JPH07142817A - One-piece printed wiring board molded product - Google Patents

Abstract

PURPOSE:To provide a one-piece printed wiring board molded product in which the contamination of a circuit face caused by adhesive from the rear side, etc., can be avoided even if a printed wiring board which has through-holes and circuit patterns on both the surfaces is unified molded in one body. CONSTITUTION:In a one-piece printed wiring board molded product which is composed of a printed wiring board 1 unified with a resin-molded item, required circuit patterns 2a and 2b are provided on both surfaces of the base sheet 3 of the printed wiring board 1 and at least one through-hole 7 is provided on the sheet 3. Further, a heat-sensitive adhesive layer 4, a cover film 5 and an adhesive layer 6 are successively formed into layers on the circuit pattern surface which is to be bonded to the resin-molded element.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated printed wiring board molded product by injection molding or the like, and an integrated printed wiring board molded product obtained by integrally molding printed wiring boards having predetermined circuit patterns on both front and back surfaces. Regarding the body

[0002]

2. Description of the Related Art Recently, audio, computer, 8
Electric products such as millivideos and mobile phones have advanced in performance, and along with this, there is an increasing need for miniaturization, weight reduction, and thinning. Conventionally, printed wiring boards for such electrical products have been manufactured by using a rigid electrically insulating substrate such as glass cloth-based epoxy resin or paper-based phenolic resin, or a flexible substrate such as polyimide film or polyester film with copper on the surface. It has been manufactured by a method of forming a circuit by etching after applying a foil or the like (subtractive method), a method of forming a circuit on a substrate by electroless plating or electrolytic plating (additive method), and the like.

In recent years, as a method of manufacturing a printed wiring board, a method has been used in which an injection-molded resin molded body is electroless plated, etched to form an electric circuit, and a solder resist is provided thereon. ing. According to the above method, the printed wiring board is not limited to a flat surface and can have a three-dimensional shape. Therefore, the wiring board itself can be used as a part of the housing or a part of the component.
Moreover, there is an advantage that the wiring board mounting and the formation of the electric component mounting holes can be simultaneously performed by injection molding.

[0004]

However, in the above method, it is necessary to perform metal plating, etching, and further solder resist processing on the molded body for a printed wiring board having a desired three-dimensional shape. There is a problem that it is complicated.

For the purpose of solving such a problem, for example, in JP-A-2-7592, a so-called printed wiring board sheet on which a conductive circuit is formed is inserted into an injection molding die for injection molding. , A method of manufacturing a three-dimensionally shaped printed wiring board molded body has been proposed. However, in the integrated printed wiring board molded body created by this method, when using a printed wiring board having a predetermined circuit pattern and through holes on both front and back surfaces, the pattern (backside circuit pattern) surface to be bonded to the resin molded body The adhesive layer provided on the side of the circuit pattern on the opposite side (front side circuit pattern) contaminates the circuit pattern on the opposite side via the through hole due to the heat and injection pressure of the injection resin at the time of its application or at the time of injection molding. There is a problem of causing it.

Therefore, according to the present invention, there is no backing of the adhesive and there is no problem in terms of performance even when integrally formed by using a printed wiring board having a predetermined circuit pattern and through holes on both front and back surfaces. An object is to provide an integrated printed wiring board molded body with high productivity.

[0007]

The above object can be achieved by the present invention described below. That is, the integrated printed wiring board molded body of the present invention has a structure of the printed wiring board in which predetermined circuit patterns and one or more through holes are provided on both surfaces of the base material, and resin molding is performed at the time of integral molding. A cover film is laminated on the entire surface of the circuit pattern surface on the side to be adhered to the body through a heat-reactive adhesive layer, and an adhesive layer is further provided on the cover film. An integrated printed wiring board molded body is formed by integrally molding so that the layers are in contact with the resin molded body.

