JPH0713049A - Method for assembling optical module - Google Patents
Method for assembling optical moduleInfo
- Publication number
- JPH0713049A JPH0713049A JP15649593A JP15649593A JPH0713049A JP H0713049 A JPH0713049 A JP H0713049A JP 15649593 A JP15649593 A JP 15649593A JP 15649593 A JP15649593 A JP 15649593A JP H0713049 A JPH0713049 A JP H0713049A
- Authority
- JP
- Japan
- Prior art keywords
- fixing member
- semiconductor laser
- optical fiber
- support
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体レーザの出射光
を光ファイバに結合する光モジュールの組立方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of assembling an optical module for coupling light emitted from a semiconductor laser with an optical fiber.
【０００２】[0002]
【従来の技術】従来の光モジュール組立方法について図
面を参照して詳細に説明する。図４は、従来の組立方法
を示すフローチャートで、図２に光モジュールの断面図
を示す。2. Description of the Related Art A conventional optical module assembling method will be described in detail with reference to the drawings. FIG. 4 is a flowchart showing a conventional assembling method, and FIG. 2 is a sectional view of the optical module.
【０００３】図２においてパッケージステム１に半導体
レーザ２、モニタ用受光素子３、電極及びレンズホルダ
６が固定され、レンズホルダ６内に半導体レーザ２から
の出射光を集光する球レンズ５が固定され、これらで半
導体レーザユニット１０を構成している。またサポート
７にフェルール８が固定され、光ファイバ素線９の先端
がフェルール８に固定され、レンズホルダ６の上面とサ
ポート７の下面が密着固定される。この光モジュール
は、光学軸を中心とした同心円筒形を組み合わせた形態
となっている。In FIG. 2, a semiconductor laser 2, a light receiving element 3 for monitoring, an electrode and a lens holder 6 are fixed to a package stem 1, and a spherical lens 5 for converging light emitted from the semiconductor laser 2 is fixed in the lens holder 6. The semiconductor laser unit 10 is composed of these components. Further, the ferrule 8 is fixed to the support 7, the tip of the optical fiber element wire 9 is fixed to the ferrule 8, and the upper surface of the lens holder 6 and the lower surface of the support 7 are closely fixed. This optical module has a form in which concentric cylindrical shapes centered on the optical axis are combined.
【０００４】半導体レーザユニット１０に光ファイバを
さらに組み合わせる場合、従来の組立方法では、光ファ
イバ素線９は、フェルール８に樹脂接着剤で固定されて
おり、初めにフェルール８はサポート７に１μｍ程度の
クリアランスを設けてガイドされている。この従来の光
モジュール組立方法は半導体レーザユニット１０を固定
しフェルール８を光学軸に平行な方向（Ｚ方向）および
光学軸に垂直な方向（Ｘ−Ｙ方向）にステージなどのユ
ニュピレータで微調整を行い、半導体レーザ２からのレ
ーザ光に対し最大の結合効率となるところに位置合わせ
する工程Ｓ１と、サポート７の下面と半導体レーザユニ
ット１０の上面を密着押圧状態にし、フェルール８とサ
ポート７をレーザ溶接する工程Ｓ２と、半導体レーザユ
ニット１０に対しフェルール８を相対的にＸ−Ｙ方向に
動かし、光軸位置合わせできる程度の力でサポート７の
下面を半導体レーザユニット１０の上面に押圧し（これ
を低押圧すると称する）、再び結合効率が最大の位置に
半導体レーザユニット１０とフェルール８を合わせる工
程Ｓ３と、サポート７を高押圧した状態でサポート７と
半導体レーザユニット１０をレーザ溶接する工程Ｓ４か
ら構成されていた。このような光モジュールの組立て方
法では工程Ｓ３で共ずれが生じる。When the semiconductor laser unit 10 is further combined with an optical fiber, in the conventional assembling method, the optical fiber element wire 9 is fixed to the ferrule 8 with a resin adhesive, and the ferrule 8 is first attached to the support 7 by about 1 μm. It is guided with clearance. In this conventional optical module assembling method, the semiconductor laser unit 10 is fixed, and the ferrule 8 is finely adjusted in a direction parallel to the optical axis (Z direction) and a direction perpendicular to the optical axis (X-Y direction) with a unit such as a stage. Then, the step S1 of aligning the laser light from the semiconductor laser 2 at a position where the maximum coupling efficiency is achieved, the lower surface of the support 7 and the upper surface of the semiconductor laser unit 10 are brought into close contact with each other, and the ferrule 8 and the support 7 are lased. In the welding step S2, the ferrule 8 is moved in the XY directions relative to the semiconductor laser unit 10, and the lower surface of the support 7 is pressed against the upper surface of the semiconductor laser unit 10 with a force sufficient to align the optical axis. Is referred to as low pressure), and the step S of aligning the semiconductor laser unit 10 and the ferrule 8 again at the position where the coupling efficiency is maximum. When the support 7 and the semiconductor laser unit 10 the support 7 at a high pressing state was composed from step S4 for laser welding. In such an optical module assembling method, a misalignment occurs in step S3.
