JPH07144353A - Temperature control structure of mold - Google Patents

Temperature control structure of mold

Info

Publication number
JPH07144353A
JPH07144353A JP29375293A JP29375293A JPH07144353A JP H07144353 A JPH07144353 A JP H07144353A JP 29375293 A JP29375293 A JP 29375293A JP 29375293 A JP29375293 A JP 29375293A JP H07144353 A JPH07144353 A JP H07144353A
Authority
JP
Japan
Prior art keywords
temperature control
partition wall
heat transfer
transfer plate
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29375293A
Other languages
Japanese (ja)
Other versions
JP3143005B2 (en
Inventor
Akio Hirano
彰士 平野
Hisaaki Oseko
久秋 小瀬古
Jun Watabe
順 渡部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP29375293A priority Critical patent/JP3143005B2/en
Publication of JPH07144353A publication Critical patent/JPH07144353A/en
Application granted granted Critical
Publication of JP3143005B2 publication Critical patent/JP3143005B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • B29C2045/7393Heating or cooling of the mould alternately heating and cooling

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To enable rapid heating/cooling to achieve the shortening of a molding cycle and the enhancement of quality in a mold temp. control structure performing temp. control by passing first and second medil different in temp. through a mold, by reducing the effect of mutual heat capacities of a heating mechanism and a cooling mechanism and enhancing heat transmission efficiency. CONSTITUTION:A mold temp. control structure is equipped with the temp. control chamber 15 adjacent to a cavity 14 through a partition wall 13, the temp. control block 16 inserted in the temp. control chamber 15 capable of coming close to and separating from the partition wall 13, and the first temp control passage 22 in the block 16 receiving the supply of a first heating medium. The heat transfer plate 17 sliding along with the block 16 is provided between the partition wall 13 and the block 16 and, when the block 16 approaches the partition wall 13, the block 16 comes into close contact with the partition wall 13 through the heat transfer plate 17 and, when the block 16 is separated from the partition wall 13, the partition wall 13, the block 16 and the heat transfer plate 17 are respectively separated to set the gap between the partition wall 13 and the heat transfer plate 17 to a second temp. control passage 15a receiving the supply of a second heating medium.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、金型の温度調節構造に
関し、詳しくは、金型に温度の相違する第1熱媒体およ
び第2熱媒体を通すことにより、迅速に金型温度の調節
を行うようにした金型の温度調節構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold temperature control structure, and more particularly, to quickly control the mold temperature by passing a first heat medium and a second heat medium having different temperatures through the mold. The present invention relates to a mold temperature control structure.

【0002】[0002]

【従来の技術】一般に、可塑化樹脂の射出成形にあって
は、金型温度は成形品の表面転写性に大きく影響し、金
型温度が高いほど表面転写性が向上する。ところが、最
終的に金型から成形品を取り出すためには、取出し時の
成形品温度が成形樹脂の熱変形温度以下であることが必
要なため、金型温度は熱変形温度の10℃前後低い温度を
上限としていることが多く、その表面転写性には限界が
ある。また、金型温度が高いと成形品が熱変形温度以下
になるまでの時間も長くなるため、成形サイクルが長く
なるという不具合が発生してしまう。
2. Description of the Related Art Generally, in injection molding of a plasticized resin, the mold temperature has a great influence on the surface transferability of a molded product, and the higher the mold temperature, the higher the surface transferability. However, in order to finally take out the molded product from the mold, it is necessary that the temperature of the molded product at the time of removal is not higher than the heat distortion temperature of the molding resin, so the mold temperature is lower than the heat distortion temperature by about 10 ° C. The temperature is often set as the upper limit, and the surface transferability thereof is limited. Further, when the mold temperature is high, the time until the temperature of the molded product falls below the thermal deformation temperature also becomes long, which causes a problem that the molding cycle becomes long.

【0003】このような不具合を発生させることなく精
密成形において表面転写性を向上させるために、成形樹
脂を射出・充填する前に金型を樹脂の熱変形温度以上に
設定し、射出・充填以後に金型を熱変形温度以下に下げ
たり、射出・充填以後に金型を熱変形温度以上に加熱
し、その後再び冷却を行うようにして、成形サイクルを
長くすることのない金型の熱変形温度以上の加熱を実現
した金型の温度調節構造が考えられている。
In order to improve surface transferability in precision molding without causing such problems, the mold is set to a temperature higher than the heat distortion temperature of the resin before injection / filling of the molding resin, and after injection / filling. Thermal deformation of the mold without lengthening the molding cycle by lowering the mold below the heat deformation temperature, heating the mold above the heat deformation temperature after injection / filling, and then cooling again. A temperature control structure of a mold that realizes heating above a temperature is considered.

【0004】従来のこの種の金型の温度調節構造として
は、次ぎに挙げるものがある。 (1) 金型内に設けられた一対の温度調整用媒体通路
と、該通路に温調媒体を供給する温度調節用媒体供給装
置とを有し、供給装置の温度を適宜切り換えるようにし
たもの。 (2) 金型内に設けられた1系統の温度調整用媒体通
路と、該通路に低温および高温の温調媒体を供給する2
つの温度調節用媒体供給装置とを有し、供給装置から媒
体通路に導く途中で媒体を切り換えるようにしたもの
(例えば特開昭58−215309号公報および特開昭
62−208918号公報参照)。
The following is a conventional temperature control structure of this type of mold. (1) A pair of temperature adjusting medium passages provided in a mold and a temperature adjusting medium supplying device for supplying a temperature adjusting medium to the passages, and the temperature of the supplying device is appropriately switched . (2) One system of temperature control medium passage provided in the mold, and the temperature control medium of low temperature and high temperature is supplied to the passage 2
A medium supply device for controlling the temperature is provided, and the medium is switched on the way from the supply device to the medium passage (see, for example, JP-A-58-215309 and JP-A-62-208918).

【0005】(3) 金型内に設けられた一対の低温媒
体用通路と、該通路に低温の温調媒体を供給する低温媒
体供給装置と、金型内に設けられたヒータ等の加熱手段
とを有し、加熱時には加熱手段により金型を加熱し、冷
却時には加熱手段の作動を停止して低温媒体によって金
型を冷却するようにしたもの。 (4) 金型内に設けられた2対の温度調整用媒体通路
と、該媒体通路にそれぞれ高温媒体および低温媒体を供
給する温度調節用媒体供給装置とを有し、加熱時には高
温媒体のみを媒体通路に供給して金型を加熱し、また、
冷却時には低温媒体のみを媒体通路に供給して金型を冷
却するようにしたもの(例えば、実開平1−11661
0号公報参照)。
(3) A pair of low temperature medium passages provided in the die, a low temperature medium supply device for supplying a low temperature temperature control medium to the passages, and heating means such as a heater provided in the die. And a heating means for heating the mold, and a cooling means for stopping the operation of the heating means to cool the mold with a low temperature medium. (4) It has two pairs of temperature adjusting medium passages provided in the mold and a temperature adjusting medium supplying device for supplying a high temperature medium and a low temperature medium respectively to the medium passages, and only the high temperature medium is supplied during heating. Supply to the medium passage to heat the mold,
The one in which only the low temperature medium is supplied to the medium passage at the time of cooling so as to cool the die (for example, the actual opening 1-111661).
No. 0 publication).

【0006】[0006]

【発明が解決しようとする課題】しかしながら、上記
(1)に記載した金型の温度調節構造にあっては、温度
調節媒体の温度を昇降させるのに時間を要していたた
め、成形サイクルが非常に長くなってしまうとともに成
形品の品質が低下してしまうという問題があった。ま
た、上記(2)〜(4)に記載した金型の温度調節構造
にあっては、金型内に加熱機構と冷却機構が近接して設
けられていたため、互いの熱容量のために速やかな金型
の冷却または加熱を実現することができず、成形サイク
ルが長くなるという問題があった。
However, in the mold temperature control structure described in the above (1), it takes a long time to raise and lower the temperature of the temperature control medium, so that the molding cycle is extremely difficult. There has been a problem that the quality of the molded product deteriorates as the length increases. Further, in the mold temperature control structure described in the above (2) to (4), since the heating mechanism and the cooling mechanism are provided close to each other in the mold, the heat capacity of each is promptly increased. There is a problem that the mold cannot be cooled or heated, and the molding cycle becomes long.

【0007】そのため、本出願人はこのような問題を解
消する金型の温度調節構造を特開平5−177640号
公報に開示している。この金型の温度調節構造は、キャ
ビティを画成する隔壁を挟んで隣接する温調室内に、内
部に第1熱媒体を供給される第1温調用通路を有する温
調ブロックを摺動して隔壁に接離させ、隔壁から離隔し
たときに隔壁と温調ブロックとの間の間隙を第2熱媒体
を供給される第2温調用通路とするものである。
Therefore, the applicant of the present invention discloses a mold temperature control structure for solving such a problem in Japanese Patent Application Laid-Open No. 5-177640. In this temperature control structure of a mold, a temperature control block having a first temperature control passage into which a first heat medium is supplied is slid in a temperature control chamber adjacent to each other with a partition wall defining a cavity interposed therebetween. The partition wall is brought into contact with and separated from the partition wall, and when separated from the partition wall, the gap between the partition wall and the temperature control block is used as a second temperature control passage to which the second heat medium is supplied.

