JPH07112286A - Method and device for laser beam trimming - Google Patents

Abstract

PURPOSE:To perform homogeneous trimming for every direction by irradiating a wiring pattern after transmitting a lambda/4 polarizing plate with a YAC-SHG laser beam. CONSTITUTION:A resin substrate 100 on which the copper wiring pattern 101 to be formed with a cut groove is formed is first arranged ahead a condenser 9. A laser beam trimming device 1 is then driven. Second harmonics of a YAG laser beam are than generated by a YAG-SHG oscillator 2 and brought out toward an optical system 3. The YAG-SHG laser beam introduced into the optical system 3 is circularly polarized by transmitting the lambda/4 polarizing plate 10 and lastly, the wiring pattern 101 on the resin substrate 100 is irradiated with the laser beam after passing the condenser 9. The directivity in the polarization directivity of the laser beam disappears. Thus, even when the cutting direction for the wiring pattern 101 is changed, the difference is not generated in the cut shape and trimming can be homogenized regardless of the cutting direction and the cut shape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention implements a trimming method for forming a cut groove by a YAG laser on a wiring pattern formed on a resin substrate in order to adjust electrical characteristics such as an oscillation frequency, and a trimming method. The present invention relates to a trimming device used for trimming.

[0002]

2. Description of the Related Art Conventionally, in an electronic component constituting a VCO (voltage controlled oscillator) or the like, a groove formed by cutting a copper wiring pattern formed on a resin substrate with a YAG laser in order to adjust electrical characteristics such as an oscillation frequency. Is formed, the L component of the copper wiring pattern is adjusted, and function trimming is performed. Such function trimming is performed by a trimming device 50 including a YAG-SHG oscillator 51 and an optical system 52, as shown in FIG. That is, the YAG-SHG (linearly polarized) laser light that is the second harmonic of the YAG laser light generated by the YAG-SHG oscillator 51 including the Q switch 53, the YAG rod 54, and the BBO (harmonic conversion crystal) 55. , Expand lens 56, galvanometer 57,
The optical system 52 having the condenser lens 58 is used to guide the copper wiring pattern 101 on the resin substrate 100 and irradiate the copper wiring pattern 101 to form a cut groove.

[0003]

By the way, in the conventional trimming method having such a configuration, the resin substrate 100 is used.
Although it is necessary to form the cut groove only in the copper wiring pattern 101 without damaging the same, etc., it is necessary to accurately control the cut cross section, the cut width, etc. of the cut groove. There is a problem in that variations occur and accurate trimming cannot be performed. This is due to trimming with the second harmonic (YAG-SHG laser light) of the YAG laser light generated by the YAG-SHG oscillator 51. That is,
As shown in each drawing of FIG. 4, the cut groove 102 formed in the copper wiring pattern 101 is set parallel or perpendicular to the polarization direction G of the YAG-SHG laser light formed by the YAG-SHG oscillator 51. ing. Therefore, an angle generated between the wiring pattern and the polarization direction varies depending on the cutting direction, and such an angle variation affects trimming, and particularly when the YAG-SHG laser light is orthogonal to the polarization direction G. In that case, a large difference occurs in the cut cross section and the cut width of the cut groove 102, and it becomes impossible to perform the riming uniformly.

Therefore, it is an object of the present invention to provide a laser trimming method and a laser trimming apparatus capable of performing uniform trimming in any direction.

[0005]

In order to achieve such an object, the laser trimming method according to the first aspect of the present invention is characterized in that after YAG-SHG laser light is transmitted through a λ / 4 deflector, The feature is that the wiring pattern of the resin substrate is irradiated.

The laser trimming method of the second invention is characterized in that the YAG-SHG laser light is transmitted through the λ / 2 deflector and then is irradiated onto the wiring pattern of the resin substrate.

Furthermore, a laser trimming device according to a third aspect of the present invention is a YA that generates YAG-SHG laser light.
The optical system includes a G-SHG oscillator and an optical system that guides YAG-SHG laser light generated by the YAG-SHG oscillator to a wiring pattern formed on a resin substrate.
A feature is that it has a λ / 4 polarizing plate that circularly polarizes the SHG laser light.