【０００５】図５は、工程Ｓ３における摩擦力による共
ずれを説明するための側面図である。図５において１１
はフェルール８を保持するマニュピレータである。サポ
ート７を押圧する加圧力をＦ1 ，サポート７の下面と半
導体レーザユニット１０の上面との間の摩擦力をＦ2 と
する。加圧力Ｆ1 を１ｋｇ、静摩擦係数をμとし、μを
０．１と仮定して、摩擦力Ｆ2 は、 Ｆ2 ＝μＦ1 ＝０．１×１＝０．１ｋｇ となる。FIG. 5 is a side view for explaining the co-deviation due to the frictional force in step S3. 11 in FIG.
Is a manipulator that holds the ferrule 8. The pressing force for pressing the support 7 is F 1 , and the frictional force between the lower surface of the support 7 and the upper surface of the semiconductor laser unit 10 is F 2 . Assuming that the pressing force F 1 is 1 kg and the static friction coefficient is μ, and μ is 0.1, the frictional force F 2 is F 2 = μF 1 = 0.1 × 1 = 0.1 kg.
【０００６】この場合フェルールの形状（外径：φ２ｍ
ｍ 内径：１ｍｍ）及びフェルール８の下端とクランプ
点とのかの距離をＬ（７ｍｍと仮定）、フェルール８の
材質をステンレス鋼としてフェルール８のたをみδを求
めると δ＝Ｆ2 Ｌ3 ／３ＥＩ＝７．４（μｍ） となる（ここで、Ｅはステッレス鋼の縦弾性係数、Ｉは
フェルール８の断面２次モーメント）。この結果、工程
Ｓ３では最終光軸調整後に共ずれによる最大７．４μｍ
の残留歪が残ることになり、これが工程Ｓ４の溶接時の
軸ずれの原因となる。In this case, the shape of the ferrule (outer diameter: φ2 m
m (inner diameter: 1 mm) and the distance between the lower end of the ferrule 8 and the clamp point is L (assuming 7 mm), the ferrule 8 is made of stainless steel, and the ferrule 8 is bent to find δ = F 2 L 3 / 3EI = 7.4 (μm) (where E is the longitudinal elastic modulus of the stainless steel, and I is the moment of inertia of area of the ferrule 8). As a result, in step S3, a maximum of 7.4 μm due to co-deviation after the final optical axis adjustment.
Of residual strain remains, which causes axis deviation during welding in step S4.
【０００７】すなわち、工程Ｓ３でサポート７の下面と
レンズホルダ６の上面の間で光軸が合わせられるがフェ
ルール８にたわみδの残留歪が生じる。この光軸が合い
残留歪が生じた状態は、サポート７の下面が半導体レー
ザユット１０の上面に押圧密着され半導体レーザユニッ
ト１０は固定されフェルール８を保持するマニュピレー
タ１１を固定しているので維持される。しかし工程Ｓ４
の溶接時にサポート７の下面が半導体レーザユニット１
０から浮き上がりその間の摩擦力が無くなることがある
のでその瞬間にフェルール８のたわみの残留歪が解放さ
れサポート７の下面と半導体レーザユニット１０の上面
が相対的にずれ、軸ずれを生じる。That is, in step S3, the optical axis is aligned between the lower surface of the support 7 and the upper surface of the lens holder 6, but the residual strain of the deflection δ is generated in the ferrule 8. The state in which the optical axes are aligned and the residual strain is generated is maintained because the lower surface of the support 7 is pressed and brought into close contact with the upper surface of the semiconductor laser unit 10 so that the semiconductor laser unit 10 is fixed and the manipulator 11 holding the ferrule 8 is fixed. . However, step S4
The lower surface of the support 7 is the semiconductor laser unit 1 when welding
Since it may float from 0 and the frictional force between them may disappear, the residual strain of the flexure of the ferrule 8 is released at that moment, and the lower surface of the support 7 and the upper surface of the semiconductor laser unit 10 are relatively deviated from each other, causing axial misalignment.
