JPH07106739A - Method and device for removing solder ball - Google Patents

Method and device for removing solder ball

Info

Publication number
JPH07106739A
JPH07106739A JP26953393A JP26953393A JPH07106739A JP H07106739 A JPH07106739 A JP H07106739A JP 26953393 A JP26953393 A JP 26953393A JP 26953393 A JP26953393 A JP 26953393A JP H07106739 A JPH07106739 A JP H07106739A
Authority
JP
Japan
Prior art keywords
mounting
mounting surface
substrate
solder
solder ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP26953393A
Other languages
Japanese (ja)
Inventor
Masahiro Ishikawa
石川　　正宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP26953393A priority Critical patent/JPH07106739A/en
Publication of JPH07106739A publication Critical patent/JPH07106739A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Abstract

PURPOSE:To eliminate solder balls at a high elimination factor without giving any damage to a mounting substrate by bringing an adhesive member into contact with the mounting surface of the substrate while the substrate is heated and, at the same time, attracting free solder balls by rolling the adhesive member on the mounting surface. CONSTITUTION:The lead sections 9a of electronic parts 9 are soldered to the mounting surface 2 of a mounting substrate 1. When the soldering is performed, solder balls 8 adhere to the surface 2, with part of the balls 8 adhering to flux parts and the other part to the surface 2 in free states. The mounting surface 2 is heated with a heater 4 to a temperature which is lower than the melting point of the solder, but sufficiently high to soften the flux. Then an attracting device 5 composed of a core member 7 and adhesive layer 6 formed on the external surface of the member 7 is rolled on the mounting surface in the direction shown by the arrow A while the layer 6 is kept in close contact with the surface 2. When the device 5 is rolled, the balls 8 are eliminated from the substrate 1, because they are attracted to the giving any damage to the substrate 1 nor causing any environmental pollution.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は電子部品が実装された実
装基板からハンダボールを除去する方法と、この除去に
使用される除去装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for removing solder balls from a mounting board on which electronic parts are mounted, and a removing device used for this removal.

【０００２】[0002]

【従来の技術】ハンダボールは電子部品を配線基板にハ
ンダ付けにより実装する際にハンダが酸化して、電子部
品のハンダ付け時の加熱温度よりも高い溶融温度を帯び
るようになるため、電子部品の実装後にボール状となっ
て実装基板に付着する。このハンダボールの付着によ
り、実装基板の配線回路がショートしたり、実装基板の
絶縁抵抗が低下するため、ハンダボールを除去する必要
がある。かかるハンダボールの除去として、従来は、実
装基板をブラシで擦ってハンダボールを剥離しエアー吸
引するか、あるいは、実装基板を洗浄液に浸漬してシャ
ワー洗浄することが行われている。2. Description of the Related Art A solder ball oxidizes when an electronic component is mounted on a wiring board by soldering and has a melting temperature higher than the heating temperature at the time of soldering the electronic component. After mounting, it becomes a ball shape and adheres to the mounting substrate. Due to the adhesion of the solder balls, the wiring circuit of the mounting board is short-circuited and the insulation resistance of the mounting board is reduced. Therefore, it is necessary to remove the solder balls. As the removal of such solder balls, conventionally, a mounting substrate is rubbed with a brush to remove the solder balls and air is sucked, or the mounting substrate is immersed in a cleaning liquid to perform shower cleaning.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、従来よ
り行われているブラシによる洗浄は、ブラシにより実装
基板が傷付くと共に、ブラシの毛先の大きさや間隔によ
り狭い場所に付着しているハンダボールが除去できない
問題があった。一方、洗浄液に浸漬するシャワー洗浄で
は、シャワーの圧力調整や流量調整が面倒であり、しか
もハンダの除去率が悪い問題があった。However, in the conventional cleaning with a brush, the mounting board is scratched by the brush, and solder balls attached to a narrow space due to the size and spacing of the brush tips are removed. There was a problem that could not be removed. On the other hand, in the shower cleaning in which the cleaning liquid is immersed, there are problems that the pressure adjustment and the flow rate adjustment of the shower are troublesome and the solder removal rate is poor.

