JPH0686708A - Production of hollow ornaments - Google Patents

Production of hollow ornaments

Info

Publication number
JPH0686708A
JPH0686708A JP22464491A JP22464491A JPH0686708A JP H0686708 A JPH0686708 A JP H0686708A JP 22464491 A JP22464491 A JP 22464491A JP 22464491 A JP22464491 A JP 22464491A JP H0686708 A JPH0686708 A JP H0686708A
Authority
JP
Japan
Prior art keywords
base material
conductive base
pipe
noble metal
hollow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22464491A
Other languages
Japanese (ja)
Inventor
Satoshi Ida
智 井田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UIZU KK
Tanaka Kikinzoku Kogyo KK
With KK
Original Assignee
UIZU KK
Tanaka Kikinzoku Kogyo KK
With KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UIZU KK, Tanaka Kikinzoku Kogyo KK, With KK filed Critical UIZU KK
Priority to JP22464491A priority Critical patent/JPH0686708A/en
Publication of JPH0686708A publication Critical patent/JPH0686708A/en
Pending legal-status Critical Current

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  • Adornments (AREA)

Abstract

PURPOSE:To provide the process for production of the hollow ornamental parts which have no clearances in joint parts, are free from the infiltration of moisture and the discoloration of brazing filler metals and have an excellent ornamental effect. CONSTITUTION:The surface of a conductive base material 2 penetrated with a pipe 1 in a desired position is electroplated to form an electroplating layer 6 of a noble metal or noble metal alloy. This conductive base material 2 is then melted and is removed from a lead wire hole 7 to form the outside shape of the hollow noble metal ornaments from the electroplating layer, by which the ornaments are produced. Since the brazing filler metal 3 is not exposed, the discoloration and softening of the brazing filler metal 3 do not arise. Since the pipe penetrates the ornaments and no clearances exist, and the advance of the moisture into the ornaments does not arise. The ornamental parts having an arbitrary shape and arbitrary thickness are produced by adjusting the shape of the conductive base material and the energization quantity at the time of electroplating.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ネックレス、イヤリン
グ、ブレスレット、アンクレット、時計バンド等の繋ぎ
合わせて使用される中空の貴金属装飾部品の製造方法に
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a hollow precious metal decorative part used for connecting necklaces, earrings, bracelets, anklets, watch bands and the like.

【0002】[0002]

【従来技術とその問題点】従来電鋳により中空の貴金属
装飾品が製造され、中空の貴金属装飾品を繋ぎ合わせた
ネックレスやイヤリング等の貴金属装飾部品の前記繋ぎ
合わせはパイプとピン等を用いて行われるが、該装飾部
品とパイプ等が接合されていないとその隙間から水等が
該部品内に入り、それを除くことが極めて困難となるた
めに身に付けていると衣服等を汚すといった欠点があっ
た。又その欠点を解決するために部品とパイプ等をろう
付けすることが行われるが、使用するろう材は貴金属合
金でも比較的貴金属含有率の低いものが使用されるため
変色し易く、ろう付けした周辺が焼鈍されて軟化し易
く、かつ複雑な形状のものではろう付け作業に労力を費
やすという欠点があった。
[Prior art and its problems] Conventionally, hollow precious metal ornaments have been manufactured by electroforming, and pipes and pins are used to connect the precious metal ornaments such as necklaces and earrings. However, if the decorative part and the pipe are not joined, water or the like will enter the part through the gap and it will be extremely difficult to remove it. There was a flaw. Also, in order to solve the drawback, brazing of parts and pipes is performed, but since the brazing material used is a noble metal alloy having a relatively low content of noble metal, it is easily discolored and brazed. There is a drawback that the periphery is easily annealed and softened, and that a complicated shape requires labor for brazing work.

【0003】[0003]

【発明の目的】本発明は、上記従来技術の欠点を解決す
るために成されたもので、ピン等で繋ぎ合わせて使用さ
れる中空の貴金属装飾部品とパイプが一体となり隙間の
ない装飾部品を製造する方法を提供することを目的とす
る。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks of the prior art. A hollow precious metal decorative component used by connecting with a pin or the like and a pipe are integrated to form a decorative component without a gap. It is intended to provide a method for manufacturing.

【0004】[0004]

【問題点を解決するための手段】本発明は、繋ぎ合わせ
て使用される中空の貴金属装飾部品の製造方法におい
て、所望位置に貴金属又は貴金属合金のパイプを洞貫し
た導電性母材の表面に電気メッキを行って貴金属又は貴
金属合金の電気メッキ層を形成し、次いで前記導電性母
材を溶解して前記電気メッキ層により中空の前記貴金属
装飾部品の外形を形成することを特徴とする中空装飾部
品の製造方法である。
DISCLOSURE OF THE INVENTION The present invention is a method for producing a hollow noble metal decorative part used by joining together, in which a surface of a conductive base material penetrates a noble metal or noble metal alloy pipe at a desired position. Hollow decoration characterized by performing electroplating to form a noble metal or noble metal alloy electroplating layer, and then melting the conductive base material to form a hollow outer shape of the noble metal decorative component by the electroplating layer. It is a method of manufacturing a component.