[0008]

As described above, in the integrated printed wiring board molded body of the present invention, the printed wiring board has predetermined circuit patterns on both front and back surfaces of the base material, and also has one or more through holes. A cover film was laminated on the entire surface of the circuit pattern on the side to be adhered to the resin molded body during integral molding, with a heat-reactive adhesive layer interposed, and an adhesive layer was provided on the cover film. The composition is adopted. Therefore, the adhesive applied on the cover film is shielded from the circuit pattern and the through holes by the cover film, and the adhesive is applied at the time of the application and at the time of injection molding for integral molding which is a later step. Does not go around through the through hole to contaminate the circuit pattern on the opposite side, and the conduction at the through hole portion is not destroyed by heat or resin pressure during injection molding. The heat-reactive adhesive that attaches the cover film to the circuit pattern surface is applied to the cover film side by the melt extrusion method and adhered to the circuit pattern surface by thermocompression bonding, so problems such as backing from the through hole do not occur. Does not happen.

[0009]

The present invention will be described in more detail with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing one embodiment of the integrated printed wiring board molded body of the present invention, and FIG. 2 explains the main part of the printed wiring board used in the integrated printed wiring board molded body of the present invention. FIG. FIG. 3 is a schematic perspective view illustrating an embodiment of the integrated printed wiring board molded body of the present invention. FIG. 4 is a schematic cross-sectional view showing a state in which the printed wiring board is inserted into the injection molding die for manufacturing the integrated printed wiring board molded body of the present invention.

The integrated printed wiring board molded body 13 of the present invention
As shown in FIGS. 1 to 3, in the printed wiring board 1 in which predetermined circuit patterns 2a and 2b are formed on both front and back surfaces of the base material 3 and at least one through hole 7 is provided, integrated molding is performed. At this time, the cover film 5 is provided on the surface of the circuit pattern 2b on the side to be adhered to the resin molded body 11 via the heat-reactive adhesive layer 4, and further the adhesive layer 6 is provided on the cover film 5. The adhesive layer 6 is integrally molded so as to be in contact with the resin molded body 11. Therefore, normally, no electronic component is mounted on the circuit pattern 2b, and the circuit patterns 2a and 2b are electrically connected through the through hole 7 having the copper plating 9.

Various plastic films can be preferably used as the base material 3 of the printed wiring board 1 used in the integrated printed wiring board molded body 13 of the present invention, as well as a glass cloth base material epoxy resin impregnated substrate or paper base. Although the material phenol resin-impregnated substrate and the like have some restrictions, for example, when the installation location on the integrated resin molded body 11 is a relatively flat surface,
Or, even on a three-dimensional three-dimensional surface, the gradient is comparatively gentle,
It can be used sufficiently when the aperture is relatively shallow. As described above, the circuit patterns 2a (front surface) and 2b (rear surface) are provided on both surfaces of the base material 3, and the insulating resin layer 10 is provided on the front surface side circuit pattern 2a as required. You can On the surface of the back side circuit pattern 2b on which electronic parts are not mounted, a metal layer may be left in a blank portion of the circuit pattern 2b to serve as an electromagnetic wave shield layer. If the circuit pattern 2b is not particularly required, the whole surface may be used. An electromagnetic wave shield layer (not shown) may be provided by providing a metal layer on the.

Materials used for the integrated printed wiring board molded body 13 of the present invention, a manufacturing method, and the like will be described below. [Substrate] In the present invention, the plastic film is mainly used as the substrate 3 used for the printed wiring board 1, but in terms of physical properties, heat resistance is obtained because the electronic component is welded to the circuit pattern 2a surface by soldering or the like. Need to be
Those having excellent flexibility and flexibility are preferable. Examples of films having such properties include polyesters such as polyethylene terephthalate and polyethylene-2,6-naphthalate, polyether sulfones, polyether ether ketones, aromatic polyamides, polyarylates, polyimides, polyamideimides, polyetherimides, Films of polyphenylene sulfide (PPS) and their halogen or methyl group-substituted products can be used. Of these, the polyimide film is particularly preferable. The thickness of the film is usually 1
It is about 2 μm to 300 μm, and more preferably in the range of 25 μm to 80 μm.