【０００４】本発明は上記事情を考慮してなされたもの
であり、実装基板を傷付けることなく、しかもハンダボ
ールの除去率が高いハンダボールの除去方法および除去
装置を提供することを目的とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a solder ball removing method and a removing device which do not damage the mounting board and have a high solder ball removing rate.

【０００５】[0005]

【課題を解決するための手段および作用】上記目的を達
成するため本発明のハンダボール除去方法は、ハンダの
溶融温度によりも低い温度に実装基板を加熱し、この実
装基板の実装面に粘着部材を接触させ前記実装面に対し
て粘着部材を転接させながらハンダボールを粘着部材に
吸着することを特徴とする。この方法に使用される本発
明のハンダボール除去装置は、ハンダの溶融温度よりも
低い温度に実装基板を加熱する加熱手段と、表面に粘着
層が設けられ当該粘着層が実装基板の実装面に転接する
ように配置された回転可能な吸着装置とを備えているこ
とを特徴とする。また、別の本発明のハンダボール除去
方法は、実装基板を洗浄した後、この実装基板の実装面
に粘着部材を接触させ前記実装面に対して粘着部材を転
接させながらハンダボールを粘着部材に吸着することを
特徴とする。この方法に使用される本発明のハンダボー
ル除去装置は、実装基板を洗浄する洗浄手段と、表面に
粘着層が設けられ当該粘着層が洗浄後の実装基板の実装
面に転接するように配置された回転可能な吸着装置とを
備えていることを特徴とする。In order to achieve the above object, the solder ball removing method of the present invention heats the mounting board to a temperature lower than the melting temperature of the solder, and the adhesive member is mounted on the mounting surface of the mounting board. And the solder ball is attracted to the adhesive member while the adhesive member is brought into contact with the mounting surface to make rolling contact. The solder ball removing apparatus of the present invention used in this method comprises a heating means for heating the mounting board to a temperature lower than the melting temperature of the solder, and an adhesive layer provided on the surface of the mounting layer of the mounting board. And a rotatable suction device arranged so as to be in rolling contact with each other. Another method of removing the solder balls of the present invention is to clean the mounting board, and then contact the mounting surface of the mounting board with the adhesive member to roll the solder ball onto the mounting surface to adhere the solder balls to the mounting surface. It is characterized by being adsorbed on. The solder ball removing apparatus of the present invention used in this method is a cleaning means for cleaning the mounting board, and an adhesive layer is provided on the surface, and the adhesive layer is arranged so as to contact the mounting surface of the mounting board after cleaning. And a rotatable suction device.

【０００６】実装基板を加熱して粘着部材を接触させる
方法では、その加熱により実装基板の実装面に付着して
いるフラックスが軟化する。これによりフラックス部分
に付着しているハンダボールのフラックスに対する密着
力が弱くなり、粘着部材の粘着力によりハンダボールが
吸着されて除去される。In the method of heating the mounting board to bring the adhesive member into contact, the heating softens the flux adhering to the mounting surface of the mounting board. As a result, the adhesion force of the solder balls attached to the flux portion to the flux is weakened, and the solder balls are adsorbed and removed by the adhesive force of the adhesive member.

【０００７】一方、実装基板を洗浄液に接触させる方法
では、洗浄液との接触で実装面に付着しているフラック
スが軟化する。これによりフラックスとハンダボールと
の密着力が弱くなり、粘着部材の粘着力によりハンダボ
ールを吸着して除去することができる。この場合、洗浄
液としては、有機溶剤などの溶剤系洗浄液または準水系
洗浄液が良好である。また、上記いずれの方法により使
用される粘着部材は実装面上の電子部品の大きさ、実装
基板との密着性から１０ｍｍ以上の厚さであることが好
ましい。On the other hand, in the method of bringing the mounting board into contact with the cleaning liquid, the flux adhering to the mounting surface is softened by the contact with the cleaning liquid. As a result, the adhesive force between the flux and the solder ball becomes weak, and the solder ball can be adsorbed and removed by the adhesive force of the adhesive member. In this case, the cleaning liquid is preferably a solvent-based cleaning liquid such as an organic solvent or a semi-aqueous cleaning liquid. In addition, the adhesive member used by any of the above methods preferably has a thickness of 10 mm or more in view of the size of the electronic component on the mounting surface and the adhesiveness with the mounting substrate.

