JPH07138736A - Member for working and its production - Google Patents

Abstract

PURPOSE:To produce a member for working in which the generation of peeling of a wear resistant film layer formed on the surface of a substrate is effectively prevented to prolong its service life and to provide a method for producing the same. CONSTITUTION:A primary gradient compsn. layer 3 and a secondary gradient compsn. layer 4 are formed on the space between a substrate 1 and a film layer 2. The primary gradient compsn. layer 3 contains at least one element among constituting elements of the film layer 2 and the constituting elements of the substrate 1, and the secondary gradient compsn. layer 4 contains all constituting elements of the film layer 2 and the constituting elements of the substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a machined member and a method for manufacturing the same, and more particularly to a die and a tool used when punching or plastic working a material to be machined or when forming. Is.

[0002]

2. Description of the Related Art Conventionally, an ion plating method has been known as a method for forming a wear resistant film on a mold or a tool.
FIG. 9 is a document-Metal surface technology (Vol. 30, No. 5, 197).
9) is a schematic diagram for explaining the ion plating method disclosed in pp232-240. FIG. 10 is a cross-sectional view showing a material structure in the vicinity of the surface of a base material of a mold on which a coating is formed by the ion plating method. First, FIG.
Referring to, the vacuum chamber 105 is provided with a gas inlet 108 and an exhaust system 124. In the vacuum chamber 105,
The substrate holder 106 is installed, and the substrate holder 1
The base material 101 is attached to the lower surface of 06. Also,
A high frequency coil 125 is installed in the vacuum chamber 105, and a coil application power source 126 is connected to the high frequency coil 125. An evaporation filament 127 is installed below the high frequency coil 125, and a filament application power source 128 is connected to the evaporation filament 127. The evaporation material 112 is attached to the evaporation filament 127. Further, a DC power source 123 for acceleration is connected to the substrate holder 106.

Next, with reference to FIG. 9, a conventional method for manufacturing a mold or tool having an abrasion resistant coating formed thereon will be described. First, the vacuum chamber 105 is evacuated using the exhaust system 124. Then, for example, nitrogen gas is introduced from the gas inlet 108. A high frequency electric field is generated by generating a high frequency discharge between the high frequency coil 125 and the base material 101 by the coil application power source 126. At this time, the filament applying power source 128 energizes the evaporation filament 127. Thereby, the vapor deposition material 112 made of, for example, titanium is heated and evaporated. The vaporized titanium particles enter a high frequency electric field, and a part thereof collides with ionized or excited nitrogen particles or electrons to be ionized, and reacts with the nitrogen particles to become TiN particles. This TiN
The particles are accelerated by the negative potential of the base material 101 and adhere to the surface of the base material 1. As a result, the coating layer 102 as shown in FIG. 10 is formed on the surface of the base material 101. Referring to FIG. 10, when the coating layer 102 is formed on the base material 101 by the conventional method, the diffusion layer 122 is formed on the boundary surface between the base material 101 and the coating layer 102. This diffusion layer 122 is generated mainly by thermal action and has an extremely thin thickness.

FIG. 11 is a cross-sectional view showing a conventional punching punch described in a new press working handbook (Nikkan Kogyo Shimbun, 1993) p2. Figure 11
Referring to, the punch 129 has a cutting edge side surface 120, a tool surface 119, and a cutting edge edge portion 118. Further, the die 130 is installed such that the side surface of the punch 129 is located at a predetermined distance from the side surface 120 of the cutting edge. A material 131 to be processed is placed on the upper surface of the die 130.

As a base material for the punch 129 and the die 130, in consideration of durability when used in press working and workability into a desired shape, a steel material or cemented carbide having hardness and hardness as hard as possible is generally used. To be As the method of manufacturing the punch 129, the tool surface 119 and the cutting edge side surface 120 having a desired shape are formed by machining such as cutting or grinding or electric discharge machining. As a result, the cutting edge portion 11
8 is also formed. In the conventional punch 129 and die 130, a wear resistant coating may be formed on the surface of the punch 129 and the die 130 in order to prolong the service life.

FIG. 12 is a cross-sectional view showing the structure in the vicinity of the machined surface of a conventional electric discharge machined metal. Referring to FIG. 12, when the surface of base material 101 made of metal is subjected to electric discharge machining, work-affected layer 133 is formed on the surface of base material 101. Further, the melt redeposition layer 132 is formed on the work-affected layer 133. Here, the electric discharge machining is performed between a discharge electrode and a base material 101 which are opposed to each other in a liquid such as water or oil with a very small distance of 5 to 100 μm.
This is a process performed by repeating arc discharge for a short time of 0 ^-7 to 10 ^-3 seconds. That is, the discharge electrode and the base material 10
10 in a very small area between 1 and the discharge gap
⁵ -10 introducing electrical energy to reach ⁸ W / cm ² things power density. As a result, the surface of the base material 101 is instantaneously melted and evaporated. This melting and evaporation is repeated. Thus, electric discharge machining mainly proceeds by thermal machining. Therefore, on the processed surface of the base material 101, a melt reattachment layer 132 is formed in which the material of the base material 101 which has been melted and the reaction product of the constituent elements of the base material 101 and the liquid constituent elements are adhered and solidified. To be done. Further, between the melt redeposition layer 132 and the base material 101, a work-affected layer 133 containing microcracks generated by thermal stress or electric field action during working is formed. In the case of forming a wear resistant film on a machined surface of a metal that has been subjected to conventional electric discharge machining, the wear resistant film was formed on the melt-redeposition layer 132.

[0007]

First, in the conventional coating fitting and tool shown in FIG. 10, the base material 1 is used.
The diffusion layer 122 formed between 01 and the coating layer 102 is extremely thin. Therefore, the adhesion of the coating layer 102 to the base material 101 is weak, and the coating layer 102 is likely to peel off during use. As a result, the effect of improving the life by coating the coating layer 102 was insufficient.

Further, in the conventional press die and tool shown in FIG. 11, the cutting edge portion 118 having a sharp shape is hardened or hard-coated. However, since a very large concentrated stress acts on the cutting edge portion 118, the cutting edge portion 11 immediately after the start of use.
The film peeling of No. 8 occurs. As a result, the effect of improving the life of the coating was insufficient.

Further, in a conventional mold for molding a resin material containing a hard filler which has been hardened or hard-coated, the hard filler such as fused silica contained in the mold resin material is a mold. A severe grinding action is exerted on the branch portions of the mold resin material in the runner and the edge portions existing at the spool and the runner, the runner and the gate, and the boundary portions of the gate and the cavity. Therefore, there is a problem in that the coating film at the edge portion is peeled off or worn away, and as a result, the effect of improving the life of the coating film is insufficient.

Conventionally, in order to suppress the wear of the die base material, tool steel and similar high hardness steel may be used as the die base material. Here, toughness and hardness are contradictory, and a tool and a mold that satisfy both of them at the same time cannot be realized. Therefore, when machining a high-hardness base material, there is a problem in that the tool is damaged and the processing time is increased due to its low toughness.

In the conventional electric discharge machining die and tool shown in FIG. 12, when a wear resistant film is formed, it is formed on the melt re-adhesion layer 132. Here, the adhesion between the melt-redeposition layer 132 and the base material 101 is weak. Therefore, when a hard wear resistant coating is formed on the melt reattachment layer 132, the wear resistant coating is easily separated from the base material 101 together with the melt reattachment layer 132 when the mold and the tool are used. There was a point.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a wear-resistant coating formed on the surface of a base material in a processing member. It is intended to prolong the service life by preventing peeling.

It is an object of the inventions described in claims 8 to 13 in a method for manufacturing a working member to stably and efficiently manufacture a working member having a long life.

[0014]

A processing member according to claims 1 and 2 comprises a base material having a main surface, a coating layer formed on the main surface of the base material, and the base material and the coating layer. A first graded composition layer which is located between and is in contact with the main surface of the base material and which contains at least one element of the constituent elements of the coating layer and a constituent element of the base material; a first graded composition layer and a coating layer; A second layer which is located between the two and includes all the constituent elements of the coating layer and the constituent elements of the base material.
And a graded composition layer. The sum of the thickness of the first gradient composition layer and the thickness of the second gradient composition layer is 30 nm or more.

