JPH07147341A - Container - Google Patents

Abstract

PURPOSE:To reduce a force generated at a bonded part and to eliminate the damage of the bonded part by providing a function which absorbs the difference in a deformation between materials of different kinds and between materials which cause a temperature difference. CONSTITUTION:Members 1, 2 of different materials are bonded by a member 3 which has a deformation-absorbing function. When the members 1, 2 are constituted of materials whose coefficient of thermal expansion is different, both cause an extension difference when they are subjected to a temperature change. However, since the member 3 has a soft structure in a direction in which the extension difference of the members 1, 2 is caused, it absorbs the extension difference of both members 1, 2, and a large force is not generated in a bonded part. That is to say, the members 1, 2 can be assembled even by using a production process via a thermal history such as a braxing operation, a soldering operation or the like. Thereby, an unreasonable force due to a deformation difference is not generated, and the soundness of solder is held when both members are bonded by the solder. Consequently, this system is effective when it is used for a container whose airtightness is required.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention is partly for other properties such as heat transfer and low thermal expansion.
The present invention relates to a container which is used in which adjacent members cause different deformations, absorbs a difference in deformation between the two members, and is effective in maintaining the soundness of a joint.

[0002]

2. Description of the Related Art As a structure of an airtight container capable of absorbing the difference in thermal deformation of members, there is a structure using packing and bolts (known example 1). However, this structure requires a flange for fastening the bolts, and thus the entire container The disadvantage is that the dimensions are large compared to the effective dimensions of the container. In addition, when a special gas is filled in the container, the packing may be worn due to slight sliding caused by relative deformation between the members, so that reliable air tightness may not be obtained.

Therefore, soldering may be performed instead of packing and bolt fastening (known example 2), but in this case, if the deformation difference between the members joined by the solder is large, the solder may be broken, so Material combinations are performed so that a difference in deformation does not easily occur between them. That is, it is difficult to combine materials having greatly different thermal expansion coefficients.

Known example 3 is a multi-chip structure which is considered to be applied to those having different thermal expansion coefficients. A cylindrical deformation difference absorbing member is attached to each of the members to be joined, and soldering for airtightness is performed at the tip thereof. It is carried out. Since the deformability of this portion determines the deformation difference absorbing ability of this tubular member, it is necessary to elongate the tubular member, resulting in the structure as shown in the figure and a space in the module thickness direction.

[0005]

In a container made of a combination of materials having different thermal characteristics such as a thermal expansion coefficient, when there is a large temperature difference between the containers made of the same material due to a temperature change, the container made of the same material has a large temperature difference. A large force is generated at the joint,
It is likely to cause damage to the joint. The present invention is intended to solve such a problem.

[0006]

[Means for Solving the Problems] Since the force generated at the joint portion is caused by the deformation difference between the members to be joined, by providing another member having a function of absorbing the deformation difference between the members, It is intended to solve the above-mentioned problems.

[0007]

Operation The operation will be described by taking a multi-chip module as an example. Usually, the LSI mounting board is made of a ceramic material having a thermal expansion coefficient substantially equal to that of the LSI in order to reduce the thermal strain at the joint with the LSI, but these materials generally have poor thermal conductivity. On the other hand, since the heat generated by the LSI needs to be actively released to the outside of the module, the cover portion on the upper side of the LSI is made of a material having excellent heat transfer characteristics, mainly metal.
If the ceramic substrate and the metallic cover are soldered together, there is a possibility that excessive stress will be generated in the solder due to the difference in thermal deformation between the two in the joining process. Further, during operation, the substrate close to the LSI has a high temperature and the cooling jacket side has a lower temperature than that, so that the temperature difference may cause the same thermal deformation difference as described above, and the solder may be burdened. Further, the substrate and the cap will be deformed by these forces, and in particular, the out-of-plane deformation causes a problem in connection with other components mounted on the substrate and in contact heat transfer performance between the cap and the other component. There is a fear.

In order to reduce the force generated at the joint in the combination of materials having different deformations, it is effective to provide a more easily deformable member such as a bellows or a bellows at the joint. is there.

