JPH07111134A - Gas discharge display panel and electrode forming method therefor - Google Patents

Abstract

PURPOSE:To form a thin thickness electrode by utilizing screen printing technique in a surface discharge type PDP. CONSTITUTION:Metal organic paste composed of an organic Au compound, resin, and an organic solvent is printed on a base board 30 and then baked to form surface discharge type PDP sustaining electrodes 34 and 36. When the paste is baked, the organic component of the paste is gasified and so on to disappear from on the base board 30, and Au, the metallic component of the paste, is left on the base board 30 to form the electrodes 34 and 36. The thickness of the electrodes 34 and 36 can be made thinner than in the case of thick film paste usually used in general, consequently improving the performance of the PDP. Moreover the electrodes 34 and 36 can be formed by utilizing screen printing technique to be excellent in mas-productivity.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an AC type gas discharge display panel.

[0002]

2. Description of the Related Art In recent years, a gas discharge display panel which has a thin panel and is capable of forming a large-area display screen has received attention. The gas discharge display panel is roughly classified into a direct current type and an alternating current type according to its driving method. As one of the alternating current type, for example, Reference 1: Technical Report of Television Society
There is a surface discharge type gas discharge display panel disclosed in IDY93-2 (January 1993).

FIG. 13 is a perspective view schematically showing a main structure of a surface discharge type gas discharge display panel disclosed in the above document. In the figure, the front plate and the rear plate are not sealed, and these electrode forming surfaces are opposed to each other.
The hidden lines that complicate the drawings and hinder the understanding of the drawings are omitted.

In the panel shown in the figure, the front plate 10
Sustain electrodes 12 and 14 are provided thereon. The sustain electrodes 12 and 14 are arranged in parallel to form a pair, and a plurality of pairs of sustain electrodes 12 and 14 are provided so as to extend in the first direction P. The sustain electrode 12 includes a transparent electrode 12a and an auxiliary electrode 12b for preventing a voltage drop.
The sustain electrodes 14 are transparent electrodes 14a and auxiliary electrodes 14
b.

Then, the sustain electrodes 12 and 14 are covered with a dielectric 16 and barrier ribs 18 are provided on the dielectric 16. The barrier rib 18 exists between the adjacent display cells and separates the discharge space. Further, the protective film 20 covers the dielectric 16 in the display cell. The protective film 20 allows the dielectric 1
6 spatter is prevented.

On the other hand, on the rear plate 22, the address electrodes 2
4 is provided. A plurality of address electrodes 24 are provided so as to extend in a second direction Q intersecting with the first direction P, and barrier ribs 26 are provided between adjacent address electrodes 24. Further, the phosphor 28 is formed so as to cover the address electrode 24.
To provide.

A voltage is applied to the sustain electrodes 12 and 14 to form a discharge for display light emission, and the address electrode 24 is used to selectively form this discharge. Since the discharge for display light emission is generated in the vicinity of the dielectric layer 16 on the side of the front plate 10, charged particles such as ions generated by this discharge are less likely to collide with the phosphor 28, and therefore the deterioration of the phosphor 28 due to the charged particles can be prevented.

In this conventional surface discharge type gas discharge display panel, the sustain electrodes 12, 14 and the protective film 20 are formed by a thin film forming technique, and the dielectric 16, the barrier ribs 18, 2 are formed.
6 and the address electrode 24 are formed by a thick film printing technique.

[0009]

As described above, the sustain electrodes 12 and 14 are thin film electrodes. In the formation, the electrode material is deposited on the entire surface of the front plate 10 where the electrode is formed by a thin film forming technique. Then, the electrode material is etched to form the sustain electrodes 12 and 14.

Therefore, in order to enlarge the display screen of the gas discharge display panel, a large area front plate 10 is required, and a large vacuum container capable of accommodating the front plate 10 is required. Therefore, the cost of the device used for manufacturing the gas discharge display panel with a large screen display is very high.

Further, although the area of the electrode forming region increases as the display screen of the gas discharge display panel is enlarged,
It is difficult to form a thin film so that the film thickness and film quality are uniform over a large area. As a result, the yield of the sustain electrodes 12 and 14 deteriorates, and the manufacturing cost of the gas discharge display panel increases.