[Circuit pattern and electromagnetic wave shield layer]
For example, the polyimide film is used as the base material 3, and the circuit patterns 2a and 2b provided thereon are formed by laminating a conductive metal foil such as copper or aluminum on the base material 3 to form a conductive metal layer. Can be formed by a conventional method such as a subtractive method of forming a circuit by etching with a photoresist method or an additive method of forming a circuit on the base material 3 by electroless plating or electrolytic plating.

The conductive metal layer may be formed of a conductive metal such as copper or aluminum as a thin film layer on the substrate 3 by a vacuum deposition method, a sputtering method, an ion plating method, or the like. As described above, a foil of a conductive metal such as copper or aluminum may be attached to the base material 3 by using an adhesive agent. In any case, the circuit patterns 2a and 2b can be provided by etching the formed conductive metal layer by a photoresist method or the like.

If necessary, a circuit pattern 2b is provided on the surface (back surface) of the printed wiring board 1 that is to be bonded to the resin molded body 11. If the circuit pattern 2b is a partial pattern, A metal layer can be separately formed at the same time as the formation of the circuit pattern over the remaining blank portion to serve as an electromagnetic wave shield layer. Further, when the circuit pattern 2b is not particularly required, a metal layer may be provided on the entire surface instead of the circuit pattern to serve as an electromagnetic wave shield layer or used as a ground electrode. In this case, a through hole 7 is provided at a predetermined position of the base material 3 in advance, the metal layers on both sides are electrically connected through the through hole 7, and the circuit pattern 2a on the front surface side can be connected to the ground. .

The circuit pattern 2a of the printed wiring board 1 is
On the surface of the above-mentioned film-made substrate 3 provided with a conductive metal layer, an etching resist is applied only to a necessary portion as a conductor pattern by a silk screen printing method or the like, and after drying,
An etching solution such as ferric chloride is sprayed onto the exposed metal layer to dissolve and remove the metal layer other than the conductor pattern.
After that, the etching resist is peeled off with a strong alkali to complete the conductor pattern. Then, the metal terminal portion on which the electronic component is mounted is previously plated with solder or tin. When the electromagnetic wave shield layer is provided on the surface of the base material 3 opposite to the circuit pattern 2a, it is preferable that the metal vapor deposition layer is provided first and the metal plating layer is provided thereon. The same materials and the like as those used for the above-mentioned circuit pattern can be used for the metal vapor deposition layer and the metal plating layer.

In the present invention, the printed wiring board 1 can be appropriately provided with circuit pattern 2a, 2b forming marks, mold setting marks, mounting marks and the like. These marks correspond to the circuit patterns 2a and 2 respectively.
Before the formation of b, or at the time of formation or the circuit patterns 2a, 2
It may be provided by printing after forming b (or the insulating resin layer 10). If such a mark is provided, the circuit pattern 2 can be obtained by using the image identification device.
Printing of etching resists a, 2b, setting of the printed wiring board 1 in the mold of the injection molding machine, mounting of electronic parts, etc. can be performed without error. This is effective for accurate positioning of component mounting because the surface of the printed wiring board 1 adhered to the inner surface of the housing molded body may not be flat. In particular, the mold setting mark can set the printed wiring board 1 on the mold so as to correct the deviation of the printed wiring board 1 due to the injection of the resin, etc., depending on the resin used, the injection pressure, etc. preferable.

[Heating Reactive Adhesive and Cover Film] The surface (back surface) of the printed wiring board 1 on which the circuit patterns 2a, 2b and one or more through holes 7 are bonded is bonded to the resin molded body 11 (back surface). The cover film 5 is provided via the heat-reactive adhesive layer 4. The heat-reactive adhesive layer 4 is previously applied to the cover film 5 by a melt extrusion method,
The printed circuit board 1 is laminated on the circuit pattern 2b surface (back surface) by thermocompression bonding with a heat roll or the like. As the cover film 5, a polyimide film, a polyester film, or the like having heat resistance and strength is used.
A heat-reactive adhesive layer 4 such as a pressure sensitive type or a hot melt type is provided. This heat-reactive adhesive layer 4 also needs heat resistance because an electronic component is mounted on the surface of the circuit pattern 2a on the front side of the base material 3 by soldering, and a thermosetting adhesive is usually used. For example, an epoxy resin or acrylic resin adhesive can be used.