【0008】しかしながら、隔壁の温調ブロックおよび
第2熱媒体との接触面積が小さいため、加熱機構と冷却
機構との互いの熱容量の影響を受け難くすることは達成
できたが、更なる急速な金型の加熱および冷却を行なう
程の熱の伝達を充分得ることができなかった。そこで、
本発明は、加熱機構と冷却機構との互いの熱容量の影響
をなくすとともに、熱の伝達効率を向上させることによ
り、適正な条件での急速な加熱および冷却を可能にし
て、成形サイクルの短縮を図るとともに、成形品の品質
を向上することができる金型の温度調節構造を提供する
ことを目的としている。
However, since the contact area between the temperature control block of the partition wall and the second heat medium is small, it has been possible to make it less susceptible to the mutual heat capacities of the heating mechanism and the cooling mechanism. It was not possible to obtain enough heat transfer to heat and cool the mold. Therefore,
The present invention eliminates the influence of the heat capacities of the heating mechanism and the cooling mechanism, and improves the heat transfer efficiency, thereby enabling rapid heating and cooling under appropriate conditions and shortening the molding cycle. In addition, it is an object of the present invention to provide a temperature control structure for a mold that can improve the quality of a molded product.

【0009】[0009]

【課題を解決するための手段】上記目的達成のため、請
求項1記載の発明は、金型の隔壁を挟み、キャビティに
隣接する金型の内部に設けられた温調室と、温調室に嵌
挿され、隔壁に近接、離隔可能に設けられた温調ブロッ
クと、温調ブロックに設けられ、第1熱媒体が供給され
る第1温調用通路と、を備えた金型の温度調節構造であ
って、前記温調室内の隔壁と温調ブロックとの間に嵌挿
され、該温調ブロックの移動とともに同一方向に温調室
内を摺動する伝熱板を設け、温調ブロックが隔壁に近接
したときには伝熱板を介して該温調ブロックおよび隔壁
は当接して密接し、温調ブロックが隔壁から離隔したと
きには伝熱板は該温調ブロックおよび隔壁から離隔して
温調室内で該伝熱板と隔壁との間に形成された間隙を第
2温調用通路として第2熱媒体を供給するようにしたこ
とを特徴とするものである。
In order to achieve the above-mentioned object, the invention according to claim 1 is such that a temperature control chamber is provided inside the mold adjacent to a cavity with a partition wall of the mold sandwiched between the temperature control chamber and the temperature control chamber. Temperature control of a mold provided with a temperature control block fitted into the partition wall so as to be close to and separated from the partition wall, and a first temperature control passage provided in the temperature control block and supplied with a first heat medium. The structure is provided with a heat transfer plate which is fitted between the partition wall and the temperature control block in the temperature control chamber, and which slides in the temperature control chamber in the same direction as the temperature control block moves. When the temperature control block and the partition wall are in close contact with each other via the heat transfer plate when the temperature control block is separated from the partition wall, the heat transfer plate is separated from the temperature control block and the partition wall when the temperature control block is separated from the partition wall. The gap formed between the heat transfer plate and the partition wall as the second temperature control passage. It is characterized in that it has to supply the second heat medium.

【0010】請求項2記載の発明は、伝熱板または隔壁
の当接面の一方側に凹部を、他方側に凸部を設け、該
凹、凸部を含む当接面を、当接したとき隙間なく密接す
るよう形成したことを特徴とするものである。請求項3
記載の発明は、前記凹部を、所定方向へ平行に延在する
よう複数本形成し、前記凸部を、凹部と同一方向へ平行
に延在するよう複数本形成したことを特徴とするもので
ある。
According to a second aspect of the present invention, a concave portion is provided on one side of the contact surface of the heat transfer plate or the partition wall, and a convex portion is provided on the other side, and the contact surfaces including the concave portion and the convex portion are in contact with each other. It is characterized in that it is formed so as to be in close contact without a gap. Claim 3
The invention described is characterized in that a plurality of the concave portions are formed so as to extend in parallel in a predetermined direction, and a plurality of the convex portions are formed so as to extend in parallel in the same direction as the concave portions. is there.

【0011】請求項4記載の発明は、前記凹部の互いに
対向する側面を、底部側ほど近接するよう形成し、前記
凸部の互いに対向する側面を、頂部側ほど近接するよう
形成したことを特徴とするものである。請求項5記載の
発明は、前記凹部の深さおよび凸部の高さを、前記温調
用ブロックと隔壁との離隔距離よりも大きく形成したこ
とを特徴とするものである。
According to a fourth aspect of the present invention, the side surfaces of the concave portion facing each other are formed closer to each other on the bottom side, and the side surfaces facing each other of the convex portion are formed to be closer to each other on the top side. It is what The invention according to claim 5 is characterized in that the depth of the concave portion and the height of the convex portion are formed to be larger than the separation distance between the temperature control block and the partition wall.

【0012】請求項6記載の発明は、前記凹部の開口部
および凸部の頂部の側面を、前記伝熱板が隔壁から離隔
したとき密接するよう形成して該伝熱板と隔壁との間に
形成される間隙を分割し、隔壁側に形成された間隙のみ
を第2温調用通路として第2熱媒体を供給するようにし
たことを特徴とするものである。
According to a sixth aspect of the present invention, the side surface of the opening of the concave portion and the side surface of the top of the convex portion are formed so as to come into close contact with each other when the heat transfer plate is separated from the partition wall, and between the heat transfer plate and the partition wall. It is characterized in that the gap formed in (1) is divided and only the gap formed on the partition wall side is used as the second temperature control passage to supply the second heat medium.

【0013】[0013]

【作用】請求項1記載の発明では、温調室内の隔壁と温
調ブロックとの間に温調ブロックの移動とともに同一方
向に温調室内を摺動する伝熱板が挿嵌される。そして、
温調ブロックは伝熱板を介して隔壁に当接されて密接さ
れた状態で温調ブロック内の第1温調用通路に第1熱媒
体が供給され、キャビティ近傍の隔壁へ第1熱媒体から
熱伝達される。また、温調ブロック、伝熱板、および隔
壁がそれぞれ離隔した状態で伝熱板と隔壁との間に形成
された間隙に第2温調用通路として第2熱媒体が供給さ
れ、キャビティ近傍の隔壁へ第2熱媒体から熱伝達され
る。
According to the first aspect of the invention, the heat transfer plate that slides in the temperature control chamber in the same direction as the temperature control block moves is inserted between the partition wall and the temperature control block in the temperature control chamber. And
The temperature control block is in contact with the partition wall via the heat transfer plate and in close contact with the partition wall, the first heat medium is supplied to the first temperature control passage in the temperature control block, and the first heat medium flows from the first heat medium to the partition wall in the vicinity of the cavity. Heat is transferred. Further, the second heat medium is supplied as a second temperature adjusting passage to the gap formed between the heat transfer plate and the partition wall in a state where the temperature control block, the heat transfer plate, and the partition wall are separated from each other, and the partition wall near the cavity is provided. Heat is transferred from the second heat medium to.

【0014】このとき、伝熱板と隔壁との間に形成され
た第2温調用通路に第2熱媒体が供給されるとき、温調
ブロックは伝熱板から離隔しているので、温調ブロック
への第2熱媒体からの熱伝達はなく、温調ブロックの熱
変化(温度変化)は防止される。その後、伝熱板を介し
て温調ブロックおよび隔壁が密接したとき、温調ブロッ
クは熱変化なく密接するとともに伝熱板および隔壁の間
には第2熱媒体は供給されない。したがって、第1、2
熱媒体から隔壁へ効率良く熱伝達され、キャビティ近傍
が必要に応じて急速に加熱あるいは冷却される。
At this time, since the temperature control block is separated from the heat transfer plate when the second heat medium is supplied to the second temperature control passage formed between the heat transfer plate and the partition wall, the temperature control block is separated from the heat transfer plate. There is no heat transfer from the second heat medium to the block, and heat change (temperature change) of the temperature control block is prevented. Then, when the temperature control block and the partition wall are in close contact with each other via the heat transfer plate, the temperature control block is in close contact without heat change and the second heat medium is not supplied between the heat transfer plate and the partition wall. Therefore, the first and second
Heat is efficiently transferred from the heat medium to the partition wall, and the vicinity of the cavity is rapidly heated or cooled as needed.

【0015】請求項2記載の発明では、キャビティ近傍
の隔壁またはこの隔壁に接離する伝熱板の当接面の一方
側に凹部が、他方側に凸部が設けられ、この凹、凸部を
含む当接面が当接したとき隙間なく密接するよう形成さ
れる。そのため、伝熱板と隔壁との密接面積が大きくさ
れ、第1、2熱媒体による隔壁への熱の伝達効率はより
高くされる。したがって、キャビティ近傍が必要に応じ
てより急速に加熱あるいは冷却される。
According to the second aspect of the present invention, a recess is provided on one side of the partition wall near the cavity or the contact surface of the heat transfer plate that is in contact with and separated from the partition wall, and a projection is provided on the other side. The contact surfaces including the contact surfaces are formed so as to closely contact each other without a gap. Therefore, the contact area between the heat transfer plate and the partition wall is increased, and the efficiency of heat transfer to the partition wall by the first and second heat mediums is further increased. Therefore, the vicinity of the cavity is heated or cooled more rapidly as needed.

