JPH07126475A - Styrene resin composition - Google Patents
Styrene resin compositionInfo
- Publication number
- JPH07126475A JPH07126475A JP27536793A JP27536793A JPH07126475A JP H07126475 A JPH07126475 A JP H07126475A JP 27536793 A JP27536793 A JP 27536793A JP 27536793 A JP27536793 A JP 27536793A JP H07126475 A JPH07126475 A JP H07126475A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- component
- rubber
- resin composition
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、スチレン系樹脂組成物
に関するものである。更に詳しくは、本発明は、透明
性、耐衝撃性及び剛性に優れたスチレン系樹脂組成物に
関するものである。FIELD OF THE INVENTION The present invention relates to a styrene resin composition. More specifically, the present invention relates to a styrene resin composition having excellent transparency, impact resistance and rigidity.
【０００２】[0002]
【従来の技術】ポリスチレンは透明性などの外観、剛性
及び成形性に優れ、かつ安価であることから、食品包装
容器などに広く使用されている。ところが、ポリスチレ
ンは、耐衝撃性に劣るという欠点を有している。かかる
欠点を解決する方法として、ポリスチレンにビニル芳香
族化合物及び共役ジエン化合物からなる熱可塑性ブロッ
ク共重合体ゴムをブレンドして用いる技術が知られてい
る（特開昭５４−６２２５１号公報及び特開昭５３−２
５０号公報参照。）。しかしながら、これらの方法にお
いては、透明性、耐衝撃性及び剛性を同時に高い水準に
維持することが困難であるという問題を有していた。2. Description of the Related Art Polystyrene is widely used in food packaging containers because it has excellent appearance such as transparency, rigidity and moldability, and is inexpensive. However, polystyrene has the drawback of being poor in impact resistance. As a method for solving such a drawback, there is known a technique in which polystyrene is blended with a thermoplastic block copolymer rubber composed of a vinyl aromatic compound and a conjugated diene compound (JP-A-54-62251 and JP-A No. 62-251251). Sho 53-2
See Japanese Patent Publication No. 50. ). However, these methods have a problem that it is difficult to maintain transparency, impact resistance and rigidity at a high level at the same time.
【０００３】[0003]
【発明が解決しようとする課題】かかる状況において、
本発明が解決しようとする課題は、透明性、耐衝撃性及
び剛性に優れたスチレン系樹脂組成物を提供する点に存
する。In such a situation,
The problem to be solved by the present invention is to provide a styrene resin composition having excellent transparency, impact resistance and rigidity.
【０００４】[0004]
【課題を解決するための手段】すなわち、本発明は、下
記（Ａ）成分２０〜４５重量％、（Ｂ）成分１〜１５重
量％及び（Ｃ）成分４５〜７０重量％からなるスチレン
系樹脂組成物に係るものである。 （Ａ）：ビニル芳香族化合物６５〜８５重量％及び共役
ジエン化合物３５〜１５重量％からなる熱可塑性ブロッ
ク共重合体樹脂 （Ｂ）：ビニル芳香族化合物１０〜６０重量％及び共役
ジエン化合物９０〜４０重量％からなる熱可塑性ブロッ
ク共重合体ゴム （Ｃ）：ゴム変性スチレン系樹脂（ＨＩＰＳ）を含有す
る樹脂組成物であって、該樹脂組成物中のブタジエン含
有量が２〜１０重量％であり、該ゴム変性スチレン系樹
脂（ＨＩＰＳ）は、マトリックスとしてのスチレン系樹
脂及びゴム状重合体を含有する軟質成分粒子が分散から
なるゴム変性スチレン系樹脂（ＨＩＰＳ）であって、全
軟質成分粒子についての平均粒子径は０．５μ以下であ
り、かつ全軟質成分粒子の６０重量％以上が平均粒子系
０．５μ以下の単一オクルージョン構造を有するもので
ある樹脂組成物[Means for Solving the Problems] That is, the present invention provides a styrene resin comprising 20 to 45% by weight of the following component (A), 1 to 15% by weight of the component (B) and 45 to 70% by weight of the component (C). It relates to the composition. (A): Thermoplastic block copolymer resin consisting of 65 to 85% by weight of vinyl aromatic compound and 35 to 15% by weight of conjugated diene compound (B): 10 to 60% by weight of vinyl aromatic compound and 90 to 90% of conjugated diene compound. 40% by weight of a thermoplastic block copolymer rubber (C): a resin composition containing a rubber-modified styrene resin (HIPS), wherein the content of butadiene in the resin composition is 2 to 10% by weight. The rubber-modified styrenic resin (HIPS) is a rubber-modified styrenic resin (HIPS) in which soft component particles containing a styrene resin as a matrix and a rubber-like polymer are dispersed, and all the soft component particles. Has an average particle size of 0.5μ or less, and 60% by weight or more of all the soft component particles have a single occlusion structure with an average particle size of 0.5μ or less. Resin composition is intended to
【０００５】以下、詳細に説明する。本発明の（Ａ）成
分は、ビニル芳香族化合物６５〜８５重量％及び共役ジ
エン化合物３５〜１５重量％からなる熱可塑性ブロック
共重合体樹脂である。The details will be described below. The component (A) of the present invention is a thermoplastic block copolymer resin composed of 65 to 85% by weight of a vinyl aromatic compound and 35 to 15% by weight of a conjugated diene compound.