[Adhesive Layer] The adhesive layer 6 provided on the cover film 5 adheres the printed wiring board 1 to the resin molded body 11 integrally formed by injection molding with good followability. It is a layer for the above, and can be appropriately set depending on the type of resin used for the resin molded body 11 which is the casing and the material of the cover film 5. For example, the resin molded body 11
When a polyamide is used as the resin and a polyimide film is used as the cover film 5, an epoxy adhesive may be used, and the resin of the resin molded body 11 may be acrylonitrile-
When a butadiene-styrene copolymer resin (ABS resin) is used and a polyester film is used as the cover film 5, a polyester adhesive may be used.

The above-mentioned adhesive is usually adjusted in viscosity with a solvent, applied on the cover film 5 by a method such as roll coating or screen printing, and dried. The amount of the adhesive applied is 5 μm to 15 μm depending on the thickness of the adhesive layer 5.
A degree is preferable. When the thickness is 5 μm or less, the adhesive strength is weak, the wiring board and the injection resin are not sufficiently adhered, and the wiring board may float. On the other hand, if the thickness exceeds 15 μm, the adhesive may flow due to the injection pressure at the time of injection of the resin, sticking out from the end of the coating surface and adhering to the circuit surface on the front side, which may cause poor circuit conductivity. Absent.

[Release film (not shown)] When the adhesive-coated surface has tack, the release film is releasably attached and covered until before integral molding such as injection molding. be able to. A release agent such as silicone is usually applied to the release film, and a moisture-proof substrate is used to avoid deterioration of the adhesive due to moisture absorption, and a biaxially stretched polyester film or the like is usually used. The thickness of the release film is
30 μm to 100 μm is suitable, and if it is 30 μm or less, peeling work before molding is difficult, and if it is 100 μm or more, it is not functionally necessary, which is disadvantageous in terms of cost.

[Integral Molding Method of Integrated Printed Wiring Board Mold] Next, the integrated printed wiring board mold of the present invention 13
The integral molding method will be described. Printed wiring board 1
In most cases, the injection molding method is used for the integral molding of the resin molded body 11 which is the casing, and as shown in FIGS. 1 to 4, a predetermined circuit pattern 2a, Two
A printed wiring board in which b is formed, one or more through holes 7 are provided, a cover film 5 is provided on the surface of the circuit pattern 2b via a heat-reactive adhesive layer 4, and an adhesive layer 6 is further formed thereon. 1 is used. Then, first, when a release film is attached to the surface of the adhesive layer 6 of the printed wiring board 1, the release film is peeled off and removed, and the surface of the circuit pattern 2a is injected into one mold (male mold) for injection molding. ) 14 fixed toward a predetermined position and one (or a plurality of) injection gates 12
In combination with the other mold (female mold) 15 having the above, the molten resin is injected from the injection gate 12, and the printed wiring board 1
Is integrally molded with the resin molded body 11 having a predetermined shape via the adhesive layer 6.

The injection molding resin is not particularly limited as long as it can be injection-molded. However, since an electronic component is soldered to the surface of the front side circuit pattern 2a, it has heat resistance enough to withstand this. Those having are preferable, for example, various polyamides, polyarylates (PAR), polysulfones (PSF), polyetherimides (PE).
I), polyamideimide (PAI), polyether sulfone (PES), polyphenylene sulfide (PP)
S), polyimide (PI), polyetheretherketone (PEEK), liquid crystal polymer (LCP), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS) Resin), a fluorine-based resin, or the like, or a polymer alloy of two or more kinds among these can be used. Among these, particularly high heat-resistant polyamide such as 46 nylon and modified polyamide 6T, polyphenylene sulfide (PP
S), liquid crystal polymer (LCP) and the like are preferable. The molding conditions of these resins can be set and molded according to conventionally known conditions depending on the resin used.