In order to form the sustain electrodes 12 and 14 with high yield, it is advantageous to use the screen printing technique. However, if a thick film paste that has been generally used in the electrode formation of the gas discharge display panel is used, the thickness of the sustain electrodes 12 and 14 becomes thicker, and therefore the surface of the dielectric 16 covering these electrodes is flattened. The laminated thickness must be increased.

The surface of the dielectric 16 must be flattened in order to reduce the bias of the discharge for display light emission or to reduce the variation of the discharge start voltage for each display cell. However, if the thickness of the dielectric 16 is increased, the sustain electrode 12 or 1
4 and the discharge space, the capacitance formed between the discharge space and the discharge space is reduced, so that the electric charges (wall charges) accumulated on the surface of the dielectric 16 are reduced, and as a result, the discharge starting voltage is increased or the luminous efficiency is reduced. Causes problems such as

Since capacitance is also formed between the side surfaces of the sustain electrodes 12 and 14, when the thickness of these electrodes becomes large, the current consumed between the side surfaces of these electrodes (reactive current).
Will increase. Since the current consumed to form the discharge for display light emission is reduced by the increment of the reactive current, the increase of the reactive current becomes a factor to reduce the light emission efficiency.

In order to solve such a problem, the inventors of the present application have made various investigations, and as a paste for forming an electrode thinner than before by using screen printing technology, It was determined that a paste containing an organometallic compound was suitable. By firing the organometallic compound, a conductive metal as an electrode can be produced.

When a paste is printed to form a printed pattern with a fine pitch, in order to reduce the fluidity of the paste so that the pattern shape does not collapse, a paste containing solid components such as conductive particles is used. Is preferred.
Therefore, in addition to the organometallic compound, the paste may contain an appropriate amount of a solid component for enhancing fluidity. However, in order to reduce the thickness of the electrode, it is advantageous to use a paste containing no solid component. However, in this case, the pattern shape is likely to collapse and the electrodes are likely to be short-circuited. Therefore, there is a limit to the miniaturization of the electrode pitch.

In order to solve the above-mentioned conventional problems, an object of the present invention is to provide a gas discharge display panel provided with an electrode that can be formed by using a printing technique and can be made thinner than before, and the electrode thereof. It is to provide a forming method.

More preferably, it is an object of the present invention to provide an electrode forming method for a gas discharge display panel, which can form electrodes with a finer pitch when forming electrodes thinner than before using a printing technique.

[0019]

In order to achieve this object, the gas discharge display panel of the first invention comprises a first and a second gas discharge display panel for forming a gas discharge for display light emission by passing an alternating current into a discharge gas of a display cell. In an AC type gas discharge display panel comprising a second electrode and a wall charge storage dielectric covering the first and second electrodes, the first and second electrodes are formed of a metal organic paste containing an organometallic compound. It is characterized in that the electrode is formed by firing.

The electrode forming method for a gas discharge display panel according to the second aspect of the present invention comprises first and second electrodes for forming a gas discharge for display light emission by applying an alternating current to a discharge gas of a display cell.
In forming an electrode of an AC type gas discharge display panel comprising a wall charge storage dielectric covering these first and second electrodes, a printing technique is used using a metal organic paste containing an organometallic compound. First and second electrodes are formed.

[0021]

According to the first and second inventions, since the first and second electrodes covered with the wall charge storage dielectric are electrodes formed by firing a metal organic paste, the thickness of the electrodes is It is thinner than the thick film electrode generally used in the gas discharge display panel.

Therefore, even if the laminated thickness of the dielectric covering the first and second electrodes is reduced, the surface of the dielectric can be flattened. As a result, the capacitance formed between the first and second electrodes and the discharge space (or discharge gas) can be increased. It is possible to increase the charge accumulated in the.

Moreover, since the metal organic paste can be printed, the electrodes can be formed by using the printing technique, especially the screen printing technique, which is advantageous when producing a gas discharge display panel of a large screen display.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. It should be noted that the drawings are merely schematic representations so that the invention can be understood, and therefore the invention is not limited to the illustrated examples.

FIG. 1 is a perspective view schematically showing the structure of a main part of the gas discharge display panel of the embodiment. In the figure, a back plate as one substrate and a front plate as the other substrate are not sealed, and these electrode formation surfaces are shown to face each other, and hidden lines that complicate the drawing and obstruct understanding of the drawing are shown. Omitted.

The gas discharge display panel of this embodiment is of a surface discharge type, and includes one and the other substrates 30 and 32 arranged to face each other through a discharge space, and the first, second and second substrates provided between these substrates. Three electrodes 34, 36 and 38, and a wall charge storage dielectric 40 covering the first and second electrodes 34 and 36.
With.

