CN102230156A - Method for preparing composite hard coating on min-cutter and min-cutter - Google Patents
Method for preparing composite hard coating on min-cutter and min-cutter Download PDFInfo
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Abstract
The invention discloses a method for preparing a composite hard coating on a min-cutter and a min-cutter. The method for preparing a composite hard coating on a min-cutter comprises the steps of carrying out pretreatment before coating, implantation of metallic ions and deposition of hard coating on the surface of the min-cutter to be processed. According to the invention, metallic ions are implanted into the surface of the min-cutter through energy-loaded ion beams generated by an ion implanter before the hard coating is deposited on the surface of the min-cutter to be processed; therefore, physical and chemical properties of the surface of the min-cutter to be processed are changed, binding force between the hard coating and the min-cutter in the process of hard coating deposition is improved, and burns to the cutting edge of the mini-cutter are avoided, thereby enabling the min-cutter with the coating to have a more excellent processing property and a longer service life and successfully realizing surface modification of the min-cutter.
Description
Technical field
The present invention relates to PCB min-cutter process for modifying surface field, particularly a kind of method and min-cutter that on min-cutter, prepares rigid composite coating.
Background technology
Min-cutter can be used for processing printed circuit board (hereinafter to be referred as PCB).PCB is the copper-clad plate that is formed by substrate, Copper Foil and tackiness agent pressing, and the insulation laminate that substrate is made up of high molecular synthetic resin and strongthener, thereby the main processing object of PCB min-cutter is Copper Foil, resin and strongthener.When adopting PCB min-cutter processing printed circuit board, there are some problems.
At first, contain a large amount of resins and strongthener in the printed circuit board, the hardness of printed circuit board and intensity height, the common min-cutter rate of wear in the process of processing printed circuit board is fast, and abrasion loss is big, and the life-span of cutter is short; Secondly, during min-cutter processing printed circuit board, smear metal is blocked in the junk slot of cutter easily, causes dust discharge bad, can seriously reduce the hole wall quality of printed circuit board; Once more, contain Copper Foil in the printed circuit board, during PCB min-cutter processing printed circuit board, copper scale easily is bonded on the cutting edge of PCB min-cutter, forms built-up edge at cutting edge, also can seriously reduce the quality of PCB min-cutter processing printed circuit board.
For life-span of improving the PCB min-cutter and the quality of processing printed circuit board thereof, lot of domestic and international enterprise all carries out surface modification treatment to min-cutter, as chemical vapor deposition (CVD) and physical vapor deposition (PVD) etc.Chemical vapor deposition (CVD) is to utilize the processing method of gaseous substance at the chemical reaction formation solid film of workpiece surface, as direct current glow discharge plasma CVD, radio frequency glow discharge plasma CVD, electron cyclotron CVD etc.; Physical vapor deposition (PVD) is under vacuum condition, utilizes physical method, and the deposit material gasification for atom, molecule or ion turn to ion, is directly deposited to the method for matrix surface, as the ion beam depositing method.
Yet when conventional cutter coat preparation technology is directly transferred to min-cutter; the bonding force of coating of preparing and min-cutter matrix is low; coating easily comes off and has lost provide protection; cause cutting performance still good inadequately; work-ing life is also still shorter, and it is especially obvious that this embodies on the PCB min-cutter.
The bonding force of conventional coating and min-cutter matrix is poor, in order to improve the bonding force of coating and matrix, before coating preparation, all can adopt etching technics to improve coating's adhesion.Adopt the titanium ion bombardment to purify the bonding force that improves coating and matrix such as arc ion plating, working bias voltage 800-1000V, what high-energy, highdensity titanium ion arrived workpiece mainly is the sputter effect, the sputter effect can not form film greater than sedimentation, can form " pseudo-diffusion layer ", the atoms metal quality is big, the sputter good purification.In addition, magnetron sputtering adopts argon ion bombardment to purify, and charges into argon gas to vacuum chamber, and vacuum remains on 1-3Pa, and glow discharge takes place bombarding voltage 1000-3000V, produces the argon plasma bombardment and purifies tool matrix.No matter adopt titanium ion bombardment or argon ion bombardment; ion energy all at hundreds of to a kiloelectron volt; the ion energy deficiency; can not remove the impurity of matrix surface fully; thereby the coating of preparation and the bonding force of matrix are still good inadequately, particularly during deposited coatings, occur coating shedding easily on min-cutter; expose hard alloy substrate, promptly can not give full play to the wear-resistant protection effect of coating.