【０００６】ビニル芳香族化合物としては、たとえばス
チレン、ｏ−メチルスチレン、ｍ−メチルスチレン、ｐ
−メチルスチレンなどをあげることができる。好ましく
はスチレンである。共役ジエン化合物としては、たとえ
ば１，３−ブタジエン、２−メチル−１，３−ブタジエ
ン、２，３−ジメチル−１，３−ブタジエン、１，３−
ペンタジエンなどをあげることができる。好ましくは
１，３−ブタジエンである。Examples of vinyl aromatic compounds include styrene, o-methyl styrene, m-methyl styrene and p.
-Methyl styrene etc. can be mentioned. Preferred is styrene. Examples of the conjugated diene compound include 1,3-butadiene, 2-methyl-1,3-butadiene, 2,3-dimethyl-1,3-butadiene and 1,3-
Mention may be made of pentadiene. Preferred is 1,3-butadiene.
【０００７】ビニル芳香族化合物と共役ジエン化合物の
含有割合は、ビニル芳香族化合物６５〜８５重量％、好
ましくは７０〜８５重量％であり、共役ジエン化合物３
５〜１５重量％、好ましくは３０〜１５重量％である。The content ratio of the vinyl aromatic compound and the conjugated diene compound is 65 to 85% by weight of the vinyl aromatic compound, preferably 70 to 85% by weight.
It is 5 to 15% by weight, preferably 30 to 15% by weight.
【０００８】（Ａ）成分は、公知の方法により製造で
き、また市販の該当品を利用してもよい。The component (A) can be produced by a known method, or a commercially available product may be used.
【０００９】本発明のスチレン系樹脂組成物中における
（Ａ）成分の含有量は、２０〜４５重量％である。
（Ａ）成分の含有量が過少な場合は透明性に劣り、一方
（Ａ）成分の含有量が過多な場合は剛性に劣る。The content of the component (A) in the styrene resin composition of the present invention is 20 to 45% by weight.
When the content of the component (A) is too small, the transparency is poor, and when the content of the component (A) is too large, the rigidity is poor.
【００１０】本発明の（Ｂ）成分は、ビニル芳香族化合
物１０〜６０重量％及び共役ジエン化合物９０〜４０重
量％からなる熱可塑性ブロック共重合体ゴムである。The component (B) of the present invention is a thermoplastic block copolymer rubber comprising 10 to 60% by weight of a vinyl aromatic compound and 90 to 40% by weight of a conjugated diene compound.
【００１１】ビニル芳香族化合物及び共役ジエン化合物
としては、上記（Ａ）成分について記したものの中から
選ぶことができる。なお、（Ａ）成分と（Ｂ）成分のあ
いだにおいて、同一の化合物を用いてもよく、又は異種
の化合物を用いてもよい。The vinyl aromatic compound and the conjugated diene compound can be selected from those described for the component (A). In addition, between the component (A) and the component (B), the same compound may be used or different compounds may be used.
【００１２】ビニル芳香族化合物と共役ジエン化合物の
含有割合は、ビニル芳香族化合物１０〜６０重量％、好
ましくは２５〜５０重量％であり、共役ジエン化合物９
０〜４０重量％、好ましくは７５〜５０重量％である。The content ratio of the vinyl aromatic compound and the conjugated diene compound is 10 to 60% by weight of the vinyl aromatic compound, preferably 25 to 50% by weight.
It is 0 to 40% by weight, preferably 75 to 50% by weight.
【００１３】（Ｂ）成分は、公知の方法により製造で
き、また市販の該当品を利用してもよい。The component (B) can be produced by a known method, or a commercially available product may be used.
