JPH07136572A - Rotary cup type liquid supplying device - Google Patents
Rotary cup type liquid supplying deviceInfo
- Publication number
- JPH07136572A JPH07136572A JP28309293A JP28309293A JPH07136572A JP H07136572 A JPH07136572 A JP H07136572A JP 28309293 A JP28309293 A JP 28309293A JP 28309293 A JP28309293 A JP 28309293A JP H07136572 A JPH07136572 A JP H07136572A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- casing
- inner cup
- coating liquid
- cup type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coating Apparatus (AREA)
- Weting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はガラス基板や半導体ウェ
ーハ等の被処理物の表面に被膜形成用の塗布液等を塗布
する回転カップ式液体供給装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary cup type liquid supply device for applying a coating liquid for forming a film onto the surface of an object to be treated such as a glass substrate or a semiconductor wafer.
【０００２】[0002]
【従来の技術】スピンナーによって回転せしめられるイ
ンナーカップ及びチャックをケーシング（アウターカッ
プ）内に配置し、チャック上に吸着された被処理物上面
にＳＯＧ等の塗布液を滴下し、インナーカップとともに
チャック上に吸着された被処理物を回転し、滴下された
塗布液を遠心力で被処理物表面に均一に拡散するように
した回転カップ式の塗布装置を本出願人は特開平３−２
９３０５５号公報に記載された発明として先に提案して
いる。2. Description of the Related Art An inner cup and a chuck rotated by a spinner are arranged in a casing (outer cup), and a coating liquid such as SOG is dropped on the upper surface of an object to be treated adsorbed on the chuck, and the inner cup and the chuck are placed on the chuck. The applicant of the present invention has disclosed a rotary cup type coating apparatus in which the object to be treated adsorbed on the substrate is rotated and the dropped coating liquid is uniformly dispersed on the surface of the object to be treated by centrifugal force.
It has been previously proposed as the invention described in Japanese Patent Publication No. 93055.
【０００３】上述した回転カップ式の塗布装置にあって
は、滴下された塗布液の一部は被処理物表面に残るが、
他の塗布液は遠心力にて被処理物から飛散する。この飛
散した塗布液を回収して再利用等を図るため、従来にあ
ってはケーシングに回収通路を形成し、被処理物から飛
散した塗布液をインナーカップを介してケーシングの回
収通路に入れ、インナーカップの回転を利用して外部に
回収するようにしている。In the above-mentioned rotary cup type coating device, a part of the dropped coating liquid remains on the surface of the object to be treated.
Other coating liquids are scattered from the object to be processed by centrifugal force. In order to collect and reuse the scattered coating liquid, conventionally, a collecting passage is formed in the casing, and the coating liquid scattered from the object to be processed is put into the casing collecting passage through the inner cup. The rotation of the inner cup is used to collect it outside.
【０００４】[0004]
【発明が解決しようとする課題】上述したように従来に
あっては、被処理物から飛散した塗布液を一旦インナー
カップを介してケーシングの回収通路に入れるようにし
ているので、回収効率が悪く、また、回収通路の清掃を
装置を停止して頻繁に行わなければならず、更に、ケー
シングに回収通路を形成しているため、その分ケーシン
グの径が大きくなり、装置全体の大型化につながってい
る。As described above, in the conventional case, since the coating liquid scattered from the object to be processed is once introduced into the recovery passage of the casing through the inner cup, the recovery efficiency is poor. In addition, the recovery passage must be cleaned frequently by stopping the device, and since the recovery passage is formed in the casing, the diameter of the casing increases accordingly, leading to an increase in the size of the entire device. ing.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決すべく本
発明は、回転カップ式液体供給装置のインナーカップの
内周部側に供給された液の貯留部を形成し、更に貯留部
に溜まった液体を吸引回収するノズルを移動可能に配置
した。In order to solve the above-mentioned problems, the present invention forms a reservoir for the liquid supplied to the inner peripheral side of an inner cup of a rotary cup type liquid supply device, and further stores the liquid in the reservoir. A nozzle for sucking and collecting the liquid was arranged so as to be movable.
【０００６】[0006]
【作用】１回の供給毎、或いは供給された液の貯留部に
所定量の液体が溜まったならば、インナーカップの回転
を停止又はゆっくり回転せしめ、ケーシング及びインナ
ーカップの蓋体を上げ、ノズルを貯留部まで移動し、貯
留部内の液体を吸引回収する。After each supply, or when a predetermined amount of liquid is accumulated in the reservoir for the supplied liquid, the inner cup is stopped or slowly rotated, the casing and the lid of the inner cup are raised, and the nozzle is rotated. Is moved to the storage section, and the liquid in the storage section is sucked and collected.