Summary of the invention
Technical problem to be solved by this invention provides a kind of work-ing life than the method and the min-cutter that prepare rigid composite coating on the long min-cutter.
The objective of the invention is to be achieved through the following technical solutions:
Prepare the method for rigid composite coating on a kind of min-cutter, may further comprise the steps:
A: the min-cutter work surface is carried out pre-treatment before the coating;
B: the min-cutter work surface is carried out metal ion inject processing;
C: the min-cutter work surface is carried out the hard coat depositing treatment.
Among the described step C, the hard coat deposition adopts the vacuum arc deposition technology to realize.
Further, among the step C, the hard coat deposition also can adopt magnetic filtered pulse cathodic vacuum arc deposition technique to realize.Wherein, described magnetic filtered pulse cathodic vacuum arc deposition technique is the plasma body that utilizes the cathodic vacuum arc discharge generation, adopt the motion of crooked introduction by magnetic field plasma body, make the plasma body of cathodic vacuum arc discharge generation arrive in the sight line target chamber in addition, filter out drop and macrobead that arc discharge produces simultaneously, realize the deposition of high-quality thin-film.Adopt magnetic filtered pulse cathodic vacuum arc deposition technique can produce that hardness is higher, density is bigger, more purified film.
It is IVA family element, VA family element, VIA family element or its alloy that the metal that is adopted is handled in metal ion injection among the described step B.
It is titanium, chromium, aluminium or its alloy that the metal that is adopted is handled in metal ion injection among the described step B.After having passed through experiment repeatedly, it is best to select for use these several metals to carry out the effect that metal ion injects.
Among the described step B, between ion implantation energy range three kiloelectron volts-10,005 kiloelectron volt.
Among the described step C, when the hard coat depositing treatment that carry out on the min-cutter surface, adopt the high purity titanium target, in vacuum chamber, be connected with nitrogen as cathode targets, with at tool surface in conjunction with producing the TiN coating.
Among the described step C, when the hard coat depositing treatment that carry out on the min-cutter surface, adopt atomic ratio be 50: 50 titanium-aluminum alloy target as cathode targets, in vacuum chamber, be connected with nitrogen, with at tool surface in conjunction with producing the TiAlN coating.
Pretreated step may further comprise the steps before in the described steps A min-cutter work surface being carried out coating:
Carry out ultrasonic cleaning: adopt the metal cleaning agent in Ultrasonic Cleaners, to clean, remove dust, grease and the rust staining on min-cutter surface, adopt a large amount of rinsed with deionized water min-cutters then, remove the clean-out system that remains on the min-cutter; Afterwards, min-cutter is put into alcohol clean, remove the water on min-cutter surface; At last, min-cutter is put into acetone clean, remove residual grease;
Through after the ultrasonic cleaning, min-cutter is toasted, remove acetone, the grease of min-cutter remained on surface, and its volatilization cracked gas is taken away by vacuum pump, obtain extremely clean surface.
A kind of min-cutter that adopts above-mentioned preparation method to make wherein, earlier carries out pre-treatment before the coating to the min-cutter work surface; Again the min-cutter work surface is carried out metal ion and inject processing; Again the min-cutter work surface is carried out the hard coat deposition.
The present invention is because the ion implantation processing of advanced row metal before the min-cutter work surface is carried out the hard coat depositing treatment, carry and to carry out ion implantation to tool surface by ionic fluid by what ion implanter produced, thereby change the physical and chemical performance of min-cutter work surface material, improve the bonding force of hard coat and min-cutter in the follow-up hard coat depositing treatment, can avoid the min-cutter cutting edge to be burnt again; Make that the processing characteristics of the min-cutter after the coating is more superior, longer service life successfully realizes the min-cutter surface modification.