【０００８】[0008]

【実施例１】図１は本発明の実施例１を示し、実装基板
１の実装面２にＩＣ，ＬＳＩ，コンデンサ，抵抗器など
の電子部品９が実装されている。これらの電子部品９は
そのリード部９ａが実装基板１のパッドにハンダ付けさ
れることにより実装される。８は実装基板１の実装面２
に付着したハンダボールであり、一部は実装基板１の実
装面２のフラックス３部分に付着しており、他の一部は
フラックスとの遊離状態で実装基板１の実装面２に付着
している。First Embodiment FIG. 1 shows a first embodiment of the present invention in which an electronic component 9 such as an IC, an LSI, a capacitor or a resistor is mounted on a mounting surface 2 of a mounting board 1. These electronic components 9 are mounted by soldering the lead portions 9a to the pads of the mounting board 1. 8 is a mounting surface 2 of the mounting board 1.
Solder balls attached to the mounting surface 1, part of which is attached to the flux 3 portion of the mounting surface 2 of the mounting substrate 1, and another portion of which is attached to the mounting surface 2 of the mounting substrate 1 in a state of being separated from the flux. There is.

【０００９】このような実装基板１に対して本実施例で
は、加熱手段としてのヒーター４と、円柱形状の吸着装
置５とが配設される。ヒーター４はその給電により発熱
して実装基板１を加熱する。この加熱は電子部品９の実
装に用いたハンダの溶融温度よりも低い温度で、しかも
フラックス３を軟化させることができる温度となるよう
に調整される。かかる温度領域では、電子部品９のリー
ド９ａの実装に用いたハンダが軟化しないが、フラック
ス３を軟化することができると共に、遊離状態のハンダ
ボール８の実装基板１に対する付着力を低下させること
ができる。In this embodiment, a heater 4 as a heating means and a column-shaped adsorption device 5 are provided for such a mounting substrate 1. The heater 4 generates heat due to the power supply and heats the mounting substrate 1. This heating is adjusted to a temperature lower than the melting temperature of the solder used for mounting the electronic component 9 and to a temperature at which the flux 3 can be softened. In such a temperature range, the solder used for mounting the leads 9a of the electronic component 9 does not soften, but the flux 3 can be softened and the adhesive force of the solder balls 8 in the free state to the mounting board 1 can be reduced. it can.

【００１０】吸着装置５は、実装基板１の搬送方向Ａに
対して、ヒーター４よりも下流側に位置するように配設
される。図２はこの吸着装置５を示し、円柱状の芯部材
７の外面の全体に粘着層６が設けられている。芯部材７
はＳＵＳなどのステンレスにより成形されており、ブラ
ケット７ａにより回転自由状態で支持されている。粘着
層６はこの芯部材７の外面全体に１０ｍｍ程度の厚さと
なるように設けられている。この吸着装置５は実装基板
１の実装面２に粘着層６が転接するように配設される。The suction device 5 is arranged downstream of the heater 4 in the transport direction A of the mounting substrate 1. FIG. 2 shows this adsorption device 5, in which an adhesive layer 6 is provided on the entire outer surface of a cylindrical core member 7. Core member 7
Is formed of stainless steel such as SUS, and is supported in a freely rotatable state by a bracket 7a. The adhesive layer 6 is provided on the entire outer surface of the core member 7 so as to have a thickness of about 10 mm. The suction device 5 is arranged such that the adhesive layer 6 is in rolling contact with the mounting surface 2 of the mounting substrate 1.

【００１１】次に本実施例によりハンダボールの除去を
説明する。本実施例において、吸着装置５の粘着層６と
し、ポリアクリル酸ナトリウムが５重量％、カルボキシ
ビニルポリマが９０重量％およびカルボキシメチルセル
ロースナトリウムが５重量％混合されたものを使用す
る。この粘着層６は弾性率が１０8 ｄｙｎ／ｃｍ2 であ
り、またハンダボール８との粘着強度が１０ｋｇ／ｃｍ
以上の粘着力を有している。かかる粘着層６は１０ｍｍ
の厚さとなるように芯部材７の外面に設けられ、吸着装
置５の全体の半径は３０ｍｍとなっている。Next, the removal of the solder balls according to this embodiment will be described. In this embodiment, as the adhesive layer 6 of the adsorption device 5, a mixture of 5% by weight of sodium polyacrylate, 90% by weight of carboxyvinyl polymer and 5% by weight of sodium carboxymethylcellulose is used. The adhesive layer 6 has an elastic modulus of 10 8 dyn / cm 2 and an adhesive strength with the solder balls 8 of 10 kg / cm.
It has the above adhesive strength. The adhesive layer 6 is 10 mm
Is provided on the outer surface of the core member 7 so that the total radius of the adsorption device 5 is 30 mm.