Further, in the present invention, for the purpose of further improving the physical properties such as heat resistance of the resin for injection molding, an inorganic filler such as glass fiber or talc can be blended with the resin. The content of these inorganic fillers is about 10 to 50% by weight, and 15 to 40% by weight, based on the total weight of the resin for injection molding and the inorganic filler.
The degree is more preferable. When the content of the inorganic filler is 10% by weight or less, the effect of improving the heat resistance due to the content is not sufficient, and when it exceeds 50% by weight, the moldability is deteriorated and the appearance is deteriorated, which is not preferable.

In FIG. 4, the injection mold is a male mold 14
And a female mold 15, and a cavity 16 is formed when the male mold 14 and the female mold 15 are closed. The surface of the male mold 14 is subjected to a matte treatment, and various three-dimensional surfaces corresponding to the inner wall surface of the integrated printed wiring board molded body 13 are formed. Further, the male mold 14 is provided with one or a plurality of suction ports 17 for fixing the printed wiring board 1 by suction,
Further, although not shown, a retaining pin to be inserted into a through hole 18 provided in the printed wiring board 1 is provided on the flat portion of the male mold 14. The retaining pin can be moved back and forth in the through hole 18, and the retaining pin is retracted in response to the closing of the male mold 14 and the female mold 15 or injection of resin. It is preferable that the retaining pin is not completely retracted at the time of injection of the resin, and the retaining pin is formed to have a thickness equal to or larger than the thickness of the printed wiring board 1. If the retaining pin is left in this way, it is possible to prevent the injection resin from being lined from the through hole 18 to the front side of the printed wiring board 1 by the resin pressure at the time of injection of the resin.

On the other hand, the female die 15 is provided with the injection gate 12, but the number of the injection gate 12 is one in FIG. 4, but the number is not limited to one, and the size and shape of the molded product are provided. You may provide a plurality by these. In this case, it is preferable that the number and positions of the through holes correspond to the number and positions of the injection gates. The female die 15 is movable in the left-right direction in FIG. 4 with respect to the male die 14.

In such an apparatus, first, the female die 15 is set to the backward limit position (moved from the position in FIG. 4 to the left side), and the male die 15 is moved.
With the 14 and the female die 15 opened, the printed wiring board 1
Are installed so that the adhesive layer 6 faces the female mold side. Male 14
The printed wiring board 1 installed above is held in a state of being perfectly positioned on the surface of the male mold 14 by sucking air from the suction port 17. The printed wiring board 1
To match the shape of the male mold 14 as needed,
Preforming can be performed in advance by vacuum forming, pressure forming, or the like.

Next, the female die 15 is advanced to the male die 14, and the die is closed to form the cavity 16. Then, the molten resin is injected through the injection gate 12 and the cavity 16
The whole is filled. In this way, after the injection molding is finished and cooled, the female mold 15 is retracted, and the mold is released by the action of an ejector pin or a stopper plate (not shown) to obtain an integrated printed wiring board molded body 13. it can. When a thermosetting adhesive such as an epoxy adhesive is used for the adhesive layer 6, in order to strengthen the adhesion between the printed wiring board 1 and the resin molded body 11 by the injection resin, the adhesive conditions may be changed. It is preferable to apply an appropriate heat treatment. The conditions of the heat treatment are 100 to 150 ° C. and 1 to 10 hours, and more preferably 100 to 120 ° C. and 1 to 3 hours. If the heat treatment temperature is 100 ° C. or lower, it takes a long time to cure, and if the curing is insufficient, strong adhesion cannot be obtained.
On the other hand, if the heat treatment temperature exceeds 150 ° C., the adhesive component is decomposed and the decomposed gas or the like easily causes swelling failure or the like in the printed wiring board 1, which is not preferable. Appropriate heat treatment can be easily performed with an apparatus such as an oven capable of controlling the temperature.