【００１４】本発明のスチレン系樹脂組成物中における
（Ｂ）成分の含有量は、１〜１５重量％、好ましくは３
〜１５重量％である。（Ｂ）成分の含有量が過少な場合
は耐衝撃性に劣り、一方（Ｂ）成分の含有量が過多な場
合は剛性に劣る。The content of the component (B) in the styrene resin composition of the present invention is 1 to 15% by weight, preferably 3%.
~ 15% by weight. If the content of the component (B) is too small, the impact resistance is poor, while if the content of the component (B) is too large, the rigidity is poor.
【００１５】本発明の（Ｃ）成分は、ゴム変性スチレン
系樹脂（ＨＩＰＳ）を含有する樹脂組成物であって、該
樹脂組成物中のブタジエン含有量が２〜１０重量％であ
り、該ゴム変性スチレン系樹脂（ＨＩＰＳ）は、マトリ
ックスとしてのスチレン系樹脂及びゴム状重合体を含有
する軟質成分粒子が分散からなるゴム変性スチレン系樹
脂（ＨＩＰＳ）であって、全軟質成分粒子についての平
均粒子径は０．５μ以下であり、かつ全軟質成分粒子の
６０重量％以上が平均粒子系０．５μ以下の単一オクル
ージョン構造を有するものである樹脂組成物である。The component (C) of the present invention is a resin composition containing a rubber-modified styrene resin (HIPS), wherein the butadiene content in the resin composition is 2 to 10% by weight, and the rubber is The modified styrenic resin (HIPS) is a rubber-modified styrenic resin (HIPS) in which soft component particles containing a styrene resin as a matrix and a rubber-like polymer are dispersed, and an average particle of all soft component particles. The resin composition has a diameter of 0.5 μm or less, and 60% by weight or more of all soft component particles have a single occlusion structure with an average particle size of 0.5 μm or less.
【００１６】（Ｃ）成分中のブタジエン含有量は２〜１
０重量％、好ましくは３〜１０重量％である。該含有量
が過少な場合は耐衝撃性に劣り、一方該含有量が過多な
場合は透明性及び剛性に劣る。なお、該含有量は、ヨウ
素滴定法（高分子分析ハンドブック、日本分析学会及び
高分子分析研究懇談会編、朝倉書店発行、１９８５年、
第２６７〜２６８頁）により、求めることができる。The content of butadiene in the component (C) is 2 to 1
It is 0% by weight, preferably 3 to 10% by weight. If the content is too small, impact resistance is poor, while if the content is too large, transparency and rigidity are poor. The content is determined by the iodometric titration method (polymer analysis handbook, edited by Japan Society for Analytical Science and Polymer Analysis Research Conference, published by Asakura Shoten, 1985,
Pp. 267-268).
【００１７】（Ｃ）成分中には、必須の樹脂として、上
記の条件を満足する特定のゴム変性スチレン系樹脂（Ｈ
ＩＰＳ）が含まれる。すなわち、全軟質成分粒子につい
ての平均粒子径は０．５μ以下、好ましくは０．４μ以
下である。該平均粒子径が過大な場合は透明性に劣る。In the component (C), a specific rubber-modified styrenic resin (H
IPS) is included. That is, the average particle size of all soft component particles is 0.5 μm or less, preferably 0.4 μm or less. If the average particle size is too large, the transparency is poor.
【００１８】また、全軟質成分粒子の６０重量％以上、
好ましくは８０重量％以上は、平均粒子系０．５μ以
下、好ましくは０．４μ以下の単一オクルージョン構造
を有するものでなければならない。上記の含有量が過少
な場合又は平均粒子径が過大な場合は、透明性に劣る。Further, 60% by weight or more of all the soft component particles,
Preferably 80% by weight or more should have a single occlusion structure with an average particle size of 0.5μ or less, preferably 0.4μ or less. If the above content is too small or the average particle size is too large, the transparency is poor.
【００１９】（Ｃ）成分中には、上記のゴム変性スチレ
ン系樹脂（ＨＩＰＳ）に加えて、（Ｃ）成分中のブタジ
エン含有量が前記の条件を満足する範囲において、ゴム
変性されていない、いわゆる汎用ポリスチレン（ＧＰＰ
Ｓ）を含有していてもよい。In the component (C), in addition to the rubber-modified styrenic resin (HIPS) described above, rubber is not modified within a range in which the content of butadiene in the component (C) satisfies the above conditions. So-called general-purpose polystyrene (GPP
S) may be contained.
