JPH068930U - LCD mounting structure - Google Patents
LCD mounting structureInfo
- Publication number
- JPH068930U JPH068930U JP4654092U JP4654092U JPH068930U JP H068930 U JPH068930 U JP H068930U JP 4654092 U JP4654092 U JP 4654092U JP 4654092 U JP4654092 U JP 4654092U JP H068930 U JPH068930 U JP H068930U
- Authority
- JP
- Japan
- Prior art keywords
- lcd
- wiring board
- printed wiring
- bare chip
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
(57)【要約】
【目的】ＬＣＤとプリント配線板とに生ずる隙間部分に
ベアチップが実装され、しかも、外力がＬＣＤに作用し
てもＬＣＤに局所的に荷重が集中することのないＬＣＤ
の取付構造の提供。
【構成】プリント配線板22とＬＣＤ23との間にはＬＣＤ
の裏面とほぼ全域にわたって対向させられた支持板30が
設けられ、支持板30に形成された穴部30a 内でベアチッ
プ29はプリント配線板22に実装され、穴部30a にはベア
チップを樹脂封止する封止剤34が充填されている。
(57) [Abstract] [Purpose] An LCD in which a bare chip is mounted in a gap formed between an LCD and a printed wiring board, and a load is not locally concentrated on the LCD even when an external force acts on the LCD.
Providing mounting structure. [Structure] An LCD is provided between the printed wiring board 22 and the LCD 23.
A support plate 30 is provided to face the back surface of the support plate 30 almost entirely, and the bare chip 29 is mounted on the printed wiring board 22 in the hole 30a formed in the support plate 30, and the bare chip is resin-sealed in the hole 30a. It is filled with a sealing agent 34.
Description
【０００１】[0001]
本考案は、選択呼出受信機等の小形電子機器に装着されるＬＣＤ（液晶表示器 ）の取付構造に関する。 The present invention relates to a mounting structure for an LCD (liquid crystal display) mounted on a small electronic device such as a selective call receiver.
【０００２】[0002]
図３及び図４にこの種の従来のＬＣＤの取付構造を示す。 3 and 4 show a conventional LCD mounting structure of this type.
【０００３】 小形電子機器の筐体１内には、図４に示す如く、プリント配線板２が取付けら れており、このプリント配線板２に実装されたＬＣＤ３が筐体１に設けられた窓 部1aと対向させられている。ＬＣＤ３のプリント配線板２への取付けは、図３に 示す如く、ＬＣＤ保持枠５内にＬＣＤ３を嵌め込み、ＬＣＤ３の電極部3aとプリ ント配線板２との間にゴムコネクタ７を位置付けた状態とし、ＬＣＤ保持枠５の 取付足5aをプリント配線板２の角穴2aに挿入し、取付足5aの先端をプリント配線 板２の裏面側で捩ることにより行なわれる。これでＬＣＤ３はプリント配線板２ と並行する状態でプリント配線板２に実装され、また、ＬＣＤ３とプリント配線 板２とで圧縮させられたゴムコネクタ７を介してＬＣＤ３とプリント配線板２と は電気的にも接続される。As shown in FIG. 4, a printed wiring board 2 is mounted in the housing 1 of the small electronic device, and an LCD 3 mounted on the printed wiring board 2 is provided in the housing 1 in a window. It is opposed to the portion 1a. To attach the LCD 3 to the printed wiring board 2, the LCD 3 is fitted in the LCD holding frame 5 and the rubber connector 7 is positioned between the electrode portion 3a of the LCD 3 and the printed wiring board 2, as shown in FIG. The mounting foot 5a of the LCD holding frame 5 is inserted into the square hole 2a of the printed wiring board 2 and the tip of the mounting foot 5a is twisted on the back surface side of the printed wiring board 2. Thus, the LCD 3 is mounted on the printed wiring board 2 in parallel with the printed wiring board 2, and the LCD 3 and the printed wiring board 2 are electrically connected via the rubber connector 7 compressed by the LCD 3 and the printed wiring board 2. Is also connected.