【0005】以下本発明の詳細について説明する。本発
明方法により前記装飾部品を製造するには、まず必要と
する装飾部品の形状と同形の導電性母材を作製する。こ
の導電性母材の材質は、銀、銅及びその合金あるいは半
田であることが望ましく、これらの材料は白金や金等の
貴金属や貴金属合金を電気メッキし易い材料であるだけ
でなく、鋳造及び加工が極めて容易であり、更に貴金属
等を電気メッキした後、硝酸等の酸に容易に溶解して中
空の貴金属装飾部品を製造するに適するからである。
The details of the present invention will be described below. In order to manufacture the decorative component by the method of the present invention, first, a conductive base material having the same shape as the required decorative component is prepared. The material of this conductive base material is preferably silver, copper and its alloys or solders, and these materials are not only materials that are easy to electroplate precious metals or precious metal alloys such as platinum and gold, but also cast and This is because it is extremely easy to process and is suitable for producing a hollow precious metal decorative component by electroplating a precious metal or the like and then easily dissolving it in an acid such as nitric acid.

【0006】この導電性母材の作製法は特に限定されな
いが、例えば所望形状の装飾部品の中実状原型をデザイ
ンし、該原型から中空のゴム型を作製し、該ゴム型にワ
ックスを流し込んでワックスパターンを製造し、該ワッ
クスパターンの周囲を石膏で固めた後にワックスパター
ンを溶解して石膏型を形成し、該石膏型に導電性母材の
材料である銀や銅等の溶湯を流し込み次いで冷却して作
製することができる。そして本発明では所望箇所にパイ
プを洞貫させてある導電性母材を使用するが、前記パイ
プは所定形状に成形された導電性母材に該パイプを貫通
させて一体としても良いが、好ましくは該導電性母材の
成形用型の所要個所に前記パイプをセットし、前記導電
性母材用溶湯を前記型に流し込んで成形しパイプが洞貫
した導電性母材を作製することが工程を簡略化するため
にも望ましい。つまり前述した導電性母材を作製する過
程のワックスパターンを完成する前のゴム型の所望位置
に前記パイプをセットしワックスを注入して成形される
ワックスパターンと一体化するか、あるいは該ワックス
パターンを成形した後に該パターンの所望位置に前記パ
イプを洞貫させ石膏で覆い固めた後に加熱してワックス
を溶解除去し、該パイプが固定された石膏型内に前記導
電性母材の材料である溶湯を流し込み冷却してパイプが
洞貫した導電性母材を作製することができる。前記導電
性母材とパイプとの位置関係は所要の装飾部品の形状に
従って決めればよく、通常はパイプの両端が僅かに導電
性母材から突出するような相互関係とする。そして引続
き行う電気メッキのメッキ液が流れ込まないようにパイ
プの両端を樹脂等で塞ぐ。そして導電性母材とパイプと
の位置関係が次に行う電気メッキ時に変動する恐れがあ
る場合には両者をろう付け等により固定しておくことが
望ましい。
The method for producing the conductive base material is not particularly limited. For example, a solid prototype of a decorative part having a desired shape is designed, a hollow rubber mold is produced from the prototype, and wax is poured into the rubber mold. A wax pattern is produced, and after the wax pattern is solidified with gypsum, the wax pattern is melted to form a gypsum mold, and a molten metal such as silver or copper, which is a material of the conductive base material, is poured into the gypsum mold and then It can be prepared by cooling. And in the present invention, the conductive base material is used by piercing the pipe at a desired position, but the pipe may be formed by passing the pipe through the conductive base material formed into a predetermined shape, but is preferable. Is a step of setting the pipe at a required position of a mold for molding the conductive base material, pouring the molten metal for the conductive base material into the mold, and molding the pipe to make a conductive base material having a hollow pipe. It is also desirable to simplify. That is, the pipe is set at a desired position of the rubber mold before completing the wax pattern in the process of producing the conductive base material described above, and is integrated with the wax pattern formed by injecting wax, or the wax pattern is formed. After molding the pipe into the desired position of the pattern and covering with gypsum to harden it, the wax is dissolved and removed by heating, and the pipe is a material of the conductive base material in a gypsum mold fixed. It is possible to produce a conductive base material in which a molten metal is poured and cooled to form a pipe. The positional relationship between the conductive base material and the pipe may be determined according to the shape of the desired decorative component, and usually the mutual relationship is such that both ends of the pipe slightly project from the conductive base material. Then, both ends of the pipe are closed with a resin or the like so that the plating liquid of the electroplating that is subsequently performed does not flow in. If the positional relationship between the conductive base material and the pipe may change during the next electroplating, it is desirable to fix the two by brazing or the like.

