JPH07130256A - Image device - Google Patents

Image device

Info

Publication number
JPH07130256A
JPH07130256A JP29446893A JP29446893A JPH07130256A JP H07130256 A JPH07130256 A JP H07130256A JP 29446893 A JP29446893 A JP 29446893A JP 29446893 A JP29446893 A JP 29446893A JP H07130256 A JPH07130256 A JP H07130256A
Authority
JP
Japan
Prior art keywords
lens
holder
monocular
metal plate
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29446893A
Other languages
Japanese (ja)
Other versions
JP2779585B2 (en
Inventor
Shunji Murano
俊次 村野
Koji Miyauchi
宏治 宮内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP29446893A priority Critical patent/JP2779585B2/en
Priority to US08/331,354 priority patent/US5617131A/en
Publication of JPH07130256A publication Critical patent/JPH07130256A/en
Application granted granted Critical
Publication of JP2779585B2 publication Critical patent/JP2779585B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements

Abstract

PURPOSE:To perform accurate positioning of monocular lenses by positioning them in a vertical direction by a metal plate, using flange surfaces of a lens holder, and positioning in a horizontal direction. CONSTITUTION:An LED array 12 is mounted on a substrate 10. A monocular lens 2 is fitted to a through hole 28 of a metal plate 26, to set an upper part holder 32 so as to interpose the plate 26, and a reference surface 8 of the lens 2 is brought into contact with a flange surface 22 in the periphery of a recessed part 18 of a lens holder 16 and fixed by a bonding agent. Next by a pins 24, from the substrate 10 to the holder 32 are integrally connected. The through hole 28 has high shape accuracy by etching, and a side surface of a ring part 6 of the lens 2 is accurately formed by a metal mold at the time of forming the lens 2. Accordingly, when the lens 2 is fitted to the through hole 28, the lens 2 can be accurately positioned in the horizontal direction. The lens 2 is pressed by the holder 32, and the reference surface 8 is brought into contact with the flange surface 22 and accurately positioned in the vertical direction.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の利用分野】この発明はLEDヘッドや,ELヘ
ッド,イメージセンサ等の画像装置に関し、特に単眼レ
ンズを用いた画像装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image device such as an LED head, an EL head and an image sensor, and more particularly to an image device using a monocular lens.

【0002】[0002]

【従来技術】単眼レンズを用いた画像装置は画像の縮小
拡大ができるため、古くから提案されている。しかしな
がらこのような画像装置は、単眼レンズを精密に搭載せ
ねばならないため、実用化が困難である。例えば単眼レ
ンズの配列ピッチが狂うと、レンズとレンズのつなぎ目
の位置で、白筋や黒筋が生じる。レンズが傾くと、結像
位置が狂う。またレンズ搭載面の平坦度が低下すると、
焦点性能が低下する。安価で簡単なホルダーを用いて、
単眼レンズを正確に位置決めすることは困難である。
2. Description of the Related Art An image device using a monocular lens has been proposed for a long time because it can reduce and enlarge an image. However, such an image device is difficult to put into practical use because a monocular lens must be mounted precisely. For example, if the arrangement pitch of the monocular lens is incorrect, white streaks or black streaks occur at the position where the lenses are connected to each other. If the lens is tilted, the image formation position will change. If the flatness of the lens mounting surface decreases,
Focusing performance is degraded. With an inexpensive and simple holder,
Accurate positioning of a monocular lens is difficult.

【0003】[0003]

【発明の課題】請求項1の発明の課題は、単眼レンズ
を、水平方向にも垂直方向にも、正確に位置決めするこ
とにある。請求項2の課題は、小さなレンズを多数回搭
載する代わりに、大きなレンズを少数回搭載するように
し、単眼レンズを容易にかつ正確に搭載することにあ
る。請求項3の課題は、単眼レンズをホルダーに正確に
かつ容易に位置決めすることにある。
SUMMARY OF THE INVENTION An object of the present invention is to accurately position a monocular lens both horizontally and vertically. An object of the present invention is to mount a large lens a small number of times instead of mounting a small lens a large number of times, and to mount a monocular lens easily and accurately. An object of claim 3 is to accurately and easily position the monocular lens in the holder.