Preferably, the above-mentioned coating layer is composed of one or more layers, and the lowermost coating layer is Ti ₂
N, TiN, and one material selected from the group consisting of mixed phases of Ti ₂ N and TiN, and the first graded composition layer has a concentration gradient in which the constituent elements of the base material and N atoms are opposite to each other. Alternatively, the second gradient composition layer may be formed such that the constituent elements of the base material and the N and Ti atoms have opposite concentration gradients.

According to a third aspect of the present invention, there is provided a processing member comprising a base material having a main surface and containing Al, a first coating layer containing AlN formed on the main surface of the base material, and the first coating layer. located between formed on Ti ₂ N, and TiN, and a second coating layer composed of Ti ₂ N and one material selected from the group consisting of mixed phases of TiN, the substrate and the first coating layer And at least Al and N are located between the first graded composition layer having a concentration gradient opposite to each other and the first coating layer and the second coating layer.
2 and a second graded composition layer in which Ti and N have concentration gradients opposite to each other.

According to a fourth aspect of the present invention, there is provided a processing member, wherein a base material having a main surface and containing Al, a first coating layer containing Al ₂ O ₃ formed on the main surface of the base material, and a first coating layer thereof. One material selected from the group consisting of a second coating layer containing TiO formed on the coating layer, Ti ₂ N, TiN formed on the second coating layer, and a mixed phase of Ti ₂ N and TiN. A third coating layer, a first gradient composition layer formed between the base material and the first coating layer and having Al and O having opposite concentration gradients, a first coating layer and a second coating layer. Between the second coating layer and the third coating layer, and a second gradient composition layer having Al and Ti having opposite concentration gradients, and O and N having opposite concentration gradients. And a third graded composition layer having the same.

According to a fifth aspect of the present invention, there is provided a working member comprising a base material having a main surface and made of a cemented carbide, and a periodic table group 3 to group 6 and group 8 formed on the main surface of the base material. A coating layer containing a nitride of one element selected from the group consisting of the above elements, W and C atoms formed between the base material and the coating layer, and metal atoms and N atoms constituting the coating layer, And a graded composition layer having an opposite concentration gradient. The graded composition layer is configured not to include WN crystal.

A machining member according to a sixth aspect includes a cutting edge side surface, a tool surface, and a cutting edge edge surface having a radius of curvature of 5 to 100 μm. At least the edge surface of the cutting edge is hardened.

The working member according to claim 7 is provided with a cutting edge side surface, a tool surface, and a cutting edge edge surface. The cutting edge side surface and the cutting edge edge surface, and the tool surface and the cutting edge edge surface intersect at an obtuse angle, and at least the cutting edge surface is hardened.

The method for manufacturing a processing member according to claim 8 is characterized in that the metal element forming the nitride on the surface of the base material in a vacuum is 0.1 to 5 until a film thickness of at least 70 nm is reached.
At the same time as the step of vapor deposition at a rate of nm / sec, simultaneously with the step of vapor deposition, nitrogen ions having energy E = 5 to 100 keV are ion current density I <227- (1.
33 × E) irradiating with μA / cm ² .

According to a ninth aspect of the present invention, there is provided a method for manufacturing a processing member, wherein the energy E of the substrate surface is 0.1 to 3 in a vacuum.
1-3 at least nitrogen-containing ions having 5 keV
Energy E ≦ 16 at ion current density of 00 μA / cm ²
In the case of keV, the irradiation nitrogen ion amount D = (4+ (0.2
3 × E)) × 10 ¹⁶ pieces / cm ² or less, energy E> 16
In the case of keV, the irradiation nitrogen ion amount D = (14− (0.
4 × E)) × 10 ¹⁶ pieces / cm ² or less, and a step of forming a coating layer thereafter.

A method for manufacturing a processing member according to claim 10
Is the energy E = 0.1-3 on the surface of the substrate in vacuum.
1 to 300 μA / inert element ion having 5 keV
cm ²Ion current density of 5 × 10¹³~ 1 x 10¹⁷Individual/
cm²Irradiation process, then substrate surface in vacuum
0.1 to 5 nm / sec for the metal element that constitutes the nitride
On the surface of the substrate at the same time as the step of vapor deposition at the same time
Nitrogen ions with energy E = 5 to 100 keV
ON current density I <227− (1.33 × E) μA / cm
²And the step of irradiating with.

A method of manufacturing a working member according to a eleventh aspect includes a step of processing an edge portion so that a radius of curvature of the edge portion becomes 5 to 100 μm, and a step of forming a wear resistant layer on at least the edge portion. ing.

According to a twelfth aspect of the present invention, there is provided a method of manufacturing a working member, the step of working an edge portion into a shape in which two surfaces sandwiching the edge intersect the surface of the edge portion at an obtuse angle, and a wear-resistant layer at least on the edge portion. And a step of forming.

A method of manufacturing a working member according to a thirteenth aspect includes a step of removing at least the melt-redeposited layer on the worked surface, and a step of subsequently forming a wear resistant layer on the worked surface.

[0027]

In the processing member according to claim 1, the first graded composition layer is formed between the base material and the coating layer, and the second graded composition layer is formed between the first graded composition layer and the coating layer. Since the sum of the thickness of the first gradient composition layer and the thickness of the second gradient composition layer is set to 30 nm or more, a clear interface that causes peeling is formed between the base material and the coating layer. Without forming a coating layer having extremely strong adhesion. The coating layer is formed of one or more layers, and the lowermost coating layer is made of one material selected from the group consisting of Ti ₂ N, TiN, and a mixed phase of Ti ₂ N and TiN. The first gradient composition layer is formed such that the constituent elements of the base material and the N atoms have opposite concentration gradients, and
If the gradient composition layer of No. 1 is configured such that the constituent elements of the base material and the N and Ti atoms have opposite concentration gradients, a coating layer having excellent wear resistance is formed as if it is integrated with the base material. Thus, a processing member having excellent wear resistance and a long life can be obtained.

In the processing member according to claim 3, at least A is provided between the Al-containing base material and the AlN-containing first coating layer.
A first graded composition layer is formed in which 1 and N have opposite concentration gradients, and the first coating layer and Ti ₂ N, TiN, and T are formed.
Al and Ti between the second coating layer made of one material selected from the group consisting of a mixed phase of i ₂ N and TiN,
Since the second gradient composition layer having N and the concentration gradient opposite to each other is formed, the base material and the second coating layer are more likely to be formed by the first gradient composition layer and the second gradient composition layer sandwiching the first coating layer. It is toughly bonded. As a result, a processing member having excellent durability can be obtained.

In the processing member according to the fourth aspect, the first gradient in which Al and O have opposite concentration gradients between the base material containing Al and the first coating layer containing Al ₂ O _3. the composition layer is formed, the second graded composition layer is formed to have a reverse concentration gradient mutually Al and Ti between the second coating layer comprising a first coating layer and the TiO, second coating layer and the Ti ₂ Third gradient composition layer having concentration gradients of O and N opposite to each other between the third coating layer made of one material selected from the group consisting of N, TiN and mixed phases of Ti ₂ N and TiN. Is formed, the third coating layer having excellent abrasion resistance is formed as if it were integrated with the base material. As a result, a processing member having excellent wear resistance and long life can be obtained.

In the processing member according to claim 5, a base material made of cemented carbide and a nitride of one element selected from the group consisting of elements of Groups 3 to 6 and 8 of the periodic table. A gradient composition layer having concentration gradients of W and C atoms and metal atoms and N atoms constituting the coating layer opposite to each other is formed between the gradient composition layer and the coating layer containing. Since it is formed so as not to contain, a layer containing brittle crystals that induces film peeling or a clear interface is not formed between the base material and the coating layer, and a coating layer having extremely strong adhesive force is formed. It is formed. Thereby, a processing member having excellent long-term reliability can be obtained.

In the working member according to the sixth aspect, the cutting edge surface is formed so as to have a radius of curvature of 5 to 100 μm, and at least the cutting edge surface is hardened. Peeling of the coating layer and chipping of the substrate are effectively prevented.

In the machining member according to the seventh aspect, the cutting edge side surface and the cutting edge edge surface, the tool surface and the cutting edge edge surface intersect at an obtuse angle, and at least the cutting edge surface is hardened. Further, peeling of the coating layer and chipping of the base material can be effectively prevented during the punching process. As a result, the life of the coating layer is dramatically improved.