【0016】請求項3記載の発明では、凹部が所定方向
へ平行に複数本延在し、凸部がその凹部と同一方向へ平
行に延在するよう複数本形成される。そのため、凹部に
より溝が形成されるとともに隣接する凸部間にも溝が形
成され、この対向する溝は平行に形成されている。した
がって、伝熱板と隔壁との間に形成された間隙の第2温
調用通路に供給される第2熱媒体はスムーズに流動さ
れ、キャビティ近傍の隔壁へ均一に熱伝達される。
According to the third aspect of the invention, a plurality of recesses are formed so as to extend in parallel in a predetermined direction, and a plurality of protrusions are formed so as to extend in the same direction as the recesses. Therefore, the groove is formed by the concave portion and the groove is also formed between the adjacent convex portions, and the opposing grooves are formed in parallel. Therefore, the second heat medium supplied to the second temperature control passage in the gap formed between the heat transfer plate and the partition wall is smoothly flowed and uniformly transferred to the partition wall in the vicinity of the cavity.

【0017】請求項4記載の発明では、凹部の互いに対
向する側面が底部側ほど近接するよう形成され、凸部の
互いに対向する側面が頂部側ほど近接するよう形成され
る。そのため、凹部の断面形状が他方側に近接するほど
幅広となる所謂、逆台形状に形成され、凸部の断面形状
が一方側に近接するほど幅狭となる所謂、台形状に形成
される。したがって、温調ブロックを隔壁に近接させる
際、凹、凸部のエッジが接触することにより当接面を密
接させることができなくなったり、破損してしまうこと
がない。
According to the fourth aspect of the present invention, the side surfaces of the concave portion facing each other are closer to the bottom side, and the side surfaces of the convex portion facing each other are closer to the top side. Therefore, the concave portion is formed in a so-called inverted trapezoidal shape in which the cross-sectional shape becomes wider as it approaches the other side, and the convex portion is formed in a so-called trapezoidal shape in which the cross-sectional shape becomes narrower as it approaches the one side. Therefore, when the temperature control block is brought close to the partition wall, contact between the edges of the concave and convex portions prevents the contact surface from being brought into close contact with each other and is not damaged.

【0018】請求項5記載の発明では、凹部の深さおよ
び凸部の高さが伝熱板と隔壁との離隔距離よりも大きく
形成される。そのため、伝熱板を隔壁から離隔させたと
き、凸部の頂部が凹部内に入り込んだ状態にされ、凹、
凸部の間に第2温調用通路が形成され、またはそれに加
え凹、凸部の側面間にも第2温調用通路が形成される。
したがって、供給される第2熱媒体が効果的に隔壁の凹
部または凸部を含む当接面に接触されるとともにこの第
2熱媒体の流動に乱流が発生され、第2熱媒体から隔壁
へ効率良く熱伝達される。
According to the fifth aspect of the present invention, the depth of the concave portion and the height of the convex portion are formed larger than the distance between the heat transfer plate and the partition wall. Therefore, when the heat transfer plate is separated from the partition wall, the top of the convex portion is put in the concave portion,
The second temperature adjustment passage is formed between the convex portions, or in addition to this, the second temperature adjustment passage is also formed between the side surfaces of the concave portion and the convex portion.
Therefore, the supplied second heat medium is effectively brought into contact with the contact surface including the concave portion or the convex portion of the partition wall, and a turbulent flow is generated in the flow of the second heat medium, so that the second heat medium flows to the partition wall. Heat is transferred efficiently.

【0019】また、伝熱板を隔壁から離隔させたときで
も凸部の頂部が凹部内に入り込んだ状態なので、伝熱板
を隔壁に近接させる際、凹、凸部のエッジが接触するこ
とがなく、当接面を密接させることができなくなったり
破損してしまうことがない。請求項6記載の発明では、
凹部の開口部および凸部の頂部の側面が、伝熱板が隔壁
から離隔したとき密接するよう形成されて伝熱板と隔壁
との間に形成される間隙が分割され、隔壁側に形成され
た間隙のみを第2温調用通路として第2熱媒体が供給さ
れる。したがって、第2熱媒体に接触する伝熱板は当接
面の一部にされ、伝熱板への第2熱媒体からの熱伝達が
少なくされて第2熱媒体から隔壁ヘの熱伝達の効率が高
くされる。
Further, even when the heat transfer plate is separated from the partition wall, the tops of the projections are in the recesses, so that when the heat transfer plate is brought close to the partition wall, the edges of the recesses and the projections may come into contact with each other. In addition, the contact surfaces cannot be brought into close contact with each other and are not damaged. According to the invention of claim 6,
The side surfaces of the openings of the recesses and the tops of the projections are formed so as to come into close contact with each other when the heat transfer plate is separated from the partition wall, and the gap formed between the heat transfer plate and the partition wall is divided to be formed on the partition wall side. The second heat medium is supplied using only the gap as the second temperature control passage. Therefore, the heat transfer plate in contact with the second heat medium is made a part of the contact surface, heat transfer from the second heat medium to the heat transfer plate is reduced, and heat transfer from the second heat medium to the partition wall is reduced. Efficiency is increased.

【0020】[0020]

【実施例】以下、本発明を図面に基づいて説明する。図
1および図2は本発明に係る金型の温度調節構造の第1
実施例を示す図であり、本実施例は請求項1記載の発明
に対応する。まず、構成を説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 and FIG. 2 show a first structure for controlling the temperature of a mold according to the present invention.
It is a figure which shows an Example, and this Example respond | corresponds to the invention of Claim 1. First, the configuration will be described.

【0021】両図において、11、12は一対の金型であ
り、金型11、12は略同様に構成されており、隔壁13のパ
ーティング面P.L で互いに当接してキャビティ14を画成
する。金型11にはキャビティ14に連通する図示していな
いランナーが形成されており、この金型11、12は図外の
射出成形機のノズルからランナーを介して樹脂をキャビ
ティ14内に射出・充填され成形品を成形するようになっ
ている。この金型11、12には、それぞれ隔壁13を挟んで
キャビティ14に隣接し内部に画成される温調室15を有し
ており、この温調室15には温調ブロック16および伝熱板
17が摺動自在に遊挿(挿嵌)されている。
In both figures, 11 and 12 are a pair of molds, and the molds 11 and 12 have substantially the same structure, and abut on each other on the parting surface PL of the partition wall 13 to define a cavity 14. . A runner (not shown) communicating with the cavity 14 is formed in the mold 11, and these molds 11 and 12 inject and fill the resin into the cavity 14 from the nozzle of the injection molding machine (not shown) via the runner. Then, the molded product is molded. Each of the molds 11 and 12 has a temperature control chamber 15 defined inside thereof adjacent to the cavity 14 with a partition wall 13 interposed therebetween. The temperature control chamber 15 includes a temperature control block 16 and a heat transfer chamber 15. Board
17 is slidably inserted (inserted).

【0022】温調ブロック16は、油圧シリンダ21によっ
て駆動され、図中左右方向に移動して図1(a)に示す
ように、伝熱板17を介して隔壁13に当接して密接するよ
うになっており、このとき隔壁13の当接面13aと伝熱板
17の当接面17aとが当接して密接し、さらに伝熱板17の
当接面17bと温調ブロック16の当接面16aとが当接して
密接する。また、温調ブロック16は、図1(b)に示す
ように、伝熱板17から離隔する。この温調ブロック16に
は、第1温調用通路22が設けられており、この第1温調
用通路22には第1熱媒体が図外の第1温調システムから
供給されるようになっている。
The temperature control block 16 is driven by a hydraulic cylinder 21 and moves in the left-right direction in the drawing so as to come into contact with the partition wall 13 via a heat transfer plate 17 and come into close contact therewith, as shown in FIG. At this time, the contact surface 13a of the partition wall 13 and the heat transfer plate
The contact surface 17 a of the heat transfer plate 17 comes into contact with the contact surface 17 a of the temperature control block 16, and the contact surface 17 a of the temperature control block 16 comes into contact with the contact surface 17 a. The temperature control block 16 is separated from the heat transfer plate 17, as shown in FIG. The temperature control block 16 is provided with a first temperature control passage 22, and a first heat medium is supplied to the first temperature control passage 22 from a first temperature control system (not shown). There is.

【0023】また、温調ブロック16には、図2に示すよ
うに、伝熱板17を貫通し隔壁13に挿嵌可能なフランジ18
a、18bを有するシャフト18が少なくとも一つ以上固設
されており、シャフト18のフランジ18a、18bの間隔は
伝熱板17の厚さよりも広く形成され、フランジ18aは温
調ブロック16の当接面16aから伝熱板17の板厚よりも離
隔した位置に、フランジ18bは当接面16aに接した位置
に形成されている。
As shown in FIG. 2, the temperature control block 16 has a flange 18 penetrating the heat transfer plate 17 and insertable into the partition wall 13.
At least one shaft 18 having a and 18b is fixedly provided, and the distance between the flanges 18a and 18b of the shaft 18 is formed wider than the thickness of the heat transfer plate 17, and the flange 18a is in contact with the temperature control block 16. The flange 18b is formed at a position separated from the surface 16a by a thickness larger than that of the heat transfer plate 17, and at a position in contact with the contact surface 16a.