【0007】次いで導電性母材の表面の任意個所に通電
用リード線を接続し、該導電性母材と対極を好ましくは
金や白金等の貴金属を含む電気メッキ浴中に浸漬しかつ
該導電性母材及び対極間に通電することにより、導電性
母材及びパイプの表面に貴金属又は貴金属合金の電気メ
ッキ層を形成する。前述のろう付けが行われていない場
合でも表面に形成される電気メッキ層により前記導電性
母材とパイプとは確実に一体化されてパイプの位置ずれ
や変形がなくなり精度良く固定することができ、かつ予
めろう付けを行った場合でもろうが電気メッキ層で被覆
され露出しないため、変色しあるいは軟化するといった
従来技術の欠点は解消される。そして電気メッキである
ため導電性母材が例えば多数の凹凸を有するような複雑
な形状でも電気メッキ浴中の電解液が該導電性母材及び
パイプ面に均一に接触して均一な電気メッキ層を形成す
ることができ、更に通電量を調節することで該電気メッ
キ層を任意の厚みにすることができる。
Then, a current-carrying lead wire is connected to an arbitrary position on the surface of the conductive base material, the conductive base material and the counter electrode are immersed in an electroplating bath containing a precious metal such as gold or platinum, and An electroplating layer of a noble metal or a noble metal alloy is formed on the surfaces of the conductive base material and the pipe by energizing the conductive base material and the counter electrode. Even if the above-mentioned brazing is not performed, the electroconductive base material and the pipe are securely integrated by the electroplating layer formed on the surface, and the pipe can be fixed accurately without displacement or deformation. Moreover, even when brazing is performed in advance, since the braze is covered with the electroplating layer and is not exposed, the drawbacks of the prior art such as discoloration or softening are eliminated. Since the electroplating is electroplating, even if the electroconductive base material has a complicated shape having, for example, a large number of irregularities, the electrolytic solution in the electroplating bath uniformly contacts the electroconductive base material and the pipe surface to form a uniform electroplating layer. Can be formed, and the electroplating layer can be made to have an arbitrary thickness by adjusting the amount of electric current.

【0008】次いで必要な厚みに電気メッキされた前記
導電性母材等を電気メッキ装置から取り出し、リード線
を取り除く。この状態で該導電性母材等を硝酸等の前記
導電性母材を溶解する溶液中に浸漬すると、前記リード
線が接続されていたため電気メッキ層が形成されず露出
している部分の導電性母材が前記硝酸等と接触して徐々
に内部に向かって溶解が進行し、最終的には導電性母材
全部を溶解して除去することができる。該導電性母材は
完全に溶解して除去することが望ましく、該導電性母材
が完全に溶解したか否かは、希硝酸溶液に浸漬して20〜
30分間加温した後、該希硝酸溶液中の導電性母材の金属
イオンを分析することで確認することができる。これに
より導電性母材と同形でリード線接続部に孔を有するパ
イプ付きの中空装飾部品が作製される。次いでこの装飾
部品を熱純水等で十分に洗浄し該装飾部品の表面及び内
部の不純物を除去し、温風乾燥した後、電気炉内で400
〜600 ℃に加熱して完全に水分を蒸発させ除去する。こ
の加熱温度を過度に高くすると前記装飾部品の変形や割
れ等が生ずるため好ましくない。次に前述の孔を塞ぐた
めに貴金属等の好ましくは前記電気メッキ層と同一材質
の貴金属でろう付けして所望形状を有する密閉された中
空の貴金属装飾部品を得ることができる。複数の該装飾
部品を適宜の手段で接続して、ネックレス、イヤリン
グ、ブレスレット、アンクレット、時計バンド等の貴金
属装飾品とすることができる。
Then, the electroconductive base material and the like electroplated to the required thickness are taken out from the electroplating apparatus, and the lead wire is removed. In this state, when the conductive base material or the like is immersed in a solution such as nitric acid that dissolves the conductive base material, the conductivity of the exposed portion where the electroplating layer is not formed because the lead wire is connected. The base material comes into contact with the nitric acid or the like to gradually dissolve toward the inside, and finally the entire conductive base material can be dissolved and removed. It is desirable to completely dissolve and remove the conductive base material. Whether the conductive base material is completely dissolved is determined by immersing in a dilute nitric acid solution for 20 to 20
After heating for 30 minutes, it can be confirmed by analyzing the metal ions of the conductive base material in the dilute nitric acid solution. As a result, a hollow decorative component with a pipe having the same shape as the conductive base material and having a hole in the lead wire connecting portion is produced. Next, this decorative part is thoroughly washed with hot pure water or the like to remove impurities on the surface and inside of the decorative part, dried with warm air, and then heated in an electric furnace at 400 ° C.
Heat to ~ 600 ° C to completely evaporate and remove water. If the heating temperature is excessively increased, the decorative component may be deformed or cracked, which is not preferable. Then, in order to block the above-mentioned holes, a sealed hollow precious metal decorative component having a desired shape can be obtained by brazing with a precious metal such as a precious metal, preferably the same material as the electroplated layer. A plurality of the ornamental parts can be connected by an appropriate means to form a precious metal ornament such as a necklace, an earring, a bracelet, an anklet and a watch band.