Description of drawings
Fig. 1 is the preparation method's of the embodiment of the invention a schematic flow sheet;
Fig. 2 is the surfaceness enlarged diagram of the min-cutter of common not deposited coatings;
Fig. 3 is the surfaceness enlarged diagram that directly carries out the sedimentary min-cutter of coating routinely;
Fig. 4 is the surfaceness enlarged diagram of the min-cutter of the coating production in the present embodiment;
Fig. 5 is the wear pattern synoptic diagram of min-cutter behind processing circuit board 4000 holes of common not deposited coatings;
Fig. 6 directly carries out the wear pattern synoptic diagram of the sedimentary min-cutter of coating behind processing circuit board 4000 holes routinely;
Fig. 7 is the wear pattern synoptic diagram of min-cutter behind processing circuit board 4000 holes of the coating production in the present embodiment.
Embodiment
The invention will be further described below in conjunction with accompanying drawing and preferred embodiment.
As shown in Figure 1, prepare min-cutter of the present invention, may further comprise the steps:
A: the min-cutter work surface is carried out pre-treatment before the coating;
B: the min-cutter work surface is carried out metal ion inject processing; Wherein, metal ion injects and adopts high current metallic vapor vacuum arc ion source (MEVVA source) to carry out, ion source converts certain atoms of elements or molecule to ion, these ions are under the electric field up to several kilovolts, be injected into the surface of min-cutter workpiece to be processed, and enter subsurface certain depth, be deposited on the there.
C: the min-cutter work surface is carried out the hard coat depositing treatment.
A year energy ionic fluid that adopts ion implanter to produce carries out ion implantation to tool surface, can improve the bonding force of follow-up hard coat and tool matrix:
At first, when the energetic ion that ion source produces clashes into tool surface, energetic ion produces intensive sputter effect to cutter, can remove the impurity such as gas, liquid and dust that are adsorbed on tool surface, for the deposition of hard coat provides extremely clean surface, strengthen the bonding force of min-cutter and follow-up hard coat;
Secondly, energetic ion produces intensive collision and cascade collision on the tool matrix surface, the part energetic ion replaces the original atom of tool matrix, change the chemical ingredients of tool surface, form one deck mixed interface on the surface, this mixed interface had both improved mechanical properties such as the intensity, hardness of tool surface, also can strengthen the bonding force of hard coat and tool matrix simultaneously;
Once more, because it is different to inject between ion and the matrix atom radius, when injecting the position of the original atom of ionic replacement min-cutter matrix, must cause the lattice distortion of min-cutter matrix, promptly in the transition layer of min-cutter matrix surface, there is a large amount of rooms, interstitial atom, dislocation, vacancy cluster, defectives such as interstitial atom group and dislocation group, this transition layer is in unstable higher-energy state, carry out hard coat when deposition when follow-up, when the plasma motion that magnetic filtered pulse cathodic vacuum arc produces arrives this interface, plasma body is assembled at the lattice defect place easily, and nucleation rate is big.When the speed of growth of hard coat was identical, nucleation rate was big more, and the crystal grain of the hard coat of follow-up generation is tiny more, and the intensity of the hard coat of preparation, hardness are high more, and performance is superior more.
Metal ion injection among the step B is handled the metal that is adopted and be can be IVA family element, VA family element, VIA family element or its alloy, as titanium, chromium, aluminium or its alloy.
Because the PCB min-cutter is to be used for High-speed machining, it is minimum that cutter bores the footpath, and generally between 0.1-0.3mm, any small defective all will have a strong impact on the processing characteristics of cutter.Therefore, deposited coatings on so small cutter need to keep the min-cutter surface that higher smooth finish is arranged, yet there are a lot of difficulties in the coating that adopts conventional coating technology to prepare best bright finish on min-cutter.Conventional PVD coating apparatus is after exciting target; can excite and produce plasma body and a large amount of liquid particle; if not carrying out the magnetic filtering technique handles; the plasma body that excites can deposit on the tool surface with big liquid particle; form rough structure on the min-cutter surface; reduce min-cutter surface smoothness; improved the surfaceness of min-cutter; adopt the type coating min-cutter when processing PCB sheet material; the frictional force of cutter and sheet material increases; it is bad and cause broken needle to be easier to occur dust discharge; position, the hole precision of the sheet material of processing and hole slightly are worth problems such as also serious reduction; and these liquid particle do not have complete ionization; there is a lot of neutral atoms; can not form hard coat with the nitrogen ionic bond, but, will seriously reduce the hardness of coating with the soft coating inside that is embedded in mutually; the wear resisting property of min-cutter can not be improved, thereby the life-span of min-cutter can not be increased.