【０００４】 一方、小形電子機器では、筐体１内に装着されるプリント配線板２で筐体１の 大きさが決定されるため、プリント配線板２を極力小形化する必要があり、その ためには、プリント配線板２とＬＣＤ３との間に生じる狭い隙間Ｓにも電子部品 を実装し空間の有効利用を図る必要がある。そこで、従来は図４に示す如く、Ｌ ＣＤ３が装着されるプリント配線板２の部分にベアチップ９をワイヤ10により直 接ボンディングして接続していた。また、ベアチップ９及びワイヤ10は樹脂封止 する必要があるが、封止剤の粘度を高くすると全体の高さが大きくなり、封止剤 の粘度を低くすると封止剤がプリント配線板２上に広がってしまうため、ベアチ ップ９及びワイヤ10を囲繞するようにして樹脂封止枠12をプリント配線板２に設 け、この樹脂封止枠12内に粘度の低い封止剤14を充填していた。On the other hand, in a small electronic device, the size of the housing 1 is determined by the printed wiring board 2 mounted in the housing 1. Therefore, it is necessary to make the printed wiring board 2 as small as possible. For this reason, it is necessary to mount electronic components even in the narrow gap S formed between the printed wiring board 2 and the LCD 3 to effectively utilize the space. Therefore, conventionally, as shown in FIG. 4, a bare chip 9 is directly bonded and connected to a portion of the printed wiring board 2 on which the LCD 3 is mounted by a wire 10. Further, the bare chip 9 and the wire 10 need to be resin-sealed, but if the viscosity of the sealant is increased, the overall height is increased, and if the viscosity of the sealant is decreased, the sealant is placed on the printed wiring board 2. Therefore, the resin sealing frame 12 is provided on the printed wiring board 2 so as to surround the bare chip 9 and the wire 10, and the resin sealing frame 12 is filled with the low-viscosity sealing agent 14. Was.
【０００５】 しかしながら、上記従来のＬＣＤの取付構造では、筐体１に外力が作用しＬＣ Ｄ３がプリント配線板２側へ押圧された場合に、図５に示す如く、樹脂封止枠12 の角部12a にＬＣＤ３が当接するので、角部12a と当接するＬＣＤ３の部分に集 中的に荷重が加わり、ＬＣＤ３が破損する場合があった。However, in the above-mentioned conventional LCD mounting structure, when an external force acts on the housing 1 and the LCD 3 is pressed toward the printed wiring board 2 side, as shown in FIG. Since the LCD 3 abuts on the portion 12a, a load may be concentrated on the portion of the LCD 3 abutting on the corner 12a, and the LCD 3 may be damaged.
【０００６】[0006]
上述の如く、ＬＣＤとプリント配線板とに生ずる隙間部分にベアチップを実装 した従来のＬＣＤの取付構造では、ＬＣＤに外力が作用した場合に、ベアチップ を樹脂封止するためにプリント配線板に設けられた樹脂封止枠の角部にＬＣＤが 当接するので、樹脂封止枠の角部と当接するＬＣＤの部分に集中的に荷重が加わ るという問題点があった。 As described above, in the conventional LCD mounting structure in which the bare chip is mounted in the gap between the LCD and the printed wiring board, the bare chip is provided on the printed wiring board for resin sealing when an external force acts on the LCD. Further, since the LCD comes into contact with the corner portion of the resin sealing frame, there is a problem that the load is concentrated on the portion of the LCD that comes into contact with the corner portion of the resin sealing frame.
【０００７】 本考案はこのような従来の欠点を解決するべくなされたものであり、ＬＣＤと プリント配線板とに生ずる隙間部分にベアチップが実装され、しかも、外力がＬ ＣＤに作用してもＬＣＤの一部に荷重が集中することのないＬＣＤの取付構造を 提供することを目的とする。The present invention has been made in order to solve the above-mentioned conventional drawbacks. A bare chip is mounted in a gap portion between an LCD and a printed wiring board, and even if an external force acts on the LCD, the LCD is It is an object of the present invention to provide an LCD mounting structure in which the load is not concentrated on a part of the LCD.