【００２０】なお、単一オクルージョン構造とは、カプ
セル構造又はコア−シェル構造とも呼ばれ、スチレン系
樹脂からなるコア部分とゴム状重合体からなるシェル部
分で構成された構造を指す。なお、単一オクルージョン
構造以外の構造としては、たとえばゴム状重合体相中に
スチレン系樹脂の小粒子が点在するサラミ構造がある。
これらの軟質成分粒子の構造は、透過型電子顕微鏡を用
いた観察により判定できる。The single occlusion structure is also called a capsule structure or a core-shell structure, and means a structure composed of a core portion made of a styrene resin and a shell portion made of a rubbery polymer. A structure other than the single occlusion structure is, for example, a salami structure in which small particles of a styrene resin are scattered in the rubber-like polymer phase.
The structure of these soft component particles can be determined by observation using a transmission electron microscope.
【００２１】軟質成分粒子の平均粒子径は、以下の方法
により求められる。すなわち、ゴム変性スチレン系樹脂
組成物（ＨＩＰＳ）の透過型電子顕微鏡写真の画像解析
により、単一オクルージョン構造についての粒径
（Ｄi ）とその個数ｎi を求め、式Ｄ＝ｎi Ｄi 4 ／Σ
ｎi Ｄi 3 に従いそれぞれの構造の平均粒径Ｄを求め
る。The average particle size of the soft component particles is determined by the following method. That is, the particle size (D i ) and the number n i of the single occlusion structure are obtained by image analysis of a transmission electron micrograph of the rubber-modified styrene resin composition (HIPS), and the formula D = n i D i 4 / Σ
The average particle diameter D of each structure is determined according to n i D i 3 .
【００２２】本発明のゴム変性スチレン系樹脂（ＨＩＰ
Ｓ）を得る方法として、たとえば重合槽内において、ゴ
ム状重合体の存在下でスチレン系化合物単量体を重合す
る方法を用いることができる。この重合方法としては、
連続塊状重合法、塊状−懸濁二段重合法があげられ、重
合槽としては、完全混合型攪拌重合槽、縦型又は横型の
満液型攪拌重合槽、静的混合型管状重合槽及びこれらの
組合せがあげられる。なお、軟質成分粒子の粒径、粒径
分布、粒子構造の制御は、攪拌速度、重合温度、脱気槽
温度などを調節することにより実施することができる。The rubber-modified styrene resin (HIP
As a method of obtaining S), for example, a method of polymerizing a styrene compound monomer in the presence of a rubbery polymer in a polymerization tank can be used. As this polymerization method,
Examples of the continuous bulk polymerization method, bulk-suspension two-stage polymerization method, as the polymerization tank, a complete mixing stirring polymerization tank, vertical or horizontal full liquid stirring polymerization tank, static mixing tubular polymerization tank and these The combination of The particle size, particle size distribution, and particle structure of the soft component particles can be controlled by adjusting the stirring speed, polymerization temperature, degassing tank temperature, and the like.
【００２３】なお、（Ｃ）成分の一部として汎用ポリス
チレン（ＧＰＰＳ）を併用する場合は、上記のゴム変性
スチレン系樹脂（ＨＩＰＳ）と汎用ポリスレン（ＧＰＰ
Ｓ）を、通常の方法により混合すればよい。When the general-purpose polystyrene (GPPS) is used as a part of the component (C), the rubber-modified styrene resin (HIPS) and the general-purpose polystyrene (GPP) are used.
S) may be mixed by a usual method.
【００２４】本発明のスチレン系樹脂組成物中における
（Ｃ）成分の含有量は、４５〜７０重量％である。
（Ｃ）成分の含有量が過少な場合は剛性に劣り、一方
（Ｃ）成分の含有量が過多な場合は透明性に劣る。The content of the component (C) in the styrene resin composition of the present invention is 45 to 70% by weight.
When the content of the component (C) is too small, the rigidity is poor, while when the content of the component (C) is too large, the transparency is poor.
