JPH07118420B2 - Coil parts - Google Patents
Coil partsInfo
- Publication number
- JPH07118420B2 JPH07118420B2 JP1233240A JP23324089A JPH07118420B2 JP H07118420 B2 JPH07118420 B2 JP H07118420B2 JP 1233240 A JP1233240 A JP 1233240A JP 23324089 A JP23324089 A JP 23324089A JP H07118420 B2 JPH07118420 B2 JP H07118420B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- ferrite powder
- filler
- coil element
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Soft Magnetic Materials (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はフェライト含有樹脂でコイル素子を封止したコ
イル部品に関するものである。TECHNICAL FIELD The present invention relates to a coil component in which a coil element is sealed with a ferrite-containing resin.
従来の技術 近年、各種電子機器や小形化，薄型化に伴う半導体集積
回路の高密度化，多機能化が押し進められる中電子回路
を構成する各種電子部品のチップ化，面実装化が急速に
進展しコイル部品においてもすでに量産化されている。
一般にチップコイルはリフロー半田付，ディップ半田付
などによりプリント配線基板に実装できるように高耐熱
性を有し、また小形でありながら寸法精度が良く高性
能，高信頼性が得られるようにさまざまな樹脂で封止さ
れている。特に最近は高密度実装における他の電子部品
との相互干渉や磁気的結合を防ぐためさらにはより小形
化，特性向上化のため特開昭60−12709号公報に記載さ
れているように磁性材料であるフェライトを混入したフ
ェライト粉体含有樹脂でコイル素子を封止する比率が高
まってきた。2. Description of the Related Art In recent years, various electronic devices and miniaturization and thinning of semiconductor integrated circuits are becoming more dense and multifunctional. The coil components have already been mass-produced.
Generally, the chip coil has high heat resistance so that it can be mounted on the printed wiring board by reflow soldering, dip soldering, etc. In addition, it is compact and has various dimensional accuracy, high performance and high reliability. It is sealed with resin. Particularly, in recent years, in order to prevent mutual interference and magnetic coupling with other electronic parts in high-density mounting, and to further reduce the size and improve the characteristics, magnetic materials as disclosed in JP-A-60-12709 are disclosed. The ratio of encapsulating the coil element with the ferrite powder-containing resin mixed with ferrite has been increasing.
発明が解決しようとする課題 しかし、これらのフェライト粉体含有樹脂は比重が約５
で0.5〜６μｍに粉砕したフェライト微粉のみを比重約
１の樹脂に含有するので樹脂の体積比率が大きくなりフ
ェライト含有樹脂の線膨張係数がコイル素子を構成する
材料の線膨張係数の３倍以上になり、半田付時の熱スト
レスにおける信頼性に問題があった。However, the specific gravity of these ferrite powder-containing resins is about 5
Since only the fine ferrite powder crushed to 0.5 to 6 μm is contained in the resin with a specific gravity of about 1, the volume ratio of the resin is large, and the linear expansion coefficient of the ferrite-containing resin is more than three times the linear expansion coefficient of the material forming the coil element. Therefore, there was a problem in reliability against heat stress during soldering.
また、フェライト粉体が粉砕品であるがゆえに表面が平
滑でなくそれ自体が角ばっているのでコイル素子封止時
の流動性が悪く、また線材への損傷といった問題があっ
た。Further, since the ferrite powder is a crushed product, the surface is not smooth and is itself angular, so that there is a problem in that the fluidity is poor when the coil element is sealed and the wire is damaged.
そこで本発明は球径のフェライト粉体と無機物との混合
物を充填剤とする樹脂でコイル素子を封止することによ
り半田付時の熱ストレスに対する高信頼性とコイル素子
封止時の成形性性能向上を目的とするものである。Therefore, the present invention seals the coil element with a resin containing a mixture of spherical ferrite powder and an inorganic material as a filler, thereby achieving high reliability against thermal stress during soldering and formability during coil element sealing. The purpose is to improve.
課題を解決するための手段 そして上記課題を解決するために本発明は、樹脂に充填
剤を含有した封止樹脂によりコイル素子を封止してお
り、前記充填剤は、球径フェライト粉体と、コイル素子
構成材料の線膨脹係数より小さい線膨脹係数を持った無
機物とからなり、前記充填剤は前記樹脂に対して60〜80
wt％含有し、前記球径フェライトは前記充填剤に対して
60〜90wt％含有し、前記無機物は前記充填剤に対して10
〜40wt％含有した構成としたものである。Means for Solving the Problems And in order to solve the above problems, the present invention seals a coil element with a sealing resin containing a filler, and the filler is a spherical ferrite powder. And a filler having a coefficient of linear expansion smaller than that of the coil element constituent material, wherein the filler is 60 to 80 relative to the resin.
wt%, the spherical ferrite is based on the filler
60 to 90 wt%, the inorganic material is 10% with respect to the filler.