The first and second electrodes 34 and 36 are provided for supplying an alternating current to the discharge gas of the display cell to form a gas discharge for display light emission, and a plurality of pairs of the first and second electrodes 3 are provided.
4 and 36 are arranged so as to extend in the first direction P respectively. These electrodes 34 and 36 are electrodes formed by firing a metal organic paste containing an organometallic compound. Further, the third electrode 38 is for selecting a display cell forming a gas discharge for display light emission, and the plurality of third electrodes 38 are arranged in a second direction Q intersecting the first direction P, respectively. Extend and arrange in parallel.

In this embodiment, one of the substrates 30 is used as a back plate, and the first and second electrodes 34 and 36 are provided on the substrate 30.
To provide. Striped first and second electrodes 34 and 3
6 are adjacent to each other to form a pair of electrodes T, and a plurality of pairs of first and second electrodes 34 and 36 are arranged in parallel. The first and second electrodes 34 and 36 are sustain electrodes for generating or maintaining discharge for display light emission.

The dielectric 4 is sequentially formed on the electrodes 34 and 36.
0, a protective film 42 and a barrier rib 44 are provided. The barrier ribs 44 extend in a stripe shape in the first direction P and are arranged so as to be located between the adjacent electrode pairs T when seen in a plan view. By using the MgO film as the protective film 42, not only the sputtering of the dielectric 40 can be prevented but also the discharge starting voltage can be reduced. The barrier ribs 44 are for preventing erroneous discharge.

Further, the other substrate 32 is used as a front plate, and the third electrode 38 and the barrier rib 46 are provided on this substrate 32. The third electrode 38 extends in a stripe shape in a second direction Q orthogonal to the first direction P when seen in a plan view, and a plurality of third electrodes 38 are arranged in parallel. Then, the barrier rib 46 is arranged between the adjacent third electrodes 38. The barrier ribs 46 extend in a stripe shape in the second direction Q. Further, the phosphor 48 is provided on the third electrode 38 separately for each third electrode 38. Three types of phosphors 48 that emit red, green, and blue fluorescence are arranged in a predetermined positional relationship. Third electrode 3
Reference numeral 8 denotes an address electrode, which is used to select a display cell (or pixel) which forms a discharge for display light emission.

Next, the forming process of the first and second electrodes 34 and 36 of this embodiment will be described together with the explanation of the forming process of the gas discharge display panel.

First, the first electrode 34 and the second electrode 36 are formed using a printing technique using a metal organic paste, particularly a screen printing technique.

In this example, a metal organic Au paste A-3725 (hereinafter referred to as "Engelhard") was manufactured.
Simply referred to as Au paste). This Au paste contains an organic Au compound as the organometallic compound. Then, a soda lime glass plate is prepared as the substrate 30, and Au paste is screen-printed on the substrate 30 to form a striped print pattern. A plurality of printing patterns are arranged at the positions where the first and second electrodes are to be formed. After that, these patterns are dried and baked to obtain the Au first electrode 34 and the Au second electrode 36.

The thick film paste used for forming electrodes in a conventional gas discharge display panel usually contains conductive particles and a binder (the binder is generally lead glass),
Therefore, the electrode formed by firing this thick film paste becomes a conductor formed by binding conductive particles with a binder.

On the other hand, it is considered that the Au paste of this embodiment described above is mainly composed of an organic Au compound, a resin and an organic solvent and does not contain solid components such as conductive particles and lead glass. The organic solvent and the organic component of the organic Au compound disappear from the substrate 30 by being gasified by firing, while Au, which is the metal component of the organic Au compound, is
The electrodes 34 and 36 are formed by remaining on the substrate 30 by firing. Therefore, A containing substantially no solid component other than Au
It is considered that the u electrodes 34 and 36 can be formed. Therefore, the thickness of the electrodes 34 and 36 can be made very thin, and the thickness of the electrodes 34 and 36 obtained by firing is, for example, 0.3 to 0.4 μm.
It can be a degree.

Next, a thick film paste containing lead glass as a main component is screen-printed on the first electrode 34 and the second electrode 36, and then the paste is dried and fired to obtain the dielectric 4.
Form 0. In the past, the printing and drying of the thick film paste were repeated a plurality of times to flatten the surface of the dielectric. However, in this embodiment, the drying and printing of the thick film paste is performed to a level that is practically satisfactory. A dielectric 40 having a surface can be formed. Since the electrodes 34 and 36 are thin, it is possible to reduce the number of times of printing and drying required to form the dielectric 40 having a flat surface.

