituted phenols are preferred.

Examples of the bifunctional aralkyl halide include p-xylylene dichloride and the like, and examples of the bifunctional aralkyl ether include p-xylylene glycol dimethyl ether and the like. The aromatic nucleus of these bifunctional aralkyl halides, difunctional aralkyl ethers or xylylene glycol may be further substituted with an alkyl group.

As the catalyst used in the production of the polyphenol compound (b-1), for example, acid-activated ball clay, sulfuric acid, p-toluenesulfonic acid,
Examples thereof include diethyl sulfate, stannic chloride, zinc chloride and the like.

Next, as the polyphenol compound (b-2) having an α, α'-dimethylxylylene group, a compound having a structure in which a phenol nucleus, an ethylidene group, a benzene nucleus and an ethylidene group are connected in this order as a repeating unit Resins are mentioned, and more specifically, those represented by the following general formula (2) are preferable.

[0025]

[Chemical 2]

(In the formula, R is a hydrogen atom which may be the same or different, an alkyl group having 1 to 4 carbon atoms or a hydroxyl group, and n is an integer of 0 to 5.)

Examples of the method for producing the polyphenol compound (b-2) include a method in which a hydroxy aromatic compound and a divinyl aromatic compound are reacted in the presence of a catalyst under a temperature condition of 110 ° C. or higher.

The hydroxy aromatic compound is not particularly limited, and may be phenol or bisphenols such as bisphenol A and bisphenol F, alkyl-substituted phenols such as cresol and p-tertiarybutylphenol, and phenolic hydroxyl groups such as resorcin. Examples thereof include aromatic hydrocarbons containing 1 or more, naphthols such as 1-naphthol, 2-naphthol, 1,6-dihydroxynaphthalene, and 2,7-dihydroxynaphthalene, among which the above-mentioned general formula (2) is satisfied. Phenol or alkyl-substituted phenols are preferred.

Examples of the divinyl aromatic compound include divinylbenzene and alkyl-substituted divinylbenzene.

As the catalyst, for example, metal chlorides such as aluminum chloride and stannous chloride, sulfuric acid, hydrochloric acid,
Examples thereof include inorganic acids such as phosphoric acid, organic sulfonic acids such as benzenesulfonic acid and paratoluenesulfonic acid, acetic acid, oxalic acid, organic maleic acid and the like.

In carrying out this reaction, an organic solvent may be used, and examples thereof include toluene, xylene, dimethylformamide, dimethyl sulfoxide, solvesso and the like.

The polyphenol compound (b-
In the case of producing 1) and the polyphenol compound (b-2), in the case of (b-1), a mole of the hydroxy aromatic compound and the bifunctional aralkyl halide, the bifunctional aralkyl dialkyl ether or the xylylene glycol. In the case of the ratio (b-2), the molecular weight and the number of functional groups can be adjusted by adjusting the molar ratio of the hydroxyaromatic compound and the divinylaromatic compound. In view of the fluidity-improving effect of the composition and the amount of filler that can be filled, the range of 0.1 to 10 poises at 150 ° C. is preferable. The range is preferably.

Further, each of the above-mentioned linking groups has three kinds of isomers of the ortho position, the meta position and the para position, and any one of them may be used, or a mixture of different isomers may be used. There is no particular limitation, but it is preferable to use the para isomer in view of its excellent heat resistance. In addition, industrial products of divinylbenzene may contain ethyl-vinylbenzene as an impurity. Of course, it can be used without removing the impurities, but the higher the purity of divinylbenzene, the better the heat resistance. It is preferable in terms of excellent properties and the like, and specifically, the purity of divinylbenzene is preferably 50% by weight or more.

The epoxy resin composition of the present invention comprises a polyglycidyl ether (A) of a compound in which the above-mentioned cycloaliphatic hydrocarbon group is bonded to a hydroxyl aromatic compound as a bonding group, and a phenol having a xylylene bond as a bonding group. Although the polyphenol compound (B) bound to the system compound is an essential component, other epoxy resin and curing agent may be used in an optional ratio. Considering the degree of the effect of the present invention described above, it is preferable to use the other epoxy resin and the curing agent together in an amount of 50% by weight or less based on the total weight of the epoxy resin and the curing agent.

