JPH0682477A - Sensor device - Google Patents

Abstract

PURPOSE:To simplify the assembling process of a sensor element and to enhance the assembling accuracy by simplyfing positioning of the sensor element and to provide a sensor device of enhanced reliability. CONSTITUTION:A connecting lead 19, projecting from an end face 17 of a base 16 and passed through and connected to a circuit board 12 on which a Hall IC 10 is mounted, has a curved portion 18 formed therein, and a projecting portion 20 in which a supporting groove 21 for supporting the circuit board 12 is formed, is provided around the end face 17 of the base 16. The connecting lead 19 is passed through the circuit board 12 and the circuit board 12 is fitted into the supporting groove 21 of the projecting portion 20 and supported so as to facilitate and simplify positioning. Also, error caused by positioning and stress applied to a soldering portion are both absorbed by the curved portion 18 so as to enhance assembling accuracy and reliability. A holder 11 assembled is fitted into a housing 13 and sealed by a sealing member 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a projecting portion for mounting a circuit board on the tip surface of a base of a holder comprising a base and a connecting lead penetrating the base and projecting from the tip surface. By providing the bent portion on the connection lead, it is possible to easily align the sensor element mounted on the circuit board, simplify the assembly process and improve the assembly accuracy, and at the same time improve the reliability. The present invention also relates to a sensor device.

[0002]

2. Description of the Related Art As a sensor device in which a sensor element for detecting magnetism, temperature, etc. is mounted on a circuit board and the outside is surrounded by a protective housing to be used, for example, a circuit board 2 on which a magnetoelectric conversion element 1 is mounted is shown in FIG. Is placed on the electrode of the connection lead 4 which is penetrated through the holder 3 and exposed at the tip end surface thereof, the circuit board 2 and the holder 3 placed on the holder 3 are surrounded by the housing 5, and the sealing member 6 is provided. There is a rotation sensor for automobiles sealed with.

In such a rotation sensor for an automobile, conventionally, in order to position the circuit board 2 and take out a detection signal from the circuit board 2, it faces an electrode formed at the end of the connecting lead 4 on the end surface of the holder 3. An output electrode is provided on the back surface of the circuit board 2, and solder bumps 7 having a solder coating on a copper core are arranged between the electrodes to melt the solder by heating on a hot plate, and the like. When both electrodes are connected by soldering due to the surface tension of the solder, the sensor element 1 of the circuit board is abutted against the inner wall of the housing 5 for vertical positioning and connection.

In the case of using the solder bumps 7 described above, the circuit board 2 has its electrodes and the electrodes of the connection leads 4 on the end face of the holder 3 supported by soldering with the solder having the solder bumps 7 melted. However, both electrodes, which do not originally support mechanical force but are supported by soldering for electrical connection, are weak against impact force, pressure, etc., and there is a risk of causing wire breakage, etc. Therefore, there are many concerns about the mechanical reliability.

Therefore, as shown in FIG. 7, a recess is provided at the tip of the holder 3, and the end of the circuit board 2 is brought into contact with the side wall of the recess to support the mechanical force applied to the circuit board 2. However, as long as the connection between the circuit board 2 and the connection lead 4 is performed by a so-called abutting method using soldering with the solder bumps 7, a molding error between the circuit board 2 and the holder 3, thermal expansion and contraction, All the distortions and the like will be added to the soldered portion of the solder bump 7 as stress, and there is a concern that the wire will be broken due to solder cracking or peeling.

For this reason, resin is poured into the tip of the holder 3 in the housing 5 shown in FIG.
Although the circuit board 2 is often fixed by a so-called potting method or the like, an external impact is applied to the soldering portion of the solder bump 7 through the resin, and the resin solidified by flowing causes distortion. It is conceivable that unnecessary stress may be applied to the soldered portion to cause wire breakage due to solder cracking, solder peeling, or the like, as described above.

As one of the solutions to these problems, FIG.
It is conceivable that the circuit board 2 is supported, positioned and electrically connected by the connection leads 4 penetrating the circuit board 2 which are directly soldered to the circuit board 2, as shown in FIG.

[0008]

However, in the case where the above-mentioned circuit board is supported by the connection lead penetrating the circuit board directly soldered to the circuit board, for example, the through hole of the connection lead of the circuit board is formed. If there is a deviation between the position and the position of the connection lead, the attachment cannot be performed, so that the processing accuracy of the constituent members such as the holder, the circuit board, and the connection lead must be increased, and there is a problem that the cost becomes high.