【0009】次に本発明方法により貴金属製の中空の装
飾部品を製造する要領を、添付図面に基づいて例示する
が、本発明は図示の例に限定されるものではない。図1
から図4は、それぞれ球状の母材上に貴金属を電気メッ
キにより被覆して中空の装飾部品を製造する一連の工程
を例示する縦断面図である。図1は両端が若干突出する
パイプ1が洞貫された銀や銅等から成る球状の導電性母
材2であり、該パイプ1と導電性母材2との接触部にろ
う3をろう付けして両者を固定するとともに、導電性母
材2の表面にリード線4を接続し、更に前記パイプ1の
両端に樹脂5を充填して図2に示す電気メッキ用導電性
母材とする。
Next, the procedure for manufacturing a hollow decorative component made of a noble metal by the method of the present invention will be illustrated with reference to the accompanying drawings, but the present invention is not limited to the illustrated examples. Figure 1
4 to 4 are vertical cross-sectional views illustrating a series of steps of manufacturing a hollow decorative component by coating a noble metal on a spherical base material by electroplating. FIG. 1 shows a spherical conductive base material 2 made of silver, copper, or the like, in which a pipe 1 with both ends slightly protruding is pierced, and a braze 3 is brazed to a contact portion between the pipe 1 and the conductive base material 2. Then, the two are fixed, the lead wire 4 is connected to the surface of the conductive base material 2, and the resin 5 is filled into both ends of the pipe 1 to obtain the conductive base material for electroplating shown in FIG.

【0010】次に図2のパイプ1付き導電性母材2を、
金や白金等の貴金属の化合物を溶解した電気メッキ浴に
浸漬し、通電して前記導電性母材2表面及び露出してい
るパイプ1表面に貴金属の電気メッキ層6を被覆する。
通電停止後前記電気メッキ浴から取り出し、かつ前記リ
ード線4を外すと図3に示すようにリード線孔7の部分
にのみ電気メッキ層6が形成されていない電気メッキさ
れた導電性母材2が得られる。この電気メッキ層6を有
する導電性母材2を希硝酸溶液等に浸漬すると、前記孔
7を通して該導電性母材2が希硝酸溶液と接触して溶解
し、最終的には該導電性母材2が完全に溶解し、次いで
前記孔7を貴金属8でろう付けし、更にパイプ1の両端
に充填された樹脂5を取り除くと図4に示した所望形状
の装飾部品を得ることができる。
Next, the conductive base material 2 with the pipe 1 shown in FIG.
The surface of the conductive base material 2 and the exposed surface of the pipe 1 are coated with a noble metal electroplating layer 6 by immersing in an electroplating bath in which a compound of a noble metal such as gold or platinum is dissolved.
When the lead wire 4 is taken out from the electroplating bath after the energization is stopped and the lead wire 4 is removed, the electroplated conductive base material 2 in which the electroplating layer 6 is not formed only in the lead wire hole 7 as shown in FIG. Is obtained. When the electroconductive base material 2 having the electroplated layer 6 is dipped in a dilute nitric acid solution or the like, the electroconductive base material 2 is contacted and dissolved with the dilute nitric acid solution through the holes 7, and finally the electroconductive base material 2 is dissolved. After the material 2 is completely melted, the hole 7 is brazed with the noble metal 8 and the resin 5 filled at both ends of the pipe 1 is removed, so that a decorative component having a desired shape shown in FIG. 4 can be obtained.

【0011】次に本発明方法の実施例を記載するが、該
実施例は本発明を限定するものではない。
Next, examples of the method of the present invention will be described, but the examples do not limit the present invention.

【実施例1】銀製の母材で直径10mmの球に18金製の外
径1mm、内径0.8 mmのパイプを貫通させて銀ろうで
固定し、該球の両側に3mmづつ突き出した状態とし、
熱硬化性樹脂でパイプの両側の穴を塞ぎ、球の側面に2
mmの銅のリード線をろう付けして金を100 ミクロンの
厚さに電気メッキした。金のメッキ浴は厚付けメッキ用
の浴(日本エレクトロプレーティングエンジニヤース
製:アートフォーム18)を使用し、メッキ条件は70℃、
1.5 A/dm2 で3時間行った。
Example 1 A sphere having a diameter of 10 mm made of a base material made of silver was made to penetrate a pipe made of 18-karat gold and having an outer diameter of 1 mm and an inner diameter of 0.8 mm and fixed with silver brazing, and the sphere was protruded by 3 mm on both sides,
Block the holes on both sides of the pipe with thermosetting resin,
mm of copper lead wire was brazed and gold was electroplated to a thickness of 100 microns. The gold plating bath uses a thick plating bath (manufactured by Nippon Electroplating Engineers: Art Form 18) and the plating conditions are 70 ° C.
It was carried out at 1.5 A / dm 2 for 3 hours.