The epoxy resin that can be used in combination is not particularly limited, but other epoxy resins include, for example,
Bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin,
Cresol novolac type epoxy resin, BPA novolac type epoxy resin, naphthol novolac type epoxy resin, biphenol type epoxy resin, brominated phenol novolac type epoxy resin, brominated BPA type epoxy resin, cresol-naphthol co-compressed novolac type epoxy resin, dihydroxynaphthalene Type epoxy resin, glycidyl amine type tetrafunctional epoxy resin and the like.

As curing agents which can be used in the same manner, phenol novolac resins, alkylphenol novolac resins, cresol novolac resins, BPA novolac resins, polyhydric phenol novolac resins, brominated phenol novolac resins, polyphenol compounds such as dihydroxynaphthalene, diethylenetriamine, Aliphatic amines such as triethylenetetraamine, aromatic amines such as diaminodiphenylamine and diaminodiphenylsulfone, polyamide resins and their modified products, maleic anhydride, phthalic anhydride, hexahydrophthalic anhydride, pyroperitic anhydride, etc. Examples thereof include acid anhydride type curing agents, dicyandiamide, imidazole, BF3 complexes, and latent curing agents such as guanidine derivatives. These curing agents may be used alone or in combination of two or more.

Further, if necessary, a curing accelerator may be used, but in the case of the present invention, a known curing accelerator for epoxy resin can also be used. For example, tertiary phosphines, imidazoles, and Tertiary amines and the like can be used. Specifically, examples of the tertiary phosphines preferably include triethylphosphine, tributylphosphine, triphenylphosphine, and the like. Examples of the tertiary amines include dimethylethanolamine, dimethylbenzylamine, 2,4,
Preferable examples include 6-tris (dimethylamino) phenol and 1,8 diazabicyclo [5,4,0] undecene. Examples of imidazoles include 2
-Ethyl-4-methylimidazole, 2,4-dimethylimidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1-
Vinyl-2-methylimidazole, 1-propyl-2-
Methyl imidazole, 2-isopropyl imidazole,
1-cyanoethyl-2-ethylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-
Cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 2
-Phenyl-4-methylimidazole, 2-phenyl-
Examples include 4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole. Among these, 2-methylimidazole, diazabicycloundecene (DBU), triphenylphosphine, and dimethylbenzylamine are excellent in heat resistance, water resistance, electrical characteristics, and the like, and are excellent in stability in semiconductor encapsulation material applications. And mixtures thereof are preferred.

The epoxy resin composition of the present invention contains the above-mentioned epoxy resin, curing agent and inorganic filler as essential components. Examples of the inorganic filler include fused or crystalline silica powder, glass fiber, carbon fiber, calcium carbonate, quartz, Aluminum oxide, magnesium oxide, aluminum hydroxide, magnesium hydroxide, diatomaceous earth, calcined clay, carion, mica,
Examples include asbestos, pulp, wood flour and the like.

Further, if necessary, flame retardants such as antimony trioxide and hexabromobenzene, coloring agents such as carbon black and red iron oxide, releasing agents such as natural wax and synthetic wax, and low stress such as silicone oil and rubber. It can be obtained by appropriately mixing various additives such as additives.

In order to prepare a molding material from the epoxy resin composition of the present invention, the epoxy resin, the curing agent, the curing accelerator, and other additives are sufficiently and uniformly mixed with a mixer or the like, and then the heat roll is further added. Alternatively, it can be obtained by melt-kneading with a kneader or the like and performing transfer molding or injection molding.

The semiconductor encapsulating material of the present invention is the epoxy resin composition of the present invention containing the above-mentioned epoxy resin and curing agent as essential components, and further containing an inorganic filler as an essential component. Similarly, the other epoxy resin as exemplified above and the curing agent may be used together in an arbitrary ratio, and similarly, if necessary, other curing accelerators and additives as exemplified above. May be used.

As the inorganic filler used in the semiconductor encapsulating material of the present invention, the above-mentioned ones can be used, but generally, silica powder filler and the like can be preferably used. The compounding ratio of the inorganic filler used in the epoxy resin composition for encapsulant of the present invention is usually 50 to 90% by weight, and preferably 65 to 85% by weight based on the whole semiconductor encapsulating material. .

To prepare a molding material using the semiconductor encapsulating material of the present invention, after the epoxy resin, the phenol resin, the curing accelerator, the inorganic filler, and other additives are sufficiently uniformly mixed with a mixer or the like. Alternatively, it can be obtained by melt-kneading with a hot roll or a kneader and performing low-pressure transfer molding or injection molding.