【０００８】サポートと半導体レーザユニットの密着押
圧状態における光軸調整方法として、例えば特開昭６３
−２９６００９に示された方法がある。この方法では例
えばサポートを固定し、半導体レーザユニットをＸＹ方
向に移動させ、相互間の光結合効率がより大きくなるよ
うにＸＹ方向交互に山登り探索した場合、摩擦力による
歪で相互に影響するため、Ｘ方向にステップ送りして固
定し、その位置でＹ方向に移動し、光ファイバの受光の
最大光量の位置を求める。これを順次繰り返すことで、
まず最大光量の得られるＸ位置を探索する。その後、決
定された最大光量の得られるＸ位置でＹ方向に移動して
最大光量が得られる位置で停止し、光軸調整を終了す
る。この光軸調整方法は、確実に最大光量を探索できる
が最終的にＹ方向に歪が残ってしまい、溶接時の軸ズレ
の要因になり得る。As a method of adjusting the optical axis when the support and the semiconductor laser unit are in close contact with each other, a method of adjusting the optical axis is disclosed in, for example, JP-A-63 / 1988
There is a method shown in -29609. In this method, for example, when the supports are fixed, the semiconductor laser units are moved in the XY directions, and the hill climbing search is performed alternately in the XY directions so that the mutual optical coupling efficiency becomes greater, the strain due to the frictional force affects each other. , Stepwise feed in the X direction to fix and move in the Y direction at that position to obtain the position of the maximum amount of light received by the optical fiber. By repeating this in sequence,
First, the X position where the maximum light quantity is obtained is searched. Then, it moves in the Y direction at the X position where the determined maximum light amount is obtained and stops at the position where the maximum light amount is obtained, and the optical axis adjustment ends. Although this optical axis adjusting method can reliably search for the maximum light amount, distortion may eventually remain in the Y direction, which may cause axial misalignment during welding.
【０００９】[0009]
【発明が解決しようとする課題】上述した従来の光モジ
ュール組立方法は、工程Ｓ３でサポート７を半導体レー
ザユニット１０に低押圧した状態で、ステージなどを動
かしてサポート７と半導体レーザユニット１０とを相対
的に移動させて光軸調整するために摩擦力で共ずれを起
こしてしまい、残留歪が残り、工程Ｓ４のレーザ溶接時
に残留歪の影響で光軸がずれてしまうという欠点があっ
た。また、特開昭６３−２９６００９に示された方法で
はＸ方向の残留歪を解消できてもＹ方向の残留歪を解消
できずやはり溶接時に軸ずれを生じてしまう。In the conventional method of assembling the optical module described above, the support 7 and the semiconductor laser unit 10 are moved by moving the stage or the like while the support 7 is pressed against the semiconductor laser unit 10 in step S3. Since the optical axis is adjusted by relatively moving the optical axis, a frictional force causes a misalignment, and residual strain remains, and the optical axis is displaced due to the residual strain during laser welding in step S4. Further, in the method disclosed in Japanese Patent Laid-Open No. 63-29609, even if the residual strain in the X direction can be eliminated, the residual strain in the Y direction cannot be eliminated, and an axis shift occurs during welding.