【００２５】本発明のスチレン系樹脂組成物を得るに
は、上記の（Ａ）〜（Ｃ）成分の所定量を、ヘンシェル
ミキサー、タンブラーなどの混合装置でドライブレンド
するか、一軸又は二軸のスクリュー押出機、バンバリー
ミキサーなどの混練機を用い、１８０〜２６０℃の温度
で十分に加熱混練し、その後造粒すればよい。なお、必
要に応じて、酸化防止剤、熱安定剤、紫外線吸収剤、滑
剤、帯電防止剤、ミネラルオイル、シリコンオイルなど
の添加剤を使用することができる。本発明のスチレン系
樹脂組成物は、一般に使用されている成形機を用いて成
形することができ、成形法としては、たとえばシート押
出成形、真空圧空成形、ブロー成形、射出成形などがあ
げられる。In order to obtain the styrenic resin composition of the present invention, the predetermined amounts of the above-mentioned components (A) to (C) are dry blended with a mixing device such as a Henschel mixer or a tumbler, or uniaxial or biaxial. A kneader such as a screw extruder or a Banbury mixer may be used to sufficiently heat knead at a temperature of 180 to 260 ° C., and then granulate. If necessary, additives such as an antioxidant, a heat stabilizer, an ultraviolet absorber, a lubricant, an antistatic agent, mineral oil and silicone oil can be used. The styrene-based resin composition of the present invention can be molded using a commonly used molding machine, and examples of the molding method include sheet extrusion molding, vacuum pressure molding, blow molding, and injection molding.
【００２６】かくして得られる、本発明のスチレン系樹
脂組成物は、透明性、耐衝撃性及び剛性に優れたもので
あり、かかる優れた特徴を生かして、たとえば各種食品
包装容器などに好適に使用される。The styrene resin composition of the present invention thus obtained is excellent in transparency, impact resistance and rigidity, and by taking advantage of such excellent characteristics, it is suitable for use in, for example, various food packaging containers. To be done.
【００２７】[0027]
【実施例】以下に実施例により本発明を説明する。な
お、測定評価は以下のとおり実施した。EXAMPLES The present invention will be described below with reference to examples. The measurement and evaluation were carried out as follows.
【００２８】（１）透明性（全光線透過率及びヘイズ） ０．３ｍｍ厚の樹脂シートを用い、ＪＩＳ Ｋ６７１４
に準拠して行った。 （２）耐衝撃性（デュポン式衝撃強度） ０．３ｍｍ厚の樹脂シートを０℃の低温恒温槽で２時間
冷却し、ダート先端径１／８インチＲ、受け径３／１６
インチＲの装置を用い、５０％破壊率のエネルギーを測
定した。 （３）剛性（引張り弾性） ０．３ｍｍ厚の樹脂シートを用い、ＪＩＳ Ｋ７１１３
に準拠して測定した。(1) Transparency (total light transmittance and haze) Using a 0.3 mm thick resin sheet, JIS K6714
It was done according to. (2) Impact resistance (DuPont impact strength) A 0.3 mm thick resin sheet is cooled in a low temperature constant temperature bath of 0 ° C. for 2 hours, and the dart tip diameter is 1/8 inch R and the receiving diameter is 3/16.
The energy at 50% failure rate was measured using an inch R device. (3) Rigidity (tensile elasticity) Using a 0.3 mm thick resin sheet, JIS K7113
It was measured according to.
【００２９】実施例１及び比較例１〜９ 表１及び表２に示した成分を、タンブラーで混合した。
得られた樹脂組成物を、６５ｍｍφのシート加工機（田
辺プラスチック機械製、Ｖ６５−Ｓ１０００型）を用
い、樹脂温度２４０℃で押出し、厚さ０．３ｍｍの樹脂
シートを得た。なお、用いたゴム変性スチレン系樹脂
（ＨＩＰＳ）及び汎用ポリスチレン（ＧＰＰＳ）は、塊
状重合法により製造した。Example 1 and Comparative Examples 1-9 The ingredients shown in Tables 1 and 2 were mixed in a tumbler.
The obtained resin composition was extruded at a resin temperature of 240 ° C. using a sheet processing machine having a diameter of 65 mm (V65-S1000, manufactured by Tanabe Plastic Machinery Co., Ltd.) to obtain a resin sheet having a thickness of 0.3 mm. The rubber-modified styrene resin (HIPS) and general-purpose polystyrene (GPPS) used were produced by the bulk polymerization method.