【0012】次いでリード線を取り除き、希硝酸(1:
2)溶液中に金メッキした前記球を入れ、温度を60℃に
加熱して4時間処理し母材の銀を溶解したのち純水洗浄
し、その後新しい希硝酸(1:1.5 )溶液に入れて20分
間60℃で処理し、希硝酸溶液中の銀濃度を原子吸光法で
測定したところ銀を検出しなかったので80℃の熱純水で
十分に洗浄した後、ドライヤで温風乾燥し、400 ℃の電
気炉内で15分間加熱して水分を完全に除去した。次い
で、リード線を取り除いた部分の穴を厚み100 ミクロン
の金箔を用いて金ろうにてろう付けして塞ぎ、バフ研磨
して中空の球状にパイプが突き出た状態の装飾部品を得
た。先端にホワイトジルコニアの石を付けた金の撚り線
により上記の方法で得た金の中空の球を繋ぎ、止めガネ
を付けてイヤリングとした。製造したイヤリングを水中
に1時間漬けて取り出したところ、パイプ内には水が入
っていたが、中空の球の部分には水が入ることはなかっ
た。
Then, the lead wire is removed and diluted nitric acid (1:
2) Put the gold-plated spheres in the solution, heat to 60 ° C for 4 hours to dissolve the base material silver, wash with pure water, and then put in a new dilute nitric acid (1: 1.5) solution. It was treated at 60 ° C for 20 minutes, and when silver concentration in the dilute nitric acid solution was measured by atomic absorption spectrometry, no silver was detected, so after thoroughly washing with hot pure water at 80 ° C, dried with warm air with a dryer, Water was completely removed by heating in an electric furnace at 400 ° C for 15 minutes. Next, the hole where the lead wire was removed was brazed and closed with gold brazing using a gold foil having a thickness of 100 μm, and buffing was performed to obtain a decorative part with a hollow spherical pipe protruding. The gold hollow spheres obtained by the above method were connected by a gold strand having a tip of white zirconia stones, and a stopper was attached to form an earring. When the produced earrings were immersed in water for 1 hour and taken out, water was contained in the pipe, but water was not contained in the hollow ball portion.

【0013】[0013]

【実施例2】銅製の母材でV型のコマに白金90重量%パ
ラジウム10重量%の外径1mm、内径0.8 mmのパイプ
を先端部とVの開いた部分の3カ所にそれぞれ貫通させ
て両側に1mmづつ突き出した状態とし銀ろうで固定し
た。耐熱性ポリ塩化ビニル棒でパイプの両端の穴を塞
ぎ、V型の先端部裏面に2mmの銅のリード線をろう付
けし、白金を80ミクロンの厚さに電気メッキした。白金
のメッキ浴は白金厚付けメッキ浴(日本エレクトロプレ
ーティングエンジニヤース製:プラチナート100 )を使
用し、メッキ条件は90℃、2.5 A/dm2で3.5 時間行
った。
[Embodiment 2] A V-shaped piece made of a copper base material is penetrated with a pipe having an outer diameter of 1 mm and an inner diameter of 0.8 mm of 90% by weight of platinum and 10% by weight of palladium at three portions of the tip portion and the open portion of V. It was fixed with silver solder in a state of protruding by 1 mm on each side. The holes at both ends of the pipe were closed with a heat-resistant polyvinyl chloride rod, a 2 mm copper lead wire was brazed to the back surface of the V-shaped tip, and platinum was electroplated to a thickness of 80 μm. As the platinum plating bath, a platinum thick plating bath (manufactured by Nippon Electroplating Engineers: Platinate 100) was used, and the plating conditions were 90 ° C. and 2.5 A / dm 2 for 3.5 hours.

【0014】次いで、リード線を取り除き、希硝酸
(1:1)溶液中に白金メッキした前記コマを入れ、温
度を60℃に加熱して3時間処理し母材の銅を溶解したの
ち純水洗浄し、その後新しい希硝酸(2:1)溶液に入
れて20分間60℃で処理し、希硝酸溶液中の銅濃度を原子
吸光法で測定したところ銅を検出しなかったので80℃の
熱純水で十分に洗浄した後、ドライヤで温風乾燥し、60
0 ℃の電気炉内で15分間加熱して水分を完全に除去し
た。次いで、リード線を取り除いた部分の穴を厚み80ミ
クロンの白金箔を用いて白金ろうにてろう付けして塞
ぎ、バフ研磨して中空のV型にパイプが3カ所突き出た
状態の装飾部品を得た。この装飾部品をピンにより15個
繋ぎ合わせて時計の鎖とした。製造した時計の鎖を水中
に1時間漬けて取り出したところ、パイプ内には水が入
っていたが、中空のV型の部分には水が入ることはなか
った。
Then, the lead wire was removed, the platinum-plated piece was placed in a dilute nitric acid (1: 1) solution, the temperature was raised to 60 ° C., and the treatment was performed for 3 hours to dissolve the copper of the base material and then pure water. It was washed and then placed in a new dilute nitric acid (2: 1) solution and treated at 60 ° C for 20 minutes. The copper concentration in the dilute nitric acid solution was measured by atomic absorption spectrometry. After thoroughly washing with pure water, dry with warm air with a dryer and
Water was completely removed by heating in an electric furnace at 0 ° C for 15 minutes. Next, the hole where the lead wire was removed was brazed with platinum brazing using a platinum foil with a thickness of 80 microns, buffed, and a decorative part with a hollow V-shaped pipe with three protruding parts Obtained. Fifteen of these decorative parts were connected by pins to form a watch chain. When the manufactured watch chain was soaked in water for 1 hour and taken out, water was in the pipe, but water was not in the hollow V-shaped portion.

