JPH0695366A - Method for washing phase shift mask - Google Patents
Method for washing phase shift maskInfo
- Publication number
- JPH0695366A JPH0695366A JP27074292A JP27074292A JPH0695366A JP H0695366 A JPH0695366 A JP H0695366A JP 27074292 A JP27074292 A JP 27074292A JP 27074292 A JP27074292 A JP 27074292A JP H0695366 A JPH0695366 A JP H0695366A
- Authority
- JP
- Japan
- Prior art keywords
- foreign matter
- phase shift
- shift mask
- water flow
- ultrasonic vibrations
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は,半導体素子の製造に用
いる照明の位相差を利用する位相シフトマスクの洗浄に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cleaning of a phase shift mask utilizing the phase difference of illumination used for manufacturing semiconductor devices.
【0002】[0002]
【従来の技術】従来,VLSI等の固体素子における微
細パターンの形成は,主に,微小露光投影法により行わ
れてきた。上記の方法は投影光学系を用い,レジストを
塗布した基板上に,拡大した配線パターンを描画したフ
オトマスクを透過した光を縮小結像させることにより,
配線パターンを転写するものである。2. Description of the Related Art Conventionally, formation of a fine pattern in a solid-state element such as VLSI has been mainly performed by a microexposure projection method. The above method uses a projection optical system to reduce and image the light transmitted through a photomask on which a magnified wiring pattern is drawn on a resist-coated substrate.
The wiring pattern is transferred.
【0003】しかし,近年,パターンの高密度化が進む
につれ,パターンの間隔が小さくなり,光源の波長と近
接し,投影像の分解能,コントラストの低下のため,特
開昭58-173744 号公報等に示されるように, 位相シフト
マスクが提案されてきた。However, in recent years, as the density of patterns has increased, the intervals between the patterns have become smaller, and the wavelengths of the light source have come closer to each other, which lowers the resolution and contrast of the projected image. Phase shift masks have been proposed, as shown in.
【0004】従来,異物除去には,様々な洗浄法が利用
されており,回転するブラシを基板表面にあてて異物を
こすり取るスクラブ法,高圧の水を基板表面に向けて射
出するハイプレッシャ−法などがある。しかし,図2,
図3と対比してみられるように,位相シフトマスクは,
位相差を導入するためのシフタ−材をフオトマスク上に
形成するために,通常のフオトマスクに比較して,パタ
ーンの段差が大きく,凹部に入り込んだ異物は除去が困
難である。例えば,通常のマスクの膜厚が,約1000Åで
あるのに対し,位相シフトマスクの膜厚は,約5000Åと
なり,パターンの凹部の深さが深くなる。さらに,位相
シフトマスクは,通常のフオトマスクに比較して,配線
パターンが,より微細になっているために,洗浄時にス
クラブやハイプレッシャ−の強い力が加わると,配線パ
ターンの欠けや脱落などのあらたな欠陥の原因となって
いた。Conventionally, various cleaning methods have been used for removing foreign matters. A scrubbing method for rubbing foreign matters by applying a rotating brush to the substrate surface, a high pressure for ejecting high-pressure water toward the substrate surface. There is a law. However, Figure 2,
As can be seen in comparison with FIG. 3, the phase shift mask
Since the shifter material for introducing the phase difference is formed on the photomask, the step difference of the pattern is large as compared with the normal photomask, and it is difficult to remove the foreign matter entering the recess. For example, the film thickness of a normal mask is about 1000 Å, whereas the film thickness of a phase shift mask is about 5000 Å, and the depth of the concave portion of the pattern becomes deep. Further, since the wiring pattern of the phase shift mask is finer than that of a normal photo mask, when a strong force of scrubbing or high pressure is applied during cleaning, the wiring pattern may be chipped or dropped. It was the cause of the new defect.
【0005】また,従来,超音波洗浄法として,ディッ
プ槽下に超音波発生装置を設置し,約100kHzの周波数を
用いて槽内に気泡を発生させ, 気泡がはじけるときの力
を利用して異物を除去する方法があるが, パターン間隙
に対して, 気泡が大きく, 凹部の異物に対して効果が著
しく弱かった。Further, conventionally, as an ultrasonic cleaning method, an ultrasonic wave generator is installed under a dip tank, bubbles are generated in the tank by using a frequency of about 100 kHz, and the force when the bubbles burst is used. There is a method of removing foreign matter, but the bubbles were large in the pattern gap, and the effect was extremely weak against foreign matter in the recesses.
【0006】[0006]
【発明が解決しようとする課題】本発明は,上記のよう
な欠陥を排除し,配線パターン表面に与えるダメージを
軽減するとともに, 効果的に異物を除去する位相シフト
マスクの洗浄方法を提供するものである。SUMMARY OF THE INVENTION The present invention provides a method for cleaning a phase shift mask which eliminates the above defects, reduces damage to the wiring pattern surface, and effectively removes foreign matters. Is.
