JPH0681191A - Non-water electroplating method - Google Patents
Non-water electroplating methodInfo
- Publication number
- JPH0681191A JPH0681191A JP25414592A JP25414592A JPH0681191A JP H0681191 A JPH0681191 A JP H0681191A JP 25414592 A JP25414592 A JP 25414592A JP 25414592 A JP25414592 A JP 25414592A JP H0681191 A JPH0681191 A JP H0681191A
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- Prior art keywords
- housing
- metal strip
- plating
- metallic strip
- plating solution
- Prior art date
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Abstract
Description
【００１】[001]
【産業上の利用分野】本発明は、低温溶融塩のめっき液
を用いて、金属ストリップに連続的に金属を電気めっき
する際、高電流密度でのめっきを可能にした方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method capable of performing plating at a high current density when continuously electroplating a metal on a metal strip using a plating solution of a low temperature molten salt.
【００２】[002]
【従来技術】イミダゾリウムハロゲン化物やピリジニウ
ムハロゲン化物などのような有機系窒素オニウムハロゲ
ン化物と１種または２種以上の金属ハロゲン化物とを混
合すると、常温でも液体となる低温溶融塩のめっき液が
得られ、混合金属ハロゲン化物の金属またその合金を電
気めっきできることが知られている。このめっき液の特
徴は、混合金属ハロゲン化物に水溶液系めっき液では電
析困難な金属、例えば、Ａｌ、Ｔｉ、Ｗ、Ｍｏなどのハ
ロゲン化物を用いれば、その金属または合金を高純度
で、しかも、低温で安全に電気めっきできる点にある。2. Description of the Related Art When an organic nitrogen-onium halide such as imidazolium halide or pyridinium halide is mixed with one or more kinds of metal halides, a low-temperature molten salt plating solution which becomes liquid even at room temperature is obtained. It is known that the resulting mixed metal halide metals or their alloys can be electroplated. The characteristic of this plating solution is that if a metal that is difficult to electrodeposit in an aqueous solution plating solution is used for the mixed metal halide, for example, a halide such as Al, Ti, W, or Mo is used, the metal or alloy will have high purity, and , It can safely electroplate at low temperature.
【００３】このめっき液で金属ストリップに電気めっき
する場合、めっき液は、モノ、ジおよび／またはトリア
ルキル置換体の有機系窒素オニウムハロゲン化物と金属
ハロゲン化物とを混合して調製しているが、めっき作業
を大気中で行うと、有機系窒素オニウムハロゲン化物の
種類には関係なく大気中の酸素でイオンが酸化され、め
っき液組成の変動によりめっき液が劣化するので、従
来、窒素ガス、アルゴンガスなどの不活性雰囲気下で行
っていた。また、めっき液は水溶液系めっき液に比べる
と、比重、粘度が著しく大きく、電導度が小さいので、
高速めっきを行う場合にはめっき液を強く撹拌すると
か、有機溶媒を添加して粘度を低くするとかの手段を講
じて、電流密度を大きくしていた。When a metal strip is electroplated with this plating solution, the plating solution is prepared by mixing a mono-, di- and / or trialkyl-substituted organic nitrogen onium halide and a metal halide. However, when the plating operation is performed in the atmosphere, the ions are oxidized by oxygen in the atmosphere regardless of the type of organic nitrogen-onium halide, and the plating solution deteriorates due to fluctuations in the composition of the plating solution. It was performed under an inert atmosphere such as argon gas. In addition, since the plating solution has a significantly higher specific gravity and viscosity and a lower electrical conductivity than the aqueous solution plating solution,
When performing high-speed plating, the current density was increased by taking measures such as vigorously stirring the plating solution or adding an organic solvent to reduce the viscosity.
【００４】しかし、このような手段を講じても、金属ス
トリップを水平方向に移動させながら、上下面に電気め
っきする通常の金属ストリップの電気めっき方法では電
流密度を高くするのに限界があった。そこで、金属スト
リップが垂れ下がらないように幅方向を垂直にして、金
属ストリップと陽極との間隔を狭くし、めっき槽の下方
からめっき液を噴出させることにより同一電流密度でも
高速めっきできる方法が提案されている（特開平１−１
０４７９４号公報）。However, even if such a measure is taken, there is a limit in increasing the current density in the ordinary metal strip electroplating method of electroplating the upper and lower surfaces while moving the metal strip in the horizontal direction. . Therefore, a method is proposed in which the width direction is made vertical so that the metal strip does not hang down, the gap between the metal strip and the anode is narrowed, and the plating solution is jetted from below the plating tank to enable high-speed plating even with the same current density. (Japanese Patent Laid-Open No. 1-1
No. 04794).