In the method for manufacturing a working member according to the eighth aspect, the metal element constituting the nitride on the surface of the base material in a vacuum is 0.1 to 5 until a film thickness of at least 70 nm is reached.
At the same time as the vapor deposition, nitrogen ions having an energy E = 5 to 100 keV are vapor-deposited at a rate of nm / sec and ion current density I <227− (1.33 × E) μA.
Since the irradiation is performed at / cm ² , the generation of WN crystal that causes film peeling between the base material and the coating layer is suppressed. This makes it possible to easily manufacture a processing member having extremely excellent reliability at the interface between the base material and the coating layer.

In the method for manufacturing a processing member according to a ninth aspect, energy E = 0.1-3 on the surface of the base material in vacuum.
1-3 at least nitrogen-containing ions having 5 keV
Energy E ≦ 16 at ion current density of 00 μA / cm ²
In the case of keV, the irradiation nitrogen ion amount D = (4+ (0.2
3 × E)) × 10 ¹⁶ pieces / cm ² or less, energy E> 16
In the case of keV, the irradiation nitrogen ion amount D = (14− (0.
4 × E)) × 10 ¹⁶ pieces / cm ² or less and a coating layer is formed thereafter, so that generation of WN crystals, which causes film peeling between the base material and the coating layer, is suppressed while the substrate is formed. Impurities on the material surface are removed. As a result, a processing member having an increased adhesion between the base material and the coating layer can be easily manufactured.

In the method for manufacturing a processing member according to claim 10,
Is the energy E = 0.1-3 on the surface of the substrate in vacuum.
Inert element ion having 5 keV is 1 to 300 μA /
cm ²Ion current density of 5 × 10¹³~ 1 x 10¹⁷Individual/
cm²The substrate surface is exposed to
The metal element composing the oxide is at a speed of 0.1 to 5 nm / sec.
Energy E = 5-1 on the surface of the substrate at the same time
Nitrogen ions having 00 keV have an ion current density I <2
27- (1.33 × E) μA / cm²Is illuminated by
The brittle crystals that cause film peeling between the substrate and the coating layer.
Removal of impurities on the surface of the substrate while effectively suppressing the generation of
To be done. As a result, a hard material with extremely strong adhesion
The coating layer is formed, making it easy to process materials with long life.
Manufactured to.

In the method for manufacturing a working member according to the eleventh aspect, the edge portion is processed so as to have a radius of curvature of 5 to 100 μm, and the wear resistant layer is formed at least on the edge portion, so that the punching process is performed. Peeling of the coating layer and chipping of the base material are effectively prevented, and wear resistance and reliability are dramatically improved.

In the method for manufacturing a working member according to the twelfth aspect, the edge portion is processed into a shape such that two surfaces sandwiching the edge portion intersect the surface of the edge portion at an obtuse angle, and at least the edge portion has a wear-resistant layer. Thus, peeling of the coating layer and chipping of the base material are effectively prevented during punching, and as a result, a processing member having a long life is easily manufactured.

In the method for manufacturing a working member according to the thirteenth aspect, at least the melt redeposited layer on the worked surface is removed, and then the wear resistant layer is formed on the worked surface. The layers that cause film peeling are easily removed between
A processing member having an excellent adhesive force of the coating layer and having a long life is easily manufactured.

[0039]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a material structure of a mold and a tool according to a first embodiment of the present invention. Referring to FIG. 1, in the first embodiment, a coating layer 2 is formed on a base material 1 with a first graded composition layer 3 and a second graded composition layer 4 interposed therebetween. The base material 1 is made of, for example, cemented carbide. Coating layer 2
Made of titanium nitride, for example, and has excellent wear resistance. The first graded composition layer 3 is formed in contact with the surface of the base material 1. The first graded composition layer 3 has a T
Without including i, the concentrations of elements constituting the substrate 1 such as W and C gradually decrease in the direction from the substrate 1 to the surface of the coating layer 2, and the element concentration of N changes from the substrate 1 to the coating layer. 2 has a gradient composition that gradually increases in the direction toward the surface. The second graded composition layer 4 is amorphous and has a first
It is formed between the gradient composition layer 3 and the coating layer 2. In the second graded composition layer 4, the concentrations of elements such as W and C that form the base material 1 gradually decrease from the first graded composition layer 3 toward the coating layer 2, and the element concentrations of N and Ti become the first level. 1 has a gradient composition that gradually increases from the gradient composition layer 3 toward the coating layer 2.

Next, with reference to FIG. 1, a method of manufacturing the mold and tool of the first embodiment will be described. Here, a specific method for manufacturing a press die will be described. First, the base material 1
Machining such as cutting, grinding and polishing is performed on the cemented carbide prepared as above. As a result, the base material 1 is finished into a desired shape that satisfies the required accuracy. At this time, in order to suppress seizure of the material to be processed and chipping (chipping) of the base material 1 at the time of press working, and to avoid local abrasion or peeling of the coating layer 2, the gold of the portion in contact with the workpiece is pressed. It is desirable to finish the surface of the mold (base material 1) to have a surface roughness of 1 μm or less. When a steel material is used as the base material 1, an alloy tool steel (JIS: SKD, etc.) or a high speed tool steel (JIS: SKH) is subjected to heat treatment such as quenching and tempering to obtain a desired hardness. Adjust to The hardness at this time is preferably about Rockwell hardness HRC 58 to 64 in order to secure sufficiently high hardness and appropriate toughness.

Next, the processing powder and the processing oil on the surface of the die (base material 1) finished in a desired shape by acetone ultrasonic cleaning or the like are completely removed. After that, the substrate 1 is immediately put in the film forming vacuum chamber. When a certain period of time is required between the completion of cleaning and the execution of film formation, the substrate 1 is placed and stored in a clean environment such as in a desiccator. Such work is important work in order to prevent a decrease in film purity and film adhesion in the film formation in a vacuum in the next step.

Next, the mold (base material 1) is set at a predetermined position on the substrate holder 6 in the vacuum tank 5 of the ion mixing film forming apparatus whose apparatus configuration is shown in FIG. Here, with reference to FIG. 2, a schematic configuration of the ion mixing film forming apparatus used in the method of manufacturing the mold and the tool of the present embodiment will be described. A substrate holder 6 is provided in the upper part of the vacuum chamber 5, and a substrate 1 is attached to the lower surface of the substrate holder 6. A crucible 11 is installed in the lower part of the vacuum chamber 5. A vapor deposition material 12 is filled in the crucible 11. Crucible 1
An electron beam gun 13 is movably installed in the vicinity of 1. An ion beam source 7 is installed below the vacuum chamber 5 so as to be fitted therein. The ion beam source 7 is provided with a gas inlet 8, an electron emission source 9, and an acceleration electrode 10.

First, the inside of the vacuum chamber 5 was set to 3 × 10 ⁻⁶ Torr by using the ion mixing film forming apparatus having the above-mentioned structure.
Evacuate to the above vacuum level. After that, N ₂ gas was introduced from the gas inlet 8 of the ion beam source 7 to ^obtain 3 × 10 ⁻⁵ T
Maintain a vacuum of about orr. The N ₂ gas particles are positively ionized by being exposed to an electron shower from the electron emission source 9. Then, by applying a negative potential to the acceleration electrode 10, the positively ionized N ₂ gas particles are accelerated to irradiate the surface of the base material 1 of the mold. Contaminants adhering to or vapor-depositing on the surface of the base material 1 of the mold are removed by the sputtering action of this irradiation.

At this time, the acceleration voltage applied to the acceleration electrode 10 is preferably 0.1 to 35 keV. This is for the following reason. That is, the acceleration voltage is 0.1k
When it is eV or less, the deposition of ions on the surface of the substrate 1 becomes remarkable, and the sputtering effect is not exhibited. Further, when the acceleration voltage is 35 keV or more, the ion implantation phenomenon becomes active, so that the sputtering effect due to the ions cannot be exhibited.
Therefore, the acceleration voltage is preferably 0.1 to 35 keV.

The irradiation ion current density is 1 to 300 μm.
A / cm ² is desirable. This is for the following reason. That is, when the ion current density is 1 μA / cm ² or less, the sputtering speed by ions is extremely slow and not practical. In addition, the ion current density is 300 μA / cm ²
In the above cases, the temperature rise of the base material 1 becomes remarkable, so that it becomes difficult to maintain the dimensional accuracy of the mold (base material 1). Therefore, the irradiation ion current density is 1 to 300 μA / cm ^2.
Is desirable.