【００１０】[0010]
【課題を解決するための手段】本発明は、半導体レーザ
と前記半導体レーザからの出射光を集光するレンズと、
前記半導体レーザ及び前記レンズを固定する第一の固定
部材と、光ファイバと、前記第一の固定部材上に載置さ
れ前記光ファイバの先端部を微小な間隙をもって光軸方
向に案内する第二の固定部材とから光モジュールを組立
てる方法において、前記第一の固定部材を第一のマニピ
ュレータで保持し前記光ファイバの先端部を第二のマニ
ピュレータで保持し、この第一及び第二のマニピュレー
タを相対的に動かし、前記半導体レーザと前記光ファイ
バとの結合効率が最大になるように前記第一の固定部材
に対する前記光ファイバの先端部の位置を合わせる第１
の工程と、この第１の工程後前記第二の固定部材の端面
と前記第一の固定部材の端面とを密着押圧状態にし前記
第二の固定部材と前記光ファイバの先端部とを溶接する
第２の工程と、前記第二の固定部材を押圧状態から解放
し、光軸と垂直な平面内で再び前記結合効率が最大にな
るように前記第一及び第二のマニピュレータを動かし
て、前記第一の固定部材に対する前記光ファイバの先端
部の位置を合わせる第３の工程と、前記第３の工程にお
ける前記第一及び第二のマニピュレータの相対的な位置
を記憶する第４の工程と、前記第二の固定部材を光軸位
置合わせできる程度の力で前記第一の固定部材に低押圧
し前記第一及び第二のマニピュレータを相対的に動かし
て前記半導体レーザと前記光ファイバとの結合効率が最
大になるように光軸に垂直な平面内で前記第一の固定部
材に対する前記光ファイバの位置を合わせる第５の工程
と、前記第二の固定部材を前記第一の固定部材へ高押圧
し前記第一及び第二のマニピュレータを第４の工程で記
憶した相対的な位置へ戻す第６の工程と、前記第二の固
定部材と前記第１の固定部材とを溶接する第７の工程を
備えている。SUMMARY OF THE INVENTION The present invention comprises a semiconductor laser and a lens for converging light emitted from the semiconductor laser.
A first fixing member that fixes the semiconductor laser and the lens, an optical fiber, and a second member that is placed on the first fixing member and guides the tip of the optical fiber in the optical axis direction with a minute gap. In the method of assembling the optical module from the fixing member, the first fixing member is held by the first manipulator and the tip end portion of the optical fiber is held by the second manipulator, and the first and second manipulators are Firstly, the tip end of the optical fiber is moved relative to the first fixing member so as to maximize the coupling efficiency between the semiconductor laser and the optical fiber.
Step, and after this first step, the end surface of the second fixing member and the end surface of the first fixing member are brought into close contact with each other to be pressed to weld the second fixing member and the end portion of the optical fiber. In the second step, the second fixing member is released from the pressed state, and the first and second manipulators are moved so that the coupling efficiency becomes maximum again in a plane perpendicular to the optical axis, A third step of aligning the position of the tip of the optical fiber with respect to the first fixing member, and a fourth step of storing the relative positions of the first and second manipulators in the third step, Coupling of the semiconductor laser and the optical fiber by low pressing the first fixing member with a force sufficient to align the optical axis of the second fixing member and relatively moving the first and second manipulators. Optical axis for maximum efficiency A fifth step of aligning the position of the optical fiber with respect to the first fixing member in a vertical plane, and the second fixing member being highly pressed against the first fixing member, and the first and second manipulators. Is returned to the relative position stored in the fourth step, and a seventh step of welding the second fixing member and the first fixing member.
【００１１】[0011]
【実施例】次に、本発明について図面を参照して詳細に
説明する。The present invention will be described in detail with reference to the drawings.
【００１２】図１は、本発明の一実施例を示すフローチ
ャートである。FIG. 1 is a flow chart showing an embodiment of the present invention.
【００１３】本実施例で組立てる光モジュールも図２に
示すようにパッケージステム１、半導体レーザ２、球レ
ンズ５、レンズホルダ６で半導体レーザユニット１０を
構成しており、光ファイバ素線９は、フェルール８に固
定されている。特許請求範囲に示す第一の固定部材とは
ここではレンズホルダ６のことであり、光ファイバとは
フェルール８に固定された光ファイバ素線９、光ファイ
バの先端部とはフェルール８のここであり、第二の固定
部材とはサポート７のことである。レンズホルダ６、サ
ポート７、及びフェルール８の材質はステンレス鋼であ
る。As shown in FIG. 2, the optical module assembled in this embodiment also comprises a semiconductor laser unit 10 including a package stem 1, a semiconductor laser 2, a spherical lens 5 and a lens holder 6, and an optical fiber element wire 9 It is fixed to the ferrule 8. Here, the first fixing member shown in the claims is the lens holder 6, the optical fiber is the optical fiber element wire 9 fixed to the ferrule 8, and the tip of the optical fiber is the ferrule 8 here. The second fixing member is the support 7. The material of the lens holder 6, the support 7 and the ferrule 8 is stainless steel.