【００５】[0095]
【発明が解決しようとする課題】しかしながら、金属ス
トリップを垂直に保った状態でめっき槽を通過させるに
は、めっき槽のシ−ルが難しく、これを避けるために水
平な金属ストリップをめっき槽内で面を９０度方向転換
するようにすると、めっき槽を長くしなければならない
という問題があった。また、めっき液は雰囲気を単に不
活性雰囲気にしただけでは、めっき作業を長時間継続す
ると、めっき外観が次第に変色してしまうという問題も
あった。However, in order to prevent the metal strip from passing through the plating tank while keeping the metal strip vertical, in order to avoid this, a horizontal metal strip is placed inside the plating tank. If the surface is turned by 90 degrees, the plating tank must be lengthened. In addition, there is a problem that the plating appearance is gradually discolored when the plating operation is continued for a long time by simply making the atmosphere of the plating solution inert.
【００６】[0096]
【課題を解決するための手段】本発明者らは、かかる問
題を解決すべく鋭意検討した結果、本発明を完成するに
至ったのである。すなわち、本発明は、高電流密度でめ
っきでき、しかも、長時間めっき作業を継続してもめっ
きが変色しない電気めっき方法を提供するもので、金属
ストリップの導入用および導出用の開口部がシ−ルロ−
ルで半密閉状態にされたハウジング内をハウジング外気
圧より水柱圧で０.０５ｍｍ以上高い露点−１０℃以下
の不活性雰囲気に保って、導入用開口部からの金属スト
リップをハウジング内の上部に配列した複数の通電ロ−
ルと底部に配列した複数のシンクロ−ルとで上下方向に
繰り返し移動させながら導出用開口部に案内して、通電
ロ−ルとシンクロ−ルとの間の金属ストリップと該金属
ストリップに沿って離隔配置した陽極板との間に上方か
ら外部貯液タンクより熱交換器を通して８０〜１５０℃
に保っためっき液をノズルより噴出させ、金属ストリッ
プと陽極板とを通電状態にしながら電解することを特徴
としている。The present inventors have completed the present invention as a result of intensive studies to solve such a problem. That is, the present invention provides an electroplating method capable of performing plating at a high current density, and in which the plating does not discolor even when the plating operation is continued for a long time, and the openings for introducing and leading out the metal strips are provided. -Ruro-
The inside of the housing, which is semi-sealed with a vacuum, is maintained in an inert atmosphere with a dew point of -10 ° C or less, which is 0.05 mm or more higher than the atmospheric pressure of the housing at a water column pressure, and the metal strip from the introduction opening is placed in the upper part of the housing. Multiple energized rolls arranged
The metal strip between the energizing roll and the synchro roll and the metal strip are guided along the metal strip while being repeatedly moved in the vertical direction by the roll and the plurality of synchros arranged at the bottom. Pass the heat exchanger from the external storage tank from the upper side between the separated anode plates and 80-150 ℃
It is characterized in that the plating solution maintained at is ejected from a nozzle to electrolyze the metal strip and the anode plate while energizing them.
【００７】[0097]
【作用】本発明は、通電ロ−ルとシンクロ−ルとで金属
ストリップを上下方向に繰り返し移動しながら、その上
下方向の金属ストリップと陽極板との間にめっき液をノ
ズルで噴出させるのであるから、噴出めっき液は周囲の
めっき液を押しのける必要がなく、しかも、めっき液に
は重力が作用している。このため、粘度が大きくとも、
流速を大きくすることができ、ノズルから離れたシンク
ロ−ル側でもその流速は低下しない。According to the present invention, the metal strip is repeatedly moved up and down by the energizing roll and the synchro while the plating solution is jetted by the nozzle between the up and down metal strip and the anode plate. Therefore, the jetted plating solution does not need to push away the surrounding plating solution, and gravity acts on the plating solution. Therefore, even if the viscosity is large,
The flow velocity can be increased, and the flow velocity does not decrease even on the side of the synchro separated from the nozzle.