【0007】[0007]
【課題を解決するための手段】本発明は,位相シフトマ
スクの洗浄工程において,超音波振動を有する水流下に
位相シフトマスクを水平または垂直等の位置で通過させ
ることを特徴とする位相シフトマスクの洗浄方法であ
る。According to the present invention, in a step of cleaning a phase shift mask, the phase shift mask is passed at a horizontal or vertical position under a water flow having ultrasonic vibrations. Is the cleaning method.
【0008】本発明は,位相シフトマスクの洗浄工程に
おいて,上方より落下する超音波振動を有する洗浄水の
水流下を通過させることにより,超音波振動を有する水
分子がマスク凹部に入り込んだ異物に振動を与えること
により,洗浄水流とともに異物をマスクより分離除去で
き,従来の洗浄法に比較して強い力を加えることもない
ので配線パターンの欠けや脱落などのダメージがない。According to the present invention, in the step of cleaning the phase shift mask, the water molecules having ultrasonic vibration are removed from the foreign matter entering the mask concave portion by allowing the cleaning water having ultrasonic vibration falling from above to pass under the water flow. By applying vibration, foreign matter can be separated and removed from the mask along with the cleaning water flow, and no strong force is applied as compared with the conventional cleaning method, so there is no damage such as chipping or dropping of the wiring pattern.
【0009】[0009]
【実施例】以下,実施例について図面を参照して説明す
る。図1は,本発明の洗浄方法の一実施例を説明する側
面図である。上方より帯状の水流をつくり,これに
(株) カイジョ−社製ハイメガソニックUSシャワーを
用い,950 kHz の超音波振動を与えて,超音波振動を有
する水流1を作った。この水流下に搬送機3上に,水平
に配置した,凹部の幅0.1 μm深さ7000Åを有する位相
シフトマスク2を搬送速度0.5cm/sec ,水量10〜15l/mi
n で通過させた。一度基板より除去された異物が流水に
より再付着せず,従来法と比較して,異物の付着が減少
し,またパターンのダメージもなかった。EXAMPLES Examples will be described below with reference to the drawings. FIG. 1 is a side view for explaining an embodiment of the cleaning method of the present invention. Create a belt-like water stream from above,
A high-megasonic US shower manufactured by Kaijo Co., Ltd. was used to apply ultrasonic vibration of 950 kHz to create a water stream 1 having ultrasonic vibration. The phase shift mask 2 having a recess width of 0.1 μm and a depth of 7,000 Å horizontally arranged on the carrier 3 under this water flow has a carrier speed of 0.5 cm / sec and a water amount of 10 to 15 l / mi.
Passed at n. The foreign matter once removed from the substrate did not reattach due to running water, and the foreign matter adhesion was reduced compared to the conventional method, and there was no pattern damage.
【0010】[0010]
【発明の効果】本発明によれば,位相シフトマスクの配
線パターンに大きなダメージを与えることなく,表面の
異物を効果的に除去することが可能である。According to the present invention, it is possible to effectively remove foreign matter on the surface without causing a large damage to the wiring pattern of the phase shift mask.
【図1】本発明の洗浄方法の一実施例を説明する側面図
である。FIG. 1 is a side view illustrating an embodiment of a cleaning method of the present invention.
【図2】位相シフトマスクの一例の断面概念図FIG. 2 is a conceptual sectional view of an example of a phase shift mask.
【図3】従来のフオトマスクの断面概念図FIG. 3 is a conceptual sectional view of a conventional photomask.
1 超音波振動を有する水流 2 位相シフトマスク 3 搬送機 4 遮光層(クロム) 5 シフタ−材 6 ストッパー層 7 ガラス基板 8 異物 1 Water Flow with Ultrasonic Vibration 2 Phase Shift Mask 3 Carrier 4 Light-Shielding Layer (Chromium) 5 Shifter Material 6 Stopper Layer 7 Glass Substrate 8 Foreign Material
Claims (1)
マスクを通過させることを特徴とする,位相シフトマス
クの洗浄方法。1. A method of cleaning a phase shift mask, which comprises passing the phase shift mask under a stream of water having ultrasonic vibrations.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27074292A JPH0695366A (en) | 1992-09-16 | 1992-09-16 | Method for washing phase shift mask |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27074292A JPH0695366A (en) | 1992-09-16 | 1992-09-16 | Method for washing phase shift mask |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0695366A true JPH0695366A (en) | 1994-04-08 |
Family
ID=17490345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27074292A Withdrawn JPH0695366A (en) | 1992-09-16 | 1992-09-16 | Method for washing phase shift mask |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0695366A (en) |
-
1992
- 1992-09-16 JP JP27074292A patent/JPH0695366A/en not_active Withdrawn
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991130 |