JPH0685453A - Removal of solder - Google Patents
Removal of solderInfo
- Publication number
- JPH0685453A JPH0685453A JP4236201A JP23620192A JPH0685453A JP H0685453 A JPH0685453 A JP H0685453A JP 4236201 A JP4236201 A JP 4236201A JP 23620192 A JP23620192 A JP 23620192A JP H0685453 A JPH0685453 A JP H0685453A
- Authority
- JP
- Japan
- Prior art keywords
- component
- solder
- sintered material
- residual
- residual solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、はんだ除去方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder removing method.
【０００２】[0002]
【従来の技術】プリント基板にはんだ付けされたＬＳＩ
等の電子部品を何等かの理由により交換するために、電
子部品を除去した場合、プリント基板のパッド部、ある
いは、電子部品のリード等にはんだが残留し、基板上へ
の新たな電子部品のはんだ付け、あるいは、除去した電
子部品の再使用等が困難になるために、残留はんだを完
全に除去するのが望ましい。2. Description of the Related Art LSI soldered to a printed circuit board
When an electronic component is removed in order to replace it with another component for some reason, the solder remains on the pads of the printed circuit board, the leads of the electronic component, etc. It is desirable to completely remove the residual solder because it becomes difficult to solder or reuse the removed electronic component.
【０００３】そして、従来、かかる残留はんだの除去方
法としては、溶融状態のはんだを吸引性の良好なパッ
ド、あるいは網目状のはんだ吸い取り線等に吸い込ませ
ることが行われていた。Conventionally, as a method of removing such residual solder, a molten solder has been sucked into a pad having a good suction property, a mesh-shaped solder sucking wire, or the like.
【０００４】[0004]
【発明が解決しようとする課題】しかし、上述した従来
例においては、吸引パッド径やはんだ吸い取り線を線径
に限りがあるために、残留はんだの吸い取りは、何回か
に分けて行う必要があり、作業性が悪い上に、はんだ面
の均一性の保証がなされないという欠点を有するもので
あった。However, in the above-mentioned conventional example, since the suction pad diameter and the solder sucking wire have a limited wire diameter, it is necessary to suck the residual solder in several steps. However, the workability is poor, and the uniformity of the solder surface is not guaranteed.
【０００５】本発明は、以上の欠点を解消すべくなされ
たものであって、作業性が良好で、かつ、除去の信頼性
の高いはんだ除去方法を提供することを目的とする。The present invention has been made to solve the above drawbacks, and an object of the present invention is to provide a solder removing method which has good workability and high reliability of removal.
【０００６】[0006]
【課題を解決するための手段】本発明によれば上記目的
は、実施例に対応する図１（ａ）に示すように、メッシ
ュの粗い焼結材１上に残留はんだ２が付着した部品３を
載置し、溶融した残留はんだ２を焼結材１により吸引除
去するはんだ除去方法を提供することにより達成され
る。According to the present invention, the above object is achieved by a component 3 having residual solder 2 adhered on a coarse mesh sintered material 1 as shown in FIG. 1 (a) corresponding to an embodiment. Is carried out and the molten residual solder 2 is removed by suction with the sintered material 1.
【０００７】また、図１（ｂ）に示すように、メッシュ
の粗い焼結材１を残留はんだ２が付着した部品３上に載
置し、溶融した残留はんだ２を焼結材１により吸引除去
することも可能であり、さらに、図２のように、部品３
を適宜の加圧手段４により焼結材１に押し付けることも
可能である。Further, as shown in FIG. 1B, the sintered material 1 having a coarse mesh is placed on the component 3 to which the residual solder 2 is attached, and the molten residual solder 2 is removed by suction with the sintered material 1. In addition, as shown in FIG.
It is also possible to press against the sintered material 1 by an appropriate pressurizing means 4.
【０００８】[0008]
【作用】焼結材１は、メッシュを粗く形成されており、
その上面、あるいは下面に当接した部品３の残留はんだ
２を吸引し、該部品３からの残留はんだ２の除去が行な
われる。[Function] The sintered material 1 has a coarse mesh,
The residual solder 2 of the component 3 that is in contact with the upper surface or the lower surface is sucked, and the residual solder 2 is removed from the component 3.