【００８】ハウジング内は、内部圧を外気圧より水柱圧
で０.０５ｍｍ以上高くしてあるので、外部からハウジ
ング内への空気の侵入を防止できる。この内部圧が外気
圧に対して０.０５ｍｍより低いと、開口部からの空気
の巻込みが起こり、めっき液を劣化させる。なお、内部
圧は開口部からの雰囲気ガス吐出速度が１.０ｍ／sec以
上となるようにするのが好ましい。Since the internal pressure inside the housing is higher than the external pressure by 0.05 mm or more in water column pressure, it is possible to prevent air from entering the housing from the outside. If the internal pressure is lower than 0.05 mm with respect to the external atmospheric pressure, air will be entrained from the opening, degrading the plating solution. The internal pressure is preferably such that the atmospheric gas discharge rate from the opening is 1.0 m / sec or more.
【００９】ハウジング内の不活性雰囲気の露点を管理す
るのは、めっき液が水分と反応して、有害なハロゲン化
水素ガスを発生しながら劣化するためである。すなわ
ち、本発明者らは、めっき作業を長時間継続した場合の
めっき液劣化は不活性雰囲気中に含まれる水分が原因
で、めっき液を金属ストリップと陽極板との間にノズル
で噴出させて流下させる本発明の場合には次のようにこ
れを厳しく管理しなければならないことを見いだしたの
である。The dew point of the inert atmosphere in the housing is controlled because the plating solution reacts with water and deteriorates while generating harmful hydrogen halide gas. That is, the inventors of the present invention, the deterioration of the plating solution when the plating operation is continued for a long time is caused by the water contained in the inert atmosphere, and the plating solution is jetted by a nozzle between the metal strip and the anode plate. In the case of the present invention in which the material flows down, it has been found that this must be strictly controlled as follows.
【０１０】めっき浴内を通過させてめっきする通常のめ
っき方法の場合、ハウジング内の雰囲気と接触するめっ
き液は、浴面に存在するものだけであるが、本発明の場
合、金属ストリップと陽極板との間から流下する都度接
触するので、めっき液全体が少量ずつハウジング内の雰
囲気と接触することになる。しかも、その接触は雰囲気
中を落下しながら接触するので、単位時間当たりの合計
接触面積は広いものになる。このため、雰囲気中の水分
が従来の通常のめっき方法の場合と同じでも、長時間め
っきを継続してゆくと、めっき浴が劣化してしまうこと
が判明し、雰囲気露点を従来の−５℃〜０℃から−１０
℃以下、好ましくは−１５℃以下にすることが必要とな
ったのである。In the case of a usual plating method in which plating is carried out by passing through the plating bath, the plating solution which comes into contact with the atmosphere in the housing is only the solution present on the bath surface. Since it comes into contact with the plate each time it flows down, the whole plating solution comes into contact with the atmosphere in the housing little by little. Moreover, since the contact is made while dropping in the atmosphere, the total contact area per unit time becomes large. Therefore, even if the water content in the atmosphere is the same as in the case of the conventional ordinary plating method, it was found that the plating bath deteriorates when the plating is continued for a long time, and the atmosphere dew point is set to -5 ° C. ~ 0 ° C to -10
It was necessary to keep the temperature below ℃, preferably below -15 ℃.
【０１１】金属ストリップと陽極板との間に噴出させる
めっき液は、粘度を低くすることにより液切れのない均
一な液流れを確保し、かつ、電導度を高くするため、液
温を８０〜１５０℃にする。液温を８０℃にしても、水
溶液系めっき液に比べて約５倍の粘度を有するが、シン
クロ−ル側の流速を１.０ｍ／sec以上にすることができ
る。また、液温を８０℃以上にすると、図１に示すよう
に、電導度は著しく高くなる。しかし、１５０℃より高
くすると、めっき液中の金属ハロゲン化物が昇華し易く
なり、めっき液組成に変動が生じるので、好ましくな
い。The plating solution jetted between the metal strip and the anode plate has a liquid temperature of 80 to 80% in order to ensure a uniform liquid flow without liquid breakage by lowering the viscosity and to increase the electrical conductivity. Bring to 150 ° C. Even if the liquid temperature is 80 ° C., the viscosity is about 5 times as high as that of the aqueous plating solution, but the flow rate on the synchro side can be 1.0 m / sec or more. Further, when the liquid temperature is set to 80 ° C. or higher, the electric conductivity becomes remarkably high as shown in FIG. However, if the temperature is higher than 150 ° C., the metal halide in the plating solution is easily sublimated, and the composition of the plating solution varies, which is not preferable.
