JPH07126412A - Method of preventing conductive substance from falling from end face of conductive molding - Google Patents

Method of preventing conductive substance from falling from end face of conductive molding

Info

Publication number
JPH07126412A
JPH07126412A JP5298925A JP29892593A JPH07126412A JP H07126412 A JPH07126412 A JP H07126412A JP 5298925 A JP5298925 A JP 5298925A JP 29892593 A JP29892593 A JP 29892593A JP H07126412 A JPH07126412 A JP H07126412A
Authority
JP
Japan
Prior art keywords
conductive
face
falling
organic solvent
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5298925A
Other languages
Japanese (ja)
Inventor
Hidemaro Nakamura
秀麿 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JNC Corp
Original Assignee
Chisso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chisso Corp filed Critical Chisso Corp
Priority to JP5298925A priority Critical patent/JPH07126412A/en
Publication of JPH07126412A publication Critical patent/JPH07126412A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To facilitate the transportation and storage of conductive moldings by treating the end faces of the conductive moldings chemically and smoothening the surfaces to prevent the conductive substance from falling from the end faces. CONSTITUTION:The edge faces of conductive moldings such as conductive tapes, films or sheets are brought into contact with an organic solvent dissolving the faces such as methanol to effect chemical treatment, smoothen the surfaces and prevent the conductive substance from falling from the edge surfaces.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は精密電子部品の運搬、保
管に使用される導電性成型品の端面からの導電性物質の
欠落を防止するための端面の処理方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for treating an end face of a conductive molded article used for transporting and storing precision electronic parts so as to prevent the conductive substance from falling off from the end face.

【0002】[0002]

【従来の技術及び発明が解決しょうとする課題】従来、
導電性成型品が精密電子部品の包装材として使用され、
その運搬、保管の際に導電性物質の一部が欠落し、精密
回路に付着することにより、精密回路を短絡させ、ある
いは電子部品を損傷させる事故が発生する場合がある。
そのような導電性物質の欠落は成型品の端面からの場合
が多い。端面は刃物で裁断された面であるため、磨耗や
かえりが発生し、その一部が欠落しやすくなっているた
めであろうと推定されている。そこで欠落しそうな物質
を予め洗浄により除去する方法がとられてきた。しかし
一度洗浄したあとでも、再度端面が擦れた場合には導電
物質が欠落してくる。そのような端面からの導電性物質
の欠落防止方法について、鋭意検討した結果、端面を化
学的に処理する方法が有効であることを見いだし本発明
に到達した。
[Prior Art and Problems to be Solved by the Invention]
Conductive molded products are used as packaging materials for precision electronic parts,
When the conductive material is transported or stored, a part of the conductive material may be lost and adhere to the precision circuit, which may cause an accident that short-circuits the precision circuit or damages electronic components.
The lack of such a conductive material is often from the end surface of the molded product. It is presumed that this is because the end face is a face cut by a blade, and thus wear and burr are generated and a part of the end face is likely to be lost. Therefore, a method has been adopted in which substances that are likely to be lost are removed in advance by washing. However, even after washing once, if the end surface is rubbed again, the conductive material will be lost. As a result of diligent studies on such a method for preventing the loss of the conductive substance from the end surface, the present invention has been found out that a method of chemically treating the end surface is effective.

【0003】[0003]

【課題を解決するための手段】本発明は下記(1)〜
(4)より構成される。 (1)導電性成型品の端面を化学的に処理し、その表面
を平滑化することにより、その端面からの導電性物質の
欠落を防止する方法。 (2)化学的に処理する方法が端面を溶解可能な有機溶
剤と接触させることを特徴とする前項(1)に記載の方
法。 (3)化学的に処理する方法が端面に塗布液を塗布する
ことを特徴とする前項(1)に記載の方法。 (4)導電性成型品が導電性テープ、フィルムもしくは
シートである前項(1)に記載の方法。すなわち、導電
性成型品、好ましくは導電性テープ、フィルムもしくは
シート、の端面を化学的に処理し、その表面を平滑化す
ることにより、その端面から導電性物質の欠落を防止す
る方法である。処理方法としては有機溶剤により端面の
一部を溶解させるか、または塗布液を塗布することが好
ましい。
The present invention provides the following (1) to
It is composed of (4). (1) A method of chemically treating the end surface of a conductive molded article and smoothing the surface to prevent the conductive material from being lost from the end surface. (2) The method according to item (1) above, wherein the chemical treatment method is to bring the end face into contact with a soluble organic solvent. (3) The method according to the above item (1), characterized in that the method of chemically treating is to apply the coating liquid to the end face. (4) The method according to (1) above, wherein the conductive molded article is a conductive tape, film or sheet. That is, it is a method of chemically treating the end surface of a conductive molded product, preferably a conductive tape, film or sheet, and smoothing the surface to prevent the conductive material from being lost from the end surface. As a treatment method, it is preferable to dissolve a part of the end face with an organic solvent or apply a coating liquid.

