JPH068132A - Polishing method - Google Patents

Abstract

PURPOSE:To enable a polishing amount to be adjusted with high accuracy through simple and inexpensive constitution. CONSTITUTION:In a polishing method whereby a sample holder 13 having sample mounting surface faced to the grinder 11 of a polishing device is kept near the grinder 11, and a sample 12 mounted on the sample mounting surface is polished to the predetermined thickness, at least one chip having such thickness as approximately equal to the predetermined post-process thickness of the sample 12 to be polished, and further having a slower polishing rate than the sample 12, is provided on the sample mounting surface in such a way as adjacent to the sample 12. In addition, the polishing method is so constituted that a polishing process continues slightly longer than the scheduled polishing time of the sample 12, thereby polishing the sample 12 to the substantially predetermined thickness.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing method based on the principle for polishing an object to be polished to a predetermined thickness.

[0002]

2. Description of the Related Art Conventionally, in order to perform such polishing,
For example, a polishing jig as shown in FIG. 6 is known.

That is, in FIG. 6, a polishing jig 1 is supported so as to be vertically movable with respect to an upper surface of a polishing platen 2 of a polishing apparatus (not shown), and a sample 3 to be polished is attached to a lower surface thereof. A sample holder 4 that can be attached, a hold ring 5 that is placed on the polishing plate 2 and that can slidably receive the sample holder 4 in the vertical direction, and a screw portion provided on the upper portion of the sample holder 4. 4a is screwed at an appropriately adjusted position, and its lower surface abuts the upper edge of the hold ring 5, so that the sample holder 4 of the sample holder 4 is adjusted based on the adjusted position of the screw portion 4a. An adjusting ring 6 for preventing the downward movement and a fixing ring 7 for fixing the adjusting ring 6 in the above-mentioned position by being screwed into a screw portion 4a provided on the upper portion of the sample holder 4 as well. It consists of and.

According to the polishing jig 1 thus constructed, as shown in the drawing, the sample 3 to be polished is attached to the lower surface of the sample holder 4, and the hold ring 5 is fitted on the sample holder 4. Then, after bringing the sample 3 into contact with the polishing plate 2 of the polishing apparatus, the lower surface of the adjusting ring 6 is
The position of the adjusting ring 6 relative to the threaded portion 4a of the sample holder 4 is set so that the adjusting ring 6 is separated from the upper edge of the holding ring by a distance d approximately equal to the polishing amount of the sample 3 to be polished. By rotating the fixing ring 7 around the screw portion 4a so that the lower surface of the fixing ring 7 is in close contact with the upper surface of the adjusting ring 6. The adjusting ring 6 is moved and fixed to the screw portion 4a.

From this state, when a polishing device (not shown) is operated to rotate the polishing disc 2, the polishing disc 2 is rotated.
The sample 3 brought into contact with the upper surface of the sample is gradually polished at a predetermined speed, and polishing is performed by lowering the sample holder 4 in accordance with the above-described polishing speed by means not shown. Be done.

When the lower surface of the adjusting ring 6 comes into contact with the upper edge of the hold ring 5 as the polishing process progresses, the downward movement of the sample holder 4 is blocked, and the sample 3
Is polished to a predetermined thickness, thus finishing the polishing process.

[0007]

However, in such a polishing method, the polishing amount of the sample 3 is determined based on the position of the adjusting ring 6 with respect to the screw portion 4a, and the adjusting ring 6 is moved to the screw portion 4a. The adjustment ring 6 can be adjusted to a predetermined polishing amount by rotating the adjustment ring 6 around.
Since the adjusting ring 6 slightly moves when the fixing ring 7 is brought into close contact with the fixing ring 7 while rotating,
It is difficult to fix the adjusting ring 6 at a desired position with high accuracy.

Therefore, the polishing amount of the sample 3 varies, and the thickness of the sample 3 after polishing also varies. For example, the polishing process of the sample 3 is highly accurate within ± 10 μm. Was difficult to do.

On the other hand, by using the micro gauge 8 as shown in FIG. 7 or the laser range finder 9 as shown in FIG. 7, the sample holder 4 and the polishing platen 2 are separated. A polishing method is also known in which the amount of polishing is adjusted by measuring the interval between them, but in any case, the device becomes complicated and expensive,
There is a problem that the entire device becomes large.

In view of the above points, it is an object of the present invention to provide a polishing method in which the polishing amount can be adjusted with high accuracy by a simple and inexpensive structure.

[0011]

According to the present invention, the above object is achieved by bringing a sample holder having a sample mounting surface facing the polishing plate of the polishing apparatus close to the polishing plate. In a method for polishing a sample mounted on a sample mounting surface of a sample holder to a predetermined thickness after polishing, the sample mounting surface has a thickness approximately equal to a predetermined thickness of the sample to be polished. And at least one tip having a polishing rate lower than the polishing rate of the sample is provided adjacent to the sample, and the sample is substantially polished by polishing for a time slightly longer than the expected polishing time of the sample. It is achieved by a polishing method characterized in that the polishing is performed to a predetermined thickness.

[0012]

According to the above-mentioned structure, by mounting the tip having the polishing speed which is half the polishing speed of the sample and is approximately equal to the predetermined thickness after polishing the sample on the sample mounting surface of the sample holder, When polishing a sample, the polishing time is calculated in advance based on the polishing amount and the polishing rate from the thickness of the sample to the predetermined thickness after polishing, and a margin time slightly shorter than the polishing time. When the polishing apparatus is operated for a long time, the sample is polished to a predetermined thickness when the tip comes into contact with the upper surface of the polishing table. Since the tip also comes into contact, the polishing rate is slowed down to about 1/3 or less.