【0015】[0015]

【従来例】銀製の母材で直径10mmの球の対向する部分
に3mmのパイプを2カ所ろう付けし、球の側面に1.5
mmの銅のリード線をろう付けし、金を100 ミクロンの
厚さに電気メッキした。金のメッキ浴は実施例1と同じ
ものを用い、メッキ条件は実施例1と同様とし3時間メ
ッキを行った。次いでリード線を取り除き、実施例1と
同様の条件で希硝酸処理、純水洗浄及び新しい希硝酸
(1:1.5 )による処理を行った後、該希硝酸溶液中の
銀濃度を原子吸光法で測定したところ銀を検出しなかっ
たので80℃の熱純水で十分に洗浄した後、ドライヤで温
風乾燥し、400 ℃の電気炉内で15分間加熱して水分を完
全に除去した。
[Prior art example] A base material made of silver is brazed with two 3 mm pipes on opposite sides of a sphere having a diameter of 10 mm, and the side surface of the sphere is 1.5
mm mm copper leads were brazed and gold was electroplated to a thickness of 100 microns. The same gold plating bath as in Example 1 was used, the plating conditions were the same as in Example 1, and plating was performed for 3 hours. Then, the lead wire was removed, and after dilute nitric acid treatment, pure water washing and treatment with fresh dilute nitric acid (1: 1.5) under the same conditions as in Example 1, the silver concentration in the dilute nitric acid solution was determined by atomic absorption spectrometry. Since silver was not detected in the measurement, it was thoroughly washed with hot pure water at 80 ° C., dried with warm air in a dryer, and heated in an electric furnace at 400 ° C. for 15 minutes to completely remove water.

【0016】次いで、リード線を取り除いた部分の穴を
厚み100 ミクロンの金箔を用いて金ろうにてろう付けし
て塞ぎ、バフ研磨して中空の球状にパイプが突き出た状
態の装飾部品を得たが、パイプのセンタにズレが生じ
た。先端にホワイトジルコンの石を付けた金の撚り線に
より上記方法で得た金の中空の球を3個繋ぎ、止めガネ
を付けてイヤリングとした。製造したイヤリングを水中
に1時間漬けて取り出したところ、パイプ内から中空の
球に水が入ってしまい水を除くのが困難であった。
Next, the hole of the portion where the lead wire is removed is brazed and closed with a gold braze using a gold foil having a thickness of 100 μm, and buffing is performed to obtain a decorative part with a hollow spherical pipe protruding. However, the center of the pipe was misaligned. Three gold hollow spheres obtained by the above method were connected by a gold stranded wire having a tip of white zircon stone, and a stopper was attached to form an earring. When the manufactured earrings were immersed in water for 1 hour and taken out, it was difficult to remove the water because the hollow spheres contained water from inside the pipe.

【0017】[0017]

【実施例3】実施例1と同様な銀の母材に金のパイプを
洞貫したものを作製する際に、原型を用いて生ゴム加硫
してゴム型を作製し、その型の中心にパイプをセット
し、ワックスを注入固化してワックスパターンを完成
し、次いで石膏で覆って固定し、800 ℃で加熱しワック
スを溶解蒸発させ石膏の型内に金のパイプが固定された
状態とし、次いで銀の溶湯を注ぎ込み、冷却して金のパ
イプが洞貫した銀製母材を得た。又上記の金のパイプを
ワックスパターン完成後のものの中心に洞貫し固定した
後、石膏で固定し、800 ℃で加熱しワックスを溶解蒸発
させ石膏の型内に金のパイプが固定した状態とし、次い
で銀の溶湯を注ぎ込み、冷却して金のパイプが洞貫した
銀製母材を得た。上記方法で得た母材を使用して実施例
1と同様にメッキ操作し、母材を硝酸溶解して得た中空
の球状にパイプが突き出た状態のものを得たところ、実
施例1で得たものとほぼ同様のものが得られた。
[Example 3] When a gold base material was pierced into a silver base material similar to that of Example 1, raw rubber was vulcanized using a prototype to prepare a rubber mold, and the center of the mold was prepared. Set the pipe, inject and solidify the wax to complete the wax pattern, then fix by covering with gypsum, heating at 800 ° C to melt and evaporate the wax and fix the gold pipe in the gypsum mold, Then, a molten metal of silver was poured and cooled to obtain a silver base material having a gold pipe pierced. In addition, after fixing the gold pipe above the center of the one after completion of the wax pattern, fix it with gypsum and heat it at 800 ° C to dissolve and evaporate the wax and fix the gold pipe in the gypsum mold. Then, a molten metal of silver was poured and cooled to obtain a silver base material having a gold pipe pierced. Using the base material obtained by the above method, a plating operation was performed in the same manner as in Example 1 to obtain a hollow spherical tube obtained by dissolving the base material in nitric acid. Almost the same as that obtained was obtained.