[0044]

The present invention will be described in detail below with reference to specific examples, but the present invention is not limited thereto.

Example 1 Dicyclopentadiene-phenol polyadduct type epoxy resin (E1) (epoxy equivalent 263 g / eq, softening point 65 ° C., melt viscosity at 150 ° C. 0.8 poise: Dainippon Ink and Chemicals ( Co., Ltd., EPICLON EXA-7200)) 60 parts by weight Polyphenol compound (P1) (phenol equivalent 175 g / eq, softening point 75 ° C, melt viscosity at 150 ° C) in which phenol is bonded with a p-xylylene group as a binding group. 3.8 Poise: Mirex XL-225-LL, manufactured by Mitsui Toatsu Co., Ltd. 40 parts by weight Triphenylphosphine 0.6 parts by weight, melted and mixed, and then cured at 175 ° C. for 5 hours to form a casting plate. It was created and evaluated for heat resistance and water resistance. The results are shown in Table 1-1.

[Evaluation method] Glass transition temperature: A test piece was cut out and a viscoelasticity measuring device (D
Measured by MA). Water absorption rate: Calculated from the weight increase rate after treatment for 300 hours under the conditions of 85 ° C. and 85% RH.

Example 2 Evaluations were made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-1.

Dicyclopentadiene-phenol polyaddition type epoxy resin (E2) (epoxy equivalent 254 g / eq, softening point 54 ° C., melt viscosity at 150 ° C. 0.3 poise: manufactured by Dainippon Ink & Chemicals Co., Ltd. , EPICLON EXA-7200L)) 60 parts by weight Polyphenol compound (P2) in which phenol is bonded with a p-xylylene group as a bonding group (hydroxyl equivalent 170 g / eq, softening point 70 ° C, melt viscosity at 150 ° C 2.1. Poise: Mitsui Toatsu Co., Ltd., Milex XL-225-3L) 40 parts by weight Triphenylphosphine 0.6 parts by weight

Example 3 Evaluations were made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-1.

Epoxy resin (E1) 57 parts by weight Polyphenol compound (P3) in which phenol is bonded with an α, α′-dimethylxylylene group as a binding group (hydroxyl equivalent 196 g / eq, softening point 65 ° C., 150 ° C.) Melt viscosity of 1.9 poise) 43 parts by weight Triphenylphosphine 0.6 parts by weight

Example 4 Evaluations were made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-1.

Dicyclopentadiene-cresol polyaddition type epoxy resin (E3) (epoxy equivalent 280 g / eq, softening point 58 ° C., melt viscosity 0.7 poise at 150 ° C.) 62 parts by weight Polyphenol compound (P1) 38 parts by weight Part Triphenylphosphine 0.6 part by weight

Example 5 Evaluations were made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-1.

3a, 4,7,7a-Tetrahydroindene-phenol polyadduct type epoxy resin (E4) (epoxy equivalent 275 g / eq, softening point 60 ° C., melt viscosity at 150 ° C. 0.5 poise: Dainippon Ink and Chemicals Industrial Co., Ltd., EPICLON EXA-786 1L) 61 parts by weight Polyphenol compound (P1) 39 parts by weight Triphenylphosphine 0.6 parts by weight

Example 6 Evaluations were made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-1.

Limonene-phenol polyaddition type epoxy resin (E5) (epoxy equivalent 250 g / eq, softening point 56 ° C., melt viscosity 0.4 poise at 150 ° C.) 55 parts by weight Phenol is α, α′-dimethylxylyl Polyphenol compound (P4) bonded with a len group as a binding group (hydroxyl group equivalent 204 g / eq, softening point 73 ° C, melt viscosity 4.0 poise at 150 ° C) 45 parts by weight Triphenylphosphine 0.6 parts by weight

Comparative Example 1 Evaluation was made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-2.

Orthocresol novolac type epoxy resin (E6) (epoxy equivalent: 208 g / eq, softening point 67 ° C., melt viscosity at 150 ° C. 3.0 poise: EPICLON N-665 manufactured by Dainippon Ink and Chemicals, Inc.) 67 wt. Parts Phenol novolac resin (P5) (hydroxyl group equivalent 104 g / eq, softening point 80 ° C., melt viscosity at 150 ° C. 1.7 poise: phenolite TD-2131 manufactured by Dainippon Ink and Chemicals, Inc.) 33 parts by weight triphenylphosphine Fin 0.7 parts by weight

Comparative Example 2 Evaluation was made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-2.