【0024】シャフト18のフランジ18a、18bは、温調
ブロック16が伝熱板17を介して隔壁13に当接するよう移
動したときには、フランジ18aは隔壁13に形成された挿
入孔13cに挿入され、またフランジ18bは伝熱板17に形
成された挿入孔17cに挿入されて温調ブロック16、伝熱
板17、および隔壁13の密接を妨げない。一方、温調ブロ
ック16が隔壁13から離隔するよう移動したときには、温
調ブロック16の当接面16aが伝熱板17の当接面17bから
離隔した後、フランジ18aが隔壁13の挿入孔13cから挿
脱され、伝熱板17の当接面17aに当接して隔壁13の当接
面13aから離隔させるようになっている。
The flanges 18a and 18b of the shaft 18 are inserted into the insertion holes 13c formed in the partition wall 13 when the temperature control block 16 moves so as to contact the partition wall 13 via the heat transfer plate 17. Further, the flange 18b is inserted into the insertion hole 17c formed in the heat transfer plate 17 so as not to prevent the temperature control block 16, the heat transfer plate 17 and the partition wall 13 from coming into close contact with each other. On the other hand, when the temperature control block 16 is moved away from the partition wall 13, the contact surface 16a of the temperature control block 16 is separated from the contact surface 17b of the heat transfer plate 17, and then the flange 18a is inserted into the insertion hole 13c of the partition wall 13. The contact surface 17a of the heat transfer plate 17 is contacted with and separated from the contact surface 13a of the partition wall 13.

【0025】そして、温調ブロック16が移動することに
より伝熱板17が、図1(b)に示すように、隔壁13から
離隔したときに温調室15に形成される隔壁13の当接面13
aと伝熱板17の当接面17aとの間隙を第2温調用通路15
aとして第2熱媒体が図外の第2温調システムから供給
されるようになっている。この第2温調用通路15aに供
給される第2熱媒体は、金型11、12に設けられた流入口
23を介して供給され、流出口24を介して回収されるよう
になっている。
As the temperature control block 16 moves, the heat transfer plate 17 comes into contact with the partition wall 13 formed in the temperature control chamber 15 when it is separated from the partition wall 13, as shown in FIG. 1 (b). Face 13
a and the contact surface 17a of the heat transfer plate 17 between the second temperature control passage 15
As a, the second heat medium is supplied from a second temperature control system (not shown). The second heat medium supplied to the second temperature control passage 15a is an inlet provided in the molds 11 and 12.
It is supplied via 23 and is collected via the outlet 24.

【0026】なお、伝熱板17の貫通孔および隔壁13の挿
入孔13cとシャフト18とはシール材(例えば、Oリング
等)を介して摺接し第2温調用通路15aからの第2熱媒
体の漏れを防止している。また、25は側板、26は背板で
あり、側板25および背板26は隔壁13とともに温調室15を
画成しており、側板25と伝熱板17とは前記シール材を介
して摺接し第2温調用通路15aからの第2熱媒体の漏れ
を防止している。
The through hole of the heat transfer plate 17, the insertion hole 13c of the partition wall 13 and the shaft 18 are in sliding contact with each other via a seal material (for example, an O-ring), and the second heat medium from the second temperature control passage 15a. To prevent leaks. Further, 25 is a side plate, 26 is a back plate, the side plate 25 and the back plate 26 define a temperature control chamber 15 together with the partition wall 13, and the side plate 25 and the heat transfer plate 17 are slid via the sealing material. In contact with each other, leakage of the second heat medium from the second temperature control passage 15a is prevented.

【0027】次に、第1温調用通路22に供給される第1
熱媒体を高温熱媒体とし、また第2温調用通路15aに供
給される第2熱媒体を低温熱媒体として金型11、12の温
度(特に、隔壁13の温度)を高温から低温そして再び高
温に調節する場合の作用を説明する。まず、射出充填中
には図1(a)に示すように、温調ブロック16が伝熱板
17を介して隔壁13に当接した状態で第1温調用通路22に
高温熱媒体が供給され、キャビティ14内の成形樹脂の温
度に対応して隔壁13が高温に保たれている。
Next, the first temperature control passage 22 is supplied to the first temperature control passage 22.
The heat medium is a high temperature heat medium, and the second heat medium supplied to the second temperature adjusting passage 15a is a low temperature heat medium. The action when adjusting to is explained. First, during injection filling, as shown in FIG. 1A, the temperature control block 16 is a heat transfer plate.
The high-temperature heat medium is supplied to the first temperature adjustment passage 22 in a state of being in contact with the partition wall 13 via 17, and the partition wall 13 is kept at a high temperature in accordance with the temperature of the molding resin in the cavity 14.

【0028】次いで、射出充填終了後、図1(b)に示
すように、温調ブロック16を隔壁13から離隔させて隔壁
13と伝熱板17との間隙に第2温調用通路15aを形成し、
第2温調用通路15aに流入口23を通して低温熱媒体が供
給されて隔壁13が冷却され、同時にキャビティ14内の成
形樹脂が隔壁13を介して冷却される。このとき、温調用
通路22には高温熱媒体が充満しているが、温調ブロック
16は伝熱板17から離隔するとともにキャビティ14の近傍
が隔壁13のみとなり熱容量が小さくされるので、高温熱
媒体に影響されることなく、キャビティ14の成形品の冷
却が迅速に行われる。また、温調ブロック16および隔壁
13は離隔して高温熱媒体から熱は伝達されないので、冷
却中でも高温熱媒体を第1温調用通路22に供給すること
ができる。
Next, after the injection filling is completed, as shown in FIG. 1 (b), the temperature control block 16 is separated from the partition wall 13 to form a partition wall.
A second temperature control passage 15a is formed in the gap between the heat transfer plate 17 and the heat transfer plate 17,
The low temperature heat medium is supplied to the second temperature adjusting passage 15a through the inflow port 23 to cool the partition wall 13, and at the same time, the molding resin in the cavity 14 is cooled via the partition wall 13. At this time, the temperature control passage 22 is filled with the high-temperature heat medium, but the temperature control block is
Since 16 is separated from the heat transfer plate 17 and the vicinity of the cavity 14 is only the partition wall 13 to reduce the heat capacity, the molded product of the cavity 14 is quickly cooled without being affected by the high temperature heat medium. In addition, the temperature control block 16 and the partition
Since 13 is separated and heat is not transferred from the high temperature heat medium, the high temperature heat medium can be supplied to the first temperature adjustment passage 22 even during cooling.

【0029】そして、成形品の取出し後、図1(a)に
示すように温調ブロック16が伝熱板17に当接して第2温
調用通路15a内の低温熱媒体を流出口24を通して排出し
ながらその伝熱板17を介して隔壁13に当接され、隔壁13
の温度が速やかに最初の高温状態に戻る。このとき、温
調ブロック16は冷却中でも高温熱媒体を第1温調用通路
22に供給して高温に保持していたので、急速に高温状態
にされる。
After the molded product is taken out, the temperature control block 16 contacts the heat transfer plate 17 and the low temperature heat medium in the second temperature control passage 15a is discharged through the outlet 24 as shown in FIG. 1 (a). While contacting the partition wall 13 via the heat transfer plate 17,
The temperature quickly returns to the initial high temperature. At this time, the temperature control block 16 keeps the high-temperature heat medium flowing through the first temperature control passage even during cooling.
Since it was supplied to 22 and kept at high temperature, it is rapidly brought to high temperature.

【0030】このように本実施例によれば、温調ブロッ
ク16が伝熱板17を介して隔壁13に密接した状態で隔壁13
へ高温熱媒体から熱伝達して、また温調ブロック16が伝
熱板17から離隔した状態で隔壁13へ低温熱媒体から熱伝
達するので、熱媒体の互いの影響をなくすことができ
る。また、低温熱媒体を隔壁13に直接接触させるととも
に温調ブロック16を隔壁13に伝熱板17を介して当接させ
第1温調用通路22を近接させているので、キャビティ14
の近傍に熱媒体から熱伝達させることができる。したが
って、キャビティ14の近傍を必要に応じて急速に加熱あ
るいは冷却することができ、成形品の表面転写性を向上
させる金型温度まで加熱させつつ成形サイクルを短縮す
ることができる。さらに、伝熱板17の板厚を薄くするこ
とにより伝熱板17の熱容量を小さくして低温熱媒体によ
る隔壁13の冷却速度を向上させることができ、また伝熱
板17の熱容量の減少と併せて温調ブロック16からの高温
熱媒体の熱の伝達距離が短くなるので隔壁13の加熱速度
を向上させることができる。
As described above, according to this embodiment, the partition wall 13 is provided in a state where the temperature control block 16 is in close contact with the partition wall 13 via the heat transfer plate 17.
Since the heat is transferred from the high temperature heat medium to the partition wall 13 in the state where the temperature control block 16 is separated from the heat transfer plate 17, the mutual influence of the heat media can be eliminated. Further, since the low temperature heat medium is brought into direct contact with the partition wall 13 and the temperature control block 16 is brought into contact with the partition wall 13 via the heat transfer plate 17, the first temperature control passage 22 is brought close to the cavity 14,
Heat can be transferred from the heat medium to the vicinity of. Therefore, the vicinity of the cavity 14 can be rapidly heated or cooled as required, and the molding cycle can be shortened while heating to the mold temperature that improves the surface transferability of the molded product. Furthermore, by reducing the plate thickness of the heat transfer plate 17, it is possible to reduce the heat capacity of the heat transfer plate 17 to improve the cooling rate of the partition wall 13 by the low temperature heat medium, and also to reduce the heat capacity of the heat transfer plate 17. At the same time, the heat transfer distance of the high-temperature heat medium from the temperature control block 16 is shortened, so that the heating rate of the partition wall 13 can be improved.