It is configured to contain ~ 40 wt%.
作用 この技術的手段により作用は次のようになる。Action The action is as follows by this technical means.
すなわち球径フェライト粉体とコイル素子の構成材料よ
り小さい線膨張係数を有する無機物を充填剤とするフェ
ライト粉体含有樹脂でコイル素子を封止することにより
コイル部品の半田付時の熱ストレスに対する高信頼性を
確保でき、また、コイル素子封止時の樹脂流動性などの
成形性性能の向上をはかることができるものである。That is, by sealing the coil element with a ferrite powder-containing resin containing an inorganic material having a linear expansion coefficient smaller than that of the spherical ferrite powder and the constituent material of the coil element as a filler, high resistance to thermal stress during soldering of the coil component can be obtained. The reliability can be ensured, and the moldability performance such as resin fluidity at the time of sealing the coil element can be improved.
実施例 以下、本発明の一実施例を添付図面に基づいて説明す
る。第１図の断面図はチップコイルの一例を示しており
１はコイル素子でありドラムコア２と巻線３とから形成
されている。５は同一平面上に相対した一体の金属板端
子であり、前記コイル素子１の巻線３と電気的接続を行
っている。そして、金属板端子５の外部接続用端子部を
残し封止樹脂４でコイル素子１全体をトランスファー成
形法や射出成形法などで封止することによりコイル機構
を有するチップ部品を構成している。封止樹脂４は充填
剤としてフェライト粉体と無機物を含有したエポキシ樹
脂，ジアリルテレフタレート樹脂，不飽和ポリエステル
樹脂などの熱硬化性樹脂やPPS,LCPなど熱可塑性樹脂を
使用する。Embodiment An embodiment of the present invention will be described below with reference to the accompanying drawings. The sectional view of FIG. 1 shows an example of a chip coil, and 1 is a coil element, which is formed of a drum core 2 and a winding 3. Reference numeral 5 is an integrated metal plate terminal facing each other on the same plane, and electrically connected to the winding 3 of the coil element 1. Then, the chip element having a coil mechanism is constructed by sealing the entire coil element 1 with the sealing resin 4 by a transfer molding method or an injection molding method while leaving the external connection terminal portion of the metal plate terminal 5. As the sealing resin 4, a thermosetting resin such as an epoxy resin containing a ferrite powder and an inorganic material as a filler, a diallyl terephthalate resin, an unsaturated polyester resin, or a thermoplastic resin such as PPS or LCP is used.
例えばフェライト粉体含有エポキシ樹脂の場合、耐熱
性，強度，耐湿性の優れたオルソクレゾールノボラック
エポキシ樹脂に球径に造粒，焼成したフェライト粉体と
加熱溶融，粉砕したシリカをミキシングロールなどで加
熱混練，冷却後粉砕して作成する。前記フェライト粉体
含有エポキシ樹脂は球径のフェライト粉体を使用してい
るのでフェライト粉体が角ばっておらずコイル素子１の
封止時の封止樹脂４の流動性が良くコイル素子１の表面
や巻線３への損傷を与えることなく製品信頼性が向上す
る。またコイル素子１を形成しているドラムコア2,巻線
3,金属板端子５の線膨張係数がそれぞれ1.1×10-51/℃,
1.7×10-51/℃,1.7×10-51/℃でありチップコイルの半
田付時の熱ストレスにおける製品信頼性面から封止樹脂
４の線膨張係数がコイル素子１の構成材料に近い方が好
ましく、少くとも２倍以下でなければならない。第１表
にエポキシ樹脂，フェライト粉体溶融シリカの線膨張係
数を示す。For example, in the case of ferrite powder-containing epoxy resin, orthocresol novolac epoxy resin, which has excellent heat resistance, strength, and moisture resistance, is granulated into spherical diameter, fired ferrite powder and heat-melted and crushed silica are heated with a mixing roll. It is made by kneading, cooling and crushing. Since the ferrite powder-containing epoxy resin uses spherical ferrite powder, the ferrite powder is not angular and the sealing resin 4 has good fluidity when the coil element 1 is sealed. Product reliability is improved without damaging the surface or the winding 3. In addition, the drum core 2 forming the coil element 1, the winding
3, the linear expansion coefficient of metal plate terminal 5 is 1.1 × 10 -5 1 / ℃,
1.7 × 10 -5 1 / ° C, 1.7 × 10 -5 1 / ° C. The linear expansion coefficient of the sealing resin 4 is the constituent material of the coil element 1 from the viewpoint of product reliability against thermal stress when soldering the chip coil. It is preferable that they are close to each other, and at least twice or less. Table 1 shows the linear expansion coefficient of epoxy resin and fused silica of ferrite powder.