Further, in the step of cleaning the base material 1, the number of N ions irradiated on the surface of the base material 1 is (4+ (0.23) when the ion acceleration voltage is E and E ≦ 16 keV. × E)) × 10 ¹⁶ pieces / cm ² or less, and E> ¹⁶ keV (14− (0.4 ×
E)) × 10 ¹⁶ pieces / cm ² or less. Irradiation with N ions above these values produces WN crystals on the surface of the substrate 1. Since the layer containing the WN crystal has a mechanically brittle property, the peeling of the coating layer 2 is likely to occur.

As described above, the contaminants attached or adsorbed on the surface of the base material 1 of the mold are removed by ion sputtering. This makes it possible to increase the adhesion of the coating layer 2 to the base material 1.

Next, the vapor deposition material 12 made of Ti contained in the crucible 11 (see FIG. 2) is heated and evaporated by using the electron beam 13. Thereby, the vapor deposition material 12 is deposited on the surface of the base material 1. At the same time, N ions are generated and accelerated by the same method as described above, and the surface of the substrate 1 is irradiated with the N ions. As a result, the hard coating layer 2 made of Ti ₂ N and TiN crystals is formed on the base material 1.

At this time, at least the film thickness 70 at the initial stage of film formation
0.1 to 0.1 nm of Ti on the surface of the substrate 1
Deposition is performed at a speed of 5 nm / sec. At the same time, 5
When the ion acceleration voltage is set to E and the N ion accelerated by the acceleration voltage of 100 keV is set to 227- (1.33x
E) It is necessary to irradiate with an ion current density of μA / cm ² or less. The vapor deposition rate is set within the range of 0.1 to 5 nm / sec for the following reason. That is, when the deposition rate is 0.1 nm / sec or less, the rate of inclusion of the impurity element floating in the vacuum chamber 5 into the coating layer 2 becomes high, and it becomes difficult to form the coating layer 2 having desired characteristics. .
Further, if the deposition rate is 5 nm / sec or more, Ti ₂
It is necessary to irradiate N ions with a high ion current density to produce N and TiN crystals. Therefore, the temperature rise of the base material 1 becomes remarkable, and as a result, it becomes difficult to maintain the dimensional accuracy of the mold (base material 1). Therefore, the vapor deposition rate is preferably within the range of 0.1 to 5 nm / sec.

Further, the ion acceleration voltage is set to 5 to 100 ke
The reason for setting it within the range of V is as follows. That is, when the accelerating voltage of the ions is 5 keV or less, the effect of pushing the ions into the base material 1 becomes insufficient, so that the first graded composition layer 3 which is indispensable for increasing the adhesive force of the coating layer 2
And it becomes impossible to form the second gradient composition layer 4 sufficiently thick. Further, when the ion acceleration voltage is 100 keV or more, the temperature rise of the base material 1 becomes remarkable, so that it becomes difficult to maintain the dimensional accuracy of the mold (base material 1). Therefore, it is preferable to set the accelerating voltage within the range of 5 to 100 keV.

Further, the ion current density is set to 227- (1.
The reason why it is set to 33 × E) μA / cm ² or less is as follows. That is, the ion current density is
When N ions are irradiated at (1.33 × E) μA / cm ² or more, WN crystals are generated on the surface of the substrate 1 and the coating layer 2 is easily peeled off. Therefore, the ion current density is 2
It is preferably 27- (1.33 × E) μA / cm ² or less.

In order to form the sufficiently thick first graded composition layer 3 and second graded composition layer 4, the film formation rate is 0 nm / sec immediately after the start of film formation until at least the film thickness reaches 70 nm. It is desirable to gradually increase from the above to a predetermined film forming speed.

By performing the film formation at the initial stage of film formation as described above, the first graded composition layer 3 and the second graded composition layer 3 having a total thickness of 30 nm or more are formed at the interface between the base material 1 and the coating layer 2. The composition layer 4 can be built in. As a result, it becomes possible to form the coating layer 2 having an extremely strong adhesive force.

Thereafter, for example, the deposition rate of Ti is 1 nm.
/ Sec, N ion accelerating voltage of 30 keV, and ion current density of 300 μA / cm ² until the coating layer 2 has a desired thickness. This enables Ti ₂ N and TiN
The hard coating layer 2 having a Vickers hardness of about 2600 is formed from the mixed crystal of.

In the above embodiment, the electron beam gun 13 is used for vapor deposition of the vapor deposition material 12 made of Ti, but other methods may be used. For example, a vacuum vapor deposition method by filament heating, a sputter vapor deposition method, an ion plating method, a method using an ion gun for ionizing Ti into clusters, or the like may be used.

In the above embodiment, the ionized gas is N 2
_Although the case where 100% gas of ₂ is used is shown, the same effect can be obtained by using a mixed gas containing an inert gas such as Ar for N ₂ gas. In this case, the ratio of N ₂ gas and inert gas is N ₂ : inert gas = 50-100.
%: 50 to 0% is preferable.

Further, in the above embodiment, the case where N ₂ gas is used as the ion gas in the step of removing the contaminants adhering to or adsorbing to the surface of the substrate 1 by ion sputtering prior to film formation has been described. The present invention is not limited to this, and an inert gas such as Ar may be used as the ionized gas. If an inert gas is used in this way, W
Generation of N crystals can be avoided. Further, when an inert gas such as N ₂ gas or Ar mixed with a reducing gas such as H ₂ gas is used as the ionized gas, the surface of the base material 1 having high cleanliness can be treated in a shorter time. It is possible to obtain it in time, and productivity can be improved.

By the manufacturing method as described above, the press die of the first embodiment shown in FIG. 1 is formed.

FIG. 3 is a sectional view showing the material structure of a molding die according to the second embodiment of the present invention. With reference to FIG. 3, in the second embodiment, the base material 1 is made of Al or Al alloy. The first gradient composition layer 3 is formed so as to contact the surface of the base material 1. A first coating layer 14 is formed on the first gradient composition layer 3, and a second gradient composition layer 4 is formed on the first coating layer 14. Second
A second coating layer 15 is formed on the gradient composition layer 4.

The first coating layer 14 is made of AlN and the second coating layer 15 is made of titanium nitride. The first graded composition layer 3 is A
The composition is such that l and N have opposite concentration gradients. The second graded composition layer 4 has a composition such that Al and Ti and N have opposite concentration gradients.

Next, with reference to FIG. 3, a method of manufacturing the molding die of the second embodiment will be described. The Al or Al alloy used for the base material 1 of the second embodiment is much easier to machine than the steel material and the cemented carbide. As a result, it is possible to significantly reduce the manufacturing time and processing cost of the mold. Further, it has a feature that the molding time can be shortened due to its high thermal conductivity. As a specific manufacturing method, first, the Al material prepared as the base material 1 is subjected to machining such as cutting, grinding and polishing. As a result, the base material 1 is finished into a desired shape that satisfies the required accuracy. At this time, in order to avoid local abrasion and peeling of the coating layer 2 and at the same time ensure good releasability of the molded product from the mold, the surface roughness of the mold surface is set to 0.
It is preferable to finish it to 5 μm or less. After that, the processed powder and the processed oil content on the mold surface are removed by acetone ultrasonic cleaning or the like. After that, the substrate 1 is quickly stored in the film forming vacuum chamber.

Next, the contaminants adhering to or adsorbing on the surface of the base material 1 are removed by ion sputtering using the same method as the method for manufacturing the press die of the first embodiment described above. The ion acceleration voltage at this time is preferably 0.1 to 20 keV. This is for the following reason. That is, when the accelerating voltage is 0.1 keV or less, the deposition of ions on the surface of the substrate becomes remarkable and the sputtering effect is not exhibited. If the acceleration voltage is 20 keV or more, the substrate 1
Since the temperature rise is marked, it becomes difficult to maintain the dimensional accuracy of the mold, and the hardness of the substrate 1 decreases. Therefore, the acceleration voltage is preferably 0.1 to 20 keV.