【０００９】焼結材１は、任意の大きさに形成すること
ができるために、一括のはんだ除去が可能となり、従来
例の欠点を解消することが可能となる。Since the sintered material 1 can be formed in an arbitrary size, it is possible to remove the solder all at once, and it is possible to eliminate the drawbacks of the conventional example.
【００１０】[0010]
【実施例】以下、本発明の望ましい実施例を添付図面に
基づいて詳細に説明する。図１に本発明の第１の実施例
を示す。焼結材１は、青銅（Ｃｕ−Ｓｎ）、銅（Ｃ
ｕ）、あるいは洋白（Ｃｕ−Ｚｎ−Ｎｉ）等の材料を焼
結して形成された板状体で、粉体間には充分な空隙が残
留してメッシュが粗くなるように、焼結条件が決定され
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 shows a first embodiment of the present invention. The sintered material 1 is bronze (Cu-Sn), copper (C
u), or a plate-shaped body formed by sintering a material such as nickel-white (Cu-Zn-Ni), and sintering so that sufficient voids remain between the powders and the mesh becomes coarse. The conditions are determined.
【００１１】３は残留はんだ２が付着したＬＳＩ素子等
の部品であり、この残留はんだ２を除去するために、部
品３を焼結材１の上に載置する。焼結材１は、予め、あ
るいは、部品３を載せた状態で加熱され、溶融状態とな
った残留はんだ２は、焼結材１の空隙に吸引されて部品
３から完全に除去される。Reference numeral 3 denotes a component such as an LSI element to which the residual solder 2 is attached. In order to remove the residual solder 2, the component 3 is placed on the sintered material 1. The sintered material 1 is heated in advance or in a state where the component 3 is placed, and the residual solder 2 in a molten state is sucked into the void of the sintered material 1 and completely removed from the component 3.
【００１２】なお、焼結材１は、任意の大きさに形成す
ることが可能であるが、例えば、ＬＳＩの面積と略等し
く形成した場合には、ＬＳＩ単位で残留はんだ２の除去
を行なうことができ、それ以上の大きさに形成する場合
には、複数のＬＳＩを同時に処理することが可能とな
り、作業性、あるいは保管性等を考慮して適宜決定可能
である。The sintered material 1 can be formed to have an arbitrary size. For example, when the sintered material 1 is formed to have an area substantially equal to that of the LSI, the residual solder 2 should be removed in LSI units. When it is formed in a larger size, it is possible to process a plurality of LSIs at the same time, and it can be appropriately determined in consideration of workability, storability, and the like.
【００１３】また、以上の説明においては、部品３とし
てＬＳＩ素子を例に取って説明したが、この他に、プリ
ント基板を燒結合金上に載せて処理することも可能であ
り、部品３を焼結材１に仮保持するために、残留はんだ
２側、あるいは、焼結材１側にフラックスを塗布してお
くことも可能である。さらに、焼結材１、あるいは部品
３の加熱手段としては、ベーパ雰囲気、レーザー、ホッ
トプレート、焼成炉等、種々のものを利用することが可
能である。In the above description, an LSI element is taken as an example of the component 3, but in addition to this, it is also possible to place a printed circuit board on a sinter-bonded plate for processing, and burn the component 3. It is also possible to apply flux to the residual solder 2 side or the sintered material 1 side in order to temporarily hold it on the binder 1. Further, as a heating means for the sintered material 1 or the component 3, various things such as a vapor atmosphere, a laser, a hot plate, a firing furnace, etc. can be used.
【００１４】なお、図１（ａ）においては、焼結材１の
上面に部品３を載置する場合を示したが、本発明は、こ
れに限られず、図１（ｂ）に示すように、処理する部品
３上に焼結材１を載せてはんだ吸引を行なうことも可能
である。なお、図１（ｂ）の例は、プリント基板上の残
留はんだ２の処理に有効な実施例であるが、これに限ら
れず、ＬＳＩ等の素子についても適用可能である。Although FIG. 1 (a) shows the case where the component 3 is placed on the upper surface of the sintered material 1, the present invention is not limited to this, and as shown in FIG. 1 (b). It is also possible to place the sintered material 1 on the component 3 to be processed and perform solder suction. Although the example of FIG. 1B is an example effective for treating the residual solder 2 on the printed circuit board, the present invention is not limited to this, and is applicable to an element such as an LSI.