【０００７】[0007]
【実施例】以下に本発明の実施例を添付図面に基づいて
説明する。ここで、図１は本発明に係る回転カップ式液
体供給装置を代表する塗布装置の半裁図、図２は同回転
カップ式塗布装置の塗布液回収の状態を示す断面図であ
る。Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is a half-cut view of a coating device representing a rotary cup type liquid supply device according to the present invention, and FIG. 2 is a sectional view showing a state of collecting the coating liquid of the rotary cup type liquid coating device.
【０００８】回転カップ式塗布装置はベースプレート１
に環状のケーシング２を固定し、このケーシング２内に
スピンナー３によって回転せしめられるインナーカップ
４を配置し、このインナーカップ４の中央に被処理物と
しての半導体ウェーハＷを吸着固定する真空チャック５
をインナーカップ４に対して昇降可能に設けている。
尚、スピンナー３によって回転せしめられるインナーカ
ップ４に代えてインナーカップ４によって回転せしめら
れるスピンナー３を用いてもよい。The rotating cup type coating device is a base plate 1
A ring-shaped casing 2 is fixed to the inner casing 4, an inner cup 4 rotated by a spinner 3 is arranged in the casing 2, and a vacuum chuck 5 for adsorbing and fixing a semiconductor wafer W as an object to be processed in the center of the inner cup 4.
Is provided to be movable up and down with respect to the inner cup 4.
Instead of the inner cup 4 rotated by the spinner 3, a spinner 3 rotated by the inner cup 4 may be used.
【０００９】前記インナーカップ４の外周面とケーシン
グ２の内周面とは略平行に近接し、これらの間に微小な
隙間６が形成され、またインナーカップ４の内周部側は
塗布液の貯留部７とされ、この貯留部７の底部は真空チ
ャック５に吸着された半導体ウェーハＷよりも深くなっ
ている。The outer peripheral surface of the inner cup 4 and the inner peripheral surface of the casing 2 are substantially parallel and close to each other, and a minute gap 6 is formed between them, and the inner peripheral portion of the inner cup 4 is coated with the coating liquid. The storage section 7 is formed, and the bottom of the storage section 7 is deeper than the semiconductor wafer W attracted to the vacuum chuck 5.
【００１０】前記ケーシング２及びインナーカップ４の
上方にはアーム８を配置している。アーム８は直線動、
回転動、上下動或いはこれらを合成した動きが可能で先
端には下方に伸びる軸９を取り付け、この軸９にはチッ
素ガス及び洗浄液を噴出するためのノズルを穿設してい
る。An arm 8 is arranged above the casing 2 and the inner cup 4. Arm 8 moves linearly,
A shaft 9 extending downward can be attached to the tip of the shaft 9, which can rotate, move up and down, or can be a combination thereof, and has a nozzle for ejecting nitrogen gas and cleaning liquid.
【００１１】また、前記軸９にはベアリング及び磁気シ
ールを介してボス部１０を回転自在に嵌合し、このボス
部１０にインナーカップ４の上面開口を閉塞するための
円板状をなすアルミニウム又は塩化ビニル等から成る蓋
体１１を取り付けている。そして、この蓋体１１の下面
に整流板１２を取り付け、また、蓋体１１の上方のアー
ム８の先端下面にはケーシング２の上面開口を閉塞する
ための蓋体１３を設けている。この蓋体１３はアーム８
の先端下面に取り付けた筒体１４の外周にリング状のス
ライド部材１５を介して上下摺動自在に保持されてい
る。A boss portion 10 is rotatably fitted to the shaft 9 via a bearing and a magnetic seal, and a disc-shaped aluminum for closing the upper opening of the inner cup 4 is attached to the boss portion 10. Alternatively, a lid 11 made of vinyl chloride or the like is attached. A current plate 12 is attached to the lower surface of the lid body 11, and a lid body 13 for closing the upper opening of the casing 2 is provided on the lower surface of the tip of the arm 8 above the lid body 11. This lid 13 is an arm 8
It is held on the outer periphery of the cylindrical body 14 attached to the lower surface of the tip of the above through a ring-shaped slide member 15 so as to be vertically slidable.
【００１２】更に、本発明に係る回転カップ式塗布装置
は吸引ノズル１６を備えている。この吸引ノズル１６は
上下動、水平動或いはこれらの合成動が可能で、回収ボ
ックス等につながっている。Further, the rotary cup type coating apparatus according to the present invention includes a suction nozzle 16. The suction nozzle 16 can move up and down, move horizontally, or combine these, and is connected to a recovery box or the like.