【００１２】まず実装基板１をヒーター４により９０℃
で１２０秒間加熱する。この加熱により実装面２のＷＷ
（ウォータホワイト）ロジン系フラックス３（商品名
「６９ＧＬ−７９ＧＫ」、日本ゲンマ（株）製、軟化点
８０℃）が軟化し、ハンダボール８とフラックス３との
剥離強度が１ｋｇ／ｃｍ以下となる。このように加熱さ
れた実装基板１の実装面２に吸着装置５の粘着層６を密
着させながら、実装基板１を矢印Ａ方向に搬送する。こ
の搬送により吸着装置５が追随回転し、粘着層６が実装
基板１の実装面２に転接する。First, the mounting substrate 1 is heated to 90 ° C. by the heater 4.
For 120 seconds. WW of the mounting surface 2 due to this heating
(Water white) Rosin-based flux 3 (trade name “69GL-79GK”, manufactured by Nippon Genma Co., Ltd., softening point 80 ° C.) is softened, and the peel strength between the solder ball 8 and the flux 3 becomes 1 kg / cm or less. . The mounting substrate 1 is conveyed in the direction of arrow A while the adhesive layer 6 of the suction device 5 is brought into close contact with the mounting surface 2 of the mounting substrate 1 heated in this way. By this conveyance, the suction device 5 is rotated, and the adhesive layer 6 is brought into contact with the mounting surface 2 of the mounting substrate 1.

【００１３】図３はこの状態を示し、吸着装置５の粘着
層６は弾性的に変形しながら実装基板１の実装面２に転
接する。この転接によりハンダボール８は粘着層６に吸
着されて実装基板１から剥離される。一方、電子部品９
はリード部９ａのハンダが軟化していないため、大きな
強度を有し、粘着層６から剥離されることがない。これ
によりハンダボール８だけを除去できると共に、実装基
板１の実装面２を傷付けることもない。FIG. 3 shows this state, in which the adhesive layer 6 of the suction device 5 rolls on the mounting surface 2 of the mounting substrate 1 while elastically deforming. By this rolling contact, the solder ball 8 is adsorbed by the adhesive layer 6 and peeled off from the mounting substrate 1. On the other hand, electronic parts 9
Since the solder of the lead portion 9a is not softened, it has a large strength and is not peeled off from the adhesive layer 6. As a result, only the solder balls 8 can be removed and the mounting surface 2 of the mounting board 1 is not damaged.

【００１４】表１は本実施例によって各種実装基板のハ
ンダボールを除去した除去率を示す。同表においてφは
ハンダボールの直径（ｍｍ）であり、「基板面積」はｉ
ｎｃｈ2 、「ｎ数」は各種基板のサンプル数を示す。ま
た比較例は、馬毛のブラシ繊維を植毛したブラシを使用
してブラシ洗浄すると共に、このブラシ洗浄と吸引圧３
０００ｍｍＡｑによる吸引を組み合わせたものである。Table 1 shows the removal rates after removing the solder balls of various mounting boards according to this embodiment. In the table, φ is the diameter (mm) of the solder ball, and the “board area” is i
nch 2 , “n number” indicates the number of samples of various substrates. In the comparative example, brush cleaning is performed using a brush in which horsehair brush fibers are implanted, and the brush cleaning and suction pressure 3
This is a combination of suction by 000 mmAq.

