JPH07128041A - Method for measuring plate thickness - Google Patents

Method for measuring plate thickness

Info

Publication number
JPH07128041A
JPH07128041A JP27287593A JP27287593A JPH07128041A JP H07128041 A JPH07128041 A JP H07128041A JP 27287593 A JP27287593 A JP 27287593A JP 27287593 A JP27287593 A JP 27287593A JP H07128041 A JPH07128041 A JP H07128041A
Authority
JP
Japan
Prior art keywords
time
reference counting
average
plate thickness
counting time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27287593A
Other languages
Japanese (ja)
Inventor
Shigeyuki Okuma
茂幸 大熊
Takeshi Murata
健 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP27287593A priority Critical patent/JPH07128041A/en
Publication of JPH07128041A publication Critical patent/JPH07128041A/en
Pending legal-status Critical Current

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  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)

Abstract

PURPOSE:To eliminate dead zone during an interval from the start of measurement to an average operating time by measuring the plate thickness based on the weighted average of data for every reference counting time during that interval. CONSTITUTION:Radiation from a radiation source 2 transmits through an object to be measured (thick plate) 1 in the arrow direction and impinges on a detector 3. A detected signal 3 is processed at an input circuit section 5 which delivers a pulse signal corresponding to the plate thickness to an processing unit 6. The processing unit 6 counts the number of pulses every reference counting time and for the interval from start of measurement to an average operating time, a weighted average AXn of data is determined for every set reference counting time according to a formula I {in the formula, k: average operating time/reference counting time (fractions are raised to a unit), n: number of counts x}. Upon reaching the average operating time, moving average BXn of the counts (x) for every reference counting time is determined according to formula II. This method eliminates the dead zone and realizes a highly accurate high response thickness gauge.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、放射線などを利用して
鋼板などの厚さを測定する板厚測定方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate thickness measuring method for measuring the thickness of a steel plate or the like by utilizing radiation or the like.

【0002】[0002]

【従来の技術】鉄鋼などの圧延および精整工程では、製
品の品質管理の重要な要素として、厚さの連続測定を必
要としており、従来放射線を利用した厚さ計を使用して
平均演算時間ごとのデータの移動平均に基づいて板厚を
測定していた。
2. Description of the Related Art In the rolling and refining processes of steel and the like, continuous thickness measurement is required as an important element of product quality control. The plate thickness was measured based on the moving average of the data for each.

【0003】[0003]

【発明が解決しようとする課題】厚さ計において、測定
精度を決定する重要な要因となる、測定結果のバラツキ
すなわち統計誤差は、
In the thickness gauge, the variation of the measurement result, that is, the statistical error, which is an important factor for determining the measurement accuracy, is

【0004】[0004]

【数4】 ここに σ:相対標準偏差 N:計数値(CPS) T:測定時間(S) で定義される。[Equation 4] Here, σ is defined as relative standard deviation N: count value (CPS) T: measurement time (S).

【0005】この統計誤差が測定精度上許容される値
は、90%信頼度で約0.05%であるから、測定時間は 0.4
Sは必要となる。しかしながら、 0.4Sの測定時間を許
容すると、通常のラインスピードで被測定物は1m以上
も移動してしまい、不感帯が大きく実用に供しない。こ
のように、統計誤差と応答(測定時間)は、相反する結
果をもたらすため、いずれかを犠牲にしなければならな
いという宿命にあった。従来は平均演算時間ごとのデー
タの移動平均のみに基づいて板厚を測定しているため
に、測定開始から平均演算時間に達するまでの間に不感
帯が生じ、平均演算時間に達した後も厚さ変化に対する
分解能が悪かった。
The value allowed for this statistical error in terms of measurement accuracy is about 0.05% at 90% reliability, so the measurement time is 0.4
S is required. However, if the measurement time of 0.4 S is allowed, the object to be measured will move by 1 m or more at a normal line speed, and the dead zone will be large and it will not be put to practical use. As described above, the statistical error and the response (measurement time) bring about contradictory results, and therefore, one of them is destined to be sacrificed. Conventionally, since the plate thickness is measured based only on the moving average of data for each average calculation time, a dead zone occurs between the start of measurement and the average calculation time, and even after the average calculation time is reached Resolution was poor.