【0004】[0004]

【発明の構成】この発明は、単眼レンズと受発光アレイ
とを組み合わせて結像させるようにした画像装置におい
て、受発光アレイに対向してレンズホルダーを設け、ホ
ルダーに単眼レンズの収容用の凹部を設けてレンズを収
容し、凹部の底面に設けたフランジ面にレンズの底面を
当接させ、かつホルダー上に、透孔付きの金属プレート
を配置して、透孔にレンズを嵌着したことを特徴とす
る。好ましくは、レンズを2個一体とし、周囲にリング
を設けて、複合レンズとし、複合レンズのリング底面
を、凹部底面のフランジ面に当接させる。また好ましく
は、上部ホルダーと前記ホルダーとで金属プレートを挟
むように上部ホルダーを設け、上部ホルダーにはゴム部
材を設けて、レンズの上面を押圧する。受発光アレイと
しては、実施例に示すLEDアレイの他にELアレイや
CCDアレイなどを用いる。
According to the present invention, in an image device in which a monocular lens and a light emitting / receiving array are combined to form an image, a lens holder is provided so as to face the light receiving / emitting array, and a recess for accommodating the monocular lens is provided in the holder. A lens housing is provided to accommodate the lens, the bottom surface of the lens is brought into contact with the flange surface provided on the bottom surface of the recess, and the metal plate with the through hole is arranged on the holder, and the lens is fitted into the through hole. Is characterized by. Preferably, two lenses are integrated and a ring is provided around the lens to form a compound lens, and the bottom surface of the ring of the compound lens is brought into contact with the flange surface of the bottom surface of the recess. Further, preferably, the upper holder is provided so as to sandwich the metal plate between the upper holder and the holder, and the upper holder is provided with a rubber member to press the upper surface of the lens. As the light emitting / receiving array, an EL array, a CCD array or the like is used in addition to the LED array shown in the embodiment.

【0005】[0005]

【発明の作用】請求項1の発明では、単眼レンズを金属
プレートでX方向に対して位置決めする。位置決めに用
いる透孔をエッチングなどで設ければ、極めて正確に位
置決めすることができる。また単眼レンズは、レンズホ
ルダーに設けたフランジ面に当接させ、Y方向に位置決
めする。レンズの搭載では、金属プレートにレンズを嵌
着し、レンズホルダーにセットすればよく、容易に搭載
することができる。プレートは金属製なので、プラスチ
ックに比べて熱膨張率が小さく、熱変形による結像性能
の低下を防止することができる。請求項2の発明では、
単眼レンズを2個一組とした複合レンズとして用いる。
このためレンズの搭載回数が2分の1になり、しかもよ
り大きなレンズを用いることになるため、正確にかつ容
易に搭載することができる。請求項3の発明では、上部
ホルダーとゴム部材とを設けて、上部ホルダーからゴム
部材を介して単眼レンズをレンズホルダーのフランジ面
へと押圧する。このため接着剤なしで、単眼レンズを正
確にフランジ面に当接させることができる。
According to the first aspect of the invention, the monocular lens is positioned by the metal plate in the X direction. If the through holes used for positioning are provided by etching or the like, the positioning can be performed extremely accurately. The monocular lens is brought into contact with a flange surface provided on the lens holder and positioned in the Y direction. To mount the lens, the lens may be fitted to the metal plate and set in the lens holder, and the lens can be easily mounted. Since the plate is made of metal, it has a smaller coefficient of thermal expansion than plastic and can prevent deterioration of the imaging performance due to thermal deformation. According to the invention of claim 2,
It is used as a compound lens in which two monocular lenses are paired.
Therefore, the number of times of mounting the lens is reduced to one half, and a larger lens is used, so that the lens can be mounted accurately and easily. According to the invention of claim 3, the upper holder and the rubber member are provided, and the monocular lens is pressed from the upper holder to the flange surface of the lens holder through the rubber member. Therefore, the monocular lens can be accurately brought into contact with the flange surface without using an adhesive.