【００１５】[0015]

【表１】 [Table 1]

【００１６】[0016]

【実施例２】図２は本発明の実施例２を示す。この実施
例では無端状の搬送コンベア１０により実装基板１を矢
印Ｂ方向に搬送しながら、ハンダボールを除去するもの
である。この搬送コンベア１０の搬送路上には洗浄手段
としての洗浄ノズル１１と、回転自由な吸着装置５と、
すすぎ洗浄ノズル１３と、乾燥ノズル１６とが順に配設
される。この場合、乾燥ノズル６は加温ヒーター１４で
加温された温風がブロア１５の駆動により供給されて噴
出する。また、吸着装置５の粘着層６は実施例１と同一
の材質が使用されるが、その厚さは１５ｍｍとなってお
り、吸着装置５全体の回転半径が５０ｍｍとなってい
る。Second Embodiment FIG. 2 shows a second embodiment of the present invention. In this embodiment, the solder balls are removed while the mounting substrate 1 is transported in the direction of arrow B by the endless transport conveyor 10. A cleaning nozzle 11 as a cleaning means, a suction device 5 which can rotate freely, are provided on the transfer path of the transfer conveyor 10.
A rinse washing nozzle 13 and a drying nozzle 16 are sequentially arranged. In this case, the drying nozzle 6 is supplied with the warm air heated by the heating heater 14 by driving the blower 15 and ejects the hot air. The adhesive layer 6 of the adsorption device 5 is made of the same material as in Example 1, but its thickness is 15 mm, and the rotation radius of the entire adsorption device 5 is 50 mm.

【００１７】上記構成において、実装基板１に対する電
子部品の実装に実施例１と同様のＷＷロジン系フラック
スを使用し、洗浄ノズル１１から準水系洗浄液（商品名
「クリンスルー７５０Ｈ」、花王（株）製）を６００秒
間噴射してシャワー洗浄する。この準水系洗浄液による
シャワー洗浄で、フラックスに対するハンダボールの剥
離強度は２ｋｇ／ｃｍ以下となる。この洗浄の後、実装
基板１の実装面２に吸着装置５の粘着層６を密着させ
て、粘着層６を実装基板１に転接する。これにより、実
装基板１の実装面２に付着しているハンダボールが吸着
されて剥離される。その後、すすぎノズル１３から純水
を噴射して、１２０秒間、すすぎ洗浄し、乾燥ノズル１
６から８０℃の温風を６００秒間噴射して乾燥する。こ
れにより実装基板１の実装面２を傷付けることなくハン
ダボールを確実に除去することができる。In the above-mentioned structure, the same WW rosin-based flux as that used in the first embodiment is used for mounting electronic components on the mounting board 1, and the semi-aqueous cleaning liquid (trade name "Clean Through 750H", manufactured by Kao Corporation) is supplied from the cleaning nozzle 11. Manufactured) is sprayed for 600 seconds to perform shower cleaning. By the shower cleaning with this semi-aqueous cleaning liquid, the peel strength of the solder ball against the flux becomes 2 kg / cm or less. After this cleaning, the adhesive layer 6 of the suction device 5 is brought into close contact with the mounting surface 2 of the mounting substrate 1, and the adhesive layer 6 is transferred onto the mounting substrate 1. As a result, the solder balls attached to the mounting surface 2 of the mounting board 1 are adsorbed and separated. Then, pure water is sprayed from the rinse nozzle 13 to rinse and wash for 120 seconds.
A warm air of 6 to 80 ° C. is blown for 600 seconds to dry. As a result, the solder balls can be reliably removed without damaging the mounting surface 2 of the mounting board 1.

【００１８】表２は本実施例によってハンダボールを除
去した除去率を示し、「比較例」、「基板面積」、「ｎ
数」はいずれも実施例１と同様である。Table 2 shows the removal rates after removing the solder balls according to the present embodiment, which are "Comparative Example", "Substrate Area", and "n".
The “number” is the same as that in the first embodiment.

【００１９】[0019]

【表２】 [Table 2]

【００２０】[0020]

【発明の効果】以上のとおり本発明は、加熱または洗浄
によってフラックスを軟化状態とした後、粘着部材の粘
着力でハンダボールを吸着して剥離するため、ハンダボ
ールを確実に除去できると共に、実装基板を傷付けるこ
とがなく、環境を汚染することもない。As described above, according to the present invention, after the flux is softened by heating or washing, the solder balls are adsorbed and separated by the adhesive force of the adhesive member, so that the solder balls can be reliably removed and mounted. It does not damage the substrate and does not pollute the environment.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の実施例１の断面図。FIG. 1 is a sectional view of a first embodiment of the present invention.