Furthermore, a laser trimming device according to a fourth aspect of the present invention is a Y laser device for generating YAG-SHG laser light.
The optical system includes an AG-SHG oscillator and an optical system that guides YAG-SHG laser light generated by the YAG-SHG oscillator to a wiring pattern formed on a resin substrate, and the optical system is YA.
Λ / that changes the polarization direction of G-SHG laser light by 45 °
The feature is that it has two polarizing plates.

[0009]

According to the structures of the first and third aspects of the invention, when transmitted through the λ / 4 polarizing plate, the linearly polarized YAG-SHG laser light becomes circularly polarized and loses its directionality in its polarization direction. Therefore, even if the cutting direction with respect to the wiring pattern is changed, there is no difference in the cut shape.

According to the second and fourth inventions, λ / 2
When transmitted through a polarizing plate, YAG-SHG that is linearly polarized light
The polarization direction of laser light is inclined by 45 °. Therefore, when a plurality of cut grooves are formed in directions orthogonal to each other, the angle formed between the polarization direction of the laser light with which the wiring pattern is irradiated and the cutting direction is 45 ° regardless of the cutting direction. Therefore, there is no difference in the cut shape.

[0011]

EXAMPLES The present invention will be described below based on examples.
FIG. 1 is a configuration diagram of a laser trimming device according to a first embodiment of the present invention. This laser trimming device 1 is a VCO
In an electronic component forming a (voltage controlled oscillator) or the like, the resin substrate 10 is used to adjust electric characteristics such as an oscillation frequency.
A cut groove is formed in the copper wiring pattern 101 formed on the YAG-SHG oscillator 2 and the optical system 3.
It has and. The YAG-SHG oscillator 2 uses the SHG
It generates harmonics of (linearly polarized) laser light, and includes a Q switch 4, a YAG rod 5, and a BBO (harmonic conversion crystal) 6. Optical system 3 is YAG-S
A harmonic of YAG-SHG laser light generated by the HG oscillator 2 is guided to the copper wiring pattern 101 on the resin substrate 100 and irradiated, and the expanded lens 7,
A galvanometer 8 and a condenser lens 9 are provided.
Further, the optical system 3 includes a λ / 4 polarizing plate 10 which is a feature of this embodiment. The λ / 4 polarizing plate 10 is provided on the YAG-SHG oscillator 2 side of the expanding lens 7 on the optical path of the laser light.

Next, a trimming method by the laser trimming device 1 will be described. First, the resin substrate 100 on which the copper wiring pattern 101 in which the cut groove is to be formed is formed is arranged in front of the condenser lens 9. Then, the laser trimming device 1 is driven. Then, the YAG-SHG oscillator 2
Then, the second harmonic of the YAG laser light (YAG-SHG laser light) is generated and guided toward the optical system 3. The YAG-SHG laser light introduced into the optical system 3 is a λ / 4 polarizing plate 10.
Is circularly polarized by passing through the
And the copper wiring pattern 101 on the resin substrate 100 is irradiated with the light. Since the laser light with which the copper wiring pattern 101 is irradiated is circularly polarized by the λ / 4 polarizing plate 10, there is no directivity in the polarization direction. Therefore, there is no difference in the cut shape depending on the cutting direction with respect to the wiring pattern, and uniform trimming can be performed in any direction.

Next, a laser trimming device according to the second embodiment of the present invention will be described. Laser trimming device 2 shown in FIG.
0 is Q switch 4, YAG rod 5, and BBO
YAG-SHG oscillator 2 including (harmonic conversion crystal) 6
And an optical system 3 including an expanding lens 7, a galvanometer 8 and a condenser lens 9, and the basic configuration is the same as that of the first embodiment. The laser trimming device 20 is characterized in that the optical system 3 includes a λ / 2 polarizing plate 21. The λ / 2 polarizing plate 21 is provided on the YAG-SHG oscillator 2 side of the expanding lens 7 on the optical path of the laser light.