At the problems referred to above, among the described step C, the hard coat deposition can adopt magnetic filtered pulse cathodic vacuum arc deposition technique to realize.Magnetic filtered pulse cathodic vacuum arc deposition technique is the plasma body that utilizes the cathodic vacuum arc discharge generation, adopt the motion of crooked introduction by magnetic field plasma body, make the plasma motion of cathodic vacuum arc discharge generation arrive in the sight line target chamber in addition, its concrete structure synoptic diagram is please referring to Fig. 3.Adopt magnetic filtered pulse cathodic vacuum arc deposition technique, have only charged plasma body just to be subjected to the controls movement in magnetic field to the min-cutter surface, and neutral particle is filtered and can not arrive tool surface, avoided influence to the cutter surfaceness, can effectively filter out simultaneously arc discharge or the target drop that produces when exciting, macrobead and neutral particle, can obtain 100% pure plasma body, eliminated the influence of the macroscopic particles in the plasma, realize the deposition of high-quality coating, can prepare more smooth, hard, fine and close, evenly, purified hard coating film.And magnetic filtered pulse cathodic vacuum arc deposition technique can realize higher ionization level and ion deposition energy, help improving hard coat quality and with the bonding force of tool matrix, and the speed of this deposition techniques hard coat is fast, the production efficiency height.
In addition, conventional coating is on min-cutter during coating, the body material at cutting edge roundness place is easily ablated and remove, promptly breach occurs or directly fall point of a knife is ablated at cutting edge roundness, this is because a large amount of ion, neutral atoms moves to the min-cutter surface together, and the point of a knife of min-cutter produces discharge after accumulating a large amount of electric charges, the temperature of cutter regional area acutely can be raise and melt, under oarse-grained bump, this part material breaks away from matrix and forms the ablation defective.And adopt magnetic filtered pulse cathodic vacuum arc deposition technique, removed macrobead such as neutral particle after, when coating deposits, do not have oarse-grained bump, avoided the formation of ablation defective.
And in the ion implantation stage, can be between three kiloelectron volts-10,005 kiloelectron volt between its energy range.Why selecting for use between this energy range, is because during high-octane ion implantation min-cutter surface, carries out violent corrasion at cutting edge, easily body material is gone out and is formed defective from the cutting edge sputter; Simultaneously, because min-cutter is minimum, charged ion discharges in the point of a knife accumulation easily, forms localized hyperthermia, makes cutting edge roundness melt and formation breach etc.And the ion energy of selecting 3,000 to 10,005 kiloelectron volts in the present embodiment is relatively to be fit to, can guarantee Impurity removal with the min-cutter remained on surface, do not injure the min-cutter matrix again and form defective, can also guarantee certain injection rate, between matrix and coating, form transition layer, improve the bonding force of coating and matrix.
Concrete, whole preparation process is as follows:
One, the pre-treatment before the PCB min-cutter coating
In order to want the good coating of preparation quality, preferably remove the pollutent on PCB min-cutter surface earlier, promptly to carry out strict cleaning to min-cutter.Pollutent is divided into four classes: tangible particle, for example dust etc.; Organic substance, for example grease and coating etc.; Inorganic substance, for example salt and rust staining etc.; The microorganism body.In conjunction with the characteristics of min-cutter, we adopt ultrasonic cleaning process and vacuum bakeout method bonded mode, can so that the min-cutter surface extremely totally clean.
Ultrasonic cleaning contains three steps.At first, adopt the metal cleaning agent in Ultrasonic Cleaners, to clean, remove the impurity such as dust, grease and rust staining on min-cutter surface, adopt a large amount of rinsed with deionized water min-cutters then, remove the impurity such as clean-out system that remain on the min-cutter; Secondly, min-cutter is put into alcohol clean, remove the impurity such as water on min-cutter surface; Once more, min-cutter is put into acetone clean, remove residual impurity such as grease.
