JPH0698734B2 - Release processing substrate - Google Patents
Release processing substrateInfo
- Publication number
- JPH0698734B2 JPH0698734B2 JP60100123A JP10012385A JPH0698734B2 JP H0698734 B2 JPH0698734 B2 JP H0698734B2 JP 60100123 A JP60100123 A JP 60100123A JP 10012385 A JP10012385 A JP 10012385A JP H0698734 B2 JPH0698734 B2 JP H0698734B2
- Authority
- JP
- Japan
- Prior art keywords
- release
- substrate
- peeling
- film
- peeling force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、表裏面におけるシリコーン系の離形皮膜の架
橋密度を相違させて表裏面における剥離力のバランスを
よくした離形処理基体に関するものである。TECHNICAL FIELD The present invention relates to a release-treated substrate in which the cross-linking densities of a silicone-based release coating on the front and back surfaces are made different so that the release forces on the front and back surfaces are well balanced. .
従来の技術及び問題点 薄葉基材の表裏面にシリコーン系離形処理剤からなる皮
膜を有する例えば粘着テープにおける剥離紙等の離形処
理基体の用途の多様化に伴って、従来の表裏面における
剥離力が実質的に同じタイプのものでは充分にその用途
に対応できないという問題が発生している。粘着テープ
を高速度で巻戻す際に剥離紙の背面側に粘着剤層が残存
する現像やテープ基材と剥離紙との間で剥がれたりする
現象などがその例である。Conventional technology and problems With thin film substrates having a film made of a silicone type release agent on the front and back surfaces, for example There is a problem that the types having substantially the same peeling force cannot be adequately applied to the application. Examples of such phenomena include a phenomenon in which the adhesive layer remains on the back side of the release paper when the pressure-sensitive adhesive tape is rewound at a high speed, and a phenomenon such as peeling between the tape base material and the release paper.
問題点を解決するための手段 本発明者らは、軽剥離から重剥離に及ぶ剥離力あるいは
剥離速度に応じた剥離バランスのコントロール化などの
要求に応じつつ、上記の問題が克服された離形処理基体
を開発するために鋭意研究を重ねた結果、シリコーン系
離形処理剤の硬化皮膜における架橋密度とその剥離力の
速度依存性とに因果性があるという新たな知見をみいだ
した。本発明はこの新知見に基づいてなしたものであ
る。Means for Solving the Problems The present inventors have realized a mold release method in which the above problems have been overcome while meeting the demands such as control of the peeling balance from light peeling to heavy peeling or peeling force according to peeling speed or peeling speed. As a result of intensive studies to develop a treated substrate, a new finding was found that there is a causal relationship between the crosslink density in the cured film of the silicone release treating agent and the speed dependence of its peeling force. The present invention is based on this new finding.
すなわち、本発明は、薄葉基材の表裏面にシリコーン系
離形処理剤からなる、表面変質処理されていない硬化皮
膜を有してなり、かつ表裏面における前記皮膜の架橋密
度が相違して基材表裏での粘着剤層との剥離力の速度依
存性が異なることを特徴とする離形処理基体を提供する
ものである。That is, the present invention comprises a thin-film substrate having a cured coating which is composed of a silicone-based release treatment agent and which has not been subjected to surface alteration treatment on the front and back surfaces, and the cross-linking density of the coating on the front and back surfaces is different. Disclosed is a release-treated substrate characterized in that the speed dependence of the peeling force from the pressure-sensitive adhesive layer on the front and back of the material is different.
本発明において用いられる薄葉基材としては、紙、プラ
スチック、金属箔等の単層物、積層物などからなり厚さ
が通常0.01〜1mmのものをその代表例としてあげること
ができる。Representative examples of the thin leaf substrate used in the present invention include a single layer material such as paper, plastic and metal foil, and a laminated material having a thickness of usually 0.01 to 1 mm.