【0004】ここで導電性成型品とはプラスチック成形
体の静電気の発生を予防することを目的として、カーボ
ンブラック、金属等の導電性物質の粉末をポリ塩化ビニ
ール、ポリエチレン、ポリプロピレン、ポリスチレン等
の高分子化合物に混合し、成形したものを言う。成型法
としては押し出し成形、射出成形、圧縮成形あるいはカ
レンダー成形等が考えられるが特にこだわらない。成型
品の形状は特に限定しないがテープ、フィルムもしくは
シートが好ましい。
Here, the conductive molded product is a powder of a conductive substance such as carbon black or metal for the purpose of preventing the generation of static electricity of a plastic molded product, and is made of a material such as polyvinyl chloride, polyethylene, polypropylene or polystyrene. It is formed by mixing with a molecular compound and molding. As a molding method, extrusion molding, injection molding, compression molding, calender molding and the like can be considered, but the molding method is not particularly limited. The shape of the molded product is not particularly limited, but a tape, film or sheet is preferable.

【0005】本発明で言う化学的に処理すると言うこと
は導電性成型品の端面を溶解可能な有機溶剤で処理する
ことによりその表面状態を変化させることである。これ
は表面に付着している微粒子を除去する物理的洗浄とは
明らかに異なる方法である。その好ましい態様の一つと
して有機溶剤に浸漬し、あるいは有機溶剤を付着させる
こと等による方法で接触させ、その表面に存在する成型
品を構成する高分子化合物の一部を溶解、除去あるいは
再付着させることにより平滑化する方法である。すなわ
ち表面の凹凸の激しい面ほど比表面積が大であるため溶
解性が大であり、凸部は溶解し、もしその溶液を除去し
ないで乾燥すると一旦溶解した高分子化合物は凹部に析
出する。その結果として平滑な面が形成される。ここで
使用される有機溶剤は導電性成型品中の高分子化合物の
種類に応じて、その溶解能を考慮して選択されるべきで
ある。
The term "chemically treating" as used in the present invention means to change the surface state of an electrically conductive molded article by treating the end surface with an organic solvent capable of dissolving the end surface. This is a method distinctly different from physical cleaning, which removes fine particles adhering to the surface. As one of the preferred embodiments, it is contacted by a method such as immersing in an organic solvent or adhering an organic solvent to dissolve, remove or redeposit a part of the polymer compound constituting the molded article existing on the surface. This is a method of smoothing by doing. That is, the more irregular the surface, the larger the specific surface area, and thus the greater the solubility. The convex portion dissolves, and if the solution is dried without removing it, the polymer compound once dissolved precipitates in the concave portion. As a result, a smooth surface is formed. The organic solvent used here should be selected according to the kind of the polymer compound in the electroconductive molded article, taking into consideration its solubility.