Further, since the circuit board and the connection leads are fixed after the assembly, thermal expansion and contraction after assembly and external impact are directly applied as stress to the soldered portions between the connection leads and the circuit board. There is also a problem of causing troubles such as solder cracks and peeling.

Therefore, an object of the present invention is to absorb or reduce processing errors and mounting errors of the holder, the circuit board and the connection leads, and thermal expansion and contraction of the soldered portion between the circuit board and the connection leads, and external shocks. It is to provide a sensor device that can be used.

[0011]

In order to solve the above-mentioned problems, in the sensor device of the present invention, one end where the bent portion is formed is projected from the tip end surface of the base and the other end is penetrated. A connection groove connected to a connection wire connected to an external circuit is formed, and a support groove is formed on the connection lead side in parallel with the front end surface around the connection lead protruding from the front end surface of the base. A holder having a protruding portion, a sensor element mounted on the holder, and a peripheral end portion fitted into a supporting groove of the protruding portion. The connection is placed on the protruding portion and protrudes from the tip surface of the base. A housing in which the ends of the leads are penetrated through the bent portion and which is equipped with a connection terminal to be connected by soldering and the base of the holder, and which is fitted from the end of the base to cover the base. And fit into the housing and the housing It was a structure comprising a sealing member for sealing the holder to be.

At this time, the tip of the projection may be configured to project from the circuit board mounted on the projection or the sensor element mounted on the circuit board.

Further, the connecting lead projecting from the front end surface of the base has a length projecting from the projecting end, and the connecting lead penetrates the circuit board.
It is also possible that the peripheral end portion of the circuit board is fitted into the support groove of the protrusion and attached, and after unnecessary portions of the connection lead protruding from the tip end of the protrusion are cut, soldering is performed.

[0014]

In the sensor device thus constructed, the circuit board on which the sensor element is mounted has its peripheral end portion fitted into the support groove formed in the protrusion of the holder front end surface.
It is placed on the holder and positioned vertically. At this time, the connection of the circuit board to the external circuit is performed by penetrating the connection leads protruding from the tip surface of the base into the connection terminals of the board and soldering. At that time, by rotating the circuit board, an axial mounting error between the connection lead and the circuit board is corrected. The stress applied to the soldered portion due to this correction is absorbed by the expansion or contraction or elasticity of the bent portion formed on the connection lead. Further, the bent portion also absorbs the stress after assembly applied to the soldered portion due to thermal expansion or contraction of the connection lead or the holder, external stress applied to the circuit board, or the like.
Therefore, the soldering portion does not cause a mounting error or a solder crack or a solder peeling due to the stress and does not cause a disconnection, so that high reliability can be obtained.

At this time, in the case where the circuit board or the sensor element mounted on the circuit board does not protrude from the tip of the protrusion, for example, due to pressing or external pressure during sealing,
Even when pressure is applied to the holder or the housing is deformed, the pressure or deformation is supported by the protrusion that abuts the inner wall of the housing tip, so that the sensor element or the circuit board may be pressed or deformed. Since the stress is prevented from being directly applied, the sensor element is not damaged and an erroneous signal due to the external pressure is not output from the sensor element.

Further, in the case where the connecting lead projecting from the tip end face has a length protruding from the tip end of the protrusion, the circuit board is attached to the holder by projecting the connecting lead projecting from the tip face. As in the case where it is made shorter than the tip of the connection part, the circuit board is fitted into the protrusion, the tip of the connection lead is brought into contact with the circuit board, and the connection lead inserted into the insertion hole of the connection terminal is, for example, the circuit board. It is not necessary to fit it by rotating etc. and to insert it, just connect the projecting lead from the projection to the predetermined terminal of the circuit board, and then push the peripheral edge of the circuit board into the support groove of the projection. As it is attached, it can be attached efficiently. At this time, since the processing error between the position of the terminal of the circuit board and the position of the connection lead is absorbed by the bent portion of the connection lead, the circuit board and the connection lead do not have to be strictly aligned. Further, even when the circuit board, the protrusion, the connection lead, and the like are misaligned due to processing errors that occur when the circuit board is pushed into the support groove of the projection, the misalignment is absorbed by the bent portion of the connection lead. . Therefore, both of them can be aligned separately, so that they can be easily attached. Also, the soldering of the connection lead and the terminal of the circuit board can be easily performed after cutting an unnecessary portion of the connection lead protruding from the board, so that the connection lead can be easily soldered.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