【００１５】図２に本発明の第２の実施例を示す。この
実施例は、上述した第１の実施例において、部品３の上
に重り等の加圧手段４を載置した場合を示すものであ
る。なお、加圧手段４としては、図２（ａ）に示したも
の以外に、例えば図２（ｂ）に示すように、スプリング
５の付勢力を利用することも可能である。FIG. 2 shows a second embodiment of the present invention. This embodiment shows a case where the pressing means 4 such as a weight is placed on the component 3 in the first embodiment described above. As the pressurizing means 4, it is possible to use the urging force of the spring 5, as shown in FIG. 2B, for example, other than the one shown in FIG.
【００１６】さらに、図２の実施例においては、部品３
を焼結材１上に載せて、部品３の上部から加圧した場合
が示されているが、図１（ｂ）のように、部品３に焼結
材１を載せる場合にも適用が可能である。Furthermore, in the embodiment of FIG.
Is shown on the sintered material 1 and pressure is applied from the upper part of the component 3, but it is also applicable when the sintered material 1 is placed on the component 3 as shown in FIG. 1 (b). Is.
【００１７】[0017]
【発明の効果】以上の説明から明らかなように、本発明
によれば、複数箇所の残留はんだを一括して除去するこ
とができるために、作業性を向上させることができる上
に、作業後の面状態の均一性を向上させることができ
る。As is apparent from the above description, according to the present invention, it is possible to collectively remove the residual solder at a plurality of locations, so that the workability can be improved, and after the work is completed. It is possible to improve the uniformity of the surface state.
【００１８】さらに、はんだ吸い取り線等を使用しない
ために、例えばパッドを擦過することがなく、パッド剥
離、あるいはバンプの脱離等の不具合を確実に防止する
ことができる。Further, since no solder sucking wire or the like is used, it is possible to reliably prevent problems such as pad peeling or bump detachment without rubbing the pad.
【図１】本発明の実施例を示す説明図である。FIG. 1 is an explanatory diagram showing an embodiment of the present invention.
【図２】本発明の第２の実施例を示す説明図である。FIG. 2 is an explanatory diagram showing a second embodiment of the present invention.
１ 焼結材 ２ 残留はんだ ３ 部品 ４ 加圧手段 1 Sintered material 2 Residual solder 3 Parts 4 Pressurizing means
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山内 勝利 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masaru Yamauchi 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited
Claims (3)
(２)が付着した部品(３)を載置し、溶融した残留はんだ
(２)を焼結材(１)により吸引除去するはんだ除去方法。1. Residual solder on a coarse mesh sintered material (1)
Part (3) with (2) attached is placed and molten solder
A solder removal method in which (2) is removed by suction using the sintered material (1).
(２)が付着した部品(３)上に載置し、溶融した残留はん
だ(２)を焼結材(１)により吸引除去するはんだ除去方
法。2. Sintered material (1) having a coarse mesh is used as residual solder.
A method of removing a solder, which is placed on a component (3) to which (2) is attached, and the molten residual solder (2) is sucked and removed by a sintered material (1).
焼結材(１)に押し付ける請求項１または２記載のはんだ
除去方法。3. The method for removing solder according to claim 1, wherein the component (3) is pressed against the sintered material (1) by an appropriate pressurizing means (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4236201A JPH0685453A (en) | 1992-09-03 | 1992-09-03 | Removal of solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4236201A JPH0685453A (en) | 1992-09-03 | 1992-09-03 | Removal of solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0685453A true JPH0685453A (en) | 1994-03-25 |
Family
ID=16997284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4236201A Withdrawn JPH0685453A (en) | 1992-09-03 | 1992-09-03 | Removal of solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0685453A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003023024A (en) * | 2001-07-09 | 2003-01-24 | Hitachi Ltd | Solder bump leveling method |
| JP2012157903A (en) * | 2011-01-28 | 2012-08-23 | Raytheon Co | Gold removal from electronic component |
-
1992
- 1992-09-03 JP JP4236201A patent/JPH0685453A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003023024A (en) * | 2001-07-09 | 2003-01-24 | Hitachi Ltd | Solder bump leveling method |
| JP4509430B2 (en) * | 2001-07-09 | 2010-07-21 | 株式会社日立製作所 | Solder bump leveling method |
| JP2012157903A (en) * | 2011-01-28 | 2012-08-23 | Raytheon Co | Gold removal from electronic component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991130 |