【0031】なお、第1熱媒体に低温熱媒体、第2熱媒
体に高温熱媒体を用いて、隔壁13の温度を調節しても良
い。この場合には、第2温調用通路15aによって急冷で
はなく、急加熱を行うことができる。また、本実施例で
はフランジを有するシャフトを温調ブロックに固設して
伝熱板を移動させているが、温調ブロック、伝熱板、お
よび隔壁のそれぞれの間にバネを介装する等、他の方法
によって伝熱板を移動させてもよい。
The temperature of the partition wall 13 may be adjusted by using a low temperature heat medium as the first heat medium and a high temperature heat medium as the second heat medium. In this case, not the rapid cooling but the rapid heating can be performed by the second temperature adjusting passage 15a. In this embodiment, the shaft having the flange is fixed to the temperature control block to move the heat transfer plate, but a spring is interposed between each of the temperature control block, the heat transfer plate, and the partition wall. The heat transfer plate may be moved by another method.

【0032】図3は本発明に係る金型の温度調節構造の
第2実施例を示す図であり、本実施例は請求項1または
2記載の発明に対応する。なお、本実施例では上述実施
例と同様な構成には同一の符号を付してその説明を省略
する。同図において、27は凹部、28は凸部であり、凹部
27は隔壁13の当接面13aに複数のブロック状に刻設さ
れ、また凸部28は伝熱板17の温調ブロック16の当接面16
aに複数のブロック状に突出した凸部28が形成されてお
り、この凹部27および凸部28は略同一形状のブロック状
に形成されるとともに同一位置に対向するよう配設され
ている。なお、隔壁13の当接面13aに凸部28を形成し、
温調ブロック16の当接面16aに凹部27を形成してもよ
い。
FIG. 3 is a view showing a second embodiment of the mold temperature control structure according to the present invention, and this embodiment corresponds to the invention described in claim 1 or 2. In this embodiment, the same components as those in the above-mentioned embodiment are designated by the same reference numerals and the description thereof will be omitted. In the figure, 27 is a concave portion and 28 is a convex portion.
27 is engraved on the contact surface 13a of the partition wall 13 in a plurality of blocks, and the convex portion 28 is the contact surface 16 of the temperature control block 16 of the heat transfer plate 17.
A plurality of protrusions 28 projecting in a block shape are formed on a, and the recesses 27 and the protrusions 28 are formed in a block shape having substantially the same shape and are arranged so as to face each other at the same position. In addition, the protrusion 28 is formed on the contact surface 13a of the partition wall 13,
The recess 27 may be formed on the contact surface 16 a of the temperature control block 16.

【0033】本実施例では、上述実施例の作用効果に加
え、隔壁13および伝熱板17には凹部27および凸部28が形
成され、それぞれの当接面13aおよび17aの表面積は大
きくされるとともに、この凹部27および凸部28は略同一
形状のブロック状に形成され同一位置に対向するよう配
設されているので、隔壁13および伝熱板17は密接して隔
壁13に対する伝熱板17の接触面積も大きくされ隔壁13へ
効率良く熱伝達される。したがって、キャビティ14の近
傍をより急速に加熱あるいは冷却することができる。
In this embodiment, in addition to the effects of the above-described embodiment, the partition wall 13 and the heat transfer plate 17 are provided with the concave portion 27 and the convex portion 28, and the surface areas of the respective contact surfaces 13a and 17a are increased. At the same time, since the concave portion 27 and the convex portion 28 are formed in a block shape having substantially the same shape and are arranged so as to face each other at the same position, the partition wall 13 and the heat transfer plate 17 are in close contact with each other and the heat transfer plate 17 for the partition wall 13 is closely contacted. The contact area is also increased, and heat is efficiently transferred to the partition wall 13. Therefore, the vicinity of the cavity 14 can be heated or cooled more rapidly.

【0034】図4および図5は本発明に係る金型の温度
調節構造の第3実施例を示す図であり、本実施例は請求
項1〜3、または5のいづれかに記載の発明に対応す
る。なお、本実施例では上述実施例と同様な構成には同
一の符号を付してその説明を省略する。図4において、
37は凹部、38は凸部であり、凹部37は伝熱板17の当接面
17aに第2熱媒体の流入方向に対して平行に複数本延在
するよう溝状に刻設されており、また凸部38は隔壁13の
当接面13aに凹部37と略同一形状で突出し同一位置で対
向するよう形成され複数本配設されている。
FIG. 4 and FIG. 5 are views showing a third embodiment of the mold temperature control structure according to the present invention. This embodiment corresponds to the invention described in any one of claims 1 to 3 or 5. To do. In this embodiment, the same components as those in the above-mentioned embodiment are designated by the same reference numerals and the description thereof will be omitted. In FIG.
37 is a concave portion, 38 is a convex portion, and the concave portion 37 is the contact surface of the heat transfer plate 17.
17a is formed in a groove shape so as to extend in parallel with the inflow direction of the second heat medium, and the convex portion 38 protrudes from the contact surface 13a of the partition wall 13 in substantially the same shape as the concave portion 37. Plural pieces are formed so as to face each other at the same position.

【0035】本実施例では、上述実施例の作用効果に加
え、伝熱板17の当接面17aに刻設されている凹部37によ
り第2熱媒体の流入方向に平行に延在する複数の溝が形
成されるとともに、隔壁13の当接面13aに突出し隣接し
ている凸部38の間にも同一方向に延在する平行な複数の
溝が形成されるので、伝熱板17と隔壁13との間に形成さ
れた第2温調用通路15aに供給される第2熱媒体はスム
ーズに流動され、その第2熱媒体の熱が隔壁13へ均一に
伝達される。したがって、キャビティ14の近傍の隔壁13
へ均一に熱伝達することができ、成形品の品質をより向
上させることができる。
In this embodiment, in addition to the effects of the above-described embodiment, a plurality of recesses 37 formed in the contact surface 17a of the heat transfer plate 17 extend in parallel to the inflow direction of the second heat medium. Since the grooves are formed and a plurality of parallel grooves extending in the same direction are formed between the adjacent convex portions 38 projecting from the contact surface 13a of the partition wall 13, the heat transfer plate 17 and the partition wall are formed. The second heat medium supplied to the second temperature control passage 15a formed between the second heat medium 13 and 13 is smoothly flowed, and the heat of the second heat medium is uniformly transferred to the partition wall 13. Therefore, the partition wall 13 near the cavity 14
Heat can be evenly transferred to the molded product, and the quality of the molded product can be further improved.

【0036】また、本実施例の他の態様としては、図5
(a)に示すように、伝熱板17を隔壁13に当接させ凹部
37を含む当接面17aと凸部38を含む当接面13aを密接さ
せた後、伝熱板17を隔壁13から離隔させて第2温調用通
路15aを画成する際、図5(b)に示すように、その離
隔距離を凹、凸部37、38の深さおよび高さ未満にして第
2温調用通路15aを凹、凸部37、38の表面のみで画成す
るよう構成されている。なお、図5は第2熱媒体の流入
方向に対して直交方向の断面図であるため、第1温調用
通路22、流入口23、および流出口24、は図示していな
い。
As another aspect of this embodiment, FIG.
As shown in (a), the heat transfer plate 17 is brought into contact with the partition wall 13
When the contact surface 17a including 37 and the contact surface 13a including the convex portion 38 are brought into close contact with each other and then the heat transfer plate 17 is separated from the partition wall 13 to define the second temperature control passage 15a, as shown in FIG. ), The distance is set to be less than the depth and height of the convex portions 37 and 38, and the second temperature control passage 15a is defined only by the surfaces of the concave portions and the convex portions 37 and 38. ing. Since FIG. 5 is a cross-sectional view in a direction orthogonal to the inflow direction of the second heat medium, the first temperature control passage 22, the inflow port 23, and the outflow port 24 are not shown.