【0006】[0006]

【実施例】図1〜図4に、最初の実施例を示す。図3に
おいて、2は単眼レンズで、プラスチックあるいはガラ
スのいずれのレンズでもよいが、ここではプラスチック
レンズとし、4はそのレンズ部、6はその周囲のリング
部である。リング部6は、射出成型時に金型で正確に形
成されるので、リング部6の底面を基準面8とする。
EXAMPLE A first example is shown in FIGS. In FIG. 3, reference numeral 2 denotes a monocular lens, which may be either a plastic lens or a glass lens. Here, a plastic lens is used, 4 is a lens portion thereof, and 6 is a ring portion around the lens portion. Since the ring portion 6 is accurately formed by a mold during injection molding, the bottom surface of the ring portion 6 is used as the reference surface 8.

【0007】図1,図2,図4に画像装置の構造を示す
と、10はLED基板でガラスやプラスチックなどの基
板を用い、12はLEDアレイである。また14は、基
板10に設けたピン穴である。16はレンズホルダー
で、例えばプラスチック製とし、18は凹部で、20は
凹部18の中心に設けた透孔、22は透孔20の周囲に
設けたフランジ面で、レンズ2の基準面8と当接させ
る。24はピンである。
1, 2, and 4 show the structure of the image device, 10 is an LED substrate using a substrate such as glass or plastic, and 12 is an LED array. Further, 14 is a pin hole provided in the substrate 10. Reference numeral 16 is a lens holder, which is made of, for example, plastic, 18 is a concave portion, 20 is a through hole provided in the center of the concave portion, 22 is a flange surface provided around the through hole 20, and is in contact with the reference surface 8 of the lens 2. Contact. 24 is a pin.

【0008】26は金属プレートで、平坦で反りの少な
いプレートとするため、厚さを例えば0.1ないし0.5mm程
度とする。金属プレート26には、例えば銅やステンレ
スあるいはアルミニウムなどを用い、厚さが0.5mmを越
えると反りやすく、0.1mm未満では変形しやすいため、
平坦度を得るのが難しい。金属プレート26には、エッ
チングにより透孔28とピン穴30とを設ける。エッチ
ングによる加工では、プレス加工などに比べ、正確にか
つ容易に透孔28を設けることができる。32は上部ホ
ルダーで、34は透孔である。
Reference numeral 26 denotes a metal plate, which has a thickness of, for example, about 0.1 to 0.5 mm in order to be a flat plate with little warpage. For the metal plate 26, for example, copper, stainless steel, or aluminum is used. When the thickness exceeds 0.5 mm, the metal plate 26 is easily warped, and when less than 0.1 mm, the metal plate 26 is easily deformed.
It is difficult to obtain flatness. The metal plate 26 is provided with through holes 28 and pin holes 30 by etching. In the processing by etching, the through hole 28 can be provided accurately and easily as compared with the press processing. 32 is an upper holder and 34 is a through hole.

【0009】このような画像装置の組立では、基板10
にLEDアレイ12を搭載する。金属プレート26の透
孔28に単眼レンズ2を嵌着し、金属プレート26を挟
み込むように上部プレート32をセットして、単眼レン
ズ2の基準面8をフランジ面22に当接させ、接着剤で
フランジ面22に固定する。次いで、ピン24により、
基板10から上部プレート32までを一体に結合する。
In the assembly of such an image device, the substrate 10 is used.
The LED array 12 is mounted on. The monocular lens 2 is fitted into the through hole 28 of the metal plate 26, the upper plate 32 is set so as to sandwich the metal plate 26, the reference surface 8 of the monocular lens 2 is brought into contact with the flange surface 22, and the adhesive is applied. It is fixed to the flange surface 22. Then, with pin 24,
The substrate 10 to the upper plate 32 are integrally joined.