第１表に示すようにエポキシ樹脂とフェライト粉体と線
膨張係数が大きいので従来のフェライト粉体のみを充填
剤とするフェライト粉体含有樹脂では線膨張係数が大き
くチップコイルのように樹脂とコイル素子の肉厚が薄い
場合、製品の半田付時の急激な熱ストレスで樹脂クラッ
クが生じることがあった。例えばフェライト粉体のみを
65〜80wt％含有したフェライト粉体含有エポキシ樹脂の
線膨張係数は4.2×10-51/℃〜4.7×10-51/℃と大きく28
0℃以上の半田ディップでは樹脂クラックが発生する。
第２表に球径のフェライト粉体と溶融シリカの混合品を
充填剤とした場合のフェライト粉体含有エポキシ樹脂の
線膨張係数を示す。また第２図にはそれらの樹脂で封止
した場合のチップコイルの半田ディップした時の樹脂ク
ラックの発生率を示す。 As shown in Table 1, since the linear expansion coefficient of epoxy resin and ferrite powder is large, the linear expansion coefficient of the conventional ferrite powder-containing resin containing only ferrite powder is large and the resin and coil like chip coils are used. When the element is thin, resin cracks may occur due to rapid thermal stress during soldering of the product. For example, only ferrite powder
The linear expansion coefficient of the epoxy resin containing ferrite powder containing 65 to 80 wt% is 4.2 × 10 -5 1 / ℃ to 4.7 × 10 -5 1 / ℃, which is 28
Resin cracks occur in solder dips above 0 ° C.
Table 2 shows the coefficient of linear expansion of the epoxy resin containing ferrite powder when the filler is a mixture of spherical ferrite powder and fused silica. Further, FIG. 2 shows the rate of occurrence of resin cracks when the chip coil is solder-dipped when sealed with these resins.
一方、コイル素子１の封止時のフェライト粉体含有エポ
キシ樹脂の成形性であるが、従来のように粒径が0.5〜
６μｍの粉砕したフェライト粉体のみを充填剤とした場
合流動性が悪く流動性を示すスパイラルフロー値は含有
量70wt％で45cmしかなく、また、バリ特性を示す10μｍ
厚みのバリフローは2.5mmと大きい。第３表，第４表に
エポキシ樹脂に充填剤として粒径20〜150μｍの球径フ
ェライト粉体と20μｍ以下の無定形のシリカを含有した
場合のスパイラルフローとバリフローの値を示す。 On the other hand, regarding the formability of the epoxy resin containing ferrite powder when the coil element 1 is sealed, the particle size is 0.5 to
When only 6 μm crushed ferrite powder is used as a filler, the fluidity is poor and the fluidity shows a spiral flow value of only 45 cm at a content of 70 wt% and a burr characteristic of 10 μm.
The variflow of thickness is as large as 2.5 mm. Tables 3 and 4 show the values of spiral flow and variflow when epoxy resin contains spherical ferrite powder having a particle size of 20 to 150 μm and amorphous silica of 20 μm or less as a filler.
一般にチップコイル等の面実装部品をプリント配線基板
に実装する時の半田付け温度は240℃から280℃であり、
部分的には290℃に達する場合がある。ゆえに半田ディ
ップでは少くとも290℃で樹脂クラックが発生しないこ
とが必要である。また、コイル素子１を封止する時の封
止樹脂４の成形性よりスパイラルフロー値は50〜80cm、
バリフロー値は1.0mm以下が望ましい。第２表，第２図
の結果および第３表，第４表の結果に示すように製品の
半田付時の熱ストレスに対する信頼性およびコイル素子
１の封止時の封止樹脂４の成形性よりエポキシ樹脂に含
有する充填剤の含有量は60〜80wt％また球径のフェライ
ト粉体と溶融シリカの比率が6:4から9:1がよいことがわ
かる。なお封止樹脂４は半田付時の耐熱性があればエポ
キシ樹脂以外の熱硬化性樹脂やPPSなどの熱可塑性樹脂
でもかまわない。また充填剤に含まれる無機物は線膨張
係数がコイル素子１の構成材料の線膨張係数より小さい
ものであれば例えばアルミナなどでもかまわない。 Generally, the soldering temperature when mounting surface mounting components such as chip coils on a printed wiring board is 240 ° C to 280 ° C.