【0037】このように、離隔距離を凹、凸部37、38の
深さおよび高さ未満にすることにより、伝熱板17を隔壁
13から離隔させたときでも凸部38の頂部が凹部37内に入
り込んだ状態にされ、凹、凸部37、38の間に第2温調用
通路15aを形成し、供給される第2熱媒体を効果的に隔
壁13の凸部38を含む当接面13aに接触させるとともに流
路面積が小さいことにより発生する乱流を第2熱媒体の
流動に発生させ、隔壁13へ第2熱媒体の熱を効率良く伝
達させるようにすることができる。
In this way, by setting the separation distance to be less than the depth and height of the concave portions and the convex portions 37 and 38, the heat transfer plate 17 is divided into partitions.
Even when it is separated from 13, the top of the convex portion 38 is kept in the concave portion 37, the second temperature adjusting passage 15a is formed between the concave portion and the convex portions 37, 38, and the second heat medium is supplied. Effectively contact the contact surface 13a including the convex portion 38 of the partition wall 13 and generate a turbulent flow in the flow of the second heat medium due to the small flow passage area, and the turbulent flow of the second heat medium to the partition wall 13 is generated. The heat can be efficiently transferred.

【0038】さらに、伝熱板17を隔壁13に再度近接させ
るときに、凹、凸部37、38のエッジが接触することがな
く、当接面13a、17aを密接させることができなくなっ
たり、破損してしまうことがない。図6は本発明に係る
金型の温度調節構造の第4実施例を示す図であり、本実
施例は請求項1〜5のいづれかに記載の発明に対応す
る。なお、本実施例では上述実施例と同様な構成には同
一の符号を付してその説明を省略する。
Further, when the heat transfer plate 17 is brought close to the partition wall 13 again, the edges of the concave portions and the convex portions 37 and 38 do not come into contact with each other, and the contact surfaces 13a and 17a cannot be brought into close contact with each other. It will not be damaged. FIG. 6 is a view showing a fourth embodiment of the mold temperature control structure according to the present invention, and this embodiment corresponds to the invention described in any one of claims 1 to 5. In this embodiment, the same components as those in the above-mentioned embodiment are designated by the same reference numerals and the description thereof will be omitted.

【0039】同図において、47は凹部、48は凸部であ
り、凹部47は伝熱板17の当接面17aに第2熱媒体の流入
方向に対して平行に複数本延在するよう溝状に刻設され
ており、また凸部48は隔壁13の当接面13aに突出し凹部
47と同一位置で対向するよう形成され複数本配設されて
いる。この凹部47は、互いに対向する側面を隔壁13から
離隔した底部側ほど近接するよう形成されており、第2
熱媒体の流入方向に直交する断面形状を隔壁13に近接す
るほど幅広となる所謂、逆台形状に形成されている。ま
た、凸部48は互いに対向する側面を伝熱板17に近接する
頂部側ほど近接するよう形成されており、第2熱媒体の
流入方向に直交する断面形状を凹部47の断面形状と略同
一形状で温調ブロック16に近接するほど幅狭となる所
謂、台形状に形成されている。
In the figure, 47 is a concave portion, 48 is a convex portion, and the concave portion 47 is a groove so that a plurality of concave portions 47 extend in the contact surface 17a of the heat transfer plate 17 parallel to the inflow direction of the second heat medium. The protrusion 48 protrudes from the contact surface 13a of the partition wall 13 and is recessed.
A plurality of 47 are formed so as to face each other at the same position as 47. The recesses 47 are formed so that side surfaces facing each other are closer to each other on the bottom side, which is separated from the partition wall 13.
The cross-sectional shape orthogonal to the inflow direction of the heat medium is formed in a so-called inverted trapezoidal shape, which becomes wider as it gets closer to the partition wall 13. Further, the convex portions 48 are formed such that side surfaces facing each other are closer to each other on the top side closer to the heat transfer plate 17, and the cross-sectional shape orthogonal to the inflow direction of the second heat medium is substantially the same as the cross-sectional shape of the concave portion 47. The shape is formed in a so-called trapezoidal shape that becomes narrower as it gets closer to the temperature control block 16.

【0040】本実施例では、上述実施例の作用効果に加
え、凸部48が台形状に形成され、凹部47が凸部48の頂部
よりも幅広で開口する逆台形状に形成されているので、
伝熱板17を隔壁13に近接させる際、凹、凸部47、48のエ
ッジが接触することがなく、当接面13a、17aを密接さ
せることができなくなったり、破損してしまうことがな
い。
In this embodiment, in addition to the effects of the above-mentioned embodiment, the convex portion 48 is formed in a trapezoidal shape, and the concave portion 47 is formed in an inverted trapezoidal shape which is wider than the top of the convex portion 48 and opens. ,
When the heat transfer plate 17 is brought close to the partition wall 13, the edges of the concave portions and the convex portions 47 and 48 do not come into contact with each other, and the contact surfaces 13a and 17a cannot be brought into close contact with each other or are not damaged. .

【0041】また、伝熱板17を隔壁13から離隔させて第
2温調用通路15aを画成する際、その離隔距離を凹、凸
部47、48の深さおよび高さ未満にすることにより、伝熱
板17を隔壁13から離隔させたときでも凸部48の頂部が凹
部47内に入り込んだ状態にして、凹、凸部47、48の側面
間にも第2温調用通路15aを形成し、供給される第2熱
媒体を効果的に隔壁13の凸部48を含む当接面13aに接触
させるとともに流路面積が小さいことにより発生する乱
流を第2熱媒体の流動に発生させ、隔壁13へ第2熱媒体
の熱を効率良く伝達させるようにすることができる。
Further, when the heat transfer plate 17 is separated from the partition wall 13 to define the second temperature control passage 15a, the separation distance is set to be less than the depth and height of the concave portions and the convex portions 47 and 48. Even when the heat transfer plate 17 is separated from the partition wall 13, the second temperature adjusting passage 15a is formed between the side surfaces of the concave portions and the convex portions 47 and 48 with the tops of the convex portions 48 entering the concave portions 47. Then, the supplied second heat medium is effectively brought into contact with the contact surface 13a including the convex portion 48 of the partition wall 13 and the turbulent flow generated by the small flow passage area is generated in the flow of the second heat medium. The heat of the second heat medium can be efficiently transmitted to the partition wall 13.

【0042】なお、本実施例では、第2熱媒体の流入方
向に延在するよう凹、凸部47、48を形成しているが、そ
の流入方向に所定角度で交叉(例えば、直交)するよう
形成して第2温調用通路15aを屈曲させて熱伝達の効率
を向上させてもよい。図7は本発明に係る金型の温度調
節構造の第5実施例を示す図であり、本実施例は請求項
1〜3、5または6のいづれかに記載の発明に対応す
る。なお、本実施例では上述実施例と同様な構成には同
一の符号を付してその説明を省略する。
In this embodiment, the concave portions and the convex portions 47 and 48 are formed so as to extend in the inflow direction of the second heat medium, but they intersect at a predetermined angle (for example, are orthogonal) in the inflow direction. The second temperature control passage 15a may be bent to improve the heat transfer efficiency. FIG. 7 is a view showing a fifth embodiment of the mold temperature control structure according to the present invention, and this embodiment corresponds to the invention described in any one of claims 1 to 5, 5 or 6. In this embodiment, the same components as those in the above-mentioned embodiment are designated by the same reference numerals and the description thereof will be omitted.

【0043】同図において、55aは第2温調用通路であ
り、第2温調用通路55aは伝熱板17を隔壁13に当接させ
凹部37を含む当接面17aと凸部38を含む当接面13aとを
密接させた後、温調ブロック16を隔壁13から離隔させる
離隔距離を凹、凸部37、38の深さおよび高さ未満にして
伝熱板17が隔壁13から離隔したとき、凹部37の開口部お
よび凸部38の頂部の側面が密接することにより隔壁13と
伝熱板17との間に形成される間隙が分割されて形成さ
れ、側板25の壁面と、凹部37を含まない伝熱板17の当接
面17aと、凸部38の側面のみと、によって画成されるよ
うになっており、この第2温調用通路55aのみに第2熱
媒体が前記第2温調システムから供給されるようになっ
ている。なお、図7は第2熱媒体の流入方向に対して直
交方向の断面図であるため、第1温調用通路22、流入口
23、および流出口24は図示していない。
In the figure, reference numeral 55a denotes a second temperature control passage, and the second temperature control passage 55a contacts the heat transfer plate 17 to the partition wall 13 and includes a contact surface 17a including a concave portion 37 and a convex portion 38. When the heat transfer plate 17 is separated from the partition wall 13 by bringing the temperature control block 16 away from the partition wall 13 after the contact surface 13a is brought into close contact with the partition wall 13 by setting the separation distance to be less than the depth and height of the convex portions 37 and 38. By closely contacting the openings of the recesses 37 and the side surfaces of the tops of the projections 38, the gap formed between the partition wall 13 and the heat transfer plate 17 is divided to form the wall surface of the side plate 25 and the recesses 37. It is configured to be defined by the contact surface 17a of the heat transfer plate 17 not included and only the side surface of the convex portion 38, and the second heat medium is provided only in the second temperature control passage 55a. It is supplied from the tone control system. Since FIG. 7 is a cross-sectional view in a direction orthogonal to the inflow direction of the second heat medium, the first temperature adjustment passage 22 and the inflow port
23 and outlet 24 are not shown.