【０１２】図２は、本発明のめっき方法を実施するのに
好ましい態様の電気めっき装置を示すもので、ハウジン
グ１の前後にそれぞれ金属ストリップ２を導入する開口
部３と導出する開口部４を設けて、それらの開口部３、
４にシ−ルロ−ル５を装着し、ハウジング１を半密閉状
態にシ−ルしておく。また、ハウジング１の上面には不
活性ガス供給管６を設けて、露点を−１０℃以下に調整
した不活性ガスを供給し、内部圧を外気圧より０.０５
ｍｍ以上高くなるように維持する。不活性ガスは供給前
に不活性ガス供給管６の途中に設けたク−ラ７で冷却し
て、露点を−１０℃以下に調整する。FIG. 2 shows an electroplating apparatus of a preferred embodiment for carrying out the plating method of the present invention, in which an opening 3 for introducing the metal strip 2 and an opening 4 for leading out the metal strip 2 are provided at the front and rear of the housing 1, respectively. To provide those openings 3,
A seal roll 5 is attached to the housing 4, and the housing 1 is sealed in a semi-sealed state. Further, an inert gas supply pipe 6 is provided on the upper surface of the housing 1 to supply an inert gas having a dew point adjusted to -10 ° C or lower, and the internal pressure is set to 0.05 from the external pressure.
Keep it higher than mm. Before supplying the inert gas, it is cooled by a cooler 7 provided in the middle of the inert gas supply pipe 6, and the dew point is adjusted to -10 ° C or lower.
【０１３】ハウジング１内には、上部に通電ロ−ル８
を、底側にシンクロ−ル９をそれぞれ複数配列して、こ
れらに金属ストリップ２を交互に巻き付け、開口部３か
ら導入した金属ストリップ２を上下に繰り返し移動させ
る。そして、通電ロ−ル８とシンクロ−ル９との間を上
下移動する金属ストリップ２と対向する部分には、陽極
板１０を金属ストリップ２の両側に平行に配置して、両
者の間の上部にノズル１１を配置し、めっき液を両者の
間に噴出させる。この噴出は、金属ストリップ２と陽極
板１０との間の上部にめっき液のダムを形成して、全体
にめっき液が常に供給されるようにするのが好ましい。Inside the housing 1, an energizing roll 8 is provided on the upper part.
Is arranged on the bottom side, and the metal strips 2 are alternately wound around these, and the metal strips 2 introduced from the openings 3 are repeatedly moved up and down. Anode plates 10 are arranged in parallel on both sides of the metal strip 2 at a portion facing the metal strip 2 which moves up and down between the energizing roll 8 and the synchro 9, and an upper part between them is provided. Nozzle 11 is arranged in and the plating solution is ejected between the two. It is preferable that this jet forms a dam of the plating solution in the upper portion between the metal strip 2 and the anode plate 10 so that the plating solution is constantly supplied to the whole.
【０１４】ノズル１１へのめっき液供給は、ハウジング
１の外部にめっき液１２の貯液タンク１３を配置して、
この貯液タンク１３とノズル１１とをポンプ１４および
熱交換器１５を備えた循環パイプ１６で接続し、ノズル
１１から吐出する液温が８０〜１５０℃になるように熱
交換器１５で加温しながら行う。To supply the plating solution to the nozzle 11, a storage tank 13 for the plating solution 12 is arranged outside the housing 1,
The liquid storage tank 13 and the nozzle 11 are connected by a circulation pipe 16 equipped with a pump 14 and a heat exchanger 15, and heated by the heat exchanger 15 so that the temperature of the liquid discharged from the nozzle 11 becomes 80 to 150 ° C. While doing.