Next, the present invention will be described more specifically with reference to Examples and Comparative Examples. (Example 1) A polyimide film having a thickness of 25 μm was used as a base material, and after plasma treatment was applied to both surfaces thereof, a copper thin film layer was provided with a sputtering device to a thickness of about 500 Å, and a copper plating layer was formed thereon. It was formed with a thickness of 5 μm. Next, predetermined circuit patterns 2a and 2b were formed on both surfaces by the subtractive method, and through holes were further provided at predetermined positions. Subsequently, a resist ink is printed by silk screen printing on a portion other than the junction point of the circuit pattern to provide an insulating resin layer 10, and tin plating 8 is applied to the junction point of the circuit pattern to form a through hole 7. Was plated with copper 9 so that the front and back sides were electrically connected.

Printed wiring board 1 thus obtained
On the back side of (the surface of circuit pattern 2b), cover film 5
As the polyimide film having a thickness of 25 μm, a film obtained by applying a heat-reactive adhesive layer 4 made of an epoxy-modified resin to a thickness of 35 μm on one surface of the polyimide film by a melt extrusion method,
Match the adhesive application surface and heat the roll at 100 ℃
At an adhesion temperature of 1.5 m / min and were thermocompressed and laminated. Further, on the cover film 5 of this printed wiring board 1, an epoxy adhesive whose viscosity has been adjusted with a solvent is applied to the entire surface by silk screen printing, and the solvent is evaporated through a drying zone at 120 ° C. for 2 minutes to obtain a thickness. An adhesive layer 6 of 10 μm is formed, and a release film is formed on this surface.
The release surface of a release PET film having a thickness of 50 μm was attached to the release surface.

Thereafter, this printed wiring board sheet is cut into a predetermined size, the release film is peeled off and removed immediately before injection molding, and the circuit pattern 2 of the printed wiring board 1 is removed.
Position and set the a side toward the male mold 14 for molding, and after clamping the mold, injection pressure (hydraulic pressure) 90 Kg / cm ² , resin temperature 3
Modified polyamide 6T (Aren A315 made by Mitsui Petrochemical Co., Ltd.) is injection molded from the injection gate 12 at 30 ° C., cooled,
It was taken out to obtain an integrated molded body. Further, the integrated molded body was placed in an oven and heat-treated at 120 ° C. for 1 hour to obtain an integrated printed wiring board molded body 13 of Example 1. Create 100 samples.

The integrated printed wiring board molded body 13 thus obtained has the cover film 5 with the adhesive layer 6 for increasing the adhesive strength between the printed wiring board 1 and the resin molded body 11.
When applying to, through hole 7 of printed wiring board 1
Since it is blocked by the cover film 5, the adhesive does not go around through the through holes 7 and does not contaminate the circuit surface on the front side. Further, even when the resin is injected, the heat of the injection resin due to the presence of the cover film 5, Through hole 7 by pressure
Neither destruction nor damage of the copper plating 9 inside was observed. Therefore, after mounting an electronic component on the sample integrated printed wiring board molded body 13 using a mounter and soldering it through a reflow furnace under the conditions of 260 ° C. and 30 seconds, the electrical characteristics of the circuit board were tested. , There was no particular problem, and it worked normally as a circuit board molded body.

(Comparative Example 1) In the configuration of Example 1, the cover film 5 coated with the heat-reactive adhesive 4 laminated by thermocompression bonding on the back surface (surface of the circuit pattern 2b) of the printed wiring board 1 is omitted. Otherwise, in the same manner as in Example 1, an integrated printed wiring board molded body 13 of Comparative Example 1 was produced. Create 100 samples. Printed wiring board 1 before injection molding of the integrated printed wiring board molded body thus obtained
When the adhesive layer 6 (epoxy type adhesive) was applied to the surface of the circuit pattern 2b by silk screen printing, the adhesive partially covered the surface of the circuit pattern 2a on the front side through the through hole 7. An electronic component is mounted on the integrated printed wiring board molded body 13 obtained by integrally molding the printed wiring board 1 in the same manner as in Example 1 using a mounter, and soldered by passing through a reflow furnace to form a circuit. When the electrical characteristics of the board were tested, it was found that there were some parts that did not conduct, and those that malfunctioned as the circuit board molded body. Further, among the samples, the copper plating 9 of the through hole 7 of the circuit pattern 2b on the back side was damaged by the heat and pressure of the resin at the time of injection molding, and the circuit was broken.