【００３０】結果から次のことが分かる。本発明の条件
を満足する実施例は、すべての評価項目において優れた
結果を示している。一方、（Ａ）成分が過少な比較例１
は透明性に劣る。（Ａ）成分が過多な比較例２は剛性に
劣る。（Ｂ）成分を含有しない比較例３は耐衝撃性に劣
る。（Ｂ）成分が過多な比較例４は剛性に劣る。（Ｃ）
成分が過少な比較例５は剛性に劣る。（Ｃ）成分が過多
な比較例６は透明性に劣る。（Ｃ）成分として必須のゴ
ム変性スチレン系樹脂（ＨＩＰＳ）を含有しない比較例
７は耐衝撃性に劣る。（Ａ）成分及び（Ｂ）成分を含有
しない比較例８及び９は透明性に劣る。The results show the following. The examples satisfying the conditions of the present invention show excellent results in all evaluation items. On the other hand, Comparative Example 1 in which the component (A) is too small
Is less transparent. Comparative Example 2 in which the amount of component (A) is excessive is inferior in rigidity. Comparative Example 3 containing no component (B) is inferior in impact resistance. Comparative Example 4 in which the amount of the component (B) is excessive is inferior in rigidity. (C)
Comparative Example 5 containing too few components is inferior in rigidity. Comparative Example 6 in which the component (C) is excessive is inferior in transparency. Comparative Example 7 containing no essential rubber-modified styrenic resin (HIPS) as the component (C) is inferior in impact resistance. Comparative Examples 8 and 9 not containing the component (A) and the component (B) are inferior in transparency.
【００３１】[0031]
【表１】 −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−− 実施例 比 較 例 1 1 2 3 4 成分 wt% *1 (A) 30 15 50 40 30 (B) 12 15 5 0 20 (C) 58 70 45 60 50 (C) の種類 C1 C2 C3 C4 C5 評価 透明性 全光線透過率 % 82 82 83 83 84 ヘイズ % 9.8 11.6 5.4 10.5 8.2 耐衝撃性 kg-cm/mm 17 10 15 7 20 剛性 kg/cm2 7500 8500 6300 9000 6000 −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−[Table 1] ------------------------------------------ Example Comparison Ratio 1 1 2 3 4 Component wt% * 1 (A) 30 15 50 40 30 (B) 12 15 5 0 20 (C) 58 70 45 60 50 (C) Type C1 C2 C3 C4 C5 Evaluation Transparency Total light transmittance% 82 82 83 83 84 Haze% 9.8 11.6 5.4 10.5 8.2 Impact resistance kg-cm / mm 17 10 15 7 20 Rigidity kg / cm 2 7500 8500 6300 9000 6000 −−−−−−−−−−−−−−−−−−−−−−− −−−−−−−−
【００３２】[0032]
【表２】 −−−−−−−−−−−−−−−−−−−−−−−−−−−−− 比 較 例 5 6 7 8 9 成分 wt% *1 (A) 50 20 40 0 0 (B) 10 5 10 0 0 (C) 40 75 50 100 100 (C) の種類 C6 C7 C8 C9 C10 評価 透明性 全光線透過率 % 84 79 83 67 56 ヘイズ % 3.3 16.2 3.9 43.0 66.9 耐衝撃性 kg-cm/mm 16 16 4 14 16 剛性 kg/cm2 6000 7500 9100 8800 9800 −−−−−−−−−−−−−−−−−−−−−−−−−−−−−[Table 2] −−−−−−−−−−−−−−−−−−−−−−−−−−−−− Comparative Example 5 6 7 8 9 Component wt% * 1 (A) 50 20 40 0 0 (B) 10 5 10 0 0 (C) 40 75 50 100 100 (C) Type C6 C7 C8 C9 C10 Evaluation Transparency Total light transmittance% 84 79 83 67 56 Haze% 3.3 16.2 3.9 43.0 66.9 Impact resistance kg-cm / mm 16 16 4 14 16 Rigidity kg / cm 2 6000 7500 9100 8800 9800 −−−−−−−−−−−−−−−−−−−−−−−−−−−− −−