【０００８】[0008]
本考案では、ベアチップがワイヤボンディングにより実装されるプリント配線 板にＬＣＤが前記ベアチップを間にして前記プリント配線板と並行に実装される ＬＣＤの取付構造において、前記プリント配線板と前記ＬＣＤとの間には前記Ｌ ＣＤの裏面とほぼ全域にわたって対向させられた支持板が設けられ、この支持板 に形成された穴部内で前記ベアチップは前記プリント配線板に実装され、前記支 持板の穴部には前記ベアチップを樹脂封止する封止剤が充填された構成となって いる。 In the present invention, an LCD is mounted on a printed wiring board on which a bare chip is mounted by wire bonding, and an LCD is mounted in parallel with the printed wiring board with the bare chip interposed therebetween. In an LCD mounting structure, a space between the printed wiring board and the LCD is provided. Is provided with a support plate which is opposed to the back surface of the LCD over almost the entire area, and the bare chip is mounted on the printed wiring board in the hole formed in the support plate, and is provided in the hole of the support plate. Is configured to be filled with a sealant that seals the bare chip with a resin.
【０００９】[0009]
【作用】 本考案では、ＬＣＤの裏面側は、ＬＣＤとプリント配線板との間に設けられた 支持板及びこの支持板の穴部に充填された封止剤により、ほぼ全域にわたって支 持される。In the present invention, the back side of the LCD is supported almost over the entire area by the supporting plate provided between the LCD and the printed wiring board and the sealant filled in the hole of the supporting plate. .
【００１０】[0010]
以下、本考案の一実施例を図１及び図２を参照して詳述する。 Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS.
【００１１】 図２は本考案に係る取付構造の分解斜視図、図１は、ＬＣＤを筐体に組込んだ 状態での図２のＡ−Ａ線断面図である。FIG. 2 is an exploded perspective view of a mounting structure according to the present invention, and FIG. 1 is a sectional view taken along the line AA of FIG. 2 with an LCD incorporated in a housing.
【００１２】 本考案に係る小形電子機器においても、従来例と同様、筐体21内にプリント配 線板22が取付けられており、このプリント配線板22に装着されたＬＣＤ23が筐体 21に設けられた窓部21a と対向させられている。また、ＬＣＤ23のプリント配線 板22への取付けは、図２に示す如く、金属板にて形成されたＬＣＤ保持枠25内に ＬＣＤ23を嵌め込み、ＬＣＤ23の電極部23a とプリント配線板22との間にゴムコ ネクタ27を位置付けた状態とし、ＬＣＤ保持枠25の取付足25a の先端をプリント 配線板22の角穴22a に挿入し、取付足25a の先端をプリント配線板22の裏面側で 捩ることにより行われる。これで、ＬＣＤ23はプリント配線板22と並行する状態 でプリント配線板22に装着され、ＬＣＤ23とプリント配線板22とで圧縮させられ たゴムコネクタ27を介してＬＣＤ23とプリント配線板22とは電気的にも接続され る。In the small electronic device according to the present invention, the printed wiring board 22 is mounted in the housing 21 as in the conventional example, and the LCD 23 mounted on the printed wiring board 22 is provided in the housing 21. It faces the opened window portion 21a. Further, as shown in FIG. 2, the LCD 23 is attached to the printed wiring board 22 by inserting the LCD 23 into an LCD holding frame 25 formed of a metal plate, and between the electrode portion 23a of the LCD 23 and the printed wiring board 22. With the rubber connector 27 positioned, insert the tip of the mounting foot 25a of the LCD holding frame 25 into the square hole 22a of the printed wiring board 22, and twist the tip of the mounting foot 25a on the back side of the printed wiring board 22. Be seen. Thus, the LCD 23 is mounted on the printed wiring board 22 in parallel with the printed wiring board 22, and the LCD 23 and the printed wiring board 22 are electrically connected via the rubber connector 27 compressed by the LCD 23 and the printed wiring board 22. Is also connected to.