【００１３】以上において、アーム８を上昇し蓋体１
１，１３をインナーカップ４及びケーシング２から外し
た状態で、図示しないノズルから塗布液をチャック５上
に吸着されたウェーハＷ表面の中心に滴下し、この後ア
ーム８を下降し蓋体１１，１３を下げ、インナーカップ
４及びケーシング２上部を閉塞し、インナーカップ４と
ともにチャック５上に吸着されたウェーハＷを回転さ
せ、滴下された塗布液を遠心力でウェーハＷ表面に均一
に拡散する。In the above, the arm 8 is raised and the lid 1
In a state where the inner cups 1 and 13 are removed from the inner cup 4 and the casing 2, the coating liquid is dropped from a nozzle (not shown) to the center of the surface of the wafer W adsorbed on the chuck 5, and then the arm 8 is lowered to lower the lid 11. 13, the inner cup 4 and the upper part of the casing 2 are closed, the wafer W adsorbed on the chuck 5 together with the inner cup 4 is rotated, and the dropped coating liquid is uniformly dispersed on the surface of the wafer W by centrifugal force.
【００１４】この時、ウェーハＷ表面から飛散した塗布
液１７は貯留部７内に溜まる。そこで、図２に示すよう
に、蓋体１１，１３をインナーカップ４及びケーシング
２から外すとともにチャック５にてウェーハＷを持ち上
げ、次工程にウェーハＷを搬送する間に、ノズル１６を
貯留部７まで移動し、その先端を貯留部７内の塗布液１
７に浸漬し塗布液１７を吸引回収する。この時インナー
カップ４については回転を停止するか又はゆっくり回転
せしめる。尚、吸引の頻度は１回の塗布毎、或いはウェ
ーハＷを数枚処理する毎に行うようにする。この実施例
は塗布装置に適用したものであるが、現像液や洗浄液、
剥離液等の液体供給装置に使用してもよい。At this time, the coating liquid 17 scattered from the surface of the wafer W is stored in the storage section 7. Therefore, as shown in FIG. 2, the lids 11 and 13 are removed from the inner cup 4 and the casing 2, the wafer W is lifted by the chuck 5, and the nozzle 16 is stored in the storage portion 7 while the wafer W is transferred to the next step. To the coating liquid 1 in the reservoir 7
7 and the coating liquid 17 is collected by suction. At this time, the inner cup 4 is stopped from rotating or slowly rotated. The suction frequency is such that it is applied every time one coating is performed or every time several wafers W are processed. Although this embodiment is applied to a coating apparatus,
It may be used in a liquid supply device for a stripping solution or the like.
【００１５】図３は別実施例を示す断面図であり、この
実施例にあってはケーシング２に従来に比べて極めて容
量の小さな回収通路１８を形成し、またケーシング２の
側面及び底面には洗浄剤の噴出ノズル１９及びドレイン
パイプ２０を設けた構造になっている。FIG. 3 is a sectional view showing another embodiment. In this embodiment, a casing 2 is provided with a recovery passage 18 having an extremely small capacity as compared with the prior art, and the casing 2 has side and bottom surfaces. It has a structure in which a cleaning agent ejection nozzle 19 and a drain pipe 20 are provided.
【００１６】この実施例にあっては、栓２１を外しその
部分に廃液パイプ２２を取り付けることで、ノズル１６
による塗布液の回収と、回収通路１８を用いたインナー
カップ４内に供給された洗浄液の回収とを分けて行うこ
とが出来る。In this embodiment, the nozzle 16 is removed by removing the plug 21 and attaching the waste liquid pipe 22 to the portion.
The recovery of the coating liquid by the method and the recovery of the cleaning liquid supplied into the inner cup 4 using the recovery passage 18 can be performed separately.
【００１７】[0017]
【発明の効果】以上に説明したように本発明によれば、
回転カップ式液体供給装置のインナーカップの内周部側
に供給された液の貯留部を形成し、この貯留部に溜まっ
た液体を移動可能なノズルで吸引回収するようにしたの
で、供給された液体の回収効率が高くなり、液体の再利
用等に有利である。また、ケーシングが汚れにくくなる
ので、清掃の回数も減ることになり、更に、ケーシング
に回収通路を形成していないので、ケーシングの小径化
が可能になり、装置全体が小型化される。As described above, according to the present invention,
Since a reservoir for the liquid supplied is formed on the inner peripheral side of the inner cup of the rotary cup type liquid supply device, and the liquid accumulated in this reservoir is sucked and recovered by a movable nozzle, so that the liquid is supplied. The liquid recovery efficiency is high, which is advantageous for liquid reuse and the like. Further, since the casing is less likely to become dirty, the number of times of cleaning is reduced, and since the casing has no recovery passage, the diameter of the casing can be reduced and the entire apparatus can be downsized.