Further, the irradiation ion current density is 1 to 200.
It is desirable to set it within the range of μA / cm ² . This is for the following reason. That is, the ion current density is 1μ
When it is less than A / cm ² , the ion sputter rate is too slow to be practical. Also, the ion current density is 2
When the value is 00 μA / cm ² or more, the temperature rise of the base material 1 becomes remarkable, so that it becomes difficult to maintain the dimensional accuracy of the mold and the hardness of the base material 1 decreases. Therefore, the irradiation ion current density is preferably 1 to 200 μA / cm ² .

Next, the vapor deposition material 12 made of Al contained in the crucible 11 (see FIG. 2) is heated and evaporated by using the electron beam gun 13. As a result, the vapor deposition material 12 is deposited on the surface of the base material 1. At the same time, N ions are generated and accelerated by the same method as described above, and the surface of the substrate 1 is irradiated with the N ions. As a result, the hard coating layer 2 made of AlN is formed on the base material 1.

At this time, the film thickness is at least 25 at the initial stage of film formation.
0.1 to 0.1 nm of Al on the surface of the base material 1
5 to 50k at the same time as vapor deposition at a rate of 3nm / sec
When the N ions accelerated by the acceleration voltage of eV are set to the ion acceleration voltage E, 160− (1.4 × E) μA / cm
Irradiate with an ion current density of ² or less. Vapor deposition rate is 0.1
The reason for setting ˜3 nm / sec is as follows. That is, when the deposition rate is set to 0.1 nm / sec or less, the rate of inclusion of the impurity element floating in the vacuum chamber 5 into the first coating layer 14 increases. Also, the deposition rate is 3 nm / sec.
With the above, it is necessary to irradiate N ions with a large ion current density in order to generate AlN crystals, and as a result, the temperature rise of the base material 1 becomes remarkable, and the dimensional accuracy of the mold and the hardness of the base material 1 are increased. Will be difficult to keep. Therefore, the vapor deposition rate is preferably within the range of 0.1 to 3 nm / sec.

The ion acceleration voltage is set to 5 to 50 keV.
Is due to the following reasons. That is, the acceleration voltage of ions is 5
In the case of keV or less, the effect of pushing ions into the base material 1
Since the fruit is not sufficient, the adhesion of the first coating layer 14 is increased.
Forming the first graded composition layer 3 which is indispensable
Becomes impossible. Also, the ion acceleration voltage is 50k.
In the case of eV or more, the ion current density is 160-
(1.4 × E) μA / cm ²When irradiating N ions with
In this case, the temperature rise of the substrate 1 becomes remarkable and the dimensional accuracy of the mold is maintained.
And the hardness of the substrate 1 decreases.
Therefore, the ion acceleration voltage should be 5 to 50 keV.
And the ion current density is 160- (1.4
× E) μA / cm²Must be:

In order to form the sufficiently thick first gradient composition layer 3, the film thickness is at least 25 nm immediately after the start of film formation.
Up to 0 nm / se.
It is desirable to gradually increase from c to a predetermined film formation rate.

After that, for example, when the deposition rate of Al is 0.
The first coating layer 14 made of AlN having a thickness of about 5 to 15 nm is formed with 5 nm / sec, an N ion acceleration voltage of 20 keV, an ion current density of 110 μA / cm ² .

As described above, the substrate 1 and the first coating layer 14
A first graded composition layer 3 having a concentration gradient in which Al and N are opposite to each other can be formed at the interface between the substrate 1 and the first
It is possible to obtain an extremely strong adhesion to the coating layer 14.

Next, the vapor deposition material 12 made of Ti contained in the crucible 11 (see FIG. 2) is heated and evaporated by using the electron beam gun 13. Thereby, the first coating layer 1
The vapor deposition material 12 is deposited on the surface of 4. At the same time,
In the same manner as described above, N ions are generated and accelerated, and the surface of the first coating layer 14 is irradiated. Thus, the hard second coating layer 15 made of Ti ₂ N and TiN crystals is formed on the first coating layer 14.

At this time, the film thickness is at least 30 at the initial stage of film formation.
Ti is vapor-deposited on the surface of the first coating layer 14 at a rate of 0.1 to 3 nm / sec until 5 nm is reached.
When the ion acceleration voltage is set to E and the N ion accelerated by the acceleration voltage of -50 keV is set to 190- (1.33x
E) Irradiation with an ion current density of μA / cm ² or less. Here, the vapor deposition rate is set in the range of 0.1 to 3 nm / sec for the following reason. That is, when the deposition rate is 0.1 nm / sec or less, the ratio of the impurity element floating in the vacuum chamber 5 into the second coating layer 15 increases. If the deposition rate is 3 nm / sec or more, T
In order to generate i ₂ N and TiN crystals, it is necessary to irradiate N ions with a large ion current density, and the temperature rise of the base material 1 becomes remarkable, so that the dimensional accuracy of the mold and the hardness of the base material 1 are improved. It will be difficult to keep. Therefore, the deposition rate is 0.
It is desirable to set within the range of 1 to 3 nm / sec.

Further, the acceleration voltage of ions is set to 5 to 50 keV.
And set the ion current density to 190- (1.33 × E)
The reason why the value is μA / cm ² or less is as follows. That is, when the acceleration voltage of ions is 5 keV or less,
Since the effect of pushing ions into the first coating layer 14 becomes insufficient, it becomes impossible to form the second graded composition layer 4, which is indispensable for increasing the adhesive force of the second coating layer 15, to be thick. Further, when the ion accelerating voltage is 50 keV or more, the ion current density is 190- (1.33 × E) μA / cm ^2.
When N ions are irradiated as described above, the temperature rise of the base material 1 becomes remarkable, it becomes difficult to maintain the dimensional accuracy of the mold, and the hardness of the base material 1 decreases.

In order to form the sufficiently thick second graded composition layer 4, at least a film thickness of 30 n is obtained immediately after the film formation is started.
until the film thickness reaches m, the deposition rate is 0 nm / se
It is desirable to gradually increase from c to a predetermined film formation rate.

As described above, the first coating layer 14 and the second coating layer 14
At the interface with the coating layer 15, the second gradient composition layer 4 in which Al and Ti have opposite concentration gradients can be formed,
The adhesion between the first coating layer 14 and the second coating layer 15 can be made extremely strong.

After that, for example, the deposition rate of Ti is 0.8.
The film is formed at nm / sec, N ion acceleration voltage of 20 keV, and ion current density of 200 μA / cm ² . As a result, the second coating layer 15 made of a mixed crystal of Ti ₂ N and TiN and having a desired thickness of Vickers hardness of about 2600 is formed. As described above, the molding die of the second embodiment shown in FIG. 3 is completed. According to the method for manufacturing a mold according to the second embodiment, the dimensional accuracy of the mold and the Al
It is possible to manufacture a molding die provided with the second coating layer 15 having a large hardness on the surface and hardly peeling off without deteriorating the properties of the base material 1 made of.

FIG. 4 is a sectional view showing the material structure of a die according to the third embodiment of the present invention. Referring to FIG. 4, in the mold according to the third embodiment, the first coating layer 14 made of Al ₂ O ₃ and Ti are formed on the base material 1 made of Al or Al alloy.
A second coating layer 15 made of O and a third coating layer 16 made of a mixed phase of Ti ₂ N and TiN are sequentially formed. A first graded composition layer 3 having a concentration gradient of Al and O opposite to each other is formed between the substrate 1 and the first coating layer 14. Al is formed between the first coating layer 14 and the second coating layer 15.
And Ti have a second gradient composition layer 4 having concentration gradients opposite to each other. Second coating layer 15 and third coating layer 16
A third graded composition layer 17 having a concentration gradient in which O and N are opposite to each other is formed between and.

Next, with reference to FIG. 4, a method of manufacturing the mold of the third embodiment will be described. First, the above-mentioned Example 2
By using a method similar to the method for manufacturing the mold of (1), contaminants adhering to or adsorbing on the surface of the base material 1 are removed by ion sputtering. Next, the first coating layer 14 composed of the first graded composition layer 3 and Al ₂ O ₃ is formed. The formation of the first graded composition layer 3 and the first coating layer 14 is carried out in the formation process of the first graded composition layer 3 and the first coating layer 14 of the second embodiment described above, in which the irradiation ions are not N ions. It can be easily manufactured only by changing to O ions. Then, subsequently, the second graded composition layer 4 and the second coating layer 15 made of TiO 2 are formed. The formation of the second graded composition layer 4 and the second coating layer 15 is performed by forming the first graded composition layer 3 of the second embodiment described above.
Also, it can be easily manufactured by changing the irradiation ions to O ions instead of N ions in the process of forming the first coating layer 14 and changing the material to be evaporated from Al to Ti. Finally, the third gradient composition layer 17 and the third coating layer 16 made of a mixed phase of Ti ₂ N and TiN are formed. The third gradient composition layer 17 and the third
The coating layer 16 is manufactured by the same process as the formation process of the second gradient composition layer 4 and the second coating layer 15 (see FIG. 3) of the second embodiment.

