JPH0684977A - Apparatus for mounting semiconductor chip - Google Patents

Abstract

PURPOSE:To provide an apparatus for mounting a semiconductor chip in which the chip can be rapidly and accurately positioned in the case of fixing the chip to a board and a production efficiency can be improved. CONSTITUTION:A positioning mechanism is provided between a semiconductor chip holding mechanism 2 and a board holding mechanism 4. In the positioning mechanism, an image of a semiconductor chip 1 incident from an upper part to an optical waveguide 6 through a window 7 is reflected by a half mirror 9, and advanced to a left of the drawing in the waveguide 6. On the other hand, the image of a board 3 incident from a lower part into the waveguide 6 through a window 8 is once reflected by the mirror 9 to a totally reflecting mirror 10 side, then reflected by the mirror 10, passed through the mirror 9, and advanced to a left of the drawing in the waveguide 6. Thus, a combined image made by superposing the image of a lower surface of the chip 1 on the image of an upper surface of the board 3 is formed at a left side of the waveguide 6, and imaged by a television camera 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip mounting apparatus.

[0002]

2. Description of the Related Art In recent years, an electronic circuit device using a semiconductor device tends to have a large circuit network. Therefore, the semiconductor device is required to be miniaturized by high integration. Further, in order to meet such requirements, semiconductor chips have been used without being packaged, and recently, a so-called multi-chip in which a plurality of unpackaged semiconductor chips are mounted on a substrate is used. Modules (MCM) are being developed.

[0003]

When mass-producing the above-mentioned multi-chip module, the electrodes of the semiconductor chip and the electrodes formed on the substrate must be firmly fixed to each other. Therefore, it is necessary to accurately position the semiconductor chip at a predetermined position on the substrate, but a large number of electrodes are arranged on the semiconductor chip at a narrow pitch, and these electrodes and the electrodes formed on the substrate are arranged. It is difficult to perform accurate and quick positioning, and it takes a long time to perform positioning, which causes a decrease in throughput, and there is a problem that a defect occurs due to a deviation of a semiconductor chip and a yield is decreased.

The present invention has been made in response to such a conventional situation, and the semiconductor chip can be positioned quickly and accurately when the semiconductor chip is fixed to the substrate, and the production efficiency can be improved. It is intended to provide a chip mounting device.

[0005]

That is, a semiconductor chip mounting apparatus according to the present invention according to claim 1 uses a positioning mechanism to position a semiconductor chip held by a semiconductor chip holding mechanism and a substrate held by the substrate holding mechanism. After positioning
In a semiconductor chip mounting apparatus for fixing the semiconductor chip to the substrate, the positioning mechanism is configured to be insertable between the semiconductor chip holding mechanism and the substrate holding mechanism, and the image of the semiconductor chip and the substrate An optical system for forming an image on which an image is superimposed is provided.

According to a second aspect of the present invention, in the semiconductor chip mounting apparatus of the present invention, the semiconductor chip held by the semiconductor chip holding mechanism and the substrate held by the substrate holding mechanism are positioned by the positioning mechanism, and then the semiconductor chip is mounted. In a semiconductor chip mounting device for fixing a chip to the substrate, the positioning mechanism is configured to be insertable between the semiconductor chip holding mechanism and the substrate holding mechanism, and displays an image of the semiconductor chip and an image of the substrate. It is characterized by comprising an optical system for forming a superposed image and an image pickup camera for picking up an image by this optical system.

According to a third aspect of the semiconductor chip mounting apparatus of the present invention, the semiconductor chip held by the semiconductor chip holding mechanism and the substrate held by the substrate holding mechanism are positioned by the positioning mechanism, and then the semiconductor chip is mounted. In a semiconductor chip mounting device for fixing a chip to the substrate, the positioning mechanism is configured to be insertable between the semiconductor chip holding mechanism and the substrate holding mechanism, and displays an image of the semiconductor chip and an image of the substrate. It is characterized in that it is provided with an optical system for forming a superposed image and an imaging camera with variable imaging magnification for picking up an image by this optical system.

[0008]

In the semiconductor chip mounting apparatus of the present invention having the above-described structure, the optical system of the positioning mechanism forms an image in which the image of the semiconductor chip and the image of the substrate are superposed by a combination of, for example, a total reflection mirror and a half mirror. Form. Therefore, by inserting this optical system between the semiconductor chip holding mechanism and the substrate holding mechanism and capturing the image with an imaging camera or the like, an image displayed so that the electrodes of the semiconductor chip and the electrodes of the substrate overlap with each other. Can be easily and accurately positioned by displaying or analyzing the image. Then, when the positioning is completed, the optical system can be retracted to bring the semiconductor chip holding mechanism and the substrate holding mechanism into close proximity to each other, and the electrodes of the semiconductor chip and the electrodes of the substrate can be brought into contact with each other and fixed. This makes it possible to improve throughput and yield.