The sensor device of the present embodiment shown in FIGS. 1 and 2 is a magnetic rotation sensor using a Hall IC 10 as a magnetic detection element as a sensor element, and is composed of a holder 11 and a Hall IC 10 mounted on the holder 11. The circuit board 12 is mounted, a housing 13 into which the holder 11 is fitted, and a sealing member 14 that seals the housing 13 and the holder 11 fitted into the housing 13.

The holder 11 has a cylindrical base 16 having a fitting groove 15 formed on one side, and the holder 16 penetrates through the base 16 and has an end 1 formed with a bent portion 18 from a front end surface 17 of the base 16.
9'is projected from the connecting lead 19, and a projecting portion 20 is formed around the periphery of the tip surface 17, that is, around one end 19 'of the connecting lead 19 projecting from the tip surface 17.

The connecting lead 19 is formed on the tip surface 17 of the base 16.
Bending portion 18 at one end 19 'of the connecting lead 19 protruding further
Is formed into an N-shape, and before mounting the circuit board 12,
It is formed to have a length protruding from the tip of the protrusion 20.

The protrusion 20 is located in the middle of the connection lead 19 side.
A support groove 21 is formed in parallel with the tip surface 17 of the base 16, and the circuit board 12 is pushed into the groove 21 from the tip of the protrusion 20 to form the peripheral end portion 1 of the circuit board 12.
2'is fitted and supported. For this reason, the tip of the protrusion 20 is formed as an inclined surface toward the outside so that the circuit board 12 can be easily inserted.
Further, the position and the length of the tip of the support groove 21 of the protrusion 20 are formed so that the Hall IC 10 of the supported circuit board 12 does not protrude from the tip.

As described above, the circuit board 12 has the peripheral end portion 12 'fitted in the support groove 21 of the protrusion 20,
The Hall IC 10 and the circuit component 22 are mounted, and the Hall IC 10 is connected to the tip surface 17 of the base 16.
A through hole 23 is provided as a connection terminal through which the connection lead 19 protruding from the connection passes.

On the other hand, an insertion hole 24 is formed in the front end surface 17 of the base 11 facing the Hall IC 10 mounted on the circuit board 12, and the magnet 2 is inserted in the insertion hole 24.
5 is press-fitted. Further, the tip of the magnet 25 is brought into contact with the circuit board 12, so that the distance between the magnet 25 and the Hall IC 10 does not become different for each sensor to be assembled and is always constant during assembly. In this way, variations in the strength of the bias magnetic field applied to the Hall IC 10 are reduced to stabilize the characteristics. Further, in this case, the magnet 25 and the circuit board 1
A magnetic pole piece using an iron piece or the like may be provided between the two to reduce the leakage flux and improve the magnetic characteristics.

The housing 13 is a cylindrical cup-shaped container that fits with the holder 11, and has a groove 15 'formed on one side thereof to fit with the fitting groove 15 of the holder 11. There is. For this reason, the orientation of the Hall IC 10 of the circuit board 12 mounted on the tip surface 17 of the holder 11 to be fitted does not differ depending on the sensor to be assembled, and is always constant with respect to the orientation of the housing 13 for mass production. The magnetically sensitive area of the sensor device is always the same.

Further, the opening end 28 of the housing 13 is bent outward, and the bending is engaged with the sealing member 12 to firmly seal the both, as shown in FIG. It is supposed to be.

Nylon resin is used for the sealing member 12, and a flange 27 having a bolt hole 26 for mounting is formed at the time of molding, and the holder 11 is formed.
The other end 19 ″ of the connecting lead 19 protruding from the rear end face and the wire harness 29 connected to the other end 19 ″ are integrally molded.

This embodiment is constructed as described above. In this rotation sensor, for example, the holder 11 and the housing 13 are used.
And are individually molded by resin molding using a mold or injection molding. At this time, the connection lead 19 is molded in the holder 11 by integral molding.