【0006】近年、品質の向上に対する要求が高まり、
厚さ計の精度および応答性の飛躍的向上が要求されるよ
うになった。特に厚板などのプレート圧延工程において
は、測定対象物が継続的に流れてくる為、板頭の不感帯
を最小限にする要求がある。
In recent years, there has been an increasing demand for quality improvement,
A dramatic improvement in the accuracy and responsiveness of thickness gauges has been demanded. Particularly in the plate rolling process for thick plates and the like, the object to be measured continuously flows, and thus there is a demand for minimizing the dead zone of the plate head.

【0007】従って、本発明の目的は、測定開始から平
均演算時間に達するまでの不感帯をなくし、高精度、高
速応答の相反する条件を満足しうる板厚測定方法を提供
することにある。
Therefore, an object of the present invention is to provide a plate thickness measuring method which can eliminate the dead zone from the start of measurement until the average calculation time is reached and satisfy the contradictory conditions of high precision and high speed response.

【0008】[0008]

【課題を解決するための手段】このため、本発明は、被
測定物をはさみ込むように一対の線源と検出器を配置
し、被測定物の板厚を測定する方法において、測定開始
から設定された平均演算時間に達するまでは設定された
基準計数時間ごとのデータの重みつき平均に基づいて板
厚を測定し、上記平均演算時間に達した後は前記基準計
数時間ごとの移動平均に基づいて板厚を測定するように
したものである。
Therefore, according to the present invention, a method of arranging a pair of a radiation source and a detector so as to sandwich an object to be measured and measuring the plate thickness of the object to be measured, from the start of measurement. Measure the plate thickness based on the weighted average of the data for each set reference counting time until the set average calculation time is reached, and then use the moving average for each reference counting time after the average calculation time is reached. Based on this, the plate thickness is measured.

【0009】[0009]

【作用】測定開始から平均演算時間に達するまでは基準
計数時間ごとのデータの重みつき平均に基づいて板厚を
測定することにより、板頭部分の不感帯が解消される。
平均演算時間に達した後も基準計数時間ごとのデータの
移動平均に基づいて板厚を測定することにより厚さ変化
に対する分解能が向上する。
The dead zone at the plate head portion is eliminated by measuring the plate thickness based on the weighted average of the data for each reference counting time from the start of measurement until the average calculation time is reached.
Even after the average calculation time is reached, the plate thickness is measured based on the moving average of the data for each reference counting time, so that the resolution with respect to the thickness change is improved.

【0010】[0010]

【実施例】以下、本発明の一実施例を図面に基づいて説
明する。図1に示すように、本実施例を適用する厚さ計
は、被測定物1をはさんで線源2と検出器3が一定の間
隔で配置されており、線源2より矢印方向に放射線を発
し、被測定物1を透過した放射線が検出器3に達する。
検出器3は光電子増倍管などを用いたパルスを出力する
検出器で、高電圧が高圧電源部4から印加されており、
検出された信号は入力回路部5で伝送可能な信号に処理
され、演算処理装置6へ入力される。被測定物1は厚板
圧延などでは1000℃前後に加熱されており、圧延中の温
度変化に対する密度の補正が不可欠の為、温度検出器7
で温度を検出し信号変換器8をへて演算処理装置6で補
正処理される。また温度検出器7は測定位置への被測定
物1の突入検出も兼ねており、信号変換部8では 600℃
以上の温度検知で板有りの判定をする板突入信号発生部
(図示せず)が含まれ測定開始信号をここから発信す
る。入力回路部5からの板厚に対応したパルス信号およ
び信号変換器8からの温度信号は、演算処理装置6で演
算処理され表示記録装置9に表示される。板厚などの各
種設定値情報および測定結果の情報は、演算処理装置6
と上位のプロセスコンピュータ10とで交信し自動測定が
なされる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 1, in a thickness gauge to which the present embodiment is applied, a radiation source 2 and a detector 3 are arranged at a constant interval with the object to be measured 1 interposed therebetween, and the radiation source 2 and the detector 3 are arranged in a direction of an arrow from the radiation source 2. The radiation that emits radiation and that has passed through the DUT 1 reaches the detector 3.
The detector 3 is a detector that outputs a pulse using a photomultiplier tube or the like, and a high voltage is applied from the high-voltage power supply unit 4,
The detected signal is processed into a signal that can be transmitted by the input circuit unit 5, and is input to the arithmetic processing unit 6. Since the DUT 1 is heated to around 1000 ° C in thick plate rolling and the like, it is indispensable to correct the density against temperature changes during rolling.
Then, the temperature is detected, the signal converter 8 is passed, and the correction processing is performed by the arithmetic processing unit 6. In addition, the temperature detector 7 also serves as the entry detection of the DUT 1 into the measurement position, and the signal conversion unit 8 has 600 ° C.
A plate rush signal generator (not shown) for determining the presence of a plate by the above temperature detection is included, and a measurement start signal is transmitted from here. The pulse signal corresponding to the plate thickness from the input circuit unit 5 and the temperature signal from the signal converter 8 are arithmetically processed by the arithmetic processing unit 6 and displayed on the display recording unit 9. Information on various set values such as the plate thickness and the information on the measurement results are stored in the arithmetic processing unit 6
And the upper process computer 10 communicate with each other to perform automatic measurement.