【0006】本発明で使用される有機溶剤の具体例とし
て以下の化合物を挙げることができるが必ずしもこれら
に限定されるものではない。メチルアルコール、エチル
アルコール、n−プロピルアルコール、i−プロピルア
ルコール、n−ブチルアルコール、sec−ブチルアル
コール、tert−ブチルアルコール、n−アミルアル
コール、i−アミルアルコール、tert−アミルアル
コール、n−ヘキシルアルコール、シクロヘキサノール
などのアルコール類、ベンゼン、トルエン、キシレン、
アニソール、テトラリン、シクロヘキサン、デカリン等
の芳香族炭化水素類もしくは脂環式化合物類、酢酸エチ
ル、酢酸ブチル等の酢酸エステル類、アセトン、メチル
エチルケトン、メチルーn−プロピルケトン、メチル−
n−ブチルケトン、メチルイソブチルケトン、ジエチル
ケトン、エチル−n−プロピルケトン、ジ−n−プロピ
ルケトン、ジイソプロピルケトン、ジ−n−アミルケト
ン、シクロヘキサノン等のケトン類、テトラヒドロフラ
ン、ジオキサン、2ーメトキシエタノール、2ーエトキ
エタノール、カルビトール、ジグライム、トリグライ
ム、テトラグライム等のエ−テル類、N,N−ジメチル
フォルムアミド、N,N−ジメチルアセトアミド、N−
メチルー2ーピロリドンなどの塩基性化合物等である。
これらの1種以上を適宜選択使用することができる。
The following compounds may be mentioned as specific examples of the organic solvent used in the present invention, but they are not necessarily limited to these. Methyl alcohol, ethyl alcohol, n-propyl alcohol, i-propyl alcohol, n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol, n-amyl alcohol, i-amyl alcohol, tert-amyl alcohol, n-hexyl alcohol , Alcohols such as cyclohexanol, benzene, toluene, xylene,
Aromatic hydrocarbons or alicyclic compounds such as anisole, tetralin, cyclohexane and decalin, acetic acid esters such as ethyl acetate and butyl acetate, acetone, methyl ethyl ketone, methyl-n-propyl ketone, methyl-
Ketones such as n-butyl ketone, methyl isobutyl ketone, diethyl ketone, ethyl-n-propyl ketone, di-n-propyl ketone, diisopropyl ketone, di-n-amyl ketone, cyclohexanone, tetrahydrofuran, dioxane, 2-methoxyethanol, 2 -Ethoxyethanol, carbitol, diglyme, triglyme, tetraglyme and other ethers, N, N-dimethylformamide, N, N-dimethylacetamide, N-
Examples thereof include basic compounds such as methyl-2-pyrrolidone.
One or more of these can be appropriately selected and used.

【0007】前記有機溶剤と導電性成型品の端面を接触
させ、常温乃至溶剤の沸点以下の温度で数分乃至数日保
持することにより、目的を達成することができる。
The object can be achieved by bringing the organic solvent into contact with the end surface of the electroconductive molded article and maintaining the temperature at room temperature to the boiling point of the solvent or lower for several minutes to several days.

【0008】本発明の別の好ましい態様は導電性成型品
の端面に高分子化合物を含む塗布液を塗布し、その表面
を薄膜で覆うことにより平滑化を行う方法である。本発
明でいう塗布液とは樹脂あるいはゴムなどの高分子化合
物、オリゴマー、モノマー等を有機溶媒あるいは水に溶
解または分散させたものである。これらのうち高分子化
合物が好ましく、塩化ビニル系樹脂、アクリル系樹脂、
ポリオレフィン系樹脂、ウレタン系樹脂あるいはNB
R、SBR,天然ゴムが特に好ましい。
Another preferred embodiment of the present invention is a method in which a coating solution containing a polymer compound is applied to the end surface of a conductive molded article, and the surface is covered with a thin film for smoothing. The coating liquid used in the present invention is a solution obtained by dissolving or dispersing a high molecular compound such as resin or rubber, an oligomer, a monomer in an organic solvent or water. Of these, polymer compounds are preferred, vinyl chloride resins, acrylic resins,
Polyolefin resin, urethane resin or NB
R, SBR and natural rubber are particularly preferable.

【0009】塗布液を塗布する方法として公知の方法を
適用することができる。たとえば、ドクターブレードコ
ート法、グラビアロールコート法、エアーナイフコート
法、リバースロールコート法、ディップコート法、カー
テンロールコート法、スプレーコート法、ロッドコート
法、刷毛塗り法などが用いられる。しかし、実質的に端
面に塗布液を塗布できればどのような方法でもよい。塗
布後は必要により、塗布液に含まれる溶媒を風乾、減圧
乾燥あるいは加熱することなどにより乾燥して使用に供
することができる。以下本発明を実施例及び比較例で具
体的に示す。
A known method can be applied as a method for applying the coating liquid. For example, a doctor blade coating method, a gravure roll coating method, an air knife coating method, a reverse roll coating method, a dip coating method, a curtain roll coating method, a spray coating method, a rod coating method, a brush coating method and the like are used. However, any method may be used as long as the coating liquid can be applied to the end surface substantially. After coating, if necessary, the solvent contained in the coating liquid can be dried by air drying, drying under reduced pressure, heating or the like before use. Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples.