【０１５】[0115]
【実施例】図２に示す構造の電気めっき装置を使用して
下記の条件で冷延鋼帯に電気アルミニウムめっきを連続
２４時間施したが、めっき外観は最初から最後まで常に
一定であった。また、めっき完了後のめっき液イオン種
を核磁気共鳴分析装置で分析してみたが変動は認められ
なかった。 （１）ハウジングの内部雰囲気 （Ａ）雰囲気ガス 窒素 （Ｂ）外気圧に対する内部圧 １.２ｍｍＡｑ （Ｃ）露点 −２５℃ （２）めっき液組成 （Ａ）1-メチル-3-エチルイミダゾリウムクロライド ５０７ｇ／Ｌ （Ｂ）塩化アルミニウム ８６５ｇ／Ｌ （３）めっき条件 （Ａ）陽極板 アルミニウム（純
度９９.９％） （Ｂ）めっき液温度 ９５℃ （Ｃ）めっき液流速 １.７ｍ／sec （Ｄ）電流密度 ３.８ｋＡ／ｍ2 EXAMPLE An electroplating apparatus having the structure shown in FIG. 2 was used to continuously electroplate a cold-rolled steel strip for 24 hours under the following conditions, but the appearance of the plating was always constant from the beginning to the end. In addition, the ion species of the plating solution after completion of plating was analyzed by a nuclear magnetic resonance analyzer, but no fluctuation was observed. (1) Internal atmosphere of the housing (A) Atmosphere gas Nitrogen (B) Internal pressure to the external pressure 1.2 mmAq (C) Dew point -25 ° C (2) Plating solution composition (A) 1-Methyl-3-ethylimidazolium chloride 507 g / L (B) Aluminum chloride 865 g / L (3) Plating conditions (A) Anode plate Aluminum (Purity 99.9%) (B) Plating solution temperature 95 ° C (C) Plating solution flow rate 1.7 m / sec (D ) Current density 3.8 kA / m 2
【０１６】[0163]
【比較例】実施例でのハウジング１の雰囲気露点を−４
℃に変更して、他は同一条件で冷延鋼帯に電気アルミニ
ウムめっきを連続２４時間施したところ、１７時間経過
した時点から両エッジのめっきが黒変し始め、２０時間
経過後には粗い黒色物が全面を覆った状態になった。そ
して、２０時間後のめっき液イオン種を実施例と同様に
分析したところ、Ａｌめっきを行うイオン種であるＡｌ
2Ｃｌ7 -の減少が認められた。[Comparative Example] The atmospheric dew point of the housing 1 in the example is -4.
After changing to ℃, the cold rolled steel strip was continuously electroplated with aluminum under the same conditions for 24 hours. After 17 hours, the plating on both edges began to turn black, and after 20 hours, it had a rough black color. The thing is in a state of covering the entire surface. The ionic species of the plating solution after 20 hours were analyzed in the same manner as in the example, and it was found that the
A decrease in 2 Cl 7 − was observed.
【０１７】[0172]
【発明の効果】以上のように、本発明のめっき方法は、
金属ストリップを水平状態で移動させながらめっきし、
しかも、めっきはめっき浴に浸漬する方法ではないの
で、垂直状態でめっき浴に浸漬してめっきする場合より
シ−ルが容易である。また、めっきは１種の竪型方式で
あるので、めっき装置を小型化できる。さらに、めっき
液の流速をめっき浴の撹拌より大きくすることができ、
しかも、陽極板の配置されている部分全体の流速が大き
くなるので、電流密度を高くできる。As described above, the plating method of the present invention is
Plating while moving the metal strip horizontally
Moreover, since plating is not a method of immersing in a plating bath, the sealing is easier than the case of plating by immersing in a plating bath in a vertical state. Moreover, since the plating is a vertical type, the plating apparatus can be downsized. Furthermore, the flow rate of the plating solution can be made higher than the stirring of the plating bath,
Moreover, since the flow velocity of the entire portion where the anode plate is arranged is increased, the current density can be increased.
【図１】メチルエチルイミダゾリウムクロライドと塩化
アルミニウムとからなるめっき液のめっき液温度と電導
度との関係を示すグラフである。FIG. 1 is a graph showing the relationship between the plating solution temperature and the conductivity of a plating solution containing methylethylimidazolium chloride and aluminum chloride.
【図２】本発明のめっき方法を実施するのに好ましい態
様の電気めっき装置の概略図である。FIG. 2 is a schematic view of an electroplating apparatus of a preferred embodiment for carrying out the plating method of the present invention.