As described above, the mold of the third embodiment shown in FIG. 4 is completed. In the method of manufacturing the mold of the third embodiment, the metal having the third coating layer 16 having a large hardness and having no peeling does not deteriorate the dimensional accuracy of the mold and the property of the base material 1 made of Al. The mold can be manufactured.
Therefore, it is possible to obtain an Al mold used for resin molding having excellent durability.

FIG. 5 is a sectional view showing the vicinity of a cutting edge portion of a punching press die according to a fourth embodiment of the present invention.
With reference to FIG. 5, in the fourth embodiment, the cutting edge portion 18 in contact with the workpiece has a radius of curvature of about 10 μm. As a result, the tool surface 19 of the base material 1 and the cutting edge side surface 2
The shape of 0 is such that the cutting edge portion 18 smoothly continues. A hard coating layer 2 is formed on the surfaces of the cutting edge portion 18, the tool surface 19 and the cutting blade side surface 20.

Next, with reference to FIG. 5, a method of manufacturing the working press die of the fourth embodiment will be described. First, the base material 1 made of cemented carbide is prepared. Then, the base material 1 is subjected to machining such as cutting, grinding and polishing. As a result, the base material 1 having a desired shape that satisfies the required accuracy is finished. At this time, in order to suppress seizure of the material to be processed and chipping (chipping) of the base material 1 at the time of press working and to avoid local abrasion or peeling of the coating layer 2,
It is desirable that the surface roughness of the surface of the mold that is in contact with the workpiece be finished to 1 μm or less.

Next, the processing powder and processing oil on the surface of the base material 1 finished in a desired shape by cleaning are removed. After that, the substrate 1 is immediately stored in the ion beam etching vacuum chamber. At this time, if the cleaning is insufficient, there arises a problem that it is difficult to evacuate the vacuum chamber due to the evaporation of oil and foreign matter on the cutting edge portion 18 hinders the ion beam processing in the next step. It is desirable to perform ultrasonic cleaning using acetone or the like.

Next, after the inside of the vacuum chamber is evacuated to a vacuum degree of 5 × 10 ^-6 Torr or more, an inert gas such as Al is ionized using a bucket type ion source or the like. afterwards,
The ionized inert gas is accelerated using an electric field of 10 keV, and the portion including the cutting edge portion 18 is irradiated. Ion beam etching is continued until the cutting edge portion 18 has a shape having a radius of curvature of about 10 μm. The acceleration voltage at this time is preferably 100 V to 30 keV. This is for the following reasons. That is,
When the accelerating voltage is 100 V or less, the deposition of ions on the surface of the substrate becomes remarkable and the sputtering effect is not exerted so much. Further, when the acceleration voltage is 30 keV or more, the ion implantation phenomenon becomes active and the sputtering effect by the ions becomes low. Therefore, in either case, it takes a long time to process the cutting edge portion 18. For this reason, the acceleration voltage is preferably 100V to 30keV. This ion beam etching process is characterized in that the edge portion is more easily removed than the flat portion. Therefore, the tool surface 19 and the cutting edge side surface 20
It is possible to make the cutting edge portion 18 rounded while minimizing the damage of the cutting edge portion 18.

Next, using the same method as that described in the method of manufacturing the mold of the first embodiment, Ti ₂ N was formed on the surfaces of the cutting edge portion 18, the tool surface 19 and the cutting blade side surface 20. A coating layer 2 made of a mixed phase with TiN is formed. In this way
A hard coating layer 2 having high adhesion is formed. In the fourth embodiment, the cutting edge portion 1 that receives the greatest stress when the press die is used for punching the material to be processed.
By providing curvature in advance in No. 8, the value of the maximum concentrated stress generated in the cutting edge portion 18 during punching can be made smaller than in the case where no curvature is provided. Thereby, peeling of the coating layer 2 and chipping of the base material 1 can be effectively prevented. As a result, the life of the coating layer 2 can be dramatically improved, and the wear resistance and reliability of the press die can be dramatically improved.

In the manufacturing method of the fourth embodiment described above, a method of performing ion beam etching in vacuum at the time of rounding the cutting edge portion 18 has been shown, but the present invention is not limited to this. Ion beam etching may be performed in a reactive gas atmosphere such as a fluorine-based gas or a chlorine-based gas. In this case, the desired processing can be completed in a shorter time.

As the rounding process for the cutting edge portion 18, the chemical removal process method such as a wet etching method or an electrolytic polishing method may be used. According to this method, more dies can be collectively processed into a desired shape in a short time. Further, when the cemented carbide base material 1 is finished by polishing or the like, the cutting edge portion 18 may be rounded. With this, the rounding process can be performed easily and inexpensively.

In the fourth embodiment described above, the case where the cutting blade of the punching die has a long service life has been described. However, the present invention is not limited to this, and a resin material containing a hard filler is used. It can also be applied to prolong the service life of the edge portions existing in the branch portion of the mold resin material in the runner and the boundary portions of the spool and runner, the runner and the gate, and the gate and the cavity in the molding die.

FIG. 6 is a sectional view showing the vicinity of the cutting edge portion of the punching press die according to the fifth embodiment of the present invention.
Referring to FIG. 6, in the fifth embodiment, the cutting edge portion 1
An inclined surface 21 is formed at 8. And its slope 2
One end of 1 and the end of the cutting edge side surface 20 are connected so as to intersect at an obtuse angle. Further, the other end of the inclined surface 21 and one end of the tool surface 19 are connected to each other at an obtuse angle. More specifically, the inclined surface 21 has a shape such that its normal line forms an angle of 40 to 80 degrees with the normal line of the tool surface 19. The hard coating layer 2 is formed on the surfaces of the inclined surface 21, the tool surface 19 and the cutting edge side surface 20. Even with this configuration,
Similar to the fourth embodiment described above, peeling of the coating layer 2 and the substrate 1
It is possible to effectively prevent chipping.

FIG. 7 shows punching according to a sixth embodiment of the present invention.
It is sectional drawing which showed the cutting blade part vicinity of the press die for processing.
With reference to FIG. 7, in the sixth embodiment, the tool surface 19 is
Plural inclined surfaces whose angle of normal to the tool surface 19 is small
21₁~ 21_nThe tool surface 19 and the cutting edge side surface 20
It has a shape that connects. A plurality of inclined surfaces 21₁~ 2
1_nNormal angles of those adjacent to each other, inclined 90 degrees
0.8 to 1.25 of the angle divided by the value obtained by adding 1 to the number of faces
Double. The inclined surface 21 having such a shape ₁~ 21
_nAnd the coating layer 2 on the surface of the cutting edge side surface 20 and the tool surface 19
Has been formed. In the sixth embodiment, the structure is as follows.
By doing so, the above-described fourth and fifth embodiments
Similarly, peeling of the coating layer 2 and chipping of the base material 1 (missing
Can be effectively prevented.

FIG. 8 is a sectional view showing the material structure of a die manufactured by using electric discharge machining or wire cutting according to the seventh embodiment of the present invention. Referring to FIG. 8, this seventh
In the example, a coating layer 2 made of a mixed phase of Ti ₂ N and TiN for imparting excellent wear resistance is formed on the surface of a base material 1 made of cemented carbide.

Next, with reference to FIG. 8, a method of manufacturing the mold of the seventh embodiment will be described. First, in a die manufactured by electric discharge machining or wire cutting, a melt reattachment layer 132 and a work-affected layer 133 are formed on the surface of the base material 101 as in the conventional structure described with reference to FIG. There is. Therefore, first, the die formed by the electric discharge machining or the wire cutting machining is washed to completely remove the machining powder, machining oil and water on the surface. After that, the mold is immediately stored in the ion beam etching vacuum chamber. At this time, in order to suppress seizure of the material to be processed and chipping (chipping) of the base material 1 at the time of press working, and to avoid local abrasion or peeling of the coating layer 2, a portion contacting the workpiece It is desirable to finish the surface roughness of the mold surface to 1 μm or less under the finish electric discharge machining condition. Further, if the cleaning is insufficient, problems such as difficulty in evacuation of the vacuum chamber due to transpiration and foreign substances on the cutting edge portion 18 hindering ion beam processing in the next step occur. It is desirable to carry out ultrasonic cleaning using.