【0010】[0010]

【実施例1及び比較例1】ポリ塩化ビニル系樹脂{チッ
ソ(株)製ニポリットSE}100重量部、導電性カー
ボンブラック10重量部、有機錫系安定剤{旭電化
(株)製アデカスタブ465E}3重量部、ワックス系
滑剤{ヘキスト(株)製ワックスOP}1.5重量部及
びブタジエン/スチレン共重合体樹脂系強化剤{三菱レ
イヨン(株)製メタプレンC303}5重量部を混合
し、直径8インチの2本ロールで温度190℃にて5分
混練後、厚さ0.2mmのシートを作製した。このシー
トをスリッターを用いて裁断し、幅30mm、長さ50
cmのテープを作製した。このテープを巻き取り、裁断
面が両側にでる円筒を形成させた。この裁断面に有機溶
剤であるテトラヒドロフランを刷毛で塗布した後室温で
1時間風乾した。この処理断面を走査型電子顕微鏡で観
察したところエッジ部が丸味を帯びた平滑な面であっ
た。この円筒の処理面を下にして、水平面に広げたゼロ
ックス用コピー用紙に軽く擦ったところコピー用紙表面
上に脱離するものは観察されなかった。また、比較例と
して裁断面の未処理面で同様にコピー用紙に軽く擦った
ところコピー用紙の表面が脱離物で黒くなった。
Example 1 and Comparative Example 1 100 parts by weight of polyvinyl chloride resin {Nipolite SE manufactured by Chisso Corporation}, 10 parts by weight of conductive carbon black, organotin stabilizer {Adeka Stub 465E manufactured by Asahi Denka Co., Ltd.} 3 parts by weight, 1.5 parts by weight of a wax-based lubricant {Wax OP manufactured by Hoechst Co., Ltd.} and 5 parts by weight of a butadiene / styrene copolymer resin-based reinforcing agent {metaprene C303 manufactured by Mitsubishi Rayon Co., Ltd.} After kneading at a temperature of 190 ° C. for 5 minutes with an 8-inch two-roll, a sheet having a thickness of 0.2 mm was prepared. This sheet is cut using a slitter, width 30 mm, length 50
cm tape was made. This tape was wound up to form a cylinder having cut surfaces on both sides. Tetrahydrofuran, which is an organic solvent, was applied to the cut surface with a brush and then air-dried at room temperature for 1 hour. When this treated cross section was observed with a scanning electron microscope, the edge was a smooth surface with a rounded edge. When the Xerox copy paper spread on a horizontal surface was lightly rubbed with the treated surface of the cylinder facing downward, no detachment was observed on the copy paper surface. As a comparative example, when the untreated surface of the cut surface was similarly rubbed against the copy paper, the surface of the copy paper became black with detached matter.

【0011】[0011]

【実施例2】実施例1と同様の方法で作製した円筒の未
処理面をアクリル系樹脂(メタクリル酸メチル50重量
%、メタクリル酸ブチル35重量%及びメタクリル酸2
ーヒドロキシエチル15重量%からなり重量平均分子量
80、000である三元共重合体)20重量%、酢酸エ
チル50重量%及びイソプロピルアルコール30重量%
からなる塗布液を刷毛で塗布した後、50℃に保たれた
オーブン中で1時間乾燥させた。この円筒の処理面を下
にして、水平面に広げたゼロックス用コピー用紙に軽く
擦ったところコピー用紙表面上に脱離するものは観察さ
れなかった。
Example 2 An untreated surface of a cylinder produced in the same manner as in Example 1 was coated with an acrylic resin (50% by weight of methyl methacrylate, 35% by weight of butyl methacrylate and 2% of methacrylic acid).
-Terpolymer containing 15% by weight of hydroxyethyl and having a weight average molecular weight of 80,000, 20% by weight, 50% by weight of ethyl acetate and 30% by weight of isopropyl alcohol
The coating liquid consisting of was applied with a brush, and then dried in an oven kept at 50 ° C. for 1 hour. When the Xerox copy paper spread on a horizontal surface was lightly rubbed with the treated surface of the cylinder facing downward, no detachment was observed on the copy paper surface.