また、シリコーン系離形処理剤としては市販のポリジメ
チルシロキサン系離形処理剤などで代表されるシリコー
ン系硬化皮膜形成性のものをあげることができる。もち
ろん、プラスチック、ゴム等の剥離力調整剤や充填剤な
どを含有するものなどであってもよい。Further, examples of the silicone-based release treating agent include those capable of forming a silicone-based cured film typified by a commercially available polydimethylsiloxane-based release treating agent. Of course, those containing a peeling force adjusting agent such as plastic or rubber or a filler may be used.
そして、本発明の離形処理基体は、薄葉基材の表裏面に
シリコーン系離形処理剤からなる硬化皮膜を、それらの
架橋密度が異なるように、好ましくは10％以上の架橋密
度差となるように、しかも電子線等の電離性放射線で硬
化皮膜の表面を変質処理して剥離特性を変化させること
なく設けたものである。これにより離形処理基体の表裏
面における剥離力の速度依存性に差異が生じることとな
る。一般にその剥離力の速度依存性は、架橋密度が高く
なるほど小さくなる傾向にある。なお、前記において硬
化皮膜を電離性放射線で表面処理して変質させた場合に
は剥離特性が変化して架橋密度差による前記の作用効果
が阻害され、目的の達成が困難となる。該皮膜の形成厚
さとしては特に限定はなく、従来と同様の厚さで本発明
の目的を達成しうる。具体的には0.1〜100μｍの厚さが
一般的である。The release-treated substrate of the present invention has a cured coating made of a silicone-based release treating agent on the front and back surfaces of a thin-film substrate so that the crosslinking densities of the cured coatings are different, and the difference in crosslinking density is preferably 10% or more. As described above, the surface of the cured film is modified by the ionizing radiation such as the electron beam without changing the peeling property. This causes a difference in the speed dependence of the peeling force on the front and back surfaces of the release-treated substrate. Generally, the speed dependence of the peeling force tends to decrease as the crosslinking density increases. In the above, when the cured film is surface-treated with ionizing radiation to be modified, the peeling property is changed and the above-mentioned effects due to the difference in cross-linking density are impaired, making it difficult to achieve the object. The formation thickness of the film is not particularly limited, and the object of the present invention can be achieved with the same thickness as the conventional one. Specifically, a thickness of 0.1 to 100 μm is generally used.
発明の効果 本発明によれば、表裏面におけるシリコーン系の離形皮
膜の架橋密度を相違させたのが、その表裏面における剥
離力の速度依存性が異なる離形処理基体を得ることがで
きる。その結果、用途に対応した表裏面における剥離力
のバランスを有する離形処理基体の形成が可能となり、
剥離紙の背面側に粘着剤層が残存すること、テープ基材
と剥離紙との間で剥れることなどを有効に防止すること
ができる。EFFECTS OF THE INVENTION According to the present invention, although the cross-linking densities of the silicone-based release coatings on the front and back surfaces are different, it is possible to obtain a release-treated substrate in which the speed dependence of the peeling force on the front and back surfaces is different. As a result, it becomes possible to form a release-treated substrate having a balance of the peeling force on the front and back surfaces corresponding to the application,
It is possible to effectively prevent the pressure-sensitive adhesive layer from remaining on the back side of the release paper and peeling between the tape base material and the release paper.
実 施 例 70g/m2の晒しクラフト紙の片面にポリジメチルシロキサ
ン系離形処理剤の塗布加熱処理層からなる厚さ１μｍ、
架橋密度５×10-5mol/gの硬化皮膜を、他面に前記と同
系の処理剤の塗布加熱処理層からなる厚さ１μｍ、架橋
密度0.1×10-5mol/gの硬化皮膜を設けて剥離紙を得た。Example 1 A surface of 70 g / m 2 bleached kraft paper was coated with a polydimethylsiloxane release agent on one side, and the heat treatment layer was 1 μm thick.
A cured film with a cross-linking density of 5 × 10 -5 mol / g and a cured film with a cross-linking density of 0.1 × 10 -5 mol / g with a thickness of 1 μm consisting of a coating and heat treatment layer of the same type of treatment agent as above are provided on the other surface. To obtain release paper.