Next, the inside of the vacuum chamber is evacuated to a vacuum degree of 5 × 10 ^-6 Torr or more. After that, an inert gas such as Ar is ionized by using a bucket type ion source or the like, and then the ionized inert gas is accelerated by using an electric field of 10 keV. Then, the accelerated inert gas is applied to the cutting edge portion subjected to the electric discharge machining or the wire cutting processing or the sliding portion with respect to the workpiece, so that the molten re-deposition layer 132 (see FIG. 12) is irradiated with the ion beam. Remove by etching. The ion irradiation conditions at this time are the same as in the case of the fourth embodiment described above.

Next, using the same manufacturing method as the mold manufacturing method of the first embodiment, Ti is formed on the surface of the base material 1 (see FIG. 8) from which the melt redeposition layer 132 (see FIG. 12) has been removed. _A coating layer 2 composed of a mixed phase of ₂ N and TiN is formed. By using the manufacturing method as described above, it is possible to avoid the problem that the coating layer 2 is easily separated from the base material 1 together with the melt redeposition layer 132 (see FIG. 12) when the mold is used. As a result, the adhesive force of the hard coating layer 2 can be made extremely strong, and the durability of the die that has been shape-processed by electrical discharge machining can be significantly improved.

In the manufacturing method described above, the ion beam etching is performed in vacuum to remove the melt redeposition layer 132 (see FIG. 12). However, the reactivity of fluorine-based gas or chlorine-based gas is used. Ion beam etching may be performed in a gas atmosphere. In this case, the desired processing can be completed in a shorter time. Alternatively, a chemical removal processing method such as a wet etching method or an electrolytic polishing method may be used. In this case, a larger number of molds can be collectively processed in a short time.

In the above manufacturing method, the method of forming the coating layer 2 after removing only the melt reattachment layer 132 has been described. However, in addition to the melt reattachment layer 132, the work-affected layer 133 is formed.
If the coating layer 2 is formed after also removing (see FIG. 12), a mold having a larger transverse rupture strength can be obtained.

[0096]

According to the processing member of the first and second aspects, the first gradient containing at least one constituent element of the coating layer and the constituent element of the base material between the base material and the coating layer. A composition layer is formed, and a second graded composition layer containing all the constituent elements of the coating layer and the constituent elements of the base material is formed between the first graded composition layer and the coating layer, and the first graded composition layer And the thickness of the second gradient composition layer are 30 nm or more, without forming a clear interface between the mold base material and the coating layer, which causes peeling, A coating layer having an extremely strong adhesive force can be formed, and a processing member excellent in long-term reliability can be obtained. Further, the above-mentioned coating layer is composed of one or more layers, and the lowermost coating layer is composed of one material selected from the group consisting of Ti ₂ N, TiN, and a mixed phase of Ti ₂ N and TiN, The first gradient composition layer is configured such that the constituent elements of the base material and the N atoms have opposite concentration gradients,
If the second graded composition layer is configured such that the constituent elements of the base material and the N and Ti atoms have mutually opposite concentration gradients, it is as if the coating layer having excellent wear resistance is integrated with the base material. It can be formed as described above, and a processing member having excellent wear resistance and long life can be obtained.

According to the processing member of claim 3, A
a first gradient composition layer having a concentration gradient in which at least Al and N are opposite to each other between the base material containing 1 and the first coating layer containing AlN, and the first coating layer and Ti ₂ N, TiN, And Al and T between the second coating layer made of one material selected from the group consisting of mixed phases of Ti ₂ N and TiN.
By forming a second gradient composition layer in which i and N have concentration gradients opposite to each other, the first and second gradient composition layers sandwiching the first coating layer between the base material and the second coating layer are stronger. Can be joined to. This makes it possible to obtain a processing member made of Al or an Al alloy having excellent durability.

According to the processing member of the fourth aspect, A
between the base material containing 1 and the first coating layer containing Al ₂ O _3.
l and O form a first gradient composition layer having concentration gradients opposite to each other, and Al and Ti have a concentration gradient opposite to each other between the first coating layer and the second coating layer containing TiO. to form a 2 graded composition layer, O between the second coating layer and the Ti ₂ N, TiN, and Ti ₂ N and a third coating layer made of one material selected from the group consisting of mixed phases of TiN By forming a third graded composition layer in which N and N have opposite concentration gradients, the third outermost layer having excellent wear resistance is formed.
The coating layer can be formed as if it were integrated with the substrate, and a processing member made of Al or Al alloy having excellent wear resistance and long life can be obtained.

According to the processing member of claim 5, one element selected from the group consisting of a base material made of cemented carbide and elements of groups 3 to 6 and 8 of the periodic table. Forming a gradient composition layer having a concentration gradient in which W and C atoms and the metal atoms and N atoms constituting the coating layer are opposite to each other, and the gradient composition layer. By containing no WN crystals, a layer containing brittle crystals that induces film peeling between the base material and the coating layer, or a coating layer having extremely strong adhesion without forming a clear interface. Can be formed, and a processing member made of a cemented carbide having excellent long-term reliability can be obtained.

According to the machining member of claim 6, the cutting edge side edge surface is formed so as to have a radius of curvature of 5 to 100 μm, and at least the cutting edge edge surface is subjected to a hardening treatment, thereby punching. It is possible to prevent peeling of the coating layer and chipping (chipping) of the base material during processing, and it is possible to dramatically improve the wear resistance and reliability of processing members such as a press die and a tool.

According to the machining member of claim 7, the cutting edge side surface and the cutting edge edge surface, the tool surface and the cutting edge edge surface intersect at an obtuse angle, and at least the cutting edge surface is hardened. By applying the above, peeling of the coating layer and chipping (chipped) of the base material can be effectively prevented during punching, as in the case of the above-mentioned invention of claim 6.

According to the manufacturing method of the working member of the eighth aspect, the metal element forming the nitride on the surface of the base material is vacuumed to a thickness of at least 70 nm in a vacuum of 0.1.
At the same time as vapor deposition at a rate of ˜5 nm / sec, nitrogen ions having energy E = 5 to 100 keV are ion current density I <227− (1.33 × E) μA / c on the surface of the base material.
By irradiating with m ² , it is possible to effectively suppress the generation of WN crystals that cause film peeling between the base material and the coating layer, and the reliability of the interface between the base material and the coating layer is extremely excellent. It is possible to easily manufacture a processing member made of cemented carbide.

In the manufacturing method of the processing member according to claim 9,
Therefore, the energy E = 0.1 on the surface of the base material in vacuum.
1 at least nitrogen-containing ions having ˜35 keV
~ 300μA / cm²Energy at the ion current density of
In the case of 16 keV, the irradiation nitrogen ion amount D = (4+
(0.23 × E)) × 10¹⁶Pieces / cm²Below, energy
When E> 16 keV, the irradiation nitrogen ion amount D = (14
− (0.4 × E)) × 10 ¹⁶Pieces / cm²Irradiate only below
Then, by forming a coating layer,
Suppresses the generation of WN crystals that cause film peeling from the film layer
While removing impurities on the surface of the substrate,
The adhesion between the alloy base material and the coating layer can be made extremely high.
Wear.

According to the manufacturing method of the processing member of the tenth aspect, the energy E = 0.
1 to 300 inert element ions having 1 to 35 keV
5 × 10 ¹³ to 1 × 10 at ion current density of μA / cm ^2
17 elements / cm ^{2 are} irradiated, and then a metal element forming a nitride is vapor-deposited on the surface of the base material at a rate of 0.1 to 5 nm / sec in a vacuum, and at the same time, energy E = 5-1 on the surface of the base material.
Ion current density I <2 for nitrogen ions having 00 keV
Irradiation at 27- (1.33 × E) μA / cm ² removes impurities on the surface of the base material while suppressing the generation of brittle crystals that cause film peeling between the base material and the coating layer. It is possible to form a hard coating layer having extremely strong adhesion. This makes it possible to easily manufacture a processing member made of cemented carbide having a long life.