【００３３】[0033]
【表３】 −−−−−−−−−−−−−−−−−−−−−−−−−−−−− (C) 成 分 C1 C2 C3 C4 C5 構成 *2 HIPS 種類 H1 H1 H1 H1 H1 量 35 40 25 35 40 GPPS 量 23 30 20 25 10 ブタジエン含量 wt% *3 5.4 5.1 5.0 5.2 7.2 −−−−−−−−−−−−−−−−−−−−−−−−−−−−−[Table 3] −−−−−−−−−−−−−−−−−−−−−−−−−−−−− (C) Component C1 C2 C3 C4 C5 Composition * 2 HIPS type H1 H1 H1 H1 H1 amount 35 40 25 35 40 GPPS amount 23 30 20 25 10 Butadiene content wt% * 3 5.4 5.1 5.0 5.2 7.2 −−−−−−−−−−−−−−−−−−−−−−− −−−−−−
【００３４】[0034]
【表４】 −−−−−−−−−−−−−−−−−−−−−−−−−−−−− (C) 成 分 C6 C7 C8 C9 C10 構成 *2 HIPS 種類 H1 H1 H1 H1 H2 量 20 75 0 100 100 GPPS 量 20 0 50 0 0 ブタジエン含量 wt% *3 4.5 9.0 0 9.0 6.7 −−−−−−−−−−−−−−−−−−−−−−−−−−−−−[Table 4] −−−−−−−−−−−−−−−−−−−−−−−−−−−−− (C) Composition C6 C7 C8 C9 C10 Composition * 2 HIPS type H1 H1 H1 H1 H2 amount 20 75 0 100 100 GPPS amount 20 0 50 0 0 Butadiene content wt% * 3 4.5 9.0 0 9.0 6.7 −−−−−−−−−−−−−−−−−−−−−−− −−−−−−
【００３５】＊１ 成分 （Ａ）：スチレン７７重量％及び１，３−ブタジエン２
３重量％からなる熱可塑性ブロック共重合体樹脂 （Ｂ）：スチレン４０重量％及び１，３−ブタジエン６
０重量％からなる熱可塑性ブロック共重合体ゴム （Ｃ）：表２及び３のとおり数値は重量％である* 1 Component (A): 77% by weight of styrene and 2 of 1,3-butadiene
3% by weight of thermoplastic block copolymer resin (B): 40% by weight of styrene and 6 of 1,3-butadiene
Thermoplastic block copolymer rubber (C) consisting of 0% by weight: as shown in Tables 2 and 3, the numerical values are% by weight.
【００３６】＊２ 構成 Ｈ１：ブタジエン含有量が９．０重量％であり、平均粒
子径０．２μの単一オクルージョン構造を有する軟質成
分粒子を含有し、サラミ構造を有する軟質成分粒子を含
有しないゴム変性スチレン系樹脂（ＨＩＰＳ） Ｈ２：ブタジエン含有量が６．７重量％であり、平均粒
子径２．１μのサラミ構造を有する軟質成分粒子を含有
し、単一オクルージョン構造を有する軟質成分粒子を含
有しないゴム変性スチレン系樹脂（ＨＩＰＳ） ＧＰＰＳ：汎用ポリスチレン ＊３ ブタジエン含量：（Ｃ）成分中の含有量（重量
％）* 2 Constitution H1: The content of butadiene is 9.0% by weight, the soft component particles having a single occlusion structure having an average particle diameter of 0.2 μ are contained, and the soft component particles having a salami structure are not contained. Rubber-modified styrenic resin (HIPS) H2: A soft component particle having a single occlusion structure, containing 6.7 wt% butadiene content and containing a soft component particle having a salami structure having an average particle diameter of 2.1 μ. Rubber-modified styrene-based resin (HIPS) that does not contain GPPS: General-purpose polystyrene * 3 Butadiene content: Content in component (C) (% by weight)
【００３７】[0037]
【発明の効果】以上説明したとおり、本発明により、透
明性、耐衝撃性及び剛性に優れたスチレン系樹脂組成物
を提供することができた。As described above, according to the present invention, it is possible to provide a styrene resin composition having excellent transparency, impact resistance and rigidity.