Epoxy resin (E1) 72 parts by weight Phenol novolac resin (P5) 28 parts by weight Triphenylphosphine 0.7 parts by weight

Comparative Example 3 Evaluation was made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-2.

Epoxy resin (E6) 54 parts by weight Polyphenol compound (P1) 46 parts by weight Triphenylphosphine 0.5 parts by weight

Comparative Example 4 Evaluation was made in the same manner as in Example 1 except that the epoxy resin and the curing agent were changed to the following. The results are shown in Table 1-2.

Epoxy resin (E6) 51 parts by weight Polyphenol compound (P3) 49 parts by weight Triphenylphosphine 0.5 parts by weight

[0065]

[Table 1] (In the table, the blending amount is based on weight)

[0066]

[Table 2] (In the table, the blending amount is based on weight)

Table 1 shows the test results of Examples 7 to 12 and Comparative Examples 5 to 8. Next, according to the composition of Table 2, they are mixed at room temperature with a mixer and kneaded at 70 to 100 ° C. with a biaxial roll,
After cooling, it was ground and used as a molding material. The obtained molding material is made into a tablet, which is then 175 ° C. on a low pressure transfer molding machine.
A 6 mm × 6 mm chip for a solder crack test was sealed in a 16 pSOP package under the conditions of 70 kg / cm 2 and 120 seconds. The sealed test element was subjected to the following heat resistance evaluation, water resistance evaluation, fluidity evaluation, and solder crack test and solder moisture resistance test.

Solder crack test: The sealed test element was treated under an environment of 85 ° C. and 85% RH for 72 hours, then immersed in a solder bath at 240 ° C. for 10 seconds, and then external cracks were observed with a microscope.

Heat resistance test, water resistance test: the same as the above composition Flowability test: 17 using a mold according to the EMMI standard
The spiral flow was measured under the conditions of 5 ° C. and 70 kg / cm ² .

[0070]

[Table 3] (In the table, the blending amount is based on weight)

[0071]

[Table 4] (In the table, the blending amount is based on weight)

[0072]

According to the present invention, it is possible to provide an epoxy resin composition having extremely excellent moisture resistance, and a semiconductor encapsulating material having extremely excellent solder crack resistance and moldability.

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Claims (10)

[Claims] 1. A polyglycidyl ether (A) which is a compound having a cycloaliphatic hydrocarbon group as a binding group and a hydroxyl aromatic compound, and a polyphenol compound (B) having a xylylene bond as a binding group and a phenolic compound. ) And an essential component of the epoxy resin composition. 2. A polyglycidyl ether (A) of 150.
The composition according to claim 1, having a melt viscosity in the range of 0.1 to 2.0 poise at ° C. 3. A cycloaliphatic hydrocarbon group based on an unsaturated bond in the molecular skeleton of dicyclopentadiene, limonene, or 3a, 4,7,7a-tetrahydroindene.
The epoxy resin composition according to claim 1, which is a valent hydrocarbon group. 4. The composition according to claim 1, 2 or 3, wherein the hydroxyaromatic compound is phenol or cresol. 5. The xylylene group is a p-xylylene group or an α, α′-dimethylxylylene group,
The composition according to 2, 3 or 4. 6. A polyglycidyl ether (A) of a compound in which a cyclic aliphatic hydrocarbon group is bonded to a phenolic compound as a binding group, a polyaddition product of a bisphenol and an aldehyde (B), and an inorganic filler ( A semiconductor encapsulating material, which comprises C) and essential components. 7. A polyglycidyl ether (A) of 150.
The semiconductor encapsulating material according to claim 6, which has a melt viscosity in the range of 0.1 to 2.0 poise at ° C. 8. A cycloaliphatic hydrocarbon group based on an unsaturated bond in the molecular skeleton of dicyclopentadiene, limonene, or 3a, 4,7,7a-tetrahydroindene.
The semiconductor encapsulating material according to claim 6, which is a valent hydrocarbon group. 9. The semiconductor encapsulating material according to claim 6, wherein the hydroxyl aromatic compound is phenol or cresol. 10. The xylylene group is a p-xylylene group or an α, α′-dimethylxylylene group, 6.
7. The semiconductor encapsulating material according to 7, 8 or 9.