[0034]

As is apparent from the above description, the integrated printed wiring board molded body according to the invention of claim 1 is an integrated printed wiring board molded body obtained by integrating a printed wiring board with a resin molded body. The printed wiring board has a predetermined circuit pattern on both sides of the base material and one or more through holes, and the circuit pattern side on the side to be bonded to the resin molded body is heated by the heating reaction from the circuit pattern side. The mold adhesive layer, the cover film, and the adhesive layer are laminated in this order. By adopting such a configuration, when the adhesive layer provided on the cover film for firmly adhering the printed wiring board and the resin molded body to each other is coated, the through hole is blocked by the cover film. Can be prevented from passing through the through hole and contaminating the circuit pattern on the side where the electronic components are mounted, resulting in electrical failure. Also, the copper plating layer of the through hole due to the resin pressure of the injection resin in integrated molding. It also prevents damage and destruction of the circuit and prevents circuit breakage. Therefore, there is an effect that it is possible to easily provide an integrated printed wiring board molded body which has no electrical problems and can be thinned and has excellent suitability for use with high productivity.

The integrated printed wiring board molded body according to the second aspect of the present invention is the integrated printed wiring board molded body according to the first aspect of the invention, wherein the surface of the printed wiring board on the side to be bonded to the resin molded body is adhered. The electromagnetic wave shield layer is provided separately from the circuit pattern. By adopting such a configuration, unlike the case where the electromagnetic wave shield layer is processed one by one in a separate process in a molded product such as a casing, the electromagnetic wave shield layer can be easily and efficiently formed simultaneously with the formation of the circuit pattern or in the same process. Can be formed on the printed wiring board, and can be assembled to a molded product such as a casing when integrally molding the printed wiring board.
Since it is automatically and simultaneously incorporated, no special work is required, and it is possible to provide an integrated printed wiring board molded body having extremely high productivity and electromagnetic wave shielding properties.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing one embodiment of the integrated printed wiring board molded body of the present invention.

FIG. 2 is a schematic cross-sectional view illustrating a main part of a printed wiring board used for the integrated printed wiring board molded body of the present invention.

FIG. 3 is a schematic perspective view illustrating an embodiment of the integrated printed wiring board molded body of the present invention.

FIG. 4 is a schematic cross-sectional view illustrating a state in which a printed wiring board is inserted into an injection mold for manufacturing the integrated printed wiring board molded body of the present invention.

[Explanation of symbols]

 1 Printed Wiring Board 2a Circuit Pattern (Front Side) 2b Circuit Pattern (Back Side) 3 Base Material 4 Heat Reactive Adhesive Layer 5 Cover Film 6 Adhesive Layer 7 Through Hole 8 Tin Plating or Solder Plating Layer 9 Copper Plating Layer 10 Insulation Resin layer 11 Resin molded body 12 Injection gate 13 Integrated printed wiring board molded body 14 Mold male mold 15 Mold female mold 16 Cavity 17 Suction port 18 Through hole

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location B29L 31:34

Claims (2)

[Claims] 1. An integrated printed wiring board molded body in which a printed wiring board is integrated with a resin molded body, wherein the printed wiring board has a predetermined circuit pattern and one or more through holes on both sides of a base material. The integrated type having a structure in which a heat-reactive adhesive layer, a cover film, and an adhesive layer are laminated in that order from the circuit pattern side on the circuit pattern surface on the side that is bonded to the resin molded body. Printed wiring board molded body. 2. The integrated printed wiring board molded article according to claim 1, wherein an electromagnetic wave shield layer is provided separately from the circuit pattern on the surface of the printed wiring board that is bonded to the resin molded article.