【0011】一方、板巾方向の厚さ検出位置を制御する
ため図2に示す如く、線源2、検出器3などが取付けら
れる保持体11は、板巾方向にレール12上を走行するよう
になっており、ピニオン13、ラック14、およびそれらに
直結された位置発信機15からパルスを発信し、位置制御
装置16に入力される。保持体11の停止目的位置は、演算
処理装置6から板巾変更とともに設定値として与えられ
位置制御装置16で位置発信機15から与えられる信号と比
較し、モーター17の電圧を制御し、所望の位置に停止さ
せる。
On the other hand, in order to control the thickness detection position in the plate width direction, as shown in FIG. 2, the holding body 11 to which the radiation source 2, the detector 3 and the like are attached is designed to run on the rail 12 in the plate width direction. The pulse is transmitted from the pinion 13, the rack 14, and the position transmitter 15 directly connected to the pinion 13, the rack 14, and is input to the position control device 16. The target stop position of the holder 11 is given as a set value by the arithmetic processing unit 6 together with the change of the plate width, and compared with a signal given from the position transmitter 15 by the position control unit 16 to control the voltage of the motor 17 to obtain a desired value. Stop in position.

【0012】図3は、演算処理装置6で実行される演算
プログラムのうち、入力回路部5からの計数値を測定開
始から設定された平均演算時間に達するまでは設定され
た基準計数時間ごとのデータの重みつき平均を行い、平
均演算時間に達した後は基準計数時間ごとの移動平均を
行う部分のフローチャートである。
FIG. 3 shows a calculation program executed by the calculation processing unit 6 for each set reference counting time from the start of measurement of the count value from the input circuit unit 5 until the set average calculation time is reached. 8 is a flowchart of a part of performing weighted averaging of data and performing a moving average for each reference counting time after the average calculation time is reached.

【0013】まず、nの初期設定を行う(ステップ2
0)。そして、nを更新し(ステップ21)、基準計数時
間ごとにパルス計数を行いxを格納する(ステップ2
2)。その後、n<kならステップ24へ進み、そうでな
いならステップ25へ進む(ステップ23)。そして、下式
(1)により計数値の重みつき平均を求めて出力する
(ステップ24)。また、下式(2)により計数値の移動
平均を求めて出力する(ステップ25)。その後、板検出
器4が板出を検出したかをチェックして板出ならば終了
し、そうでないならステップ21へ戻る(ステップ26)。
First, n is initialized (step 2).
0). Then, n is updated (step 21), pulse counting is performed every reference counting time, and x is stored (step 2).
2). Thereafter, if n <k, the process proceeds to step 24, and if not, the process proceeds to step 25 (step 23). Then, the weighted average of the count values is obtained by the following equation (1) and output (step 24). Further, the moving average of the count value is obtained and output by the following equation (2) (step 25). After that, it is checked whether the board detector 4 has detected the board exit, and if it is board exit, the procedure ends. If not, the procedure returns to step 21 (step 26).