Next, a trimming method by the laser trimming device 20 will be described. First, the resin substrate 100 on which the copper wiring pattern 101 in which the cut groove is to be formed is formed is arranged in front of the condenser lens 9. Then, the laser trimming device 20 is driven. Then, the second harmonic (YAG-SHG laser light) of the YAG laser light is generated in the YAG-SHG oscillator 2 and is guided toward the optical system 3. The YAG-SHG laser light introduced into the optical system 3 is transmitted through the λ / 2 polarizing plate 21 so that its polarization direction G is tilted by 45 °, and in that state, it passes through the condenser lens 9 and passes through the resin substrate 100.
The upper copper wiring pattern 101 is irradiated.

Normally, the cut grooves 102 are formed in different wiring patterns or in the same wiring pattern in directions orthogonal to each other, as shown in FIG. Therefore, the angle formed between the polarization direction G ′ of the laser beam applied to the copper wiring pattern 101 after passing through the λ / 2 polarizing plate 21 and the cutting direction is constant at 45 ° regardless of the cutting direction. Will be changed. Therefore, there is no difference in the cut shape depending on the cutting direction, and uniform trimming can be performed in any direction.

In each of the above embodiments, the λ / 4 polarizing plate 10 and the λ / 2 polarizing plate 21 are arranged on the YAG-SHG oscillator 2 side of the expanding lens 7 on the optical path of the laser beam. It is needless to say that the positions where these polarizing plates 10 and 21 are arranged are not limited to such positions, and may be any positions in the optical system 3.

[0017]

As described above, according to the first and third inventions of the present invention, the YA / 4 polarizing plate is made to pass therethrough, so that the YA
Since the G-SHG laser light is circularly polarized, the direction of polarization is lost. Therefore, even if the cutting direction with respect to the wiring pattern is changed, the difference in the cut shape does not occur, and the trimming can be homogenized regardless of the cutting direction and the shape.

According to the second and fourth inventions, λ / 2
Linearly polarized YAG-
Since the polarization direction of the SHG laser light is inclined by 45 °, when forming a plurality of cut grooves in directions orthogonal to each other,
The angle formed between the polarization direction of the laser light applied to the wiring pattern and the cutting direction is 45 ° regardless of the cutting direction, and it is possible to homogenize the trimming regardless of the cutting direction. It was

[Brief description of drawings]

FIG. 1 is a configuration diagram of a trimming device according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram of a trimming device according to a second embodiment of the present invention.

FIG. 3 is a configuration diagram of a conventional trimming device.

FIG. 4 is a plan view showing a relationship between a cutting direction and a polarization direction.

[Explanation of symbols]

 2 YAG-SHG oscillator 3 Optical system 10 λ / 4 polarizing plate 21 λ / 2 polarizing plate

Claims (4)

[Claims] 1. A YAG generated by a YAG-SHG oscillator.
-A laser trimming method of irradiating a wiring pattern formed on a resin substrate with SHG laser light to form a cut groove in the wiring pattern, wherein YAG-SHG laser light is transmitted through a λ / 4 deflection plate. After that, the laser trimming method is characterized in that the wiring pattern is irradiated. 2. A YAG generated by a YAG-SHG oscillator.
A laser trimming method of irradiating a wiring pattern formed on a resin substrate with SHG laser light to form a cut groove in the wiring pattern, wherein YAG-SHG laser light is transmitted through a λ / 2 deflecting plate. After that, the laser trimming method is characterized in that the wiring pattern is irradiated. 3. YA for generating YAG-SHG laser light
A G-SHG oscillator and an optical system for guiding the YAG-SHG laser light generated by the YAG-SHG oscillator to a wiring pattern formed on a resin substrate are provided, and the optical system circularly polarizes the YAG-SHG laser light. λ
A laser trimming device having a / 4 polarizing plate. 4. A YA for generating a YAG-SHG laser beam.
A G-SHG oscillator and an optical system for guiding the YAG-SHG laser light generated by the YAG-SHG oscillator to a wiring pattern formed on a resin substrate are provided, and the optical system changes the polarization direction of the YAG-SHG laser light. 45
A laser trimming device having a λ / 2 polarizing plate for changing the angle.