Further, after the positioning, the semiconductor chip or the substrate is moved vertically, for example, and brought into close proximity as it is, so that the positional deviation does not occur after the positioning due to an error of the driving mechanism. That is, the semiconductor chip is imaged at a position other than the fixing position where the semiconductor chip is fixed to the substrate, for example, at an imaging position such as a side of the fixing position, and the direction and amount of deviation of the semiconductor chip from the reference position are determined. When the semiconductor chip is detected by image recognition technology and the semiconductor chip is transported from the imaging position to the mounting position by controlling the transport amount according to the direction and amount of this displacement, the displacement occurs due to the error in the position of the transport mechanism. However, in the semiconductor chip mounting apparatus of the present invention, the positional deviation does not occur due to such a cause.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIGS. 1 and 2, in the semiconductor chip mounting apparatus of this embodiment, an unpackaged semiconductor chip 1 can be adsorbed and held by, for example, a vacuum chuck or the like. A semiconductor chip holding mechanism 2 configured to be movable in X, Y, Z and θ directions is provided. Further, below the substrate support mechanism 2, a substrate holding mechanism 4 configured to be capable of sucking and holding the substrate 3 on which the semiconductor chip 1 is mounted by, for example, a vacuum chuck or the like is provided.

The substrate holding mechanism can handle different types of semiconductor chips 1 and different substrates 3 on which the chips are mounted.

A positioning mechanism 5 is provided between the semiconductor chip holding mechanism 2 and the substrate holding mechanism 4. The positioning mechanism 5 is provided with a cylindrical optical waveguide 6 arranged substantially horizontally, and a part of the optical waveguide 6, for example, a central portion, has windows 7 on its upper surface and lower surface, respectively. ,
8 are provided. These windows 7 and 8 are provided at the same position so as to vertically penetrate the optical waveguide 6 as shown in FIG. 1, and a half mirror 9 is arranged in the middle of these windows 7 and 8. ing.

A total reflection mirror 10 is provided on the side of the half mirror 9 (on the right side in FIG. 1), and an optical system is formed by the optical waveguide 6, the half mirror 9, the total reflection mirror 10 and the like. It is configured. Then, at the end of the optical waveguide 6, there is provided a television camera 11 having a variable imaging magnification for capturing an image from this optical system. The optical waveguide 6 is picked up between the semiconductor chip holding mechanism 2 and the substrate holding mechanism 4 by a driving mechanism such as a guide rail and a driving motor (not shown), and the semiconductor chip holding mechanism 2 and the substrate holding mechanism 4 are picked up. It is freely movable between the retracted position and the retracted position.

In the optical system having the above structure, the image on the lower surface of the semiconductor chip 1 which has entered the optical waveguide 6 through the window 7 from the upper portion is reflected by the half mirror 9 as shown by the arrow in FIG. , Proceeds in the optical waveguide 6 to the left side in the figure. On the other hand, the image on the upper surface of the substrate 3 that has entered the inside of the optical waveguide 6 through the window 8 from the lower portion is once reflected by the half mirror 9 toward the total reflection mirror 10 side, and then by the total reflection mirror 10 to be half reflected. Optical waveguide 6 transmitted through mirror 9
Proceed inside to the left in the figure. As a result, an image in which the image of the lower surface of the semiconductor chip 1 and the image of the upper surface of the substrate 3 are superimposed is formed on the left side of the optical waveguide 6, and the image is captured by the television camera 11. The image captured by the television camera 11 is displayed on a display device such as a CRT 12, and is input to the image analysis device 13. Further, the analysis result by the image analysis device 13 is input to the drive control device 14 that controls the drive of the semiconductor chip holding mechanism 2.

In the semiconductor chip mounting apparatus of this embodiment having the above-described structure, the substrate 3 is placed on the substrate holding mechanism 4 and suction-held by a transport mechanism or the like (not shown). At the same time, the semiconductor chip holding mechanism 2 sucks and holds the semiconductor chips 1 accommodated in the tray from a tray (not shown) or the like, and arranges them at a predetermined position above the substrate 3 sucked and held by the substrate holding mechanism 4. To do.

Further, the above method can be applied to different types of semiconductor chips 1.