The temperature may reach 290 ° C partially. Therefore, it is necessary that the solder dip does not cause resin cracks at 290 ° C. Further, the spiral flow value is 50 to 80 cm due to the moldability of the sealing resin 4 when sealing the coil element 1.
A variflow value of 1.0 mm or less is desirable. As shown in the results of Tables 2 and 2 and the results of Tables 3 and 4, the reliability of the product against heat stress during soldering and the moldability of the sealing resin 4 when the coil element 1 is sealed. It can be seen that the content of the filler contained in the epoxy resin is 60 to 80 wt% and the ratio of the spherical ferrite powder to the fused silica is 6: 4 to 9: 1. The sealing resin 4 may be a thermosetting resin other than an epoxy resin or a thermoplastic resin such as PPS as long as it has heat resistance during soldering. The inorganic substance contained in the filler may be, for example, alumina as long as it has a linear expansion coefficient smaller than that of the constituent material of the coil element 1.
発明の効果 以上のように本発明では、60〜90wt％の球径フェライト
粉体とコイル素子の構成材料の線膨張係数より小さい線
膨張係数を持った10〜40wt％の無機物からなる充填剤を
樹脂に対して60〜80wt％含有した封止樹脂によりコイル
素子を封止することにより、コイル部品の半田付時の熱
ストレスに対する高信頼性を確保できるものである。さ
らにはコイル素子の封止時にコイル素子への充填剤のス
トレスを小さくできると同時にフェライト粉体含有エポ
キシ樹脂の成形性性能を向上するという効果が得られ
る。As described above, in the present invention, a filler composed of 60 to 90 wt% of spherical ferrite powder and 10 to 40 wt% of an inorganic material having a linear expansion coefficient smaller than the linear expansion coefficient of the constituent material of the coil element is used. By encapsulating the coil element with the encapsulating resin containing 60 to 80 wt% of the resin, it is possible to ensure high reliability against thermal stress during soldering of the coil component. Further, the stress of the filler on the coil element can be reduced when the coil element is sealed, and at the same time, the effect of improving the moldability performance of the ferrite powder-containing epoxy resin can be obtained.
第１図は本発明のコイル部品の一実施例を示す断面図、
第２図はフェライト粉体と溶融シリカの比率および充填
量を変えたフェライト粉体含有エポキシ樹脂でコイル素
子を封止したチップコイルの半田ディップ時の樹脂クラ
ックの発生率を示す特性図である。 １……コイル素子、２……ドラムコア、３……巻線、４
……封止樹脂、５……金属板端子。FIG. 1 is a sectional view showing an embodiment of the coil component of the present invention,
FIG. 2 is a characteristic diagram showing a resin crack occurrence rate during solder dipping of a chip coil in which a coil element is sealed with a ferrite powder-containing epoxy resin in which the ratio and the filling amount of ferrite powder and fused silica are changed. 1 ... Coil element, 2 ... Drum core, 3 ... Winding, 4
...... Sealing resin, 5 …… Metal plate terminal.
Claims (2)
イル素子を封止しており、前記充填剤は、球径フェライ
ト粉体と、コイル素子構成材料の線膨脹係数より小さい
線膨脹係数を持った無機物とからなり、前記充填剤は前
記樹脂に対して60〜80wt％含有し、前記球径フェライト
は前記充填剤に対して60〜90wt％含有し、前記無機物は
前記充填剤に対して10〜40wt％含有したコイル部品。1. A coil element is sealed with a sealing resin containing a filler in a resin, and the filler is spherical ferrite powder and a linear expansion coefficient smaller than that of the coil element constituent material. The filler contains 60 to 80 wt% with respect to the resin, the spherical ferrite contains 60 to 90 wt% with respect to the filler, the inorganic with respect to the filler Coil parts containing 10 to 40 wt%.