【００１４】本実施例の組立作業前にはフェルール８
は、サポート７に１μｍ程度のクリアランスでガイドさ
れており、半導体レーザユニット１０を固定しフェルー
ル８をステージなどのマニピュレータで保持しＸ，Ｙ，
Ｚ方向に微調整することで光ファイバ素線９と半導体レ
ーザ２との最大結合効率を得るようにフェルール８を位
置決めする。Before the assembling work of this embodiment, the ferrule 8 is used.
Are guided by a support 7 with a clearance of about 1 μm, and the semiconductor laser unit 10 is fixed and the ferrule 8 is held by a manipulator such as a stage, X, Y,
By finely adjusting in the Z direction, the ferrule 8 is positioned so as to obtain the maximum coupling efficiency between the optical fiber element wire 9 and the semiconductor laser 2.
【００１５】本実施例は、半導体レーザユニット１０に
対するフェルール８の光軸に対する平行、垂直及び回転
方向の位置調整を行い半導体レーザ２と光ファイバ素線
９とを結合効率が最大の位置に合わせる工程Ｐ１とし、
サポート７の端面と、半導体レーザユニット１０のレン
ズホルダ６の端面とを密着押圧状態にし、図２における
Ａ部、Ｂ部をＹＡＧレーザ等でスポットレーザ溶接して
サポート７とフェルール８と互いに固定する工程Ｐ２
と、サポート７を押圧状態から解放し、光学軸に垂直な
Ｘ−Ｙ平面内で再び結合効率が最大となるようにフェル
ール８及びマニピュレータによりサポート７の位置に合
わせる工程Ｐ３と、工程Ｐ３におけるフェルール８を保
持するマニピュレータの平面的な位置（Ｘ−Ｙ座標）を
記憶する工程Ｐ４と、サポート７を光軸位置合わせでき
る程度の力（おおよそ５００ｇ／ｃｍ2 ）でレンズホル
ダ６に低押圧し、マニピュレータによりフェルール８及
びサポート７を動かし、平面内で光ファイバ素線９を半
導体レーザ２との再度結合効率が最大の位置に合わせる
工程Ｐ５と、サポート７をレンズホルダ６に高押圧し、
工程Ｐ４で記憶した平面的位置へフェルール８を保持す
るマニピュレータを戻す工程Ｐ６と、サポート７と半導
体レーザユニット１０のレンズホルダ６とをレーザ溶接
する工程Ｐ７とから構成される。In the present embodiment, a step of adjusting the position of the semiconductor laser unit 10 in parallel, perpendicular and rotational directions with respect to the optical axis of the ferrule 8 to align the semiconductor laser 2 and the optical fiber element wire 9 at the position where the coupling efficiency is maximum. P1
The end face of the support 7 and the end face of the lens holder 6 of the semiconductor laser unit 10 are brought into close contact with each other and pressed, and the portions A and B in FIG. 2 are spot laser welded with a YAG laser or the like to fix the support 7 and the ferrule 8 to each other. Process P2
And a step P3 of releasing the support 7 from the pressed state and adjusting the position of the support 7 by the ferrule 8 and the manipulator so as to maximize the coupling efficiency again in the XY plane perpendicular to the optical axis, and the ferrule in the step P3. Step P4 of storing the planar position (X-Y coordinates) of the manipulator holding 8 and the lens holder 6 with a force (about 500 g / cm 2 ) enough to align the optical axis of the support 7, The ferrule 8 and the support 7 are moved by the manipulator to adjust the optical fiber element wire 9 to the position where the coupling efficiency with the semiconductor laser 2 is the maximum again in the plane P5, and the support 7 is highly pressed against the lens holder 6,
The process includes a process P6 of returning the manipulator holding the ferrule 8 to the planar position stored in the process P4, and a process P7 of laser welding the support 7 and the lens holder 6 of the semiconductor laser unit 10.