[0009]

Embodiments of the present invention will be described below with reference to FIGS. 1 to 3 are airtight containers in which members 1 and 2 made of different materials are joined by a member 3 having a deformation absorbing function, FIG. 4 is an enlarged view of the member having the deformation absorbing function, and FIGS. This is an example of the manufacturing means of. First, in FIG. 1, when the members 1 and 2 are made of materials having different thermal expansion coefficients, when they are subjected to a temperature change, they have an expansion difference, but the member 3 is in a direction in which the members 1 and 2 have an expansion difference. Since it has a flexible structure, it does not generate a large force at the joint by absorbing the difference in elongation between both members. That is, the members 1 and 2 can be assembled even if a manufacturing process that undergoes a heat history such as brazing or soldering is performed. FIG. 2 shows an example in which the container is circular. The members 1 and 2 may be constructed by inverting them upside down, and the member 2 may be made of a material different from the side surface and the bottom surface (or the top surface). When the container can be formed in such a shape, there is an advantage that the deformation difference absorbing member 3 can be manufactured more easily than the rectangular shape of FIG. 1 and the container can be manufactured accurately. FIG. 3 shows an example in which this structure is adopted as an LSI module. Since the LSI 9 on the substrate 1 generates heat in an operating state, it must be transferred to the upper cooling jacket 8 via the heat transfer member 10 for efficient cooling. Since the LSI has a low coefficient of thermal expansion as represented by Si, a substrate on which the LSI is mounted is made of a ceramic whose coefficient of thermal expansion is close to that of Si. On the other hand, it is necessary to use a material having excellent thermal conductivity for the cooling jacket as described above, and the cooling jacket is made of optimum copper in a practical metal material and both are joined by solder. A deformation difference absorbing member 3 is installed between the members 1 and 2 as shown in the figure. By doing so, the thermal deformation difference is absorbed by the component 3 and a large force is not generated in the joint portion, so that the soundness of the solder in the joint portion is secured. In this structure, if the member 3 is liable to be weak against the force in the vertical direction in the figure, it is possible to reinforce it by providing the member 11 for protecting it. If it is necessary to pull up the module from the outside, the handling jig 12 can be used so that no force is applied to the member 3 as shown in the figure.

FIG. 4 is an enlarged cross-sectional view of the deformation difference absorbing member 3, which can be manufactured, for example, by deep drawing a thin plate such as copper having high ductility as shown in FIG. The deformation absorption amount can be further increased by providing a plurality of bent portions 3a in FIG.

FIG. 6 shows one method of assembling the deformation difference absorbing member 3 and the members 1 and 2. Deformation difference absorbing member 3
1 is soldered to the member 1 in advance, another solder 7 having a lower melting point than this solder is preset in the joint portion 3 and the member 2 is soldered to complete the container of FIG.

In the drawing, a deformation difference absorbing member is attached to an airtight container formed by packing and bolting. Since the deformation difference between the members 1 and 2 is absorbed by the deformation difference absorbing member 3, the packing 14 does not slightly slide, so that there is no fear of wear.

FIG. 8 shows an example in which the deformation difference absorbing member has two bent portions. By doing so, it is possible to expect a deformation absorption capacity that is about twice that of a single bent portion.

[0014]

According to the present invention, an unreasonable force due to the difference in deformation does not occur, and the integrity of the solder can be maintained when the solder is used for joining. Therefore, it is particularly effective when used in a container that requires airtightness.

Further, since an unreasonable force is not generated in the joint portion, the out-of-plane deformation of the members 1 and 2 can be suppressed to a small level.

Further, when applied to a container having a packing and bolt tightening structure, sliding wear of the packing can be reduced and airtightness can be maintained.

[Brief description of drawings]

FIG. 1 is an explanatory view of a container according to an embodiment of the present invention.

FIG. 2 is an explanatory view of a circular container of the present invention.

FIG. 3 is a side sectional view of an LSI module of the present invention.

FIG. 4 is a side sectional view of the deformation difference absorbing member.

FIG. 5 is a cross-sectional view showing a deep drawing method for a deformation difference absorbing member.

FIG. 6 is a sectional view of a portion showing a method for assembling a container using a deformation difference absorbing member.

FIG. 7 is a cross-sectional view of a packing and a bolted container according to the present invention.

FIG. 8 is a cross-sectional view of a deformation difference absorbing member having two bending portions.

[Explanation of symbols]

1, 2 ... Member, 3 ... Deformation difference absorbing member, 6 ... Solder, 7 ... Preset solder.

Claims (1)

[Claims] 1. A container made of a combination of different materials and a container in which a temperature difference is likely to occur partially have a function of absorbing a deformation difference between the different materials and between the materials having a temperature difference. And a container.