【0010】金属プレート26の透孔28はエッチング
で設けたので、形状精度が高い。同様に、単眼レンズ2
の周囲のリング部6の側面は、レンズ2の形成時の金型
により正確に形成されている。そこで単眼レンズ2を透
孔28に嵌着すると、レンズ2を図での水平方向に正確
に位置決めすることができる。単眼レンズ2は上部ホル
ダー32により押圧され、基準面8が凹部18のフラン
ジ面22に当接する。このため単眼レンズ2を、図での
垂直方向に正確に位置決めすることができ、水平方向に
も垂直方向にも正確に位置決めすることができる。そし
て、金属プレート26はピン24により基板10に結合
され、単眼レンズ2はLEDアレイ12に対して正確に
搭載される。このようにして単眼レンズ2を例えば±5
μm以下の誤差で搭載し、LEDアレイ12からの光を
2倍に拡大しても、画像品位が低下しないようにする。
Since the through hole 28 of the metal plate 26 is provided by etching, the shape accuracy is high. Similarly, the monocular lens 2
The side surface of the ring portion 6 around is accurately formed by the mold used to form the lens 2. Therefore, by fitting the monocular lens 2 into the through hole 28, the lens 2 can be accurately positioned in the horizontal direction in the drawing. The monocular lens 2 is pressed by the upper holder 32, and the reference surface 8 contacts the flange surface 22 of the recess 18. Therefore, the monocular lens 2 can be accurately positioned in the vertical direction in the drawing, and can be accurately positioned in both the horizontal direction and the vertical direction. Then, the metal plate 26 is coupled to the substrate 10 by the pin 24, and the monocular lens 2 is accurately mounted on the LED array 12. In this way, the monocular lens 2 is adjusted to ± 5, for example.
Mounted with an error of less than μm so that the image quality does not deteriorate even if the light from the LED array 12 is doubled.

【0011】周囲温度の変動やLEDアレイ12からの
発熱などで、金属プレート26が変形すると、結像性能
が低下する。特に実施例の画像装置の場合、LEDアレ
イ12からの光を単眼レンズ2で拡大して結像させるの
で、熱変形により単眼レンズ2の位置が5μm以上シフ
トすると、アレイ12とアレイ12との変わり目に対応
する位置に白すじや黒すじが発生する。しかしながら金
属の熱膨張率は一般に1〜2×10-5/℃程度であり、
プラスチックの熱膨張率である5〜7×10-5/℃より
も小さく、金属プレート26により単眼レンズ2の水平
方向位置を決定することにより、熱変形による画像品位
の低下を防止することができる。また実施例では、金属
プレート26を2つのホルダー16,32で挟み込んだ
ので、例えばレンズ2からプレート26へと伝わった熱
を、ホルダー16,32へと逃がし、熱変形をさらに小
さくすることができる。
If the metal plate 26 is deformed due to fluctuations in the ambient temperature or heat generated from the LED array 12, the image forming performance will deteriorate. Particularly, in the case of the image device of the embodiment, the light from the LED array 12 is enlarged by the monocular lens 2 to form an image. Therefore, when the position of the monocular lens 2 is shifted by 5 μm or more due to thermal deformation, the transition between the arrays 12 and 12 is changed. White streaks and black streaks occur at positions corresponding to. However, the coefficient of thermal expansion of metals is generally about 1 to 2 × 10 −5 / ° C.,
It is smaller than the thermal expansion coefficient of plastic, which is 5 to 7 × 10 −5 / ° C., and by determining the horizontal position of the monocular lens 2 by the metal plate 26, it is possible to prevent deterioration of image quality due to thermal deformation. . In addition, in the embodiment, since the metal plate 26 is sandwiched between the two holders 16 and 32, the heat transmitted from the lens 2 to the plate 26 is released to the holders 16 and 32, and the thermal deformation can be further reduced. .

【0012】[0012]

【実施例2】図5,図6に、第2の実施例を示す。この
実施例は、2個の単眼レンズを一体として複合レンズ4
0とし、複合レンズ40単位での搭載を行うものであ
る。図6に示すように、複合レンズ40では2個のレン
ズ部4,4を一体として、その周囲をリング部42で囲
み、リング部42の底面を基準面44とする。レンズ4
0の形成では、例えば中心部から樹脂を注入すると、樹
脂はレンズ40の左右に均一に流れて、左右のレンズ部
4,4を対称に形成することができる。これに対して例
えばレンズ部4を3個一体とすると、中央部のレンズと
左右のレンズとを均一に形成することが難しく、例えば
左右のレンズへの樹脂の流れ込み量が中央のレンズと異
なったりする。4個以上のレンズ部4を設けると、均一
にレンズ部4を形成することがさらに難しくなる。
Second Embodiment FIGS. 5 and 6 show a second embodiment. In this embodiment, two monocular lenses are integrated to form a compound lens 4
It is set to 0 and the compound lens 40 is mounted in units. As shown in FIG. 6, in the compound lens 40, the two lens portions 4 and 4 are integrated, the periphery thereof is surrounded by the ring portion 42, and the bottom surface of the ring portion 42 is used as the reference surface 44. Lens 4
In the formation of 0, for example, when resin is injected from the central portion, the resin uniformly flows to the left and right of the lens 40, and the left and right lens portions 4 and 4 can be formed symmetrically. On the other hand, for example, if the three lens portions 4 are integrated, it is difficult to uniformly form the central lens and the left and right lenses, and for example, the amount of resin flowing into the left and right lenses is different from that in the central lens. To do. If four or more lens parts 4 are provided, it becomes more difficult to form the lens parts 4 uniformly.