【0044】本実施例では、上述実施例の作用効果に加
え、第2熱媒体が供給される第2温調用通路55aが側板
25の壁面と、凹部37を含まない伝熱板17の当接面17a
と、凸部38の側面のみとによって画成されるので、供給
される第2熱媒体に接触する伝熱板17は凹部37を除く一
部の当接面17aのみにされ、伝熱板17に伝達される第2
熱媒体の熱が少なくされ、第2熱媒体による隔壁13への
熱の伝達効率が向上される。したがって、第2温調用通
路55aに第2熱媒体を供給する際、伝熱板17の温度変化
(熱変化)を小さくすることができ、第2熱媒体の熱を
効率良く隔壁13に伝達することができる。その後、温調
ブロック16を伝熱板17を介して隔壁13に当接させて第1
温調用通路22に第1熱媒体を供給する際、伝熱板17の第
2熱媒体による温度変化が小さいため第1熱媒体の熱を
速やかに温調ブロック16から隔壁13に伝達することがで
きる。
In the present embodiment, in addition to the effects of the above-mentioned embodiment, the second temperature control passage 55a to which the second heat medium is supplied has the side plate.
25 and the contact surface 17a of the heat transfer plate 17 not including the recess 37
And only the side surface of the convex portion 38, the heat transfer plate 17 contacting the second heat medium to be supplied is limited to a part of the contact surface 17a excluding the concave portion 37. Second transmitted to
The heat of the heat medium is reduced, and the efficiency of heat transfer to the partition wall 13 by the second heat medium is improved. Therefore, when supplying the second heat medium to the second temperature adjusting passage 55a, the temperature change (heat change) of the heat transfer plate 17 can be reduced, and the heat of the second heat medium can be efficiently transferred to the partition wall 13. be able to. After that, the temperature control block 16 is brought into contact with the partition wall 13 via the heat transfer plate 17 so that the first
When the first heat medium is supplied to the temperature control passage 22, since the temperature change of the heat transfer plate 17 due to the second heat medium is small, the heat of the first heat medium can be quickly transferred from the temperature control block 16 to the partition wall 13. it can.

【0045】なお、上述実施例の第1、2熱媒体として
は、水、油、あるいはエアー等を用いることが可能であ
るが、熱効率から第1熱媒体には水または油が好適であ
る。また、温調ブロックを加熱機構として用いる場合に
は第1温調用通路に換えて他の加熱手段(例えば、ヒー
タ等)を用いてもよく、冷却機構として用いる場合には
他の冷却手段(例えば、ペルティエ素子等)を用いても
よい。
Although water, oil, air, or the like can be used as the first and second heat mediums in the above-described embodiment, water or oil is preferable as the first heat medium in terms of thermal efficiency. When the temperature control block is used as a heating mechanism, other heating means (for example, a heater) may be used in place of the first temperature control passage, and when it is used as a cooling mechanism, another cooling means (for example, , Peltier elements, etc.) may be used.

【0046】[0046]

【発明の効果】請求項1記載の発明によれば、温調ブロ
ックおよび隔壁の間に伝熱板を挿嵌しして、伝熱板を介
して温調ブロックおよび隔壁が密接した状態で隔壁へ第
1熱媒体から熱伝達し、また温調ブロックが伝熱板から
離隔した状態で隔壁へ第2熱媒体から熱伝達するので、
温調ブロックへの第2熱媒体からの熱伝達はなく、温調
ブロックが熱変化(温度変化)することはない。そのた
め、第1、2熱媒体から効率良く熱伝達することがで
き、キャビティ近傍を必要に応じて急速に加熱あるいは
冷却することができる。その結果、成形サイクルを短縮
するとともに、高品質の成形品を成形可能な金型の温度
調節構造を提供することができる。
According to the invention of claim 1, a heat transfer plate is inserted between the temperature control block and the partition wall, and the partition wall is in a state in which the temperature control block and the partition wall are in close contact with each other via the heat transfer plate. Since the heat is transferred from the first heat medium to the partition wall in the state where the temperature control block is separated from the heat transfer plate,
There is no heat transfer from the second heat medium to the temperature control block, and the temperature control block does not change heat (change in temperature). Therefore, heat can be efficiently transferred from the first and second heat mediums, and the vicinity of the cavity can be rapidly heated or cooled as needed. As a result, it is possible to shorten the molding cycle and provide a temperature control structure of a mold capable of molding a high quality molded product.

【0047】請求項2記載の発明によれば、伝熱板およ
び隔壁の互いに密接する当接面に凹、凸部を形成して、
凹、凸部を含む当接面を隙間なく密接するよう形成する
ので、伝熱板と隔壁との密接面積を大きくすることがで
き、第1、2熱媒体により効率良く急速に加熱あるいは
冷却することができる。したがって、成形サイクルをよ
り短縮することができる。
According to the second aspect of the present invention, the heat transfer plate and the partition wall are provided with concave and convex portions on the contact surfaces that are in close contact with each other,
Since the contact surfaces including the concave and convex portions are formed so as to be in close contact with each other without a gap, the contact area between the heat transfer plate and the partition wall can be increased, and the first and second heat medium can be heated or cooled efficiently and rapidly. be able to. Therefore, the molding cycle can be further shortened.

【0048】請求項3記載の発明によれば、伝熱板およ
び隔壁のそれぞれの当接面に互いに平行な溝を形成する
よう一方に複数本の凹部を他方に複数本の凸部を設けて
いるので、伝熱板と隔壁との間に形成される第2温調用
通路に第2熱媒体をスムーズに流動させキャビティ近傍
の隔壁へ均一に熱伝達することができ、成形品の品質を
より向上させることができる。
According to the third aspect of the invention, a plurality of concave portions are provided on one side and a plurality of convex portions are provided on the other side so as to form grooves parallel to each other on the contact surfaces of the heat transfer plate and the partition wall. Since the second heat medium is smoothly flowed in the second temperature control passage formed between the heat transfer plate and the partition wall, the heat can be evenly transferred to the partition wall in the vicinity of the cavity, thereby improving the quality of the molded product. Can be improved.

【0049】請求項4記載の発明によれば、伝熱板また
は隔壁の一方側に形成する凹部の断面形状を他方側に近
接するほど幅広となる所謂、逆台形状に形成し、他方側
に形成する凸部の断面形状を一方側に近接するほど幅狭
となる所謂、台形状に形成するので、伝熱板を隔壁に近
接させる際、凹、凸部のエッジが接触して当接面の密接
を妨げたり、破損してしまうことがなく、信頼性を向上
させることができる。
According to the fourth aspect of the present invention, the cross-sectional shape of the concave portion formed on one side of the heat transfer plate or the partition wall is formed in a so-called inverted trapezoidal shape which becomes wider as it approaches the other side, and is formed on the other side. Since the cross-sectional shape of the convex portion to be formed is formed into a so-called trapezoidal shape in which the width becomes narrower as it comes closer to one side, when the heat transfer plate is brought close to the partition wall, the edges of the concave portion and the convex portion come into contact with each other. It is possible to improve the reliability without hindering the close contact and damage.

【0050】請求項5記載の発明によれば、凹部の深さ
および凸部の高さを伝熱板と隔壁との離隔距離よりも大
きく形成し、伝熱板を隔壁から離隔させたときでも凸部
の頂部が凹部内に入り込んだ状態にするので、凹、凸部
の間に第2温調用通路を形成し、またはそれに加え凹、
凸部の側面間にも第2温調用通路を形成して第2熱媒体
を効果的に隔壁の凹部または凸部を含む当接面に接触さ
せるとともにこの第2熱媒体の流動に乱流を発生させ、
第2熱媒体から隔壁へ効率良く熱伝達することができ
る。したがって、キャビティ近傍をより急速に加熱ある
いは冷却することができ、成形サイクルをより短縮する
ことができる。
According to the invention of claim 5, the depth of the concave portion and the height of the convex portion are formed larger than the separation distance between the heat transfer plate and the partition wall, and even when the heat transfer plate is separated from the partition wall. Since the top of the convex portion is set in the concave portion, a second temperature control passage is formed between the concave portion and the convex portion, or in addition to that, a concave portion is formed.
A second temperature control passage is also formed between the side surfaces of the convex portion to effectively bring the second heat medium into contact with the contact surface including the concave portion or the convex portion of the partition wall, and to cause turbulence in the flow of the second heat medium. Generate
Heat can be efficiently transferred from the second heat medium to the partition wall. Therefore, the vicinity of the cavity can be heated or cooled more rapidly, and the molding cycle can be further shortened.