この剥離紙における低架橋密度側の硬化皮膜上に天然ゴ
ム系感圧接着剤を乾燥後の厚みが0.06mmとなるように塗
布して乾燥させ、これをロール状に回巻した。ついで、
その回巻物を３〜100m/分の速度で巻戻したところ良好
な巻戻し性を示し、テープと剥離紙との間の分離は生じ
なかった。A natural rubber pressure-sensitive adhesive was applied on the cured film on the low cross-link density side of the release paper so that the thickness after drying was 0.06 mm, and the roll was wound into a roll. Then,
When the rolled material was rewound at a speed of 3 to 100 m / min, good rewindability was exhibited and no separation between the tape and the release paper occurred.
ちなみに、両面に架橋密度が0.1×10-5mol/gの硬化皮膜
を設けたほかは実施例に準じて得た感圧接着テープの回
巻物の同条件での巻戻し試験では、テープと剥離紙との
間で分離が生じた。By the way, in the rewinding test under the same conditions of the wound material of the pressure-sensitive adhesive tape obtained according to the example except that a cured film with a crosslink density of 0.1 × 10 -5 mol / g was provided on both sides, it peeled off from the tape. Separation between paper occurred.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 友本 隆宣 大阪府茨木市下穂積１丁目１番２号 日東 電気工業株式会社内 (72)発明者 清水 行雄 大阪府茨木市下穂積１丁目１番２号 日東 電気工業株式会社内 (56)参考文献 特開 昭58−15537（ＪＰ，Ａ) 特開 昭59−225946（ＪＰ，Ａ) 特開 昭53−104675（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takanobu Tomomoto 1-2-1, Shimohozumi, Ibaraki City, Osaka Prefecture Nitto Denki Kogyo Co., Ltd. (72) Yukio Shimizu 1-1-1, Shimohozumi, Ibaraki City, Osaka Prefecture No. 2 within Nitto Denki Kogyo Co., Ltd. (56) Reference JP-A-58-15537 (JP, A) JP-A-59-225946 (JP, A) JP-A-53-104675 (JP, A)
Claims (2)
剤からなる、表面変質処理されていない硬化皮膜を有し
てなり、かつ表裏面における前記皮膜の架橋密度が相違
して基材表裏での粘着剤層との剥離力の速度依存性が異
なることを特徴とする離形処理基体。1. A substrate having a thin film substrate having a cured film which is made of a silicone release treating agent and which has not been subjected to surface alteration treatment, and which has different cross-linking densities of the film on the front and back faces. A release-treated substrate having different speed dependences of peeling force from the pressure-sensitive adhesive layer on the front and back sides.
範囲第１項記載の基体。2. The substrate according to claim 1, wherein the difference in crosslink density is 10% or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60100123A JPH0698734B2 (en) | 1985-05-11 | 1985-05-11 | Release processing substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60100123A JPH0698734B2 (en) | 1985-05-11 | 1985-05-11 | Release processing substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61258747A JPS61258747A (en) | 1986-11-17 |
| JPH0698734B2 true JPH0698734B2 (en) | 1994-12-07 |
Family
ID=14265555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60100123A Expired - Lifetime JPH0698734B2 (en) | 1985-05-11 | 1985-05-11 | Release processing substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0698734B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0522537U (en) * | 1991-09-05 | 1993-03-23 | リンテツク株式会社 | Double-sided release sheet |
| US6780484B2 (en) * | 2001-02-02 | 2004-08-24 | 3M Innovative Properties Company | Adhesive article and method of preparing |
| JP5302497B2 (en) * | 2006-03-13 | 2013-10-02 | ゼネラル株式会社 | Pressure sensitive transfer tape |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5922655B2 (en) * | 1977-02-23 | 1984-05-28 | 積水化学工業株式会社 | Manufacturing method of lined long tube |
| JPS5815537A (en) * | 1981-07-22 | 1983-01-28 | Fujimori Kogyo Kk | Production of release paper |
| JPS59225946A (en) * | 1983-06-06 | 1984-12-19 | 藤森工業株式会社 | Manufacture of winding body for both-surface exfoliating paper |
-
1985
- 1985-05-11 JP JP60100123A patent/JPH0698734B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61258747A (en) | 1986-11-17 |
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