【0013】図5において、50はレンズホルダーで、
複合レンズ40を用いることに対応して大きな凹部52
を設け、2ヶ所に透孔20,20を設けると共にその周
囲を平坦にしてフランジ面54とする。また56は、ピ
ン24のピン穴である。60は、複合レンズ40に対応
した金属プレートで、エッチングにより透孔62とピン
穴30とを設ける。これ以外の点では、図1〜図4の実
施例と同様である。
In FIG. 5, reference numeral 50 denotes a lens holder,
A large recess 52 corresponding to the use of the compound lens 40
Is provided, the through holes 20, 20 are provided at two places, and the periphery thereof is flattened to form a flange surface 54. Reference numeral 56 is a pin hole for the pin 24. Reference numeral 60 denotes a metal plate corresponding to the compound lens 40, which has through holes 62 and pin holes 30 formed by etching. The other points are the same as those of the embodiment shown in FIGS.

【0014】図1〜図4の実施例と、図5,図6の実施
例との違いは、小さな単眼レンズ2を多数回搭載するの
と、大きな複合レンズ40を少数回搭載することとにあ
る。小さな単眼レンズ2を搭載するにも、大きな複合レ
ンズ40を搭載する方が容易で、しかも搭載回数は2分
の1になる。このため図5,図6の実施例では、単眼レ
ンズをより正確に搭載することができる。また複合レン
ズ40の内部では、レンズ部4,4間の間隔が一定で、
複合レンズ40内でのレンズの配列ピッチを一定にする
ことができる。
The difference between the embodiment of FIGS. 1 to 4 and the embodiment of FIGS. 5 and 6 is that the small monocular lens 2 is mounted many times and the large compound lens 40 is mounted a few times. is there. Even if the small monocular lens 2 is mounted, it is easier to mount the large compound lens 40, and the number of mounting times is halved. Therefore, in the embodiment shown in FIGS. 5 and 6, the monocular lens can be mounted more accurately. Inside the compound lens 40, the distance between the lens parts 4 and 4 is constant,
The arrangement pitch of the lenses in the compound lens 40 can be made constant.

【0015】[0015]

【実施例3】図7に、第3の実施例を示す。この実施例
では、Oリング64を用いて単眼レンズ2を上部ホルダ
ー32側から押圧し、基準面8をフランジ面22に当接
させる。このようにすると、上部ホルダー32側の精度
が低い場合でも、単眼レンズ2をフランジ面22に正確
に当接させることができる。また接着剤を用いないの
で、接着剤の硬化を待つ必要がなく、接着剤の硬化温度
にあわせて空調する必要もなくなる。さらに接着剤の厚
さのばらつきにより、単眼レンズ2の高さ位置がばらつ
くという問題がなくなり、また接着剤がレンズ部4に垂
れて結像性能が低下するという問題もなくなる。なおO
リング64に変えて、ゴムパッキン等を用いても良い。
Third Embodiment FIG. 7 shows a third embodiment. In this embodiment, the O-ring 64 is used to press the monocular lens 2 from the upper holder 32 side to bring the reference surface 8 into contact with the flange surface 22. With this configuration, the monocular lens 2 can be accurately brought into contact with the flange surface 22 even when the accuracy of the upper holder 32 side is low. Further, since no adhesive is used, there is no need to wait for the adhesive to cure, and there is no need to air-condition according to the curing temperature of the adhesive. Furthermore, the problem that the height position of the monocular lens 2 varies due to the variation in the thickness of the adhesive agent is eliminated, and the problem that the adhesive agent drips on the lens portion 4 and the imaging performance is deteriorated is also eliminated. O
Instead of the ring 64, rubber packing or the like may be used.