【0018】[0018]

【発明の効果】本発明は、繋ぎ合わせて使用される中空
の貴金属装飾部品の製造方法において、所望位置に貴金
属又は貴金属合金のパイプを洞貫した導電性母材の表面
に電気メッキを行って貴金属又は貴金属合金の電気メッ
キ層を形成し、次いで前記導電性母材を溶解して前記電
気メッキ層により中空の前記貴金属装飾部品を形成する
ことを特徴とする中空装飾部品の製造方法(請求項1)
である。つまり本発明では、パイプが洞貫された導電性
母材の該パイプ及び導電性母材の表面に貴金属等の電気
メッキ層を被覆するようにしているため、前記パイプと
導電性母材が電気メッキ層により固定され電気メッキ前
に両者をろう付け等により固定していなくてもこの電気
メッキにより両者は確実に固定され、又電気メッキ前に
パイプと導電性母材をろう付けにより固定していても該
電気メッキ層が存在するためろう材の変色や軟化が生ず
ることがなく、従来技術の欠点が解消される。そして電
気メッキ後のリード線孔を介して希硝酸等と接触させて
導電性母材を溶解させ、更に該孔を所定の貴金属等でろ
う付けして塞ぐことにより、密閉された中空の所定形状
を有するパイプ付き装飾部品を得ることができる。本発
明方法により得られる装飾部品はパイプが洞貫し隙間が
存在しないため、水が該装飾部品内に進入することがな
く、該装飾部品を繋ぎ合わせてネックレス等として使用
しても、水で衣服を汚すことがなくなる。
INDUSTRIAL APPLICABILITY According to the present invention, in a method for producing a hollow precious metal decorative component to be used by joining together, electroplating is performed on a surface of a conductive base material that penetrates a pipe of a precious metal or a precious metal alloy at a desired position. A method for producing a hollow decorative component, characterized in that an electroplated layer of a noble metal or a noble metal alloy is formed, and then the conductive base material is melted to form the hollow precious metal decorative component by the electroplated layer. 1)
Is. That is, in the present invention, since the surfaces of the pipe and the conductive base material of the conductive base material in which the pipe is penetrated are coated with an electroplating layer such as a noble metal, the pipe and the conductive base material are electrically conductive. Even if both are fixed by the plating layer and not fixed by brazing before electroplating, both are securely fixed by this electroplating, and the pipe and conductive base material are fixed by brazing before electroplating. However, since the electroplating layer is present, discoloration or softening of the brazing material does not occur, and the drawbacks of the prior art are eliminated. Then, the conductive base material is melted by bringing it into contact with dilute nitric acid or the like through the lead wire hole after electroplating, and then the hole is brazed and closed with a predetermined precious metal or the like to form a closed hollow predetermined shape. It is possible to obtain a decorative part with a pipe having In the decorative part obtained by the method of the present invention, water does not enter into the decorative part because the pipe penetrates the cave and there is no gap, and even if the decorative part is connected and used as a necklace, etc. No more soiling your clothes.

【0019】更に導電性母材の形状と電気メッキ時の通
電量を調節することにより任意形状で任意厚みの装飾部
品を容易かつ大量に製造することが可能になる。電気メ
ッキ層は金や白金等の貴金属で形成することが望ましく
(請求項2)、装飾部品の表面を貴金属の有する高貴な
光沢で飾ることができる。更に前記パイプは、導電性母
材の型となるワックスパターンの完成前又は後にセット
して導電性母材に対する位置を正確に決定することが望
ましく(請求項3)、これにより高い精度でパイプの洞
貫位置を設定することができる。
Furthermore, by adjusting the shape of the conductive base material and the amount of electricity applied during electroplating, it becomes possible to easily and in large quantity manufacture decorative parts of arbitrary shapes and thicknesses. The electroplating layer is preferably formed of a noble metal such as gold or platinum (claim 2), and the surface of the decorative component can be decorated with the noble luster of the noble metal. Further, it is desirable that the pipe is set before or after completion of a wax pattern as a mold of the conductive base material to accurately determine the position with respect to the conductive base material (Claim 3). You can set the cave position.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明方法を一連の工程中、パイプが洞貫され
た導電性母材を例示する概略断面図。
FIG. 1 is a schematic cross-sectional view illustrating a conductive base material in which a pipe is hollowed during a series of steps of the method of the present invention.

【図2】同じく導電性母材にリード線を接続した状態を
例示する概略縦断面図。
FIG. 2 is a schematic vertical cross-sectional view illustrating a state where lead wires are similarly connected to the conductive base material.

【図3】導電性母材上に電気メッキ層を形成した状態を
例示する概略縦断面図。
FIG. 3 is a schematic vertical cross-sectional view illustrating a state in which an electroplating layer is formed on a conductive base material.