【００１３】 一方、プリント配線板22とＬＣＤ23との間に生ずる隙間には、従来例と同様、 ベアチップ29が実装されるが、このベアチップ29のプリント配線板22への実装に 際しては、平板状の支持板30を用いて行なわれる。On the other hand, a bare chip 29 is mounted in the gap between the printed wiring board 22 and the LCD 23 as in the conventional example. When mounting the bare chip 29 on the printed wiring board 22, This is performed using a flat support plate 30.
【００１４】 支持板30はポリカーボネート等のプラスチックにて形成されており、その板厚 はプリント配線板22とＬＣＤ23との間に生じる隙間と同程度の寸法となっている 。また、支持板30は、ＬＣＤ23の電極部23a を除いた部分と同様の大きさ、形状 となっており、図２に示す如く、プリント配線板22のＬＣＤ23が取付けられる部 分（但し、ゴムコネクタ27が取付けられる部分は除く）に接着されている。また 、支持板30には、プリント配線板22に実装されるベアチップ29のための角穴30a が複数形成されている。そして、ベアチップ29は、図１に示す如く、支持板30の 角穴30a 内でプリント配線板22に実装され、ワイヤ32にてプリント配線板22にボ ンディングされる。また、ボンディング終了後には、角穴30a には粘度の低い封 止剤34が充填され、ベアチップ29及びワイヤ32は樹脂封止される。この場合に、 封止剤34の粘度は低いので、支持板30の表面と封止剤34の表面とを略同一平面上 に位置付けられる。The support plate 30 is made of a plastic such as polycarbonate, and its thickness is about the same as the gap formed between the printed wiring board 22 and the LCD 23. The support plate 30 has the same size and shape as the portion of the LCD 23 excluding the electrode portion 23a. As shown in FIG. 2, the portion of the printed wiring board 22 to which the LCD 23 is attached (however, a rubber connector is used). (Excluding the part where 27 is attached). Further, the support plate 30 is formed with a plurality of square holes 30a for the bare chips 29 mounted on the printed wiring board 22. Then, as shown in FIG. 1, the bare chip 29 is mounted on the printed wiring board 22 in the rectangular holes 30a of the support plate 30 and is bonded to the printed wiring board 22 by the wires 32. After the bonding is completed, the square hole 30a is filled with the sealing agent 34 having a low viscosity, and the bare chip 29 and the wire 32 are resin-sealed. In this case, since the viscosity of the sealant 34 is low, the surface of the support plate 30 and the surface of the sealant 34 can be positioned on substantially the same plane.
【００１５】 このような構成となっているので、筐体21に外力が作用しＬＣＤ23がプリント 配線板22側へ押圧された場合であっても、ＬＣＤ23の裏面側はほぼ全体の面が支 持板30及び封止剤34の表面で支持されるので、ＬＣＤ23には局所的に荷重が集中 することはなくなり、ＬＣＤ23は損傷し難い。また、支持板30がプリント配線板 22に固着されているので、プリント配線板22の剛性が増し、プリント配線板22さ らにはＬＣＤ23も外力に対する曲げ強度が増加する。With such a configuration, even if an external force acts on the housing 21 and the LCD 23 is pressed toward the printed wiring board 22, almost the entire back surface of the LCD 23 is supported. Since it is supported by the surfaces of the plate 30 and the sealant 34, the load is not locally concentrated on the LCD 23 and the LCD 23 is less likely to be damaged. Further, since the support plate 30 is fixed to the printed wiring board 22, the rigidity of the printed wiring board 22 increases, and the bending strength of the printed wiring board 22 and the LCD 23 against external force also increases.