Next, M is formed as a protective film 42 on the dielectric 40.
A gO film is formed. Although the protective film 42 may be formed by a thin film forming technique, it is preferable to form the protective film 42 by using a printing technique, particularly a screen printing technique, when a gas discharge display panel with a large screen display is produced. For example, M
A protective film 42 may be formed by adding a suitable amount of a vehicle for adjusting viscosity and an organic solvent to gO powder and / or MgO precursor to form a paste, and printing, drying and firing this paste. The MgO precursor is a precursor that produces MgO by firing, and as such, magnesium diethoxide, magnesium naphthenate, magnesium octylate, magnesium dimethoxide, magnesium din
-Propoxide, magnesium di i-propoxide, or magnesium di n-butoxide can be exemplified. As a pace for forming the MgO film, a commercially available M
The gO film forming liquid may be mixed with a vehicle and a solvent to form a paste.

Next, a dielectric thick film paste containing lead glass is screen-printed on the protective film 42 to form a striped print pattern. A plurality of print patterns are arranged in parallel at positions where barrier ribs are to be formed. Then, the patterns are dried. When printing and drying are repeated to achieve a predetermined stacking thickness, the print pattern is fired to form the barrier ribs 44, and the panel forming process on the front plate side is completed.

A soda lime glass plate is prepared as the other substrate 32. Then, a Ni thick film paste is printed on the substrate 32 to form a striped print pattern. A plurality of print patterns are arranged in parallel at the positions where the third electrodes are to be formed. After that, these patterns are dried and fired to form the Ni third electrode 38.

Next, a phosphor paste is printed so as to cover the third electrode 38 to form a striped print pattern. A plurality of print patterns are formed separately for each third electrode 38. After that, these patterns are dried and baked to form the phosphor 48.

Next, a dielectric thick film paste containing lead glass is screen-printed on the substrate 32 to form a striped print pattern. A plurality of print patterns are arranged in parallel at positions where barrier ribs are to be formed. Then, the patterns are dried. When printing and drying are repeated to achieve a predetermined stacking thickness, the print pattern is fired to form the barrier ribs 46, and the panel forming process on the back plate side is completed.

When the front plate side and back plate side panel forming steps are completed, the substrates 30 and 32 are made to face each other so that the electrode forming surfaces face each other, and thereafter, the substrates 3 are formed.
Seal 0 and 32. In this way, these substrates 30
A discharge gas is enclosed in the discharge space formed between the gas discharge panel 32 and the discharge space 32 to complete the gas discharge display panel.

Next, an experiment conducted for comparing the discharge characteristics of the example panel and the comparative panels 1 and 2 will be described. These panels are surface discharge type gas discharge display panels having the structure shown in FIG. 1. In the example panel and the comparative panel 1, the materials and thicknesses of the first and second electrodes and the thickness of the dielectric covering these electrodes are set. It was created under the same creation conditions except that it was different. In comparison panels 1 and 2,
The dielectrics were formed under the same conditions except that the forming material was different. Since it is not necessary to display a large screen in this comparative experiment, MgO is laminated by the electron beam evaporation method,
The emitter was formed.

The materials for forming the first and second electrodes were Au paste (A-made by Engelhard Co., Ltd.) described above in the example panel.
3725), and Ag and P in Comparative Panels 1 and 2.
Thick film paste containing alloy particles of d and lead glass (Ag-
Pd alloy thick film paste). The material for forming the dielectric covering these electrodes is a low-dielectric-constant thick-film paste containing lead glass as the main component in the example panel and the comparative panel 1, and a high-quality material containing barium titanate particles and lead glass in the comparative panel 2. It is a dielectric constant thick film paste.

He-5% Xe gas was used as the discharge gas, and this gas was sealed so that the pressure in the discharge space was 500 Torr.

FIG. 2 is a diagram showing a state in the process of forming the first and second electrodes of the embodiment panel. In FIG. 2A, the Au paste is printed once on the substrate, and then the electrode print pattern is dried. Then, the contact of the measuring device was applied to the electrode print pattern side to measure the unevenness state on the electrode print pattern side. The measurement result is shown by the curve IIA. In addition, in FIG. 2B, the electrode printing pattern of FIG. 2A is fired to form the first and second electrodes. Then, the contact of the measuring device is applied to the first and second electrode sides, and the first,
The unevenness on the second electrode side was measured. The measurement result is shown by a curve IIB.