Through after the ultrasonic cleaning, trace impurities such as acetone, grease are also being adsorbed on the min-cutter surface, need toast.Min-cutter is toasted, and the temperature of baking is 300-500 ℃, toasts after 30-60 minute, acetone is cut end volatilization, greases etc. also are cracked into gases such as hydrogen, water vapour and carbonic acid gas fully, and these gases will be taken away rapidly by vacuum pump, thereby obtain extremely clean surface.Concrete cleaning is referring to table 1.
Table 1: min-cutter cleaning
Two, PCB min-cutter metal ion injects and handles
After the pre-treatment of PCB min-cutter through the front, though the min-cutter surface is very clean, the activity on its surface is not high, if directly carry out the coating deposition, then the bonding force of coating and cutter hub is big inadequately, and coating comes off easily and loses provide protection.Therefore when min-cutter was carried out surface modification, advanced row metal was ion implantation, to improve the activity on min-cutter surface, strengthened the performance of coating.Ion implantationly can carry out the injection of multiple metal ion, as titanium, chromium and aluminium and alloy thereof etc.Its injection condition is referring to table 2.
Table 2: ion implanting conditions
Three, the hard coat depositing treatment on PCB min-cutter surface
Only carry out ion implantationly on the min-cutter surface, the hardness of min-cutter improves little, can not obviously improve the performance of min-cutter, therefore, the min-cutter work surface is carried out ion implantation after, also need to carry out the hard coat depositing treatment.
The hard coat depositing treatment can adopt magnetic filtered pulse cathodic vacuum arc deposition technique to realize.When magnetic filtered the vacuum cathode arc deposited, the ion that electric arc produces was controlled by magnetic field, moves to the min-cutter surface by certain track and speed, at min-cutter surface forming core and grow up.Because carried out the metal ion injection earlier before the coating deposition, the activity on min-cutter surface is very high, ion is big at its surperficial nucleation rate, and promptly the grain fineness number of the coating of Sheng Chenging is very little, and the performance of coating obviously improves.
Can be at min-cutter surface deposition TiN, multiple hard coat such as TiAlN:
During the depositing TiN coating, adopt the high purity titanium target, utilize arc excitation to produce Ti as cathode targets
+, when Ti+ is subjected to the magnetic field controls movement to vacuum chamber, owing to be connected with nitrogen, Ti in the vacuum chamber
+With the nitrogen molecule collision, excite nitrogen molecule to be decomposed into N
+, Ti
+And N
+Move to tool surface together, at tool surface in conjunction with producing the TiN coating;
During depositing Ti AlN coating, can adopt atomic ratio be 50: 50 titanium-aluminum alloy target as cathode targets, utilize arc excitation to produce Ti
+And Al
+, work as Ti
+And Al
+When being subjected to the magnetic field controls movement, owing to be connected with nitrogen, Ti in the vacuum chamber to vacuum chamber
+And Al
+With the nitrogen molecule collision, excite nitrogen molecule to be decomposed into N
+, Ti
+, Al
+And N
+Move to tool surface together, at tool surface in conjunction with producing the TiAlN coating.Its concrete mode of deposition is referring to table 3:
Table 3: coating mode of deposition
| Target | Bias voltage | Nitrogen pressure | Time | |
| TiN | Pure titanium target | -50～-500V | 0.1～5Pa | 60～90min |
| TiAlN | Titanium aluminium (50: 50) target | -50～-500V | 0.1～5Pa | 60～90min |
Adopt magnetic filtered pulse cathodic vacuum arc deposition technique can realize high ionization level and ion deposition energy, help improving coating quality and with the bonding force of tool matrix, use the speed of this deposition techniques diamond-like coating fast, the production efficiency height.