【0014】[0014]

【数5】 k:平均演算時間/基準計数時間(ただし、小数点第1
位は切上げ、整数とする) n:計数値の個数 x:計数値
[Equation 5] k: Average calculation time / reference counting time (However, the first decimal point
Rounding up is an integer) n: Number of count values x: Count value

【0015】[0015]

【数6】 k:平均演算時間/基準計数時間(ただし、小数点第1
位は切上げ、整数とする) n:計数値の個数 x:計数値次に図4により、具体的動作を説明する。
[Equation 6] k: Average calculation time / reference counting time (However, the first decimal point
The digit is rounded up to an integer.) N: Number of count values x: Count value Next, a specific operation will be described with reference to FIG.

【0016】図4は被測定物(例えば鋼板)を平面的に
見たもので、A−Bが板巾方向、A−Dが圧延方向を示
しており、例えば板巾の中間点Cに測定位置がセットさ
れ、板突入検出をする温度検出器7も同じ位置に配置さ
れている。一方基準計数時間を 0.1Sにセットしてお
き、かつ平均演算時間を 0.4Sにしておく。この状態で
矢印の流れ方向に鋼板が移動し測定位置まで進行して来
ると、温度検出器7が板突入を感知し、測定開始信号を
演算処理装置6へ発し、aの間すなわち 0.1S計数をす
る。 0.1S経過すると計数値は格納され、新たに 0.1S
計数を続行する。この動作を板が測定位置を出、板検出
器4が板出の判断をするまで繰り返す。一方、計数開始
に同期して、 0.1S間隔の時間判定を行い、 0.4Sすな
わち4回目のデータが計数されるまでは、 0.1Sごとの
重みつき平均を演算し(b1 、b2、b3 の間隔でそれ
ぞれaの間計数されたデータの重みつき平均を行
う。)、 0.5Sすなわち5回目の計数を完了したら、2
回目の計数値から5回目までの計数値、4回分( 0.4S
間)を 0.1Sごとの移動平均(b4 ′) で出力し、以降
の厚さ演算を行う。以後この動作を板出まで続行する。
以上の如く、板突入から 0.1Sごとにデータが出力され
高速応答が実現され、かつ 0.4S間の平均値で求められ
るので、統計誤差も最小限におさえられ、同時に高精度
化も達成される。また、b1 、b2 、b3 の重みつき平
均を行うことにより、データのバラツキは増えるが、板
頭部分の形状を知るうえで有効なデータとなる。
FIG. 4 is a plan view of an object to be measured (for example, a steel plate), where AB indicates the sheet width direction and A-D indicates the rolling direction. For example, measurement is made at the midpoint C of the sheet width. The position is set, and the temperature detector 7 for detecting the plate plunge is also arranged at the same position. On the other hand, the reference counting time is set to 0.1S and the average calculation time is set to 0.4S. In this state, when the steel plate moves in the flow direction of the arrow and advances to the measurement position, the temperature detector 7 detects the plate plunge and issues a measurement start signal to the arithmetic processing unit 6 to count 0.1a, that is, 0.1S. do. When 0.1S has elapsed, the count value is stored and 0.1S is newly added.
Continue counting. This operation is repeated until the plate comes out of the measurement position and the plate detector 4 judges that the plate has come out. On the other hand, in synchronism with the start of counting, the time judgment is performed at 0.1S intervals, and a weighted average is calculated for each 0.1S until 0.4S, that is, until the fourth data is counted (b 1 , b 2 , b). The weighted averaging of the data counted for each a at intervals of 3 is performed.), 0.5S, that is, 2 when the fifth counting is completed.
Count value from the 5th count to the 5th count, 4 counts (0.4S
Interval) is output as a moving average (b 4 ′) for each 0.1S, and the subsequent thickness calculation is performed. After that, this operation is continued until boarding.
As described above, since data is output every 0.1S from the plate plunge, a high-speed response is realized, and the average value between 0.4S is obtained, statistical error is minimized, and at the same time high accuracy is achieved. . Further, by performing the weighted averaging of b 1 , b 2 , and b 3 , the variation of the data increases, but the data is effective for knowing the shape of the plate head portion.