【0016】[0016]

【発明の効果】請求項1の発明では、単眼レンズを金属
プレートによりX方向に位置決めし、レンズホルダーの
フランジ面を用いて、Y方向に位置決めする。このため
単眼レンズを水平方向にも垂直方向にも、正確に位置決
めすることができる。レンズの搭載では、金属プレート
の透孔に嵌着した後、レンズホルダーの凹部にセットす
ればよく、容易に搭載できる。またホルダーは金属製な
ので、熱膨張率が小さく、温度変動による結像性能の低
下が小さい。請求項2の発明では、単眼レンズを2個一
体とした複合レンズとし、1個ずつの単眼レンズを搭載
する場合に比べて、2分の1の搭載回数で、しかもより
大きなレンズを用いて搭載することができる。このため
単眼レンズの搭載性能がさらに向上する。さらに複合レ
ンズの内部ではレンズ間の配列ピッチが一定であり、レ
ンズの配列ピッチの精度が向上する。請求項3の発明で
は、ゴム部材を設けて単眼レンズの上面を押圧し、レン
ズ底面の基準面をレンズホルダーのフランジ面に正確に
当接させることができる。このようにすれば接着剤が不
要になり、接着剤の厚さばらつきによる単眼レンズのY
方向位置の変動や、接着剤がレンズ部の表面に付着する
ことによる結像性能の低下がない。さらに接着剤の硬化
を待つ必要がなく、また接着剤の硬化温度に合わせて空
調を施す必要もない。請求項3の発明では、上部ホルダ
ーとレンズホルダーの2つのホルダーで金属プレートを
挟み込むので、金属プレートからの放熱が特に容易にな
り、熱変形による結像性能の低下をさらに防止すること
ができる。
According to the invention of claim 1, the monocular lens is positioned in the X direction by the metal plate, and is positioned in the Y direction by using the flange surface of the lens holder. Therefore, the monocular lens can be accurately positioned in the horizontal direction and the vertical direction. The lens can be mounted easily by fitting it into the through hole of the metal plate and then setting it in the recess of the lens holder. Further, since the holder is made of metal, the coefficient of thermal expansion is small, and the deterioration of the imaging performance due to temperature fluctuations is small. According to the invention of claim 2, compared with the case where one monocular lens is mounted as a compound lens in which two monocular lenses are integrated, the number of times of mounting is one half, and a larger lens is used for mounting. can do. Therefore, the mounting performance of the monocular lens is further improved. Further, the arrangement pitch between the lenses is constant inside the compound lens, and the accuracy of the arrangement pitch of the lenses is improved. According to the third aspect of the present invention, it is possible to provide the rubber member to press the upper surface of the monocular lens and accurately bring the reference surface of the lens bottom surface into contact with the flange surface of the lens holder. This eliminates the need for an adhesive agent, and the Y
There is no change in the directional position and no deterioration of the imaging performance due to the adhesive adhering to the surface of the lens portion. Furthermore, there is no need to wait for the adhesive to cure, and there is no need to perform air conditioning in accordance with the curing temperature of the adhesive. According to the third aspect of the invention, since the metal plate is sandwiched between the two holders, the upper holder and the lens holder, the heat radiation from the metal plate is particularly easy, and the deterioration of the imaging performance due to thermal deformation can be further prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】 実施例の画像装置の長手方向平面図FIG. 1 is a plan view in a longitudinal direction of an image device according to an embodiment.

【図2】 実施例の画像装置の短片方向断面図FIG. 2 is a cross-sectional view in the short piece direction of the image device according to the embodiment.

【図3】 実施例に用いた単眼レンズの断面図FIG. 3 is a sectional view of a monocular lens used in Examples.

【図4】 実施例の画像装置の分解状態を示す斜視図FIG. 4 is a perspective view showing a disassembled state of the image device according to the embodiment.