【００１６】図３は本実施例の組立途中で生じる残留歪
及びその解放を説明するための組立中の光モジュールの
断面図である。図３（ａ）に示す工程Ｐ４の状態ではサ
ポート７は無負荷のため残留歪は生じない。一方図３
（ｂ）に示す工程Ｐ５においてはサポート７は低押圧さ
れているため共ずれが生じ、共ずれしただけフェルール
８を保持するマニピュレータの光軸調整完了位置がず
れ、これがフェルール８の残留歪となる。図３（ｃ）に
示す工程Ｐ６においては、高押圧した状態で半導体レー
ザユニット１０とサポート８との位置関係を工程Ｐ４の
光軸調整完了位置に戻すため、量ユニットは、逆に共ず
れし、光軸ずれを生じさせないように残留歪を解放でき
ることになる。FIG. 3 is a sectional view of the optical module during assembly for explaining the residual strain generated during the assembly of this embodiment and its release. In the state of process P4 shown in FIG. 3A, the support 7 has no load, and therefore no residual strain occurs. Meanwhile, FIG.
In step P5 shown in (b), since the support 7 is pressed low, co-deviation occurs, and the optical axis adjustment completion position of the manipulator holding the ferrule 8 deviates due to the co-displacement, and this becomes the residual strain of the ferrule 8. . In step P6 shown in FIG. 3C, since the positional relationship between the semiconductor laser unit 10 and the support 8 is returned to the optical axis adjustment completion position in step P4 in the high-pressed state, the quantity unit reversely shifts. Therefore, the residual strain can be released without causing the optical axis shift.
【００１７】なお、本発明では半導体レーザユニット
（第一の固定部材）とサポート（第二の固定部材）の相
対的な位置関係を調整して半導体レーザと光ファイバの
結合効率を最大にすればよいのであって、上述の実施例
では半導体レーザユニット１０を固定しサポート７をマ
ニピュレータで動かすようにしたが、半導体レーザユニ
ットのみ、または半導体レーザユニット及びサポートの
両者を動かすようにしてもよい。In the present invention, if the relative positional relationship between the semiconductor laser unit (first fixing member) and the support (second fixing member) is adjusted to maximize the coupling efficiency between the semiconductor laser and the optical fiber. In the above embodiment, the semiconductor laser unit 10 is fixed and the support 7 is moved by the manipulator, but it is also possible to move only the semiconductor laser unit or both the semiconductor laser unit and the support.
【００１８】[0018]
【発明の効果】本発明の光モジュール組立方法は、最終
光軸調整工程での共ずれに伴う残留歪を無負荷時の光軸
座標に軸ずれを起こさずに戻すことで、残留歪を解放
し、最終レーザ溶接固定時の光軸ずれを減少できるとい
う効果がある。According to the optical module assembling method of the present invention, the residual distortion caused by the co-deviation in the final optical axis adjusting step is returned to the optical axis coordinates under no load without causing the axial deviation, thereby releasing the residual distortion. However, there is an effect that the optical axis shift at the time of final laser welding fixation can be reduced.
【図１】本発明の一実施例を示すフローチャートであ
る。FIG. 1 is a flowchart showing an embodiment of the present invention.
【図２】図１に示す実施例を説明するための光モジュー
ルの断面図である。FIG. 2 is a sectional view of an optical module for explaining the embodiment shown in FIG.
【図３】図１の実施例での残留歪の解放を説明するため
の光モジュールの断面図で（ａ）〜（ｃ）はそれぞれ工
程Ｐ４〜Ｐ６の状態を示す。3A to 3C are cross-sectional views of the optical module for explaining the release of residual strain in the embodiment of FIG. 1, and FIGS. 3A to 3C show states of steps P4 to P6, respectively.
【図４】従来の光モジュールの組立方法を示すフローチ
ャートである。FIG. 4 is a flowchart showing a conventional method of assembling an optical module.
【図５】図４の従来の光モジュールの組立方法での共ず
れを説明するための光モジュールの断面図である。5 is a cross-sectional view of an optical module for explaining co-deviation in the conventional method of assembling the optical module of FIG.
１ パッケージステム ２ 半導体レーザ ３ モニタ用受光素子 ４ 電極 ５ 球レンズ ６ レンズホルダ ７ サポート ８ フェルール ９ 光ファイバ素線 １０ 半導体レーザユニット １１ マニピュレータ 1 Package Stem 2 Semiconductor Laser 3 Photodetector for Monitor 4 Electrode 5 Ball Lens 6 Lens Holder 7 Support 8 Ferrule 9 Optical Fiber Element 10 Semiconductor Laser Unit 11 Manipulator
Claims (2)
出射光を集光するレンズと、前記半導体レーザ及び前記
レンズを固定する第一の固定部材と、光ファイバと、前
記第一の固定部材上に載置され前記光ファイバの先端部
を微小な間隙をもって光軸方向に案内する第二の固定部
材とから光モジュールを組立てる方法において、前記第
一の固定部材を第一のマニピュレータで保持し前記光フ
ァイバの先端部を第二のマニピュレータで保持し、この
第一及び第二のマニピュレータを相対的に動かし、前記
半導体レーザと前記光ファイバとの結合効率が最大にな
るように前記第一の固定部材に対する前記光ファイバの
先端部の位置を合わせる第１の工程と、この第１の工程
後前記第二の固定部材の端面と前記第一の固定部材の端
面とを密着押圧状態にし前記第二の固定部材と前記光フ
ァイバの先端部とを溶接する第２の工程と、前記第二の
固定部材を押圧状態から解放し、光軸と垂直な平面内で
再び前記結合効率が最大になるように前記第一及び第二
のマニピュレータを動かして、前記第一の固定部材に対
する前記光ファイバの先端部の位置を合わせる第３の工
程と、前記第３の工程における前記第一及び第二のマニ
ピュレータの相対的な位置を記憶する第４の工程と、前
記第二の固定部材を光軸位置合わせできる程度の力で前
記第一の固定部材に低押圧し前記第一及び第二のマニピ
ュレータを相対的に動かして前記半導体レーザと前記光
ファイバとの結合効率が最大になるように光軸に垂直な
平面内で前記第一の固定部材に対する前記光ファイバの
位置を合わせる第５の工程と、前記第二の固定部材を前
記第一の固定部材へ高押圧し前記第一及び第二のマニピ
ュレータを第４の工程で記憶した相対的な位置へ戻す第
６の工程と、前記第二の固定部材と前記第１の固定部材
とを溶接する第７の工程とから構成されることを特徴と
する光モジュール組立方法。1. A semiconductor laser, a lens for condensing light emitted from the semiconductor laser, a first fixing member for fixing the semiconductor laser and the lens, an optical fiber, and an optical fiber on the first fixing member. In a method of assembling an optical module from a second fixing member that is placed and guides the tip of the optical fiber in the optical axis direction with a minute gap, the first fixing member is held by a first manipulator and the optical The tip of the fiber is held by a second manipulator, and the first and second manipulators are moved relatively to each other, so that the coupling efficiency between the semiconductor laser and the optical fiber is maximized. A first step of aligning the position of the tip of the optical fiber with respect to the first optical fiber, and a state in which the end surface of the second fixing member and the end surface of the first fixing member are in close contact with each other after the first step. In the second step of welding the second fixing member and the tip of the optical fiber, the second fixing member is released from the pressed state, and the coupling efficiency is re-established in a plane perpendicular to the optical axis. The third step of moving the first and second manipulators so as to maximize the position of the tip of the optical fiber with respect to the first fixing member, and the first and second steps in the third step. A fourth step of memorizing the relative position of the second manipulator, and a low pressure on the first fixing member with a force sufficient to align the optical axis of the second fixing member with the first and second steps. Moving the manipulator relatively to adjust the position of the optical fiber with respect to the first fixing member in a plane perpendicular to the optical axis so as to maximize the coupling efficiency between the semiconductor laser and the optical fiber. And the first A high pressure pressing the fixing member to the first fixing member to return the first and second manipulators to the relative positions stored in the fourth step, the second fixing member and the second fixing member. And a seventh step of welding the first fixing member together.