Claims (1)
（Ｂ）成分１〜１５重量％及び（Ｃ）成分４５〜７０重
量％からなるスチレン系樹脂組成物。 （Ａ）：ビニル芳香族化合物６５〜８５重量％及び共役
ジエン化合物３５〜１５重量％からなる熱可塑性ブロッ
ク共重合体樹脂 （Ｂ）：ビニル芳香族化合物１０〜６０重量％及び共役
ジエン化合物９０〜４０重量％からなる熱可塑性ブロッ
ク共重合体ゴム （Ｃ）：ゴム変性スチレン系樹脂（ＨＩＰＳ）を含有す
る樹脂組成物であって、該樹脂組成物中のブタジエン含
有量が２〜１０重量％であり、該ゴム変性スチレン系樹
脂（ＨＩＰＳ）は、マトリックスとしてのスチレン系樹
脂及びゴム状重合体を含有する軟質成分粒子が分散から
なるゴム変性スチレン系樹脂（ＨＩＰＳ）であって、全
軟質成分粒子についての平均粒子径は０．５μ以下であ
り、かつ全軟質成分粒子の６０重量％以上が平均粒子系
０．５μ以下の単一オクルージョン構造を有するもので
ある樹脂組成物1. 20 to 45% by weight of the following component (A),
A styrene resin composition comprising 1 to 15% by weight of the component (B) and 45 to 70% by weight of the component (C). (A): Thermoplastic block copolymer resin consisting of 65 to 85% by weight of vinyl aromatic compound and 35 to 15% by weight of conjugated diene compound (B): 10 to 60% by weight of vinyl aromatic compound and 90 to 90% of conjugated diene compound. 40% by weight of a thermoplastic block copolymer rubber (C): a resin composition containing a rubber-modified styrene resin (HIPS), wherein the content of butadiene in the resin composition is 2 to 10% by weight. The rubber-modified styrenic resin (HIPS) is a rubber-modified styrenic resin (HIPS) in which soft component particles containing a styrene resin as a matrix and a rubber-like polymer are dispersed, and all the soft component particles. Has an average particle size of 0.5μ or less, and 60% by weight or more of all the soft component particles have a single occlusion structure with an average particle size of 0.5μ or less. Resin composition is intended to
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27536793A JP2842176B2 (en) | 1993-11-04 | 1993-11-04 | Styrene resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27536793A JP2842176B2 (en) | 1993-11-04 | 1993-11-04 | Styrene resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07126475A true JPH07126475A (en) | 1995-05-16 |
| JP2842176B2 JP2842176B2 (en) | 1998-12-24 |
Family
ID=17554500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27536793A Expired - Fee Related JP2842176B2 (en) | 1993-11-04 | 1993-11-04 | Styrene resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2842176B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109320890A (en) * | 2017-08-01 | 2019-02-12 | 奇美实业股份有限公司 | Rubber-modified styrene resin composition, process for producing the same, and molded article |
-
1993
- 1993-11-04 JP JP27536793A patent/JP2842176B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109320890A (en) * | 2017-08-01 | 2019-02-12 | 奇美实业股份有限公司 | Rubber-modified styrene resin composition, process for producing the same, and molded article |
| CN109320890B (en) * | 2017-08-01 | 2021-05-04 | 奇美实业股份有限公司 | Rubber-modified styrene resin composition, process for producing the same, and molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2842176B2 (en) | 1998-12-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1238439A (en) | Thermoplastic resin composition | |
| EP0760832B1 (en) | Styrenic polymer resins achieving improved gloss and impact resistance | |
| US5294656A (en) | Rubber modified styrene based resin composition | |
| JP3201206B2 (en) | Rubber-modified styrenic resin composition and molded article thereof | |
| JPH02272050A (en) | Transparent thermoplastic resin composition | |
| JP2842176B2 (en) | Styrene resin composition | |
| JP2842178B2 (en) | Styrene resin composition | |
| US5151464A (en) | Miscible polyblends of acid-and anhydride-containing copolymers | |
| JP2983734B2 (en) | Polystyrene resin film | |
| JP3206356B2 (en) | Extruded body made of styrene resin composition | |
| EP0179941A1 (en) | Transparent blends of polymethylmethacrylate and certain styrene copolymers | |
| KR100769249B1 (en) | Thermoplastic resin composition with good transparence, good impact strength and flow characteristics | |
| DE19743504A1 (en) | High impact strength polystyrene for e.g. office equipment casings | |
| JPH0312098B2 (en) | ||
| JPH0615650B2 (en) | Block copolymer composition | |
| JP3442428B2 (en) | Low temperature shrinkable film | |
| KR100447742B1 (en) | Styrenic Resin Compositions With Low Gloss and High Impact Strength | |
| JP3196315B2 (en) | Rubber modified styrenic resin composition | |
| JPH04277508A (en) | Rubber-modified styrene resin excellent in strength and transparency | |
| JP3130322B2 (en) | Polyacetal resin composition structure and method for forming the same | |
| JP3434854B2 (en) | Extruded molded product | |
| WO2023249088A1 (en) | Resin composition and molded article | |
| JPH061812A (en) | Rubber-modified styrene resin composition and transparent container | |
| KR100524321B1 (en) | Styrenic therpoplastic resin composition | |
| JPH06145443A (en) | Styrenic resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20081023 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20081023 |
|
| RD05 | Notification of revocation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D05 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081023 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 11 Free format text: PAYMENT UNTIL: 20091023 |
|
| LAPS | Cancellation because of no payment of annual fees |