【図１】本発明に係る回転カップ式液体供給装置として
の塗布装置の半裁図FIG. 1 is a half-cut view of a coating device as a rotary cup type liquid supply device according to the present invention.
【図２】同回転カップ式塗布装置の塗布液回収の状態を
示す断面図FIG. 2 is a cross-sectional view showing a state of collecting a coating liquid of the rotary cup type coating device.
【図３】別実施例を示す断面図FIG. 3 is a sectional view showing another embodiment.
１…ベース、２…ケーシング、３…スピンナー、４…イ
ンナーカップ、５…チャック、７…貯留部、１６…ノズ
ル、１７…塗布液。1 ... Base, 2 ... Casing, 3 ... Spinner, 4 ... Inner cup, 5 ... Chuck, 7 ... Reservoir, 16 ... Nozzle, 17 ... Coating liquid.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/306 21/68 Ｎ (72)発明者 上田 康爾 神奈川県川崎市中原区中丸子150番地 東 京応化工業株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Reference number within the agency FI Technical indication location H01L 21/306 21/68 N (72) Inventor Koji Ueda 150 Nakamaruko Nakahara-ku, Kawasaki-shi, Kanagawa Within Kyoka Kogyo Co., Ltd.
Claims (1)
められるインナーカップを配置し、このインナーカップ
内に被処理物のチャックを設けた回転カップ式液体供給
装置において、前記インナーカップの内周部側には供給
された液の貯留部が形成され、更に貯留部に溜まった液
体を吸引回収するノズルを移動可能に配置したことを特
徴とする回転カップ式液体供給装置。1. A rotary cup type liquid supply device in which an inner cup rotated by a spinner is arranged in a casing, and a chuck for an object to be processed is provided in the inner cup, the inner cup side being on the inner peripheral side of the inner cup. Is a rotary cup type liquid supply device characterized in that a reservoir for the supplied liquid is formed and a nozzle for sucking and collecting the liquid accumulated in the reservoir is movably arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28309293A JP3002368B2 (en) | 1993-11-12 | 1993-11-12 | Rotating cup type liquid supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28309293A JP3002368B2 (en) | 1993-11-12 | 1993-11-12 | Rotating cup type liquid supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07136572A true JPH07136572A (en) | 1995-05-30 |
| JP3002368B2 JP3002368B2 (en) | 2000-01-24 |
Family
ID=17661118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28309293A Expired - Lifetime JP3002368B2 (en) | 1993-11-12 | 1993-11-12 | Rotating cup type liquid supply device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3002368B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5871584A (en) * | 1994-08-03 | 1999-02-16 | Tokyo Electron Limited | Processing apparatus and processing method |
| WO2005063409A1 (en) * | 2003-12-25 | 2005-07-14 | Origin Electric Company, Limited | Spin coating device |
| JP2010010719A (en) * | 2009-10-13 | 2010-01-14 | Tokyo Electron Ltd | Substrate treatment device |
| US9632300B2 (en) | 2011-11-30 | 2017-04-25 | Olympus Corporation | Image processing apparatus, microscope system, image processing method, and computer-readable recording medium |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102304208B (en) * | 2005-03-15 | 2013-07-17 | 宝理塑料株式会社 | Treating agent for decomposing unstable terminal group, stabilized polyacetal resin produced with the same, production process, composition, and molded object |
-
1993
- 1993-11-12 JP JP28309293A patent/JP3002368B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5871584A (en) * | 1994-08-03 | 1999-02-16 | Tokyo Electron Limited | Processing apparatus and processing method |
| US5965200A (en) * | 1994-08-03 | 1999-10-12 | Tokyo Electron Limited | Processing apparatus and processing method |
| WO2005063409A1 (en) * | 2003-12-25 | 2005-07-14 | Origin Electric Company, Limited | Spin coating device |
| JP2010010719A (en) * | 2009-10-13 | 2010-01-14 | Tokyo Electron Ltd | Substrate treatment device |
| JP4570054B2 (en) * | 2009-10-13 | 2010-10-27 | 東京エレクトロン株式会社 | Substrate processing equipment |
| US9632300B2 (en) | 2011-11-30 | 2017-04-25 | Olympus Corporation | Image processing apparatus, microscope system, image processing method, and computer-readable recording medium |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3002368B2 (en) | 2000-01-24 |
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