In the thus-formed holder 11, the magnet 25 is press-fitted into the insertion hole 24 of the front end surface 17 of the base 16, and the through hole 23 of the circuit board 12 on which the Hall IC 10 is separately assembled is mounted.
When the peripheral ends 12 ′ of the circuit board 12 are pushed into the support grooves 21 of the protrusions 20 and supported after the tip ends 19 ′ of the predetermined connection leads 19 are pierced through, the vertical positioning is completed.

Next, the circuit board 12 is rotated to move the hole I
Axial positioning is performed so that C10 faces the specified direction. At this time, the forming error of the through hole 23 of the circuit board 12, the forming error of the connecting lead 19, and the like are absorbed by the expansion and contraction or elasticity of the bent portion 18 of the connecting lead 19.

The circuit board 12 thus positioned
After cutting unnecessary portions of the connection leads 19 protruding from the circuit board 12, soldering is performed.

In this way, the connection lead 1 is attached to the circuit board 12.
9 is pierced through the bent portion 18 and is supported by the protrusion 20, and then unnecessary portions of the connection lead 19 are cut and soldered. Therefore, the workability is good and the soldering work is easy. I can do it.

Further, in this way, the holder 11 on which the circuit board 12 is mounted is, as shown in FIG. 2, a fitting groove 15 of the holder 11 and a groove 1 formed in the housing 13.
When fitting into the housing 13 while matching 5 ',
The Hall IC 10 on the circuit board 12 can be aligned, and the magnetically sensitive area of the sensor device is fixed.

The housing 13 in which the holder 11 is fitted in this way is sealed by injection molding using, for example, nylon resin. At this time, the other end 19 ″ of the connection lead 19 and the wire harness 29 connected to the other end 19 ″ are integrally molded.

Further, in the case where the resin molding is performed in this way, the molding pressure (several hundred kg / c) accompanying the resin molding is obtained.
m ² ) is applied to the holder 11, and the stress is also applied to the soldering portion 30 between the circuit board 12 and the connection lead 19, but the stress is applied to the bent portion 18 of the connection lead 19.
Is absorbed or relaxed by and is not added to the soldering part 30. For this reason, the soldering part 30 is not damaged due to stress such as solder cracking or solder peeling, and does not cause wire breakage.

As described above, in this rotation sensor, the holder 11 incorporating the magnet 25 and the connection lead 19 is incorporated.
In addition, since the Hall IC 10 can be positioned and fixed simply by mounting the circuit board 12, the workability is good and the Hall IC 10 is suitable for mass production.

On the other hand, the rotation sensor assembled in this manner is attached to the tire rim of the automobile facing the sensor rotor R that rotates with the wheels, for example, by the attachment flange 27, and the gear on the outer circumference of the sensor rotor R that is a magnetic body. The magnetic flux density that changes depending on the unevenness of the
It is used as a vehicle speed sensor that detects by C10 and outputs the detection signal to an external circuit via the connection lead 19 and the wire 29. At this time, for example, foreign matter is caught between the sensor rotor R and the housing 13 and Even if deformation occurs due to excessive stress, the deformation fixes the circuit board 12 so as not to protrude from the tip of the protrusion 20 of the base 11, so that the circuit board 12 and the Hall IC 10 mounted on the circuit board 12 are directly fixed. To join
It does not damage them or affect the detection signal, and is strong against external impact.

In the rotation sensor thus used, the frictional heat of the friction plate for the brake mounted near the sensor may heat it to 150 ° C. or more. The thermal expansion stress of 19 is also absorbed or relieved by the bent portion 18, so that excessive stress is not applied to the soldering portion 30 and it is strong against temperature changes.

In this embodiment, the housing 13 is made of resin, but other than this, the housing 13 may be made of a non-magnetic material such as aluminum or stainless steel to increase its strength. Good. Further, the holder 11 may be made of ceramics as long as the application is not subject to a great impact.

On the other hand, most metal can be used for the connection lead 19, but it is preferable that the connection lead 19 has elasticity and can be soldered, and for example, surface-treated phosphor bronze or the like is preferable.

Further, the bent portion 18 of the connection lead 19 is formed in an N-shape in this embodiment, but the invention is not limited to this. For example, as shown in FIG. It may be an oblique shape of b) or a coil shape as shown in FIGS.

Further, in this embodiment, the projection 20 at the tip of the base 16 is formed into a continuous cylindrical shape, but in addition to this, as shown in FIG. The circuit board 12 may be easily attached when the circuit board 12 is inserted into the protrusion.