In the figure, e and * e are regions where the first and second electrodes are formed and not formed, E _P S is the surface of the electrode print pattern, SS is the substrate surface, and ES is the electrode obtained by firing. Shows the surface of.

As can be understood from the figure, when the Au paste is used, the thickness of the dried print pattern is 1
Although it is about 7 μm, the thickness of the electrode obtained by firing the printed pattern is about 0.3 to 0.4 μm, and a very thin electrode can be formed.

FIG. 3 is a diagram showing a state in the process of forming a dielectric material covering the first and second electrodes of the embodiment panel. Figure 3
In, the low dielectric constant paste was applied on the first and second electrodes
After printing twice, after that, the unevenness of the dried dielectric printing pattern side was measured. The measurement result is shown by a curve III.

In the figure, d and * d indicate regions where a dielectric is formed and not formed, and D _P S indicates the surface of the dielectric print pattern.

As can be understood from the figure, when the Au paste is used, the height of the irregularities on the surface of the dielectric printing pattern is set to about 2 to 4 μm by printing the low dielectric constant paste once. be able to. This makes it possible to form a dielectric having a flat surface that is practically satisfactory. The thickness of the dielectric obtained by firing after printing once is 8 μm.
It is a degree.

FIG. 4 is a view showing the states of the first and second electrodes of the comparative panel 1. In FIG. 4, the Ag-Pd alloy thick film paste was printed once to form the first and second electrodes, and after that, the unevenness state on the electrode surface side was measured. The measurement result is shown by a curve IV.

When the Ag-Pd thick film paste is used, the first and second electrodes are thick films formed by bonding Ag-Pd alloy particles with lead glass, and the thickness thereof is about 12 μm.

FIG. 5 is a view showing a state in the process of forming a dielectric material covering the first and second electrodes of the comparative panel 1. Figure 5
In (A) and (B), the low-dielectric-constant paste was printed twice, and the unevenness state on the side of the dielectric print pattern that was dried in the first printing and the second printing was measured. The measurement results of the first printing and the second printing are shown by a curve VA in FIG. 5A and a curve VB in FIG. 5B.

As can be understood from the figure, when the Ag-Pd alloy thick film paste is used, the height of the unevenness on the surface of the dielectric print pattern is set to 2 by printing the low dielectric paste twice. It can be about 4 μm. Therefore, it is necessary to print at least twice in order to form a dielectric having a flat surface that is practically satisfactory. The thickness of the dielectric print pattern dried after printing twice is about 40 μm, and the thickness of the dielectric obtained by firing after printing twice is about 25 μm.

FIGS. 6 and 7 are views showing a state in the process of forming a dielectric material covering the first and second electrodes of the comparison panel 2. In these figures, the Ag-Pd alloy thick film paste is printed once to form the first and second electrodes, and then the high dielectric constant thick film paste is printed four times. And the first print,
The concavo-convex state on the side of the dielectric print pattern that was dried at the second time, the third time, and the fourth time was measured. First printing, 2
The results of the third, fourth, and fourth measurements are shown in FIG. 6 (A) as curve VIA, in FIG. 6 (B) as curve VIB, and in FIG. 7 (A).
Shown at VIIA and at curve VIIB in FIG. 7 (B). Since the unevenness of the electrode surface is the same as that of the comparative panel 1, its description is omitted.

As can be understood from the figure, when the high dielectric constant thick film paste is used, the height of the irregularities on the surface of the dielectric printing pattern is 2 to 4 μm by performing printing four times.
It can be a degree. Therefore, it is necessary to print at least four times in order to form a dielectric having a flat surface that is practically satisfactory. The thickness of the dielectric obtained by firing after printing four times is about 62 μm.

In this way, the first and second electrodes and the dielectric material covering these electrodes are formed to complete the example panel and the comparison panels 1 and 2. Then, each completed panel was aged for 5 hours after initial lighting, and after that, discharge characteristics of each panel were measured. These aging and measurement were performed by applying a voltage to the first and second electrodes while the third electrode was grounded. The results summarized for this measurement are shown in Table 1.