After that, the optical waveguide 6, which has been retracted to the retracted position in advance, is inserted between the semiconductor chip 1 and the substrate 3, and an image in which the image of the lower surface of the semiconductor chip 1 and the image of the upper surface of the substrate 3 are superimposed is displayed. The image is taken by the TV camera 11.

The image captured by the television camera 11 is displayed on the CRT 12, and the image analysis device 13 determines whether or not the semiconductor chip 1 and the substrate 3 are arranged in a predetermined positional relationship. If there is a positional shift, the direction and amount of the positional shift are calculated. At this time, on the screen projected on the CRT 12, it is possible to confirm the presence or absence of misalignment depending on whether the electrodes of the semiconductor chip 1 and the electrodes of the substrate 3 overlap.

Then, the information about the positional deviation is input to the drive controller 14, and the drive controller 14 drives the semiconductor chip holding mechanism 2 to correct the position of the semiconductor chip 1. At this time, if necessary, first, image pickup and position correction are performed by an image pickup magnification such that the entire image of the semiconductor chip 1 is displayed, and thereafter, information regarding positional deviation is increased from the enlarged image by increasing the image pickup magnification. You may make it collect.

After such position correction, the image analysis device 13 again determines the positional relationship between the semiconductor chip 1 and the substrate 3, and it is confirmed by the position correction that these positional relationships are within the allowable range. Then, the optical waveguide 6 is retracted to the retracted position, the semiconductor chip 1 is lowered by the semiconductor chip holding mechanism 2, and the electrode of the semiconductor chip 1 and the electrode of the substrate 3 are brought into contact with each other to fix them. Note that such fixing of the electrodes can be performed by a well-known surface mounting technique such as a method of previously providing solder bumps or the like on the electrodes of the substrate 3.

As described above, in this embodiment, the semiconductor chip 1 and the substrate 3 can be positioned easily and accurately. Further, after the positioning, the semiconductor chip 1 (or the substrate 3) is moved in the vertical direction and brought into close proximity as it is. The semiconductor chip 1 can be mounted. This makes it possible to improve throughput and yield.

In the above embodiment, the substrate holding mechanism 4 is fixed and the semiconductor chip holding mechanism 2 is driven. However, even if the substrate holding mechanism 4 is driven, both of them are driven. Of course, it is okay. Further, instead of using the image analysis device 13, a staff member may manually position while watching the display of the CRT 12.

[0024]

As described above, according to the semiconductor chip mounting apparatus of the present invention, the positioning when fixing the semiconductor chip to the substrate can be performed quickly and accurately, and the production efficiency can be improved. You can

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a semiconductor chip mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of the semiconductor chip mounting apparatus of FIG.

[Explanation of symbols]

 1 Semiconductor Chip 2 Semiconductor Chip Holding Mechanism 3 Substrate 4 Substrate Holding Mechanism 5 Positioning Mechanism 6 Optical Waveguide 7, 8 Window 9 Half Mirror 10 Total Reflection Mirror 11 Television Camera 12 CRT 13 Image Analysis Device 14 Drive Controller

Claims (3)

[Claims] 1. A semiconductor chip mounting apparatus, comprising: positioning a semiconductor chip held by a semiconductor chip holding mechanism and a substrate held by a substrate holding mechanism by a positioning mechanism; and fixing the semiconductor chip to the substrate. The positioning mechanism is configured to be insertable between the semiconductor chip holding mechanism and the substrate holding mechanism, and includes an optical system that forms an image in which the image of the semiconductor chip and the image of the substrate are superimposed. Semiconductor chip mounting device. 2. A semiconductor chip mounting apparatus for fixing the semiconductor chip to the substrate after positioning the semiconductor chip held by the semiconductor chip holding mechanism and the substrate held by the substrate holding mechanism by a positioning mechanism. The positioning mechanism is configured so that it can be inserted between the semiconductor chip holding mechanism and the substrate holding mechanism, and an optical system that forms an image in which the image of the semiconductor chip and the image of the substrate are superimposed, and an image by this optical system. An image pickup camera for picking up an image of a semiconductor chip mounting apparatus. 3. A semiconductor chip mounting apparatus for fixing a semiconductor chip held by a semiconductor chip holding mechanism and a substrate held by a substrate holding mechanism by a positioning mechanism, and then fixing the semiconductor chip to the substrate, The positioning mechanism is configured so that it can be inserted between the semiconductor chip holding mechanism and the substrate holding mechanism, and an optical system that forms an image in which the image of the semiconductor chip and the image of the substrate are superimposed, and an image by this optical system. An image pickup camera having a variable image pickup magnification for picking up an image of a semiconductor chip mounting apparatus.