【0051】また、伝熱板を隔壁から離隔させたときで
も凸部の頂部が凹部内に入り込んだ状態で、伝熱板を隔
壁に近接させる際、凹、凸部のエッジが接触することが
ないので、当接面の密接を妨げたり、破損してしまうこ
とがなく、信頼性を向上させることができる。請求項6
記載の発明によれば、伝熱板と隔壁との間に形成される
間隙を分割して隔壁側に形成された間隙のみを第2温調
用通路として第2熱媒体を供給するので、伝熱板と第2
熱媒体との接触を当接面の一部にして伝熱板への第2熱
媒体からの熱伝達を少なくすることができ、第2温調用
通路に第2熱媒体を供給する際の伝熱板の熱変化(温度
変化)を小さくすることができる。そのため、伝熱板を
隔壁から離隔させて第2熱媒体により効率良く加熱ある
いは冷却することができ、その後、伝熱板を介して温調
ブロックを隔壁に密接させて速やかに第1熱媒体により
冷却あるいは加熱することができる。したがって、成形
サイクルをより短縮することができる。
Further, even when the heat transfer plate is separated from the partition wall, when the heat transfer plate is brought close to the partition wall with the top of the convex portion intruding into the recess portion, the edges of the concave and convex portions may come into contact with each other. Since it does not exist, it is possible to improve reliability without hindering the contact surface from being intimately contacted or being damaged. Claim 6
According to the invention described above, the gap formed between the heat transfer plate and the partition wall is divided, and the second heat medium is supplied only through the gap formed on the partition wall side as the second temperature control passage. Board and second
The heat transfer from the second heat medium to the heat transfer plate can be reduced by making contact with the heat medium as a part of the contact surface, and the heat transfer at the time of supplying the second heat medium to the second temperature control passage can be reduced. The heat change (temperature change) of the hot plate can be reduced. Therefore, the heat transfer plate can be separated from the partition wall and efficiently heated or cooled by the second heat medium. After that, the temperature control block is brought into close contact with the partition wall via the heat transfer plate to quickly use the first heat medium. It can be cooled or heated. Therefore, the molding cycle can be further shortened.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る金型の温度調節構造の第1実施例
の全体構成を示す断面図であり、(a)はその第1熱媒
体の供給時を示す状態図、(b)はその第2熱媒体の供
給時を示す状態図である。
FIG. 1 is a cross-sectional view showing an overall configuration of a first embodiment of a temperature control structure for a mold according to the present invention, FIG. 1A is a state diagram showing the supply of a first heat medium, and FIG. It is a state diagram showing the time of supply of the second heat medium.

【図2】その要部を示す一部拡大断面図であり、(a)
はその第1熱媒体の供給時を示す状態図、(b)はその
第2熱媒体の供給時を示す状態図である。
FIG. 2 is a partially enlarged cross-sectional view showing a main part thereof, (a)
Is a state diagram showing the time of supplying the first heat medium, and FIG. 9B is a state diagram showing the time of supplying the second heat medium.

【図3】本発明に係る金型の温度調節構造の第2実施例
の要部を示す斜視図である。
FIG. 3 is a perspective view showing an essential part of a second embodiment of the mold temperature control structure according to the present invention.

【図4】本発明に係る金型の温度調節構造の第3実施例
の要部を示す斜視図である。
FIG. 4 is a perspective view showing a main part of a third embodiment of the mold temperature control structure according to the present invention.

【図5】その他の態様の全体構成を示す断面図であり、
(a)はその第1熱媒体の供給時を示す状態図、(b)
はその第2熱媒体の供給時を示す状態図である。
FIG. 5 is a cross-sectional view showing an overall configuration of another aspect,
(A) is a state diagram showing the supply of the first heat medium, (b)
[Fig. 6] is a state diagram showing the time of supplying the second heat medium.

【図6】本発明に係る金型の温度調節構造の第4実施例
の要部を示す斜視図である。
FIG. 6 is a perspective view showing an essential part of a fourth embodiment of the temperature control structure for a mold according to the present invention.

【図7】本発明に係る金型の温度調節構造の第5実施例
の全体構成を示す断面図であり、(a)はその第1熱媒
体の供給時を示す状態図、(b)はその第2熱媒体の供
給時を示す状態図である。
FIG. 7 is a cross-sectional view showing the overall structure of a fifth embodiment of the mold temperature control structure according to the present invention, FIG. 7 (a) is a state diagram showing the supply of the first heat medium, and FIG. It is a state diagram showing the time of supply of the second heat medium.

【符号の説明】[Explanation of symbols]

11、12 金型 13 隔壁 13a、16a、17a、17b 当接面 14 キャビティ 15 温調室 15a、55a 第2温調用通路 16 温調ブロック 17 伝熱板 22 第2温調用通路 27、37、47 凹部 28、38、48 凸部 11, 12 Mold 13 Partition walls 13a, 16a, 17a, 17b Contact surface 14 Cavity 15 Temperature control chamber 15a, 55a Second temperature control passage 16 Temperature control block 17 Heat transfer plate 22 Second temperature control passage 27, 37, 47 Recess 28, 38, 48 Convex

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】金型の隔壁を挟み、キャビティに隣接する
金型の内部に設けられた温調室と、温調室に嵌挿され、
隔壁に近接、離隔可能に設けられた温調ブロックと、温
調ブロックに設けられ、第1熱媒体が供給される第1温
調用通路と、を備えた金型の温度調節構造であって、 前記温調室内の隔壁と温調ブロックとの間に嵌挿され、
該温調ブロックの移動とともに同一方向に温調室内を摺
動する伝熱板を設け、 温調ブロックが隔壁に近接したときには伝熱板を介して
該温調ブロックおよび隔壁は当接して密接し、温調ブロ
ックが隔壁から離隔したときには伝熱板は該温調ブロッ
クおよび隔壁から離隔して温調室内で該伝熱板と隔壁と
の間に形成された間隙を第2温調用通路として第2熱媒
体を供給するようにしたことを特徴とする金型の温度調
節構造。
1. A temperature control chamber provided inside a mold adjacent to a cavity with a partition wall of the mold sandwiched between the temperature control chamber and the temperature control chamber.
A temperature control structure for a mold, comprising: a temperature control block provided so as to be close to and separable from a partition wall; and a first temperature control passage provided in the temperature control block and supplied with a first heat medium, Inserted between the partition wall and the temperature control block in the temperature control chamber,
A heat transfer plate that slides in the temperature control chamber in the same direction as the temperature control block moves is provided, and when the temperature control block approaches the partition wall, the temperature control block and the partition wall contact and closely contact via the heat transfer plate. When the temperature control block is separated from the partition wall, the heat transfer plate is separated from the temperature control block and the partition wall, and a gap formed between the heat transfer plate and the partition wall in the temperature control chamber is used as a second temperature control passage. (2) A temperature control structure for a mold, characterized in that a heat medium is supplied.
【請求項2】伝熱板または隔壁の当接面の一方側に凹部
を、他方側に凸部を設け、 該凹、凸部を含む当接面を、当接したとき隙間なく密接
するよう形成したことを特徴とする請求項1記載の金型
の温度調節構造。
2. A concave portion is provided on one side of a contact surface of a heat transfer plate or a partition wall, and a convex portion is provided on the other side of the contact surface so that the contact surfaces including the concave portion and the convex portion are closely contacted with each other without a gap. The mold temperature control structure according to claim 1, which is formed.
【請求項3】前記凹部を、所定方向へ平行に延在するよ
う複数本形成し、 前記凸部を、凹部と同一方向へ平行に延在するよう複数
本形成したことを特徴とする請求項2記載の金型の温度
調節構造。
3. The plurality of recesses are formed so as to extend parallel to a predetermined direction, and the plurality of projections are formed so as to extend parallel to the same direction as the recesses. The mold temperature control structure according to 2.
【請求項4】前記凹部の互いに対向する側面を、底部側
ほど近接するよう形成し、 前記凸部の互いに対向する側面を、頂部側ほど近接する
よう形成したことを特徴とする請求項2記載の金型の温
度調節構造。
4. The recesses are formed so that side surfaces facing each other are closer to each other on the bottom side, and side surfaces facing each other on the projection are formed to be closer to each other on the top side. Mold temperature control structure.
【請求項5】前記凹部の深さおよび凸部の高さを、前記
温調用ブロックと隔壁との離隔距離よりも大きく形成し
たことを特徴とする請求項2記載の金型の温度調節構
造。
5. The mold temperature control structure according to claim 2, wherein the depth of the concave portion and the height of the convex portion are formed to be larger than the distance between the temperature control block and the partition wall.
【請求項6】前記凹部の開口部および凸部の頂部の側面
を、前記伝熱板が隔壁から離隔したとき密接するよう形
成して該伝熱板と隔壁との間に形成される間隙を分割
し、 隔壁側に形成された間隙のみを第2温調用通路として第
2熱媒体を供給するようにしたことを特徴とする請求項
5記載の金型の温度調節構造。
6. The opening of the recess and the side surface of the top of the projection are formed so as to come into close contact with each other when the heat transfer plate is separated from the partition wall to form a gap formed between the heat transfer plate and the partition wall. The temperature control structure for a mold according to claim 5, wherein the second heat medium is divided and only the gap formed on the partition wall side is used as the second temperature control passage.
JP29375293A 1993-11-25 1993-11-25 Mold temperature control structure Expired - Fee Related JP3143005B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29375293A JP3143005B2 (en) 1993-11-25 1993-11-25 Mold temperature control structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29375293A JP3143005B2 (en) 1993-11-25 1993-11-25 Mold temperature control structure

Publications (2)

Publication Number Publication Date
JPH07144353A true JPH07144353A (en) 1995-06-06
JP3143005B2 JP3143005B2 (en) 2001-03-07

Family

ID=17798773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29375293A Expired - Fee Related JP3143005B2 (en) 1993-11-25 1993-11-25 Mold temperature control structure

Country Status (1)

Country Link
JP (1) JP3143005B2 (en)

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WO2009028745A1 (en) 2007-08-28 2009-03-05 Lg Electronics Inc. Injection moldings, injection-molding apparatus and method thereof
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