As can be understood from Table 1, the discharge start voltage, the discharge sustaining voltage and the reactive current can be reduced by forming the first and second electrodes by using the Au paste containing the organic Au compound.

It is considered that the discharge starting voltage and the discharge sustaining voltage can be reduced by, for example, reducing the thickness of the dielectric material covering the first and second electrodes or increasing the dielectric constant of this dielectric material. . This is because the capacity formed between the first and second electrodes and the discharge space can be increased. However, it is difficult and difficult to form a thin dielectric with a flat surface that is practically satisfactory with the thick-film paste currently used for forming a dielectric with a high dielectric constant. Even then, it is difficult to form a dielectric having a high dielectric constant such that the discharge starting voltage and the discharge sustaining voltage can be reduced. Further, the heating limit of soda lime glass used as a substrate is about 580 ° C., but the firing temperature of the high dielectric constant paste is higher than this, so that an incomplete sintered state can be obtained at a firing temperature of 580 ° C. or less. Therefore, at present, it is advantageous to reduce the thickness of the dielectric.

It is considered that the reactive current can be reduced by, for example, reducing the thickness of the first and second electrodes or lowering the dielectric constant of the dielectric material covering these electrodes. This is because the capacitance formed between the side surfaces of the first and second electrodes can be reduced. Therefore, by reducing the thickness of the first and second electrodes and using a low dielectric constant dielectric,
The reactive current can be effectively reduced.

8 to 10 are sectional views showing the principal part of another example of the electrode forming step. In the above-described embodiments, the first and second electrodes 34 and 36 are formed by using the usual method of screen printing technique. In this case, the pitch of the electrode pair T of the first and second electrodes could be reduced to about 130 μm. However, the print pattern formed by printing the Au paste described above is relatively easy to flow, and thus it is difficult to further reduce the electrode pitch of the first and second electrodes. Therefore, in this example, in order to further miniaturize the electrode pitch, in addition to the screen printing technique, the dry film etching mask forming technique and the sandblasting etching technique are used together to form the first and second electrodes. Is.

First, the metal organic paste 50 is solid-printed on the substrate 30, and then the metal organic paste 50 is fired to form the conductive metal layer 52.

Here, the metal organic paste 5 is used.
0 is Au paste A-3725 manufactured by Engelhard Co., which paste 50 is solid-screen printed,
The entire area where the first and second electrodes are formed is covered with the paste 50 (FIG. 8A). After that, paste 50 is fired to A
The u conductive metal layer 52 is formed (FIG. 8B).

Next, a dry film 54 for forming an etching mask is deposited on the conductive metal layer 52.

Here, the dry film 54 is a dry film resist OSB-200 (film thickness 50 μm) manufactured by Tokyo Ohka Kogyo Co., Ltd., and this film 54 is loaded into a dry laminating apparatus (dry laminator). Then, the dry film 54 is moved to the conductive metal layer 5 by operating the apparatus.
2 (FIG. 8 (C)).

Next, the dry film 54 is exposed and developed to remove the dry film 54 in the electrode non-formation region, and an etching mask 56 made of the dry film 54 remaining in the electrode formation region is formed.

Here, the mask 58 for exposing the dry film is a glass mask having a glass substrate 58a and a light shielding material 58b (FIG. 9 (A)). In the mask 58, the light shielding material 58 is formed on the substrate portion corresponding to the electrode non-forming area.
b is provided to form a light-shielding portion, and the light-transmitting portion is formed without providing the light-shielding material 58b on the substrate portion corresponding to the electrode formation region. Then, the mask 58 is brought into close contact with the dry film 54, and the dry film 54 in the electrode formation region is selectively exposed (FIG. 9B). In the figure, 54a and 54b indicate the exposed and unexposed portions of the dry film 54, and the exposed portions 54a are indicated by dots.

After that, the mask 58 is removed, and a developing solution is sprayed on the dry film 54 to develop the dry film 54 (spray development), and then the dry film 54 is washed and dried. 0.2 as developer
% Na ₂ CO ₃ aqueous solution is used. The exposed portion 54a of the dry film 54 is insoluble in the developer and is not exposed.
Is dissolved in the developing solution, so that the unexposed portion 54a of the electrode non-formed region can be selectively removed. As a result, the etching mask 56 including the exposed portion 54a remaining in the electrode formation region is obtained (FIG. 9C).