【図２】吸着装置の断面図。FIG. 2 is a cross-sectional view of an adsorption device.

【図３】吸着装置の作動を示す断面図。FIG. 3 is a cross-sectional view showing the operation of the adsorption device.

【図４】本発明の実施例２の側面図。FIG. 4 is a side view of the second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

１ 実装基板 ２ 実装面 ４ ヒーター ５ 吸着装置 ６ 粘着層 ８ ハンダボール 1 mounting substrate 2 mounting surface 4 heater 5 adsorption device 6 adhesive layer 8 solder ball

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 ハンダの溶融温度によりも低い温度に実
装基板を加熱し、この実装基板の実装面に粘着部材を接
触させ前記実装面に対して粘着部材を転接させながらハ
ンダボールを粘着部材に吸着することを特徴とするハン
ダボール除去方法。1. A solder ball is adhered to a mounting board by heating the mounting board to a temperature lower than the melting temperature of the solder, contacting the mounting surface of the mounting board with the adhesive member, and rolling the adhesive member onto the mounting surface. A method for removing a solder ball, which comprises adsorbing to a solder ball. 【請求項２】 ハンダの溶融温度よりも低い温度に実装
基板を加熱する加熱手段と、表面に粘着層が設けられ当
該粘着層が実装基板の実装面に転接するように配置され
た回転可能な吸着装置とを備えていることを特徴とする
ハンダボール除去装置。2. A heating means for heating the mounting substrate to a temperature lower than the melting temperature of the solder, and a rotatable adhesive layer provided on the surface so that the adhesive layer rolls on the mounting surface of the mounting substrate. A solder ball removing device comprising: a suction device. 【請求項３】 実装基板を洗浄した後、この実装基板の
実装面に粘着部材を接触させ前記実装面に対して粘着部
材を転接させながらハンダボールを粘着部材に吸着する
ことを特徴とするハンダボール除去方法。3. After cleaning the mounting board, an adhesive member is brought into contact with the mounting surface of the mounting board, and the solder ball is attracted to the adhesive member while rolling the adhesive member against the mounting surface. How to remove solder balls. 【請求項４】 実装基板を洗浄する洗浄手段と、表面に
粘着層が設けられ当該粘着層が洗浄後の実装基板の実装
面に転接するように配置された回転可能な吸着装置とを
備えていることを特徴とするハンダボール除去装置。4. A cleaning means for cleaning a mounting board, and a rotatable suction device provided with an adhesive layer on a surface thereof and arranged so as to be in contact with the mounting surface of the cleaned mounting board. A solder ball removing device characterized by being provided.
JP26953393A 1993-09-30 1993-09-30 Method and device for removing solder ball Withdrawn JPH07106739A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26953393A JPH07106739A (en) 1993-09-30 1993-09-30 Method and device for removing solder ball

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26953393A JPH07106739A (en) 1993-09-30 1993-09-30 Method and device for removing solder ball

Publications (1)

Publication Number Publication Date
JPH07106739A true JPH07106739A (en) 1995-04-21

Family

ID=17473715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26953393A Withdrawn JPH07106739A (en) 1993-09-30 1993-09-30 Method and device for removing solder ball

Country Status (1)

Country Link
JP (1) JPH07106739A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US7342749B2 (en) 2004-07-16 2008-03-11 Hitachi Global Storage Technologies Netherlands B.V. Method of removing lead-free solder from slider pad and magnetic disk drive
US7486480B2 (en) 2005-02-25 2009-02-03 Hitachi Global Storage Technolgies Netherlands B.V. Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US7342749B2 (en) 2004-07-16 2008-03-11 Hitachi Global Storage Technologies Netherlands B.V. Method of removing lead-free solder from slider pad and magnetic disk drive
CN100453191C (en) * 2004-07-16 2009-01-21 日立环球储存科技荷兰有限公司 Method of removing lead-free solder from slider pad and magnetic disk drive
US7486480B2 (en) 2005-02-25 2009-02-03 Hitachi Global Storage Technolgies Netherlands B.V. Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass

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