【0017】以上述べた本実施例による効果を図5によ
り具体的に説明する。5−Aは板頭部の断面を示す図
で、 0.4Sの単純平均で測定すると板頭より、4aすな
わち 0.4S間遅れて5−aに示す形状の結果でデータを
出力する。 0.4Sの 0.1Sごとの移動平均では5−bに
示すように、 0.4S経過後は5−aよりも分解されたデ
ータとなるが、板頭部の不感帯は改善されない。5−c
は本実施例を実行したときの、データを示す図で、前2
例の欠点が改善され、板頭の不感帯が最小限になり、厚
さ変化に対する分解能も満足される。
The effect of this embodiment described above will be described in detail with reference to FIG. 5-A is a diagram showing a cross section of the plate head, and when measured by a simple average of 0.4S, data is output as a result of the shape shown in 5-a after 4a, that is, 0.4S, behind the plate head. As shown in 5-b in the moving average of 0.4S for each 0.1S, after 0.4S, the data is decomposed more than in 5-a, but the dead zone of the plate head is not improved. 5-c
Is a diagram showing data when the present embodiment is executed.
The drawbacks of the example are improved, the dead zone of the plate head is minimized, and the resolution for thickness changes is also satisfactory.

【0018】以上のように、測定開始時点からの重みつ
き平均と、基準計数時間ごとの移動平均の演算方式を組
合せて行うことにより、実現不可能であった板頭部の不
感帯がなくなり、厚さ変動に対する分解も著しく向上
し、同時に演算時間による遅れを最小限にとどめた。高
精度でかつ高速応答の厚さ計が実現出来る。
As described above, by combining the weighted average from the start of measurement and the moving average calculation method for each reference counting time, the dead zone of the plate head which could not be realized is eliminated, and The resolution against fluctuations has been significantly improved, and at the same time, the delay due to the calculation time has been minimized. It is possible to realize a thickness gauge with high accuracy and high speed response.

【0019】上記実施例の図3中の処理24で重みつき平
均を求める際に式(1)を用いたが、下式(3)または
(4)または他の同様な結果を得られる式を用いても本
発明は実現可能である。尚説明では、基準計数時間を
0.1Sにし、平均演算時間を 0.4Sで示したが、この時
間に限ることなく、本発明は実現出来ることは言うまで
もない。
Equation (1) was used in obtaining the weighted average in the process 24 in FIG. 3 of the above-mentioned embodiment, but the following equation (3) or (4) or another equation that can obtain similar results is used. Even if it uses, the present invention can be realized. In the explanation, the reference counting time is
The average calculation time is set to 0.1 S and the average calculation time is set to 0.4 S, but needless to say, the present invention can be realized without being limited to this time.

【0020】[0020]

【数7】 [Equation 7]

【0021】上式(3)、(4)中 k:平均演算時間/基準計数時間(ただし、小数点第1
位は切上げ、整数とする) n:計数値の個数 x:計数値
In the above equations (3) and (4), k: average calculation time / reference counting time (where the first decimal point is
Rounding up is an integer) n: Number of count values x: Count value

【0022】[0022]

【発明の効果】以上述べたように、本発明によれば、測
定開始から平均演算時間に達するまでの間の不感帯がな
くなり、厚さ変動に対する分解も著しく向上し、同時に
演算時間による遅れが最小限にとどまる。従って、高精
度でかつ高速応答の厚さ計が実現出来る。
As described above, according to the present invention, the dead zone from the start of measurement to the time when the average calculation time is reached is eliminated, the resolution for thickness variation is significantly improved, and at the same time, the delay due to the calculation time is minimized. Stay in the limit. Therefore, it is possible to realize a thickness meter with high accuracy and high speed response.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を適用した放射線厚さ計の全
体構成を示すブロック図。
FIG. 1 is a block diagram showing an overall configuration of a radiation thickness gauge to which an embodiment of the present invention is applied.

【図2】図1に示した放射線厚さ計の検出系を示す詳細
図。
FIG. 2 is a detailed view showing a detection system of the radiation thickness gauge shown in FIG.