According to the manufacturing method of the working member described in claim 11, the edge portion is processed so that the radius of curvature thereof is 5 to 100 μm, and at least the wear resistant layer is formed on the edge portion. Further, it is possible to easily manufacture a processing member capable of effectively preventing the peeling of the coating layer and the chipping (chipping) of the substrate during the punching process.

According to the method of manufacturing a working member described in claim 12, the edge portion is processed into a shape in which two surfaces sandwiching the edge intersect with the surface of the edge portion at an obtuse angle, and at least the edge portion is wear-resistant. A method according to claim 1 by forming a layer.
Similar to the manufacturing method of the processing member of 1, it is possible to easily manufacture the processing member capable of effectively preventing the peeling of the coating layer and the chipping (chip) of the base material during the punching process.

According to the manufacturing method of the working member of the thirteenth aspect, at least the molten redeposited layer on the worked surface is removed, and then an abrasion resistant layer is formed on the worked surface, whereby the base material and the coating film are formed. Since there is no layer that causes film peeling between the layers, it is possible to manufacture a processing member having extremely excellent reliability at the interface between the base material and the coating layer.

[Brief description of drawings]

FIG. 1 is a sectional view showing a material structure of a mold according to a first embodiment of the present invention.

2 is a sectional structural view showing a film forming apparatus used for manufacturing the mold of the first embodiment shown in FIG.

FIG. 3 is a sectional view showing a material structure of a mold according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a material structure of a mold according to a third embodiment of the present invention.

FIG. 5 is a sectional view showing the shape and material structure of a press die according to a fourth embodiment of the present invention.

FIG. 6 is a sectional view showing the shape and material structure of a press die according to a fifth embodiment of the present invention.

FIG. 7 is a sectional view showing the shape and material structure of a press die according to a sixth embodiment of the present invention.

FIG. 8 is a sectional view showing a material structure of a mold according to a seventh embodiment of the present invention.

FIG. 9 is a cross-sectional configuration diagram of a conventional film forming apparatus.

FIG. 10 is a cross-sectional view showing a material structure of a mold formed by a conventional film forming method.

FIG. 11 is a cross-sectional view showing the shape of a conventional press die.

FIG. 12 is a cross-sectional view showing a material structure of a conventional electric discharge machined portion.

[Explanation of symbols]

 1: Base material 2: Coating layer 3: First graded composition layer 4: Second graded composition layer In each figure, the same reference numerals indicate the same or corresponding parts.

Claims (13)

[Claims] 1. A base material having a main surface, a coating layer formed on the main surface of the base material, located between the base material and the coating layer, and on the main surface of the base material. Formed in contact with each other, the first graded composition layer containing at least one element of the constituent elements of the coating layer and the constituent element of the base material, and located between the first graded composition layer and the coating layer, A second graded composition layer including all the constituent elements of the coating layer and a constituent element of the base material, wherein the sum of the thickness of the first graded composition layer and the thickness of the second graded composition layer is 30 nm or more. Is a processing member. Wherein said coating layer together with consists of one or more layers, the outermost layer of the coating layer is Ti ₂ N, TiN, and Ti ₂ N and TiN and a mixed phase composed groups than selected one of The first graded composition layer has a concentration gradient in which the constituent elements of the base material and N atoms are opposite to each other, and the second graded composition layer includes the constituent element of the base material and N atoms. , Ti
The processing member according to claim 1, wherein the atoms and the atoms have opposite concentration gradients. 3. A base material having a main surface and containing Al, a first coating layer containing AlN formed on the main surface of the base material, and a Ti ₂ layer formed on the first coating layer. A second coating layer made of one material selected from the group consisting of N, TiN, and a mixed phase of Ti ₂ N and TiN, and located between the base material and the first coating layer, and at least Al And N are located between the first coating layer and the second coating layer, and the first gradient composition layer has a concentration gradient opposite to each other.
And a second gradient composition layer in which Ti and N have concentration gradients opposite to each other, a processing member. 4. A base material having a main surface and containing Al, and a first base material containing Al ₂ O ₃ formed on the main surface of the base material.
A coating layer, a second coating layer containing TiO 2 formed on the first coating layer, Ti ₂ N, TiN, and a mixed phase of Ti ₂ N and TiN formed on the second coating layer. A third coating layer made of one material selected from the group consisting of: Al and O formed between the base material and the first coating layer;
Is formed between the first coating layer and the second coating layer, the first gradient composition layer having a concentration gradient opposite to each other, and A
1 and Ti are formed between a second gradient composition layer having concentration gradients opposite to each other, and the second coating layer and the third coating layer, and O
And a third gradient composition layer in which N has a concentration gradient opposite to each other, a processing member. 5. A base material having a main surface and made of a cemented carbide, and a base material formed on the main surface of the base material.
1 selected from the group consisting of Group 8 and Group 8 elements
Formed between the base material and the coating layer, the coating layer containing nitride of one element, and the W and C atoms and the metal atoms and N atoms constituting the coating layer have opposite concentration gradients. And a gradient composition layer having the gradient composition layer, the gradient composition layer containing no WN crystal. 6. A working member comprising: a cutting edge side surface; a tool surface; and a cutting edge edge surface having a curvature radius of 5 to 100 μm, wherein at least the cutting edge edge surface is hardened. 7. A cutting edge side surface, a tool surface, and a cutting edge edge surface, wherein the cutting edge side surface and the cutting edge edge surface, and the tool surface and the cutting edge edge surface respectively intersect at an obtuse angle and at least A processing member in which the edge surface of the cutting edge is hardened. 8. A coating layer containing a nitride of one element selected from the group consisting of Groups 3 to 6 and 8 of the periodic table is formed on the surface of a base material made of cemented carbide. The method for producing a processed member, wherein the metal element forming the nitride is added to the surface of the base material in vacuum until a film thickness of at least 70 nm is reached.
Energy E on the surface of the substrate at the same time as the step of depositing at a rate of 0.1 to 5 nm / sec;
= 5 to 100 keV, and a step of irradiating with nitrogen ions having an ion current density I <227- (1.33 x E) [mu] A / cm < ² >. 9. A coating layer containing a nitride of one element selected from the group consisting of Groups 3 to 6 and Group 8 of the Periodic Table is formed on the surface of a base material made of cemented carbide. The manufacturing method of the processed member, wherein the energy E = 0.1 to the surface of the base material in vacuum.
1 to at least nitrogen-containing ions having 35 keV
Energy E ≦ 1 at an ion current density of 300 μA / cm ^2.
In the case of 6 keV, the irradiation nitrogen ion amount D = (4+ (0.
23 × E)) × 10 ¹⁶ pieces / cm ² or less, energy E> 1
In the case of 6 keV, the irradiation nitrogen ion amount D = (14−
(0.4 × E) × 10 ¹⁶ pieces / cm ² or less, and a method of manufacturing a member for processing, comprising a step of forming the coating layer. 10. A coating layer containing a nitride of one element selected from the group consisting of Groups 3 to 6 and 8 of the Periodic Table is formed on the surface of a base material made of cemented carbide. The manufacturing method of the processed member, wherein the energy E = 0.1 to the surface of the base material in vacuum.
1 to 300 μA of inert element ion having 35 keV
Irradiation with 5 × 10 ¹³ to 1 × 10 ¹⁷ ions / cm ^{2 at} an ion current density of / cm ² , and then 0.1 to 0.1% of the metal element constituting the nitride on the surface of the base material in vacuum. The step of depositing at a rate of 5 nm / sec and the energy E = 5 on the surface of the substrate at the same time as the step of depositing.
Nitrogen ions having an ion current density I of ˜100 keV
<227- (1.33 x E) [mu] A / cm < ² >. 11. A method of manufacturing a processing member having an edge portion, the step of processing the edge portion so that its radius of curvature is 5 to 100 μm, and forming a wear resistant layer on at least the edge portion. The manufacturing method of the member for processing provided with the process of performing. 12. A method of manufacturing a processing member having an edge portion, the step of processing the edge portion into a shape such that two surfaces sandwiching the edge portion intersect the surface of the edge portion at an obtuse angle, And a step of forming a wear resistant layer on at least the edge portion. 13. A method for manufacturing a working member, comprising: a step of removing at least a molten redeposited layer on the worked surface; and a step of forming an abrasion resistant layer on the worked surface.