【００１６】[0016]
以上説明したように本考案のＬＣＤの取付構造ではＬＣＤとプリント配線板と の間にはＬＣＤの裏面のほぼ全域を支持する支持板が設けられ、ベアチップはこ の支持板に形成された穴部においてプリント配線板に実装されこの穴部を利用し て樹脂封止されている。従って、ＬＣＤをプリント配線板側へ向けて押圧する外 力がＬＣＤに働いてもＬＣＤのほぼ全面を支持板及び封止剤で受けることが可能 となり、ＬＣＤに局所的に荷重が集中することはない。また、ＬＣＤとプリント 配線板との間に支持板が設けられたことにより、プリント配線板の剛性も増加し 、従って、プリント配線板及びＬＣＤの曲げ強度も増加する。 As described above, in the LCD mounting structure of the present invention, the support plate that supports almost the entire back surface of the LCD is provided between the LCD and the printed wiring board, and the bare chip has the hole formed in the support plate. In this case, it is mounted on a printed wiring board and is resin-sealed by utilizing this hole. Therefore, even if the external force that presses the LCD toward the printed wiring board acts on the LCD, almost all of the LCD can be received by the support plate and the sealant, and the load is not locally concentrated on the LCD. Absent. Further, since the support plate is provided between the LCD and the printed wiring board, the rigidity of the printed wiring board is increased, and accordingly, the bending strength of the printed wiring board and the LCD is also increased.
【図１】ＬＣＤを筐体に組み込んだ状態での図２のＡ−
Ａ線断面図。FIG. 1A in FIG. 2 in a state where an LCD is incorporated in a housing.
A line sectional view.
【図２】本考案に係るＬＣＤの取付構造を説明する分解
斜視図。FIG. 2 is an exploded perspective view illustrating an LCD mounting structure according to the present invention.
【図３】従来のＬＣＤの取付構造を説明する分解斜視
図。FIG. 3 is an exploded perspective view illustrating a conventional LCD mounting structure.
【図４】ＬＣＤを筐体に組み込んだ状態での図３のＢ−
Ｂ線断面図。FIG. 4 is a B- of FIG. 3 in a state where the LCD is incorporated in the housing.
B line sectional drawing.
【図５】従来の取付構造の欠点を説明する断面図。FIG. 5 is a cross-sectional view illustrating a defect of a conventional mounting structure.
22 プリント配線板 23 ＬＣＤ 29 ベアチップ 30 支持板 30a 穴部 32 ワイヤ 34 封止剤 22 Printed wiring board 23 LCD 29 Bare chip 30 Support plate 30a Hole 32 Wire 34 Sealant
Claims (1)
実装されるプリント配線板にＬＣＤが前記ベアチップを
間にして前記プリント配線板と並行に実装されるＬＣＤ
の取付構造において、前記プリント配線板と前記ＬＣＤ
との間には前記ＬＣＤの裏面とほぼ全域にわたって対向
させられた支持板が設けられ、この支持板に形成された
穴部内で前記ベアチップは前記プリント配線板に実装さ
れ、前記支持板の穴部には前記ベアチップを樹脂封止す
る封止剤が充填されていることを特徴とするＬＣＤの取
付構造。1. An LCD in which a bare chip is mounted on a printed wiring board by wire bonding and an LCD is mounted in parallel with the printed wiring board with the bare chip interposed therebetween.
The printed wiring board and the LCD.
Is provided with a support plate facing the back surface of the LCD over substantially the entire area, and the bare chip is mounted on the printed wiring board in a hole formed in the support plate. A mounting structure for an LCD, characterized in that a sealant for sealing the bare chip with a resin is filled therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4654092U JPH068930U (en) | 1992-07-03 | 1992-07-03 | LCD mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4654092U JPH068930U (en) | 1992-07-03 | 1992-07-03 | LCD mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH068930U true JPH068930U (en) | 1994-02-04 |
Family
ID=12750132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4654092U Withdrawn JPH068930U (en) | 1992-07-03 | 1992-07-03 | LCD mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH068930U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018054291A (en) * | 2016-09-26 | 2018-04-05 | 日本精機株式会社 | Instrument for vehicle |
-
1992
- 1992-07-03 JP JP4654092U patent/JPH068930U/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018054291A (en) * | 2016-09-26 | 2018-04-05 | 日本精機株式会社 | Instrument for vehicle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19961003 |