【図3】本発明の一実施例を示すフローチャート。FIG. 3 is a flowchart showing an embodiment of the present invention.

【図4】本発明の一実施例の測定方法を説明する図。FIG. 4 is a diagram illustrating a measuring method according to an embodiment of the present invention.

【図5】従来の方法と本発明の一実施例における測定結
果を示す図。
FIG. 5 is a diagram showing measurement results in a conventional method and an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1…被測定物 2…線源 3…検出器 1 ... DUT 2 ... Radiation source 3 ... Detector

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 被測定物をはさみ込むように一対の線源
と検出器を配置し、被測定物の板厚を測定する方法にお
いて、測定開始から設定された平均演算時間に達するま
では設定された基準計数時間ごとのデータの重みつき平
均に基づいて板厚を測定し、前記平均演算時間に達した
後は前記基準計数時間ごとの移動平均に基づいて板厚を
測定するようにしたことを特徴とする板厚測定方法。
1. A method of arranging a pair of a radiation source and a detector so as to sandwich an object to be measured and measuring the plate thickness of the object to be measured, the setting is performed from the start of measurement until the set average calculation time is reached. The plate thickness is measured based on the weighted average of the data for each reference counting time, and after the average calculation time is reached, the plate thickness is measured based on the moving average for each reference counting time. A method for measuring plate thickness.
【請求項2】 測定開始から設定された平均演算時間に
達するまでに行う基準計数時間ごとの重みつき平均Ax
n を下式により演算することを特徴とする請求項1記載
の板厚測定方法。 【数1】 k:平均演算時間/基準計数時間(ただし、小数点第1
位は切上げ、整数とする) n:計数値の個数 x:計数値
2. A weighted average Ax for each reference counting time, which is performed from the start of measurement until the set average calculation time is reached.
The plate thickness measuring method according to claim 1, wherein n is calculated by the following formula. [Equation 1] k: Average calculation time / reference counting time (However, the first decimal point
Rounding up is an integer) n: Number of count values x: Count value
【請求項3】 測定開始から設定された平均演算時間に
達するまでに行う基準計数時間ごとの重みつき平均Ax
n を下式により演算することを特徴とする請求項1記載
の板厚測定方法。 【数2】 k:平均演算時間/基準計数時間(ただし、小数点第1
位は切上げ、整数とする) n:計数値の個数 x:計数値
3. A weighted average Ax for each reference counting time, which is performed from the start of measurement until the set average calculation time is reached.
The plate thickness measuring method according to claim 1, wherein n is calculated by the following formula. [Equation 2] k: Average calculation time / reference counting time (However, the first decimal point
Rounding up is an integer) n: Number of count values x: Count value
【請求項4】 測定開始から設定された平均演算時間に
達するまでに行う基準計数時間ごとの重みつき平均Ax
n を下式により演算することを特徴とする請求項1記載
の板厚測定方法。 【数3】 k:平均演算時間/基準計数時間(ただし、小数点第1
位は切上げ、整数とする) n:計数値の個数 x:計数値
4. A weighted average Ax for each reference counting time, which is performed from the start of measurement until the set average calculation time is reached.
The plate thickness measuring method according to claim 1, wherein n is calculated by the following formula. [Equation 3] k: Average calculation time / reference counting time (However, the first decimal point
Rounding up is an integer) n: Number of count values x: Count value
JP27287593A 1993-11-01 1993-11-01 Method for measuring plate thickness Pending JPH07128041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27287593A JPH07128041A (en) 1993-11-01 1993-11-01 Method for measuring plate thickness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27287593A JPH07128041A (en) 1993-11-01 1993-11-01 Method for measuring plate thickness

Publications (1)

Publication Number Publication Date
JPH07128041A true JPH07128041A (en) 1995-05-19

Family

ID=17519983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27287593A Pending JPH07128041A (en) 1993-11-01 1993-11-01 Method for measuring plate thickness

Country Status (1)

Country Link
JP (1) JPH07128041A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009139330A (en) * 2007-12-10 2009-06-25 Anritsu Sanki System Co Ltd X-ray mass measurement device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009139330A (en) * 2007-12-10 2009-06-25 Anritsu Sanki System Co Ltd X-ray mass measurement device

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