粒径のものと無機物20μｍ以下の無定形のものを用いた
請求項１記載のコイル部品。2. The coil component according to claim 1, wherein the spherical ferrite powder having a particle diameter of 20 to 150 μm and the inorganic material having an amorphous size of 20 μm or less are used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1233240A JPH07118420B2 (en) | 1989-09-08 | 1989-09-08 | Coil parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1233240A JPH07118420B2 (en) | 1989-09-08 | 1989-09-08 | Coil parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0396202A JPH0396202A (en) | 1991-04-22 |
| JPH07118420B2 true JPH07118420B2 (en) | 1995-12-18 |
Family
ID=16951965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1233240A Expired - Fee Related JPH07118420B2 (en) | 1989-09-08 | 1989-09-08 | Coil parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07118420B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09214111A (en) * | 1996-01-30 | 1997-08-15 | Matsushita Electric Ind Co Ltd | Electronic circuit board |
| US6063303A (en) * | 1996-08-21 | 2000-05-16 | Tdk Corporation | Magnetic powder and magnetic molded article |
| US20050007232A1 (en) | 2003-06-12 | 2005-01-13 | Nec Tokin Corporation | Magnetic core and coil component using the same |
| JP4853618B2 (en) * | 2005-11-09 | 2012-01-11 | 戸田工業株式会社 | Spherical composite particle powder for radio wave absorber, production method thereof, and resin composition for semiconductor encapsulation containing the composite particle powder |
| KR100686711B1 (en) * | 2005-12-28 | 2007-02-26 | 주식회사 이수 | Surface mount type power inductor |
| JP5212699B2 (en) * | 2008-03-21 | 2013-06-19 | 横河電機株式会社 | Electropneumatic conversion module and valve positioner equipped with this electropneumatic conversion module |
| JP2012047778A (en) * | 2010-08-24 | 2012-03-08 | Sumitomo Electric Ind Ltd | Method of manufacturing photoelectric conversion module |
| CN104284941B (en) * | 2012-04-26 | 2017-04-12 | 株式会社村田制作所 | Magnetic metal containing resin, and coil component and electronic component, using same |
| JP6715094B2 (en) * | 2016-03-31 | 2020-07-01 | 株式会社トーキン | Reactor |
| JP6722523B2 (en) * | 2016-06-28 | 2020-07-15 | 株式会社トーキン | Reactor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH634167A5 (en) * | 1978-10-10 | 1983-01-14 | Bbc Brown Boveri & Cie | Coil core, especially for high-power inductors |
| JP2600730B2 (en) * | 1987-12-07 | 1997-04-16 | 株式会社村田製作所 | Composite magnetic mold material |
-
1989
- 1989-09-08 JP JP1233240A patent/JPH07118420B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0396202A (en) | 1991-04-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108074878A (en) | Composite magnetic sealing material and use its electronic circuit package body | |
| US6535095B2 (en) | Wound type common mode choke coil | |
| EP2036860B1 (en) | Spherical sintered ferrite particle, semiconductor sealing resin composition making use of the same and semiconductor device obtained therewith | |
| US7477122B2 (en) | Loop type coil parts | |
| US8536684B2 (en) | Method of assembling shielded integrated circuit device | |
| CN107452691A (en) | Electronic circuit package | |
| CN108133912A (en) | Electronic circuit package | |
| JPH07118420B2 (en) | Coil parts | |
| CN108389679A (en) | A kind of inductance element and manufacturing method | |
| CN110034075A (en) | Use the circuit package of conductive molding material | |
| JPH09120926A (en) | High-current thin inductor and manufacture thereof | |
| US20090091412A1 (en) | Coil Integrated Inductor | |
| JPH063770B2 (en) | Chip coil | |
| JP3826898B2 (en) | Electronic component manufacturing method and semiconductor device | |
| US11101062B2 (en) | Coil component | |
| JP2003272927A (en) | Chip inductor and its manufacturing method | |
| JP2600730B2 (en) | Composite magnetic mold material | |
| JPH0410723B2 (en) | ||
| JP2000058336A (en) | Mold structure of electronic component | |
| JPH0738240A (en) | Structure of hybrid integrated circuit device | |
| JP3160775B2 (en) | Inductor and manufacturing method thereof | |
| EP1502930A1 (en) | Epoxy resin of electromagnetic interference suppression and manufacturing method thereof and an inductor applied in the electromagnetic interference suppression | |
| TWI742409B (en) | Inductor and the method to make the same | |
| JP2591013B2 (en) | Inductance element | |
| JPH0262012A (en) | Inductance element and its manufacture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |