JPH0688205A - Sputtering jig - Google Patents

Abstract

PURPOSE:To reduce working time and costs by automatically positioning a mask and a substrate to the prescribed position within the jig. CONSTITUTION:This jig has a main plate 2 formed with an aperture 2a, the mask 8 imposed and positioned on this main plate 2, holes 6 for a substrate positioning device formed on the main plate 2 and the substrate positioning device 11 mounted in the holes 6 for mounting. The substrate positioning device 11 has positioning heads 16 which are fixed at one end of revolving shafts 14 and project from the holes 6 for mounting to the substrate 9 imposing surface side of the main plate 2, working pins 19 which are fixed via working arms 18 to the other end of the revolving shafts and are extended in the direction on the side opposite from the substrate imposing surface of the main plate 2 and springs which energize the positioning heads 16 in the direction of pressing the heads to the substrate 9 and energize the working pins 19 in the direction projecting the pins to the side opposite from the substrate imposing surface of the main plate 2 from the holes 6 for mounting.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in a process for manufacturing a color filter for a liquid crystal display device or the like, and a sputtering jig for positioning a color filter substrate with respect to a sputtering mask in a manufacturing line. Regarding

[0002]

2. Description of the Related Art A process for manufacturing a color filter is performed by forming a chromium film on a transparent rectangular substrate such as glass by using a vacuum film forming method, applying a photoresist, arranging a photomask, exposing, developing, Chromium etching and photoresist stripping are performed to form a black light-shielding layer having a stripe pattern or a lattice pattern, and then a first color sensitive material is applied on the black light-shielding layer, and then a photomask is arranged. Then, after development, a colored pattern for the first color is formed, colored patterns for the second and subsequent colors are formed in the same manner, and then a protective film layer is formed on the color pattern. A step of forming a transparent electrode layer by depositing indium tin oxide (ITO) by a vacuum film-forming method.

In the step of forming the transparent electrode layer among the above steps, the sputtering method is advantageous in terms of mass production, and in the automated line, the substrate and the mask are fixed at predetermined positions in a jig, Sputtering is performed by storing about one jig in the sputtering device. In a conventional sputtering jig, a metal mask that covers the glass substrate on which a film is to be formed except for the color pattern area is arranged on a main plate having an opening. Position the glass substrate so that it follows a certain guide pin, and then place another plate, that is, in the state where the metal mask and the glass substrate are sandwiched between this plate and the main plate, both plates are placed. Are mechanically fixed by means of fastening with screws or the like.

[0004]

However, in the above-mentioned conventional sputtering jig, it is necessary to manually position the mask and the substrate at a predetermined position in the jig, which increases the working time and cost. It has a problem of inviting.

The present invention is intended to solve the above problems, and in the manufacturing process of a color filter, it is possible to automatically position a mask and a substrate at a predetermined position in a jig, thereby reducing working time and cost. It is an object of the present invention to provide a sputtering jig capable of performing the above.

[0006]

To this end, the sputtering jig of the present invention has a main plate 2 having an opening 2a formed therein.
And the mask 8 placed and positioned on the main plate 2.
In a sputtering jig including a substrate positioning device mounting hole 6 formed in the main plate 2 and a substrate positioning device 11 mounted in the substrate positioning device mounting hole 6, the substrate positioning device 11 Is a positioning head 16 fixed to one end of the rotary shaft 14 and protruding from the substrate positioning device mounting hole 6 toward the substrate 9 mounting surface side of the main plate 2.
And an operating pin 19 fixed to the other end of the rotary shaft via an operating arm 18 and extended in the direction opposite to the substrate mounting surface of the main plate 2, and the positioning head 16 is pushed to the substrate 9. A spring 20 for urging in a contacting direction and for urging the operating pin 19 in a direction in which the operating pin 19 projects from the substrate positioning device mounting hole 6 to the side opposite to the substrate mounting surface of the main plate 2.
And is provided. It should be noted that the numbers added to the above configurations are for comparison with the drawings for easy understanding, and the configurations of the present invention are not limited thereby.

[0007]

In the present invention, at a predetermined position on the transfer device of the manufacturing line, from the substrate positioning device mounting hole 6 in the direction opposite to the substrate mounting surface of the main plate 2 (bottom surface of the main plate 2 shown). , The operating pin 19 of the substrate positioning device 11 which is biased by the spring 20 and protrudes,
As shown in FIG. 3A, the operating pin 19 is pressed against the push pin 22 operated by an external device (not shown).
Is housed in the board positioning device mounting hole 6, and the rotary shaft 14 rotates to move the positioning head 16 to the board 9
Is held away from the expected position where the will be mounted. In this state, the substrate 9 is placed on the mask 8 positioned on the main plate 2. At this time, the mask 8 is positioned with respect to the main plate 2 by inserting the guide pins 7 provided in the main plate 2 into the holes 8c. Thereafter, by moving the push pin 22 away from the actuating pin 19, as shown in FIG. 3B, the actuating pin 19 is projected from the board positioning device mounting hole 6 by the biasing force of the spring 20 and is positioned. The head 16 is the substrate 9
Is pressed against the guide pin and positioned at a predetermined position with respect to the mask 8.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of a sputtering jig according to the present invention.

The sputtering jig 1 of the present invention has an opening 2a.
A main plate 2 on which the main plate 2 is formed, a mask 8 placed and positioned on the main plate 2, a sub plate 5 rotatably provided on the main plate 2 by a hinge 3, and one side 2 of the main plate 2. Substrate positioning device mounting hole 6 formed in a location, substrate positioning device 11 (FIG. 2) mounted in this substrate positioning device mounting hole 6, and a plurality of holes provided around opening 2a of main plate 2 And the guide pin 7 of the substrate positioning device 11 of the external device.
2 is operated to move the substrate 9 to the guide pin 7
The structure is such that it is positioned with respect to the mask 8 so as to abut. For example, two color patterns 10a and 10b are formed on the substrate 9, and the mask 8
The openings 8a and 8b are formed in the so as to face the color patterns 10a and 10b.

FIG. 2 shows the board positioning device mounting hole 6
The board | substrate positioning apparatus 11 mounted | worn with is shown, A figure is a top view and FIG. B is a side view.

The positioning device 11 has a cylindrical member 13 having a fixed plate 12, a rotary shaft 14 rotatably supported by the cylindrical member 13, and a positioning arm 15 fixed to one end of the rotary shaft 14. A positioning head 16 fixed to the positioning arm 15, an operating arm 18 fixed to the other end of the rotating shaft 14 by a connecting pin 17, an operating pin 19 fixed to the tip of the operating arm 18, and a rotating shaft. 14 and a spring 20 having one end locked to the fixed plate 12 and the other end locked to the actuating arm 18, and the positioning device 11 is mounted from the back side of the main plate 2 to the board positioning device mounting hole. 6 and the fixing plate 12 is fixed to the main plate 2 with bolts 21. As a result, the rotary shaft 14, the positioning head 16, and the operating pin 19 are urged to rotate in the X direction shown in the drawing.

The operation of the present invention having the above structure will be described with reference to FIGS. 1, 2 and 3. FIG. 3 shows a schematic view for explaining the operation of the present invention, FIG. 3A shows a state in which the substrate 9 is placed on the mask 8 placed on the main plate 2, and FIG. The state of being positioned with respect to the mask 8 is shown.

A sputtering jig 1 is arranged at a predetermined position on a transporting device of a manufacturing line, and a mask 8 is provided on a main plate 2 of the sputtering jig 1 with a guide pin 7 provided on the main plate 2. The mask 8 is positioned and set by passing through a hole 8c provided in the mask 8. Vice plate 5
Is a member for sandwiching the mask 8 and the substrate 9 between the main plate 2 and the main plate 2, and stands by in an open state. At this time, the operating pin 19 of the substrate positioning device 11 is pushed against the spring 20 by the push pin 22 of an external device (not shown), and as shown in FIG.
Is housed in the board positioning device mounting hole 6, and the positioning head 16 is held in an inclined state away from the planned mounting position of the board 9. In this state, the substrate 9 is placed on the mask 8 by a robot gripping device (not shown).

Next, as shown in FIG. 3B, the push pin 22
Is released from the operating pin 19, the operating pin 19 is projected from the bottom surface of the main plate 2 by the urging force of the spring 20, and the positioning head 16 pushes the substrate 9 so as to abut on the guide pin to position the substrate 9 at a predetermined position. To be done.

The sub plate 5 is closed, and the substrate 9 is masked by the mask 8.
The sputtering jig 1 held so as to be in close contact with the substrate is conveyed to the inside of the sputtering apparatus, and the color pattern 10a of the substrate 9
A transparent electrode layer is formed on the surface of 10b. When the sputtering is completed, it is carried out from the sputtering device and placed at a predetermined position. Next, when the sub-plate 5 is opened and the push pin 22 of the external device is pressed, the positioning head 16 moves in a direction away from the substrate 9 again as shown in FIG. 3A, and in this state, the robot gripping device causes the substrate to move. 9 is taken out and conveyed to the next step.

[0016]

As is apparent from the above description, according to the present invention, in a sputtering jig including a main plate having an opening formed therein and a mask placed and positioned on the main plate, A substrate positioning device mounting hole formed in the main plate; and a substrate positioning device mounted in the substrate positioning device mounting hole, wherein the substrate positioning device is fixed to one end of a rotating shaft, A positioning head that protrudes from the positioning device mounting hole toward the substrate mounting surface side of the main plate, and is fixed to the other end of the rotating shaft via an operating arm, and is positioned in the direction opposite to the substrate mounting surface of the main plate. The extended operating pin and the positioning head are urged in a direction to press the positioning head against the substrate, and the operating pin is projected from the substrate positioning device mounting hole to the side opposite to the substrate mounting surface of the main plate. That direction because configured to include a spring for biasing, in a manufacturing process of a color filter, automatically allows positioning the substrate in place within the fixture, it is possible to reduce the working time and cost.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a sputtering jig according to the present invention.

2 shows a positioning device according to the present invention, FIG. A is a plan view and FIG. B is a side view.

FIG. 3 is a schematic view for explaining the operation of the present invention, FIG. 3A shows a state in which a substrate is placed on a main plate, and FIG. 3B shows a substrate placed on the main plate. FIG.

[Explanation of symbols]

1 ... Sputtering jig, 2 ... Main plate, 2a ... Opening part,
5 ... Sub plate 6 ... Hole for mounting substrate positioning device, 7 ... Guide pin, 8 ...
Mask, 9 ... Substrate 11 ... Substrate positioning device, 12 ... Fixed plate, 13 ... Cylindrical member, 14 ... Rotating shaft 15 ... Positioning arm, 16 ... Positioning head, 17 ...
Connecting pin 18 ... Operating arm, 19 ... Operating pin, 20 ... Spring, 22 ... Pushing pin

Claims (1)

[Claims] 1. A substrate positioning device mounting hole formed in the main plate in a sputtering jig including a main plate having an opening formed therein and a mask placed and positioned on the main plate. A substrate positioning device mounted in the substrate positioning device mounting hole, wherein the substrate positioning device is fixed to one end of a rotating shaft, and the substrate positioning surface side of the main plate extends from the substrate positioning device mounting hole. A positioning head protruding toward the other end, an operating pin fixed to the other end of the rotary shaft via an operating arm, and extended in a direction opposite to the substrate mounting surface of the main plate, and the positioning head is pressed against the substrate. And a spring for biasing the actuating pin in the direction in which the actuating pin is projected from the substrate positioning device mounting hole to the side opposite to the substrate mounting surface of the main plate. Sputtering jig to.