【図4】導電性母材を溶解しかつリード線孔をろう付け
して閉塞したパイプ付き装飾部品を例示する概略縦断面
図。
FIG. 4 is a schematic vertical cross-sectional view illustrating a decorative component with a pipe in which a conductive base material is melted and lead wire holes are brazed and closed.

【符号の説明】[Explanation of symbols]

1・・・パイプ 2・・・導電性母材 3・・・ろう材
4・・・リード線 5・・・樹脂 6・・・電気メッキ層 7・・・リード
線孔 8・・・貴金属
1 ... Pipe 2 ... Conductive base material 3 ... Brazing material 4 ... Lead wire 5 ... Resin 6 ... Electroplating layer 7 ... Lead wire hole 8 ... Noble metal

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成5年8月19日[Submission date] August 19, 1993

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】図面[Document name to be corrected] Drawing

【補正対象項目名】全図[Correction target item name] All drawings

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図1】 [Figure 1]

【図2】 [Fig. 2]

【図3】 [Figure 3]

【図4】 [Figure 4]

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 繋ぎ合わせて使用される中空の貴金属装
飾部品の製造方法において、所望位置に貴金属又は貴金
属合金のパイプを洞貫した導電性母材の表面に電気メッ
キを行って貴金属又は貴金属合金の電気メッキ層を形成
し、次いで前記導電性母材を溶解して前記電気メッキ層
により中空の前記貴金属装飾部品の外形を形成すること
を特徴とする中空装飾部品の製造方法。
1. A method for producing a hollow noble metal decorative component used by joining together, wherein the surface of a conductive base material that penetrates a noble metal or noble metal alloy pipe at a desired position is electroplated to form a noble metal or noble metal alloy. Forming an electroplated layer, and then dissolving the conductive base material to form the hollow external shape of the precious metal decorative component by the electroplated layer.
【請求項2】 前記電気メッキ用貴金属又は貴金属合金
が白金、金又はその合金である請求項1に記載の方法。
2. The method according to claim 1, wherein the noble metal or noble metal alloy for electroplating is platinum, gold or an alloy thereof.
【請求項3】 パイプを洞貫させた導電性母材を、該パ
イプを該導電性母材の型となるワックスパターンの完成
前又は後にセットする請求項1又は2に記載の方法。
3. The method according to claim 1, wherein the conductive base material that penetrates the pipe is set before or after the completion of the wax pattern that forms the mold of the conductive base material.
JP22464491A 1991-08-09 1991-08-09 Production of hollow ornaments Pending JPH0686708A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22464491A JPH0686708A (en) 1991-08-09 1991-08-09 Production of hollow ornaments

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22464491A JPH0686708A (en) 1991-08-09 1991-08-09 Production of hollow ornaments

Publications (1)

Publication Number Publication Date
JPH0686708A true JPH0686708A (en) 1994-03-29

Family

ID=16816951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22464491A Pending JPH0686708A (en) 1991-08-09 1991-08-09 Production of hollow ornaments

Country Status (1)

Country Link
JP (1) JPH0686708A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008114740A1 (en) * 2007-03-16 2008-09-25 National Institute Of Advanced Industrial Science And Technology Apparatus for generating gas having extremely low oxygen concentration, processing system, thin film deposition method and inert gas
JP2008229253A (en) * 2007-03-23 2008-10-02 Moriguchi Gosei:Kk Magnetic treatment accessory component, and method for manufacturing the same
JP2008231466A (en) * 2007-03-16 2008-10-02 National Institute Of Advanced Industrial & Technology Very-low oxygen concentration gas generating apparatus
JP2008272608A (en) * 2007-04-25 2008-11-13 National Institute Of Advanced Industrial & Technology Ultralow moisture gas generating device, inert gas, treating device and method for measuring moisture content in gas
JP2008272609A (en) * 2007-04-25 2008-11-13 National Institute Of Advanced Industrial & Technology Treating system and method for treating article to be treated

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008114740A1 (en) * 2007-03-16 2008-09-25 National Institute Of Advanced Industrial Science And Technology Apparatus for generating gas having extremely low oxygen concentration, processing system, thin film deposition method and inert gas
JP2008231466A (en) * 2007-03-16 2008-10-02 National Institute Of Advanced Industrial & Technology Very-low oxygen concentration gas generating apparatus
US8597732B2 (en) 2007-03-16 2013-12-03 National Institute Of Advanced Industrial Science And Technology Thin film depositing method
JP2008229253A (en) * 2007-03-23 2008-10-02 Moriguchi Gosei:Kk Magnetic treatment accessory component, and method for manufacturing the same
JP2008272608A (en) * 2007-04-25 2008-11-13 National Institute Of Advanced Industrial & Technology Ultralow moisture gas generating device, inert gas, treating device and method for measuring moisture content in gas
JP2008272609A (en) * 2007-04-25 2008-11-13 National Institute Of Advanced Industrial & Technology Treating system and method for treating article to be treated

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