【0012】[0012]

【比較例2】実施例1と同様の方法で作製した円筒の未
処理面を水中に浸漬し、軽く数回揺することにより洗浄
した後、50℃に保たれたオーブン中で3時間乾燥させ
た。この洗浄面を下にして同様にコピー用紙に軽く擦っ
たところコピー用紙の表面が脱離物で黒くなった。
[Comparative Example 2] An untreated surface of a cylinder produced by the same method as in Example 1 was immersed in water, gently shaken several times for washing, and then dried in an oven kept at 50 ° C for 3 hours. . When the surface to be washed was faced down and lightly rubbed against the copy paper, the surface of the copy paper became black with detached substances.

【発明の効果】導電性成型品の端面を本発明の方法によ
り処理することにより、端面からの導電性物質の脱離を
防止し、よって、精密電子部品の包装材として使用され
た場合に、その汚染を防止することが可能になり、その
工業的効果は大きい。
EFFECTS OF THE INVENTION By treating the end surface of a conductive molded article by the method of the present invention, it is possible to prevent the conductive material from being detached from the end surface, and thus when used as a packaging material for precision electronic parts, It becomes possible to prevent the pollution, and its industrial effect is great.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 導電性成型品の端面を化学的に処理し、
その表面を平滑化することにより、その端面からの導電
性物質の欠落を防止する方法。
1. A chemically treated end face of a conductive molded article,
A method of preventing the loss of a conductive substance from the end surface by smoothing the surface.
【請求項2】 化学的に処理する方法が端面を溶解可能
な有機溶剤と接触させることを特徴とする請求項1に記
載の方法。
2. The method according to claim 1, wherein the chemical treatment method comprises contacting the end face with a soluble organic solvent.
【請求項3】 化学的に処理する方法が端面に塗布液を
塗布することを特徴とする請求項1に記載の方法。
3. The method according to claim 1, wherein the chemically treating method comprises applying a coating liquid to the end face.
【請求項4】 導電性成型品が導電性テープ、フィルム
もしくはシートである請求項1に記載の方法。
4. The method according to claim 1, wherein the electrically conductive molded article is an electrically conductive tape, film or sheet.
JP5298925A 1993-11-04 1993-11-04 Method of preventing conductive substance from falling from end face of conductive molding Pending JPH07126412A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5298925A JPH07126412A (en) 1993-11-04 1993-11-04 Method of preventing conductive substance from falling from end face of conductive molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5298925A JPH07126412A (en) 1993-11-04 1993-11-04 Method of preventing conductive substance from falling from end face of conductive molding

Publications (1)

Publication Number Publication Date
JPH07126412A true JPH07126412A (en) 1995-05-16

Family

ID=17865966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5298925A Pending JPH07126412A (en) 1993-11-04 1993-11-04 Method of preventing conductive substance from falling from end face of conductive molding

Country Status (1)

Country Link
JP (1) JPH07126412A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007016076A (en) * 2005-07-05 2007-01-25 Lintec Corp Highly smooth film, method for producing the same, sheet for forming protective layer for optical recording medium and optical recording medium
JP2010221433A (en) * 2009-03-19 2010-10-07 Fuji Xerox Co Ltd Method for manufacturing resin film
US8335460B2 (en) 2009-03-19 2012-12-18 Fuji Xerox Co., Ltd Resin film manufacturing method, transfer belt, transfer unit, and image forming apparatus
WO2014156419A1 (en) * 2013-03-28 2014-10-02 旭硝子株式会社 Method for producing pvb member and method for producing laminated glass

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007016076A (en) * 2005-07-05 2007-01-25 Lintec Corp Highly smooth film, method for producing the same, sheet for forming protective layer for optical recording medium and optical recording medium
JP2010221433A (en) * 2009-03-19 2010-10-07 Fuji Xerox Co Ltd Method for manufacturing resin film
US8335460B2 (en) 2009-03-19 2012-12-18 Fuji Xerox Co., Ltd Resin film manufacturing method, transfer belt, transfer unit, and image forming apparatus
WO2014156419A1 (en) * 2013-03-28 2014-10-02 旭硝子株式会社 Method for producing pvb member and method for producing laminated glass

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