バの先端部をレーザ溶接し、第７の工程で前記第二の固
定部材と前記第一の固定部材とをレーザ溶接する請求項
１記載の光モジュール組立方法。2. The second fixing member and the tip of the optical fiber are laser-welded in the second step, and the second fixing member and the first fixing member are laser-welded in the seventh step. Item 1. The optical module assembling method according to Item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5156495A JP2565090B2 (en) | 1993-06-28 | 1993-06-28 | Optical module assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5156495A JP2565090B2 (en) | 1993-06-28 | 1993-06-28 | Optical module assembly method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0713049A true JPH0713049A (en) | 1995-01-17 |
| JP2565090B2 JP2565090B2 (en) | 1996-12-18 |
Family
ID=15629007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5156495A Expired - Lifetime JP2565090B2 (en) | 1993-06-28 | 1993-06-28 | Optical module assembly method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2565090B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009003309A (en) * | 2007-06-25 | 2009-01-08 | Mitsubishi Electric Corp | Assembling method for optical module, and optical module |
| JP2009092899A (en) * | 2007-10-09 | 2009-04-30 | Mitsubishi Electric Corp | Method for assembling optical module and optical module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6263906A (en) * | 1985-09-17 | 1987-03-20 | Matsushita Electric Ind Co Ltd | Production of coupling device between semiconductor laser and optical fiber |
| JPS63303688A (en) * | 1987-06-05 | 1988-12-12 | Toshiba Corp | Multiple welding method |
| JPH01312516A (en) * | 1988-06-13 | 1989-12-18 | Oki Electric Ind Co Ltd | Lens fixing method for optical coupler |
-
1993
- 1993-06-28 JP JP5156495A patent/JP2565090B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6263906A (en) * | 1985-09-17 | 1987-03-20 | Matsushita Electric Ind Co Ltd | Production of coupling device between semiconductor laser and optical fiber |
| JPS63303688A (en) * | 1987-06-05 | 1988-12-12 | Toshiba Corp | Multiple welding method |
| JPH01312516A (en) * | 1988-06-13 | 1989-12-18 | Oki Electric Ind Co Ltd | Lens fixing method for optical coupler |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009003309A (en) * | 2007-06-25 | 2009-01-08 | Mitsubishi Electric Corp | Assembling method for optical module, and optical module |
| JP2009092899A (en) * | 2007-10-09 | 2009-04-30 | Mitsubishi Electric Corp | Method for assembling optical module and optical module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2565090B2 (en) | 1996-12-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7548673B2 (en) | Methods and apparatus for alignment and assembly of optoelectronic components | |
| KR920010947B1 (en) | Semiconductor light emitting device its component and lens position adjusting method | |
| US5222170A (en) | Optical fiber device fabrication | |
| JPH03233414A (en) | Assembling method for photosemiconductor module | |
| WO2003016969A1 (en) | Apparatus and methods for micro-positioning and alignment | |
| JP3345853B2 (en) | Laser diode module and manufacturing method thereof | |
| JP2565090B2 (en) | Optical module assembly method | |
| JPH085876A (en) | Module for light transmission and lens holder member used for the same | |
| JP2555945B2 (en) | Optical module assembly method | |
| JP2728281B2 (en) | Optical fiber device and manufacturing method thereof | |
| US6910811B2 (en) | Optical fiber alignment device and method | |
| JPH01310315A (en) | Structure for connecting light guide and optical fiber and its production thereof | |
| JP2590715B2 (en) | Optical module assembly method | |
| US7277467B2 (en) | Externally aligned laser module | |
| JPH0943455A (en) | Optical module | |
| JPH0537025A (en) | Semiconductor light-source module | |
| JPS63161405A (en) | Fixing method for optical fiber | |
| JPH0943454A (en) | Optical module | |
| JPH02245711A (en) | Optical fiber fixing device | |
| JP2936777B2 (en) | Optical device module assembly equipment | |
| JPH0627324A (en) | Method for assembling optical device and assembling jig therefor | |
| JPS61138209A (en) | Fixing method of fiber lens assembly | |
| JPH02308209A (en) | Semiconductor light emitting device, its component and lens position adjusting method | |
| JPH01186907A (en) | Semiconductor laser and optical fiber connector | |
| JPS61255312A (en) | Coupling device for optical element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960806 |