Below with example to the min-cutter of common not deposited coatings, directly carry out the sedimentary min-cutter of coating and adopted the performance of the min-cutter of the coating production in the present embodiment to compare routinely:
1, surfaceness contrast
Please referring to Fig. 2, Fig. 3, Fig. 4, wherein Fig. 3 is the min-cutter surface of conventional coating, and its coatingsurface is coarse, has tangible particle to exist; And Fig. 4 is the min-cutter surface of having adopted the coating production in the present embodiment, and smooth, the uniformity of its coatingsurface does not reduce the roughness of tool surface.And on the conventional coated cutting tool chisel edge white point is arranged, promptly there is breach on the chisel edge, and adopted the min-cutter of the coating production in the present embodiment not have similar phenomenon.
2, coating wear resistance contrast
Fig. 5, Fig. 6, Fig. 7 are respectively the wearing and tearing comparison diagram of min-cutter after having carried out processing circuit board 4000 holes among Fig. 2, Fig. 3, Fig. 4.As can be seen from the figure, conventional coating is all bigger with the abrasion loss of coated cutting tool not, and has adopted the abrasion loss of min-cutter of the coating production in the present embodiment very little, and wear resisting property obviously improves.
From figure, can visually see, adopted the min-cutter various aspects of performance of the coating production in the present embodiment all obviously more excellent.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. prepare the method for rigid composite coating on the min-cutter, it is characterized in that, may further comprise the steps:
A: the min-cutter work surface is carried out pre-treatment before the coating;
B: the min-cutter work surface is carried out metal ion inject processing;
C: the min-cutter work surface is carried out the hard coat depositing treatment.
2. the preparation method of deposition hard coat is characterized in that on the min-cutter as claimed in claim 1, and among the described step C, the hard coat deposition adopts the vacuum arc deposition technology to realize.
3. the preparation method of deposition hard coat is characterized in that on the min-cutter as claimed in claim 2, and among the described step C, the hard coat deposition adopts magnetic filtered pulse cathodic vacuum arc deposition technique to realize.
4. prepare the method for rigid composite coating on the min-cutter as claimed in claim 1, it is characterized in that, it is IVA family element, VA family element, VIA family element or its alloy that the metal that is adopted is handled in the metal ion injection among the described step B.
5. prepare the method for rigid composite coating on the min-cutter as claimed in claim 4, it is characterized in that, it is titanium, chromium, aluminium or its alloy that the metal that is adopted is handled in the metal ion injection among the described step B.
6. preparing the method for rigid composite coating on the min-cutter as claimed in claim 1, it is characterized in that, among the described step B, is 3,100 electron-volts-10,005 kiloelectron volts between ion implantation energy range.
7. as depositing the preparation method of hard coat on claim 1 or the 3 described min-cutters, it is characterized in that, among the described step C, when the hard coat depositing treatment that carry out on the min-cutter surface, adopt the high purity titanium target as cathode targets, in vacuum chamber, be connected with nitrogen, with at tool surface in conjunction with producing the TiN coating.
8. as depositing the preparation method of hard coat on claim 1 or the 3 described min-cutters, it is characterized in that, among the described step C, when the hard coat depositing treatment that carry out on the min-cutter surface, adopting atomic ratio is that 50: 50 titanium-aluminum alloy target is as cathode targets, in vacuum chamber, be connected with nitrogen, with at tool surface in conjunction with producing the TiAlN coating.
9. prepare the method for rigid composite coating on the min-cutter as claimed in claim 1, it is characterized in that, in the described steps A min-cutter work surface carried out coating before pretreated step may further comprise the steps:
Carry out ultrasonic cleaning: adopt the metal cleaning agent in Ultrasonic Cleaners, to clean, remove dust, grease and the rust staining on min-cutter surface, adopt a large amount of rinsed with deionized water min-cutters then, remove the clean-out system that remains on the min-cutter; Afterwards, min-cutter is put into alcohol clean, remove the water on min-cutter surface; At last, min-cutter is put into acetone clean, remove residual grease;
Through after the ultrasonic cleaning, min-cutter is toasted, remove acetone, the grease of min-cutter remained on surface, and its volatilization cracked gas is taken away by vacuum pump, obtain extremely clean surface.
An employing as claim 1-9 arbitrary as described in the min-cutter made of method, it is characterized in that, earlier the min-cutter work surface is carried out pre-treatment before the coating; Again the min-cutter work surface is carried out metal ion and inject processing; Again the min-cutter work surface is carried out the hard coat deposition.
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