【図5】 第2の実施例の画像装置の分解状態を示す要
部斜視図
FIG. 5 is a perspective view of essential parts showing an exploded state of the image device according to the second embodiment.

【図6】 第2の実施例で用いた単眼レンズの断面図FIG. 6 is a sectional view of the monocular lens used in the second embodiment.

【図7】 第3の実施例の画像装置での単眼レンズの搭
載状態を示す要部断面図
FIG. 7 is a cross-sectional view of essential parts showing a mounted state of a monocular lens in an image device according to a third embodiment.

【符号の説明】[Explanation of symbols]

2 単眼レンズ 4 レンズ部 6 リング部 8 基準面 10 LED基板 12 LEDアレイ 14 ピン穴 16 レンズホルダー 18 凹部 20 透孔 22 フランジ面 24 ピン 26 エッチングプレート 28 透孔 30 ピン穴 32 上部ホルダー 34 透孔 40 複合レンズ 42 リング部 44 基準面 52 凹部 54 フランジ面 56 ピン穴 60 金属プレート 62 透孔 64 Oリング 2 monocular lens 4 lens part 6 ring part 8 reference surface 10 LED substrate 12 LED array 14 pin hole 16 lens holder 18 recess 20 through hole 22 flange surface 24 pin 26 etching plate 28 through hole 30 pin hole 32 upper holder 34 through hole 40 Compound lens 42 Ring portion 44 Reference surface 52 Recessed portion 54 Flange surface 56 Pin hole 60 Metal plate 62 Through hole 64 O-ring

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 // B41J 2/44 2/45 2/455 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location // B41J 2/44 2/45 2/455

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 単眼レンズと受発光アレイとを組み合わ
せて結像させるようにした画像装置において、 受発光アレイに対向してレンズホルダーを設け、該ホル
ダーに単眼レンズの収容用の凹部を設けて前記レンズを
収容し、該凹部の底面に設けたフランジ面に前記レンズ
の底面を当接させ、 かつ前記ホルダー上に、透孔付きの金属プレートを配置
して、該透孔に前記レンズを嵌着したことを特徴とす
る、画像装置。
1. An image device in which a monocular lens and a light emitting and receiving array are combined to form an image, a lens holder is provided facing the light receiving and emitting array, and a concave portion for accommodating the monocular lens is provided in the holder. The lens is housed, the bottom surface of the lens is brought into contact with a flange surface provided on the bottom surface of the recess, and a metal plate with a through hole is arranged on the holder, and the lens is fitted into the through hole. An image device characterized by being worn.
【請求項2】 前記レンズを2個一体とし、周囲にリン
グを設けて、複合レンズとし、 該複合レンズのリング底面を、前記凹部底面のフランジ
面に当接させたことを特徴とする、請求項1の画像装
置。
2. The two lenses are integrated, a ring is provided around the lens to form a compound lens, and a ring bottom surface of the compound lens is brought into contact with a flange surface of the recess bottom surface. The image device according to item 1.
【請求項3】 上部ホルダーと前記ホルダーとで金属プ
レートを挟むように、上部ホルダーを設け、該上部ホル
ダーにはゴム部材を設けて、前記レンズの上面を押圧す
るようにしたことを特徴とする、請求項1の画像装置。
3. An upper holder is provided so as to sandwich a metal plate between the upper holder and the holder, and a rubber member is provided on the upper holder to press the upper surface of the lens. The imaging device according to claim 1.
JP29446893A 1993-10-28 1993-10-28 Imaging device Expired - Fee Related JP2779585B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP29446893A JP2779585B2 (en) 1993-10-28 1993-10-28 Imaging device
US08/331,354 US5617131A (en) 1993-10-28 1994-10-27 Image device having a spacer with image arrays disposed in holes thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29446893A JP2779585B2 (en) 1993-10-28 1993-10-28 Imaging device

Publications (2)

Publication Number Publication Date
JPH07130256A true JPH07130256A (en) 1995-05-19
JP2779585B2 JP2779585B2 (en) 1998-07-23

Family

ID=17808173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29446893A Expired - Fee Related JP2779585B2 (en) 1993-10-28 1993-10-28 Imaging device

Country Status (1)

Country Link
JP (1) JP2779585B2 (en)

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