Next, the conductive metal layer 5 in the electrode non-forming region is formed through the etching mask 56 by the sandblast method.
2 is etched to form electrodes 34 and 36 made of the conductive metal layer 52 remaining in the electrode formation region.

Here, the substrate 30 on which the etching mask 56 has been formed is attached to a sandblast machine,
After that, an abrasive is sprayed onto the conductive metal layer 52 through the etching mask 56 to selectively remove the conductive metal layer 52 in the electrode non-forming region by etching (FIG. 10).
(A)). The abrasive is SiC particles of particle size # 600.
The conductive metal layer 52 in the electrode formation region is the etching mask 5
Since it is covered with 6, it remains without being removed, and the first and second electrodes 34 and 36 composed of the remaining portion (indicated by reference numeral 52a in the figure) are obtained. Then, the etching mask 56 is removed by using a stripping solution, and then the electrode 3
4, 36 are washed and dried (FIG. 10 (B)). The stripping solution is an organic alkaline solution manufactured by Tokyo Ohka Kogyo Co., Ltd.

In this embodiment, the metal organic paste 50 is fired to form the conductive metal layer 50, and the conductive metal layer 50 is etched by the sandblast method to form the electrodes 34 and 36. Therefore, there is no fear that the printed pattern shape of the paste 50 will be broken and the electrodes 34 and 36 will be short-circuited, and the electrodes 34 and 36 can be formed with a finer electrode pitch. The electrode pitch can be reduced to about 50 μm.

FIG. 11 is a cross-sectional view of essential parts showing an example of forming a diffusion preventing film on the electrode which has been formed. here,
A diffusion preventing coating 60 is formed on the first and second electrodes 34 and 36 that have been formed by electrolytic plating. When the electrodes 34 and 36 containing a conductive component that easily diffuses are formed, for example, when the electrodes 34 and 36 are Au electrodes,
The conductive component may be diffused into the dielectric 40 covering the electrodes 34 and 36 due to heating due to electric discharge when the panel is driven, resulting in a short circuit. Coating 60 to prevent this
Are preferably formed.

Therefore, the electrodes 34 and 3 that have been formed are first formed.
6, a common electrode 62 for energization is connected (see FIG. 11).
(A)). These electrodes are connected at the portion not covered with the dielectric 40. Next, the electrodes 34 and 36 in the portions covered with the dielectric 40 are immersed in the plating bath 64 (FIG. 11B). Next, the electrodes 34 and 36 are energized to form a coating film 66 by electrolytic plating. After that, the electrodes 34 and 36 are taken out of the plating bath 64, and the common electrode 62 is removed to complete the formation of the coating film 66 (Fig. 11 (C)).

Here, a Watt bath is used as the plating bath 64, and a Ni coating 66 having a thickness of about 0.2 μm is formed. Table 2 shows an example of the plating bath composition and plating conditions.

FIG. 12 is a perspective view schematically showing a main part structure of another example of the structure of the gas discharge display panel. In this embodiment, the third electrode 38 and the dielectric 68 are sequentially provided on the substrate 30 as the back plate. Further, the first electrode 34 and the second electrode 36 are provided on the dielectric 68, and the dielectric 40 and the protective film 42 are sequentially provided on the electrodes 34 and 36. Then, the first, second and third electrodes 34, 36 and 38 are electrodes formed by firing a metal organic paste.

The present invention is not limited to the above-mentioned embodiments, and therefore, the shape of each component, the disposition position, the forming material, the numerical conditions and the like can be arbitrarily changed.

For example, the organic metal compound contained in the metal organic paste may be an organic Au (gold) compound or an organic Pt.
It can be a (platinum) compound, an organic Ag (silver) compound, an organic Rh (rhodium) compound, an organic Ir (iridium) compound, an organic Ru (ruthenium) compound, or others. In order to form an electrode having low resistance and oxidation resistance, it is preferable to use an organometallic compound containing a noble metal, particularly Pt or Ag, as a metal component. In addition, the organometallic compound contained in the metal organic paste may be one type or a plurality of types, and a solid component may be added to the metal organic paste to reduce the fluidity of the printed pattern formed by printing the metal organic paste. May be. The addition amount of the solid component may be set to an appropriate amount within the range where the thickness of the electrode can be reduced.