In this embodiment, the fitting grooves 15 and 15 'are provided as the fitting portion in the holder 11 and the housing 13, but the grooves 15 and 15' are limited to those shown in FIG. Not the one shown, for example, the deformed groove 1 shown in FIG.
5, 15 ', and the fitting portion is the groove 15,
Not only 15 ', but the holder 11 as shown in FIG.
And one side of the housing 13 is formed in a flat shape,
You may make it provide the protrusion part 33,33 'as shown in (c).

Furthermore, although the magnetic rotation sensor using the Hall effect is shown in the embodiment, there is no particular need to be particular about this, and for example, a temperature sensor device or a radiation converter using a temperature detection element (thermistor, etc.) may be used. Any sensor device using a sensor element that can be mounted on a circuit board, such as the radiation detector used, can be used.

[0044]

The present invention is configured as described above, and a protrusion for mounting a circuit board on which a sensor element is mounted is mounted on the tip end surface of a holder, and a bent portion for a connection lead soldered to the circuit board of the protrusion. By forming it, it is possible to realize a highly reliable terminal lead-out structure in which no force is applied to the soldered portion between the circuit board and the connection lead. Moreover, this structure is suitable for mass production because it is possible to perform alignment by simple fitting without performing processing that is excessively expensive and has few errors, and to realize a sensor device that requires alignment. Are suitable.

Further, the molding stress applied to the soldered portion, strain error due to processing error and thermal expansion stress due to heat are all absorbed or alleviated at the bent portion and are not applied to the soldered portion. High reliability with no disconnection due to peeling.

Further, in the structure in which the circuit board and the sensor element do not project from the tip of the protrusion, the deformation of the housing due to an external impact or the like is supported by the protrusion, and the deformation is caused by the deformation of the circuit board and the sensor element. It is also strong against external shocks to prevent it from being directly applied to.

On the other hand, if the connecting lead is made longer so as to protrude from the tip of the protrusion, the circuit board can be easily attached, so that the assembling can be simplified.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of an embodiment.

2 is a cross-sectional view of FIG.

3 (a), (b), (c), and (d) are action diagrams showing bent portions of connection leads.

FIG. 4 is a perspective view showing another embodiment of the protrusion.

5 (a), (b) and (c) are action diagrams showing another embodiment.

FIG. 6 is an operation diagram showing connection between the connection lead and the substrate

FIG. 7 is an operation diagram showing a conventional example.

FIG. 8 is a vertical sectional view showing another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Hall IC 11 Holder 12 Circuit board 12 'Circumferential end part of circuit board 13 Housing 14 Sealing member 15, 15' Fitting groove 16 Base 17 Front end surface of base 18 Bent part of connection lead 19 Connection lead 20 Projection 21 Support Groove 23 Through Hole 30 Soldering Section

Continued front page (72) Inventor Masahiro Kasu 1-1-1 Kunyokita, Itami-shi Itami Works, Sumitomo Electric Industries, Ltd.

Claims (3)

[Claims] 1. A base has a connection lead that penetrates through the base and projects one end where a bent portion is formed from a front end surface of the base, and the other end is connected to a connection wire connected to an external circuit.
Also, a holder having a protrusion in which a supporting groove is formed on the side of the connection lead in parallel with the tip surface is provided around the connection lead protruding from the tip surface of the base, and a sensor element is mounted on the holder. It has a peripheral end portion fitted in a support groove, is mounted on the projection portion, and the tip ends of the connection leads protruding from the tip end surface of the base are penetrated through the bent portions and are connected by soldering. Sealing for sealing a circuit board having connection terminals, a housing that fits with the base of the holder and is fitted from the tip of the base to cover the base, and the housing and the holder fitted into the housing A sensor device including a member. 2. The sensor device according to claim 1, wherein the tip of the protrusion projects from a circuit board mounted on the protrusion or a sensor element mounted on the circuit board. 3. The connection lead projecting from the tip surface of the base has a length projecting from the tip of the protrusion, and the connection lead penetrates the circuit board and is formed in a support groove of the protrusion. Insert the peripheral end of the circuit board by inserting it,
3. The sensor device according to claim 1, wherein soldering is performed after cutting an unnecessary portion of the connection lead protruding from the tip of the protrusion.