Further, the polishing is performed for a margin time,
In this case, since the polishing rate is significantly slowed and the margin time is minute, the polishing amount in the margin time is also minute compared to the predetermined thickness after polishing the sample, and the sample 12 is Since the sample can be polished to a substantially predetermined thickness, the sample mounting surface of the sample holder can be easily semi-automatically enhanced by a simple structure that only has a tip and a simple operation that manages the polishing time. An accurate polishing operation can be performed.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below based on the embodiments shown in the drawings. FIG. 1 shows an embodiment of a polishing jig for carrying out the method of the present invention.

The polishing jig 10 is supported so as to be movable up and down with respect to an upper surface of a polishing plate 11 of a polishing apparatus (not shown), and a sample 12 to be polished can be attached to the lower surface by wax or the like. It comprises a sample holder 13 and a holding ring 14 placed on the polishing plate 11 and capable of receiving the sample holder 13 slidably in the vertical direction.

The above construction is almost the same as that of the conventional polishing jig 1 shown in FIG. 6, but the polishing jig 10 constructed according to the present invention further includes the sample holder 13.
At least one chip 1 adjacent to the sample 12 on the surface of the sample mounting surface 13a to which the sample of FIG.
5 is attached by an appropriate method.

As shown in FIG. 2, the chip 15 is arranged near the center of the sample mounting surface 13a, and the sample 12 is mounted so as to surround the chip 15. Further, as shown in FIG. 2, the tip 15 protrudes from the sample mounting surface toward the polishing plate 11 by an amount d which is substantially equal to a predetermined thickness which is a finished dimension of the sample 12 after polishing. The material, the cross-sectional area and the like are selected so that the polishing rate of the tip 15 is slower than the polishing rate of the entire sample 12 and is, for example, 1/2 or less.

The polishing jig 10 according to the present invention is configured as described above, and the sample mounting surface 13 of the sample holder 13 is as follows.
When the sample 12 attached to a is polished, the polishing time T _{0 is} previously determined based on the polishing amount and the polishing rate V ₀ from the thickness of the sample 12 to the predetermined thickness t after polishing. Is calculated and the time T obtained by adding an appropriate minute margin time ΔT to the polishing time T ₀ is set in a timer or the like.

Here, when the polishing operation is performed by operating the polishing apparatus for the set time T, the polishing operation is performed at the polishing speed V _{0 as} shown in FIG. 3, and when the time T ₀ has elapsed, When the sample 12 has a predetermined thickness t, the actual polishing work is completed.

At this time, since the chip 15 comes into contact with the polishing plate 11 of the polishing apparatus together with the sample 12, the polishing speed V ₁ is approximately 1/3 of the polishing speed V _0. The polishing time is slower than the above, and polishing is further performed for the margin time ΔT. At this time, the polishing speed V ₁ is significantly slowed, and the margin time ΔT is minute compared to the polishing time T _0. The polishing amount in time becomes a thickness Δt which is also minute as compared with the predetermined thickness t. If the thickness Δt is within the error range, each sample 12
Can be polished to a substantially predetermined thickness t.

FIG. 4 shows another embodiment of a polishing jig for carrying out the method of the present invention. In the polishing jig 20, a chip 21 is attached to a sample mounting surface 13a of a sample holder 13. The sample mounting surface 13a is formed integrally
The configuration is the same as that of the embodiment of FIG. 1 except that it protrudes by d (see FIG. 5), and the operation is also the same.

Although the chip 21 is formed so as to project downward from the sample mounting surface 13a of the sample holder 13 in FIG. 4, it may be formed integrally with the sample holder 13. Needless to say, it may project downward from the side surface of the sample holder 13.

The polishing work by the polishing jigs 10 and 20 constructed according to the present invention becomes more accurate as the polishing speed for the chips 15 and 21 is slower and the margin time ΔT is shorter, and the polishing of the chips is performed. The speed can be arbitrarily reduced by increasing the cross-sectional area of the chip or by using a material having high hardness.

[0024]

As described above, according to the present invention, it is possible to provide an extremely excellent polishing method capable of adjusting the polishing amount with high accuracy by a simple and inexpensive structure.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing an embodiment of a polishing jig constructed according to the present invention.

2A is a bottom view and FIG. 2B is a side view of a sample mounting surface of a sample holder in the polishing jig of FIG.

3 is a graph showing a polishing rate and a polishing amount (sample thickness) in a polishing operation by the polishing jig of FIG.

FIG. 4 is a schematic cross-sectional view showing another embodiment of a polishing jig constructed according to the present invention.

5A is a bottom view and FIG. 5B is a side view of a sample mounting surface of a sample holder in the polishing jig of FIG.

FIG. 6 is a schematic sectional view showing an example of a conventional polishing jig.

FIG. 7 is a schematic sectional view showing an example of a polishing jig using a conventional micro gauge.

FIG. 8 is a schematic cross-sectional view showing an example of a polishing jig using a conventional laser range finder.

[Explanation of symbols]

 10 polishing jig 11 polishing plate 12 sample 13 sample holder 13a sample mounting surface 14 hold ring 15 chip 20 polishing jig 21 chip

Claims (1)

[Claims] 1. A sample mounted on the sample mounting surface of the sample holder is brought to a predetermined thickness by bringing a sample holder having a sample mounting surface facing the polishing disk closer to the polishing disk of the polishing apparatus. In the method for polishing so that the sample attachment surface has a thickness approximately equal to a predetermined thickness of the sample to be polished and has a polishing rate slower than the polishing rate of the sample. A tip is provided adjacent to the sample, and the sample is polished to a substantially predetermined thickness by polishing for a time slightly longer than the expected polishing time of the sample. And the polishing method.