Further, the structure of the gas discharge display panel is not limited to the above-mentioned embodiment, but can be variously modified. For example, in the configuration of FIG. 1, the third electrode 38 may be provided on the phosphor 48, and in the configuration of FIG. 12, the third electrode 38 is provided between the protective film 42 and the barrier rib 44. It is also possible to not provide the dielectric 68 that covers the. Further, the third electrode does not necessarily have to be provided. In this case, the first electrode is provided on one substrate and the second electrode is provided on the other substrate, and the first and second electrodes are arranged so as to intersect in a plan view. It may be placed in.

[0080]

[Table 1]

[0081]

[Table 2]

[0082]

As is apparent from the above description, according to the first and second inventions, the first and second electrodes covered with the wall charge storage dielectric are formed by firing a metal organic paste. Since it is an electrode, the thickness of the electrode can be reduced. Therefore, even if the laminated thickness of the dielectric covering these electrodes is thin, the dielectric surface can be flattened. As a result, the capacity formed between the first and second electrodes and the discharge space (or discharge gas) can be increased, so that the drive voltage and drive power of the AC type gas discharge display panel can be reduced.

Moreover, since the metal organic paste can be printed, the electrodes can be formed by using the printing technique, especially the screen printing technique, and therefore, the gas discharge display panel of the large screen display can be produced at low cost and with good mass productivity.

[Brief description of drawings]

FIG. 1 is a perspective view showing a main configuration of an example panel.

2A to 2B are views for explaining a state of an electrode forming process of an example panel.

FIG. 3 is a diagram for explaining a state of a dielectric forming process of an example panel.

FIG. 4 is a diagram for explaining a state of an electrode forming process of the comparative panel 1.

5A to 5B are views for explaining a state of a dielectric forming process of the comparative panel 1. FIG.

6A to 6B are views for explaining a state of a dielectric forming process of the comparative panel 2. FIG.

7 (A) to 7 (B) are views for explaining a state of a dielectric forming process of the comparative panel 2. FIG.

8A to 8C are process drawings showing another example of the electrode forming process.

9A to 9C are process diagrams showing another example of the electrode forming process.

10A to 10B are process diagrams showing another example of the electrode forming process.

11A to 11C are process drawings showing an example of forming a diffusion preventing film on an electrode that has been formed.

FIG. 12 is a perspective view showing a main configuration of another configuration example of the gas discharge display panel.

FIG. 13 is a perspective view showing a main configuration of a conventional panel.

[Explanation of symbols]

 30: One substrate 32: Other substrate 34: First electrode 36: Second electrode 38: Third electrode 40: Dielectric

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Mitsuro Mita 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd.

Claims (5)

[Claims] 1. A first and a second electrode for forming a gas discharge for display light emission by causing an alternating current to flow in a discharge gas of a display cell, and a wall charge storage dielectric covering the first and second electrodes. A gas discharge display panel comprising: an alternating current type gas discharge display panel, wherein the first and second electrodes are electrodes formed by firing a metal organic paste containing an organometallic compound. 2. The gas discharge display panel according to claim 1, further comprising a third electrode for selecting a display cell for forming a gas discharge for display light emission, wherein a plurality of pairs of first and second electrodes are provided respectively. A surface discharge type gas discharge display panel which is arranged to extend in one direction and has a plurality of third electrodes arranged in parallel so as to extend in a second direction intersecting the first direction, respectively. A gas discharge display panel characterized by the above. 3. A first and a second electrode for forming a gas discharge for display light emission by causing an alternating current to flow in a discharge gas of a display cell, and a wall charge storage dielectric covering the first and second electrodes. In forming an electrode of an AC type gas discharge display panel comprising the above, the first and second electrodes are formed by using a printing technique using a metal organic paste containing an organometallic compound. Method for forming electrodes of gas discharge display panel. 4. The method for forming an electrode of a gas discharge display panel according to claim 3, wherein the metal organic paste is solid-printed on the substrate, and then the metal organic paste is fired to form a conductive metal layer. And a step of depositing a dry film for forming an etching mask on the conductive metal layer, exposing and developing the dry film to remove the dry film in the electrode non-formation region, and dry the film remaining in the electrode formation region. A step of forming an etching mask made of a film, and a sandblasting method is used to etch the conductive metal layer in the electrode non-forming area through the etching mask to form an electrode made of the conductive metal layer remaining in the electrode forming area. The method for forming electrodes of a gas discharge display panel, comprising: 5. The method for forming an electrode of a gas discharge display panel according to claim 3, wherein a film for preventing diffusion is formed on the formed electrode by an electrolytic plating method. Method.