１…ハウジング、２…金属ストリップ、３、４…開口
部、５…シ−ルロ−ル、６…不活性ガス供給管、７…ク
−ラ、８…通電ロ−ル、９…シンクロ−ル、１０…陽極
板、１１…ノズル、１２…めっき液、１３…貯液タン
ク、１４…ポンプ、１５…熱交換器、１６…循環パイ
プ、DESCRIPTION OF SYMBOLS 1 ... Housing, 2 ... Metal strip 3, 4 ... Opening part, 5 ... Seal roll, 6 ... Inert gas supply pipe, 7 ... Cooler, 8 ... Energizing roll, 9 ... Synchronous roll 10 ... Anode plate, 11 ... Nozzle, 12 ... Plating solution, 13 ... Storage tank, 14 ... Pump, 15 ... Heat exchanger, 16 ... Circulation pipe,
───────────────────────────────────────────────────── フロントページの続き (72)発明者 渡辺 栄次 大阪府堺市石津西町５番地 日新製鋼株式 会社鉄鋼研究所表面処理研究部内 (72)発明者 山口 輝雄 東京都千代田区神田駿河台四丁目６番地 株式会社日立製作所内 (72)発明者 伊藤 雅彦 茨城県日立市久慈町4026番地 株式会社日 立製作所日立研究所内 (72)発明者 田中 瑞穂 茨城県日立市幸町三丁目１番１号 株式会 社日立製作所日立工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Eiji Watanabe, 5 No. 5 Ishizu Nishimachi, Sakai City, Osaka Prefecture, Nisshin Steel Co., Ltd. Surface Treatment Research Department, Steel Research Institute, Inc. Address: Hitachi Ltd. (72) Inventor Masahiko Ito 4026, Kuji-machi, Hitachi City, Ibaraki Prefecture Hitachi Research Laboratory, Hitachi, Ltd. (72) Inventor Mizuho Tanaka, 1-1, Saiwaicho, Hitachi City, Ibaraki Stock Association Hitachi, Ltd.Hitachi factory
Claims (1)
と金属ハロゲン化物との低温溶融塩めっき液を用いて金
属ストリップに金属ハロゲン化物中の金属を連続的に電
気めっきする方法において、金属ストリップの導入用お
よび導出用の開口部がシ−ルロ−ルで半密閉状態にされ
たハウジング内をハウジング外気圧より水柱圧で０.０
５ｍｍ以上高い露点−１０℃以下の不活性雰囲気に保っ
て、導入用開口部からの金属ストリップをハウジング内
の上部に配列した複数の通電ロ−ルと底部に配列した複
数のシンクロ−ルとで上下方向に繰り返し移動させなが
ら導出用開口部に案内し、通電ロ−ルとシンクロ−ルと
の間の金属ストリップと該金属ストリップに沿って離隔
配置した陽極板との間に上方から外部貯液タンクから熱
交換器を通して８０〜１５０℃に保っためっき液をノズ
ルより噴出させ、金属ストリップと陽極板とを通電状態
にしながら電解することを特徴とする非水電気めっき方
法。1. A method for continuously electroplating a metal in a metal halide on a metal strip using a low temperature molten salt plating solution of an organic nitrogen-containing onium halide and a metal halide, for introducing the metal strip. In addition, the inside of the housing, in which the opening for lead-out is semi-sealed by the seal roll, is 0.0 at the water column pressure from the outside pressure of the housing.
The metal strip from the introduction opening is kept in an inert atmosphere with a dew point higher than 5 mm and higher than −10 ° C. and a plurality of energizing rolls arranged in the upper part and a plurality of synchronizers arranged in the bottom part of the housing. While being repeatedly moved in the up-and-down direction, the liquid is guided to the lead-out opening, and external liquid storage is performed from above between the metal strip between the energizing roll and the synchro and the anode plate spaced apart along the metal strip. A nonaqueous electroplating method, characterized in that a plating solution kept at 80 to 150 ° C. is ejected from a tank through a heat exchanger through a nozzle to electrolyze the metal strip and the anode plate while energizing them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4254145A JP3023395B2 (en) | 1992-08-28 | 1992-08-28 | Non-aqueous electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4254145A JP3023395B2 (en) | 1992-08-28 | 1992-08-28 | Non-aqueous electroplating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0681191A true JPH0681191A (en) | 1994-03-22 |
| JP3023395B2 JP3023395B2 (en) | 2000-03-21 |
Family
ID=17260852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4254145A Expired - Lifetime JP3023395B2 (en) | 1992-08-28 | 1992-08-28 | Non-aqueous electroplating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3023395B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6423389B1 (en) * | 1997-04-10 | 2002-07-23 | Occ Corporation | Metal tube armored linear body, metal tube armoring linear body, method and apparatus for manufacturing metal tube armored linear body |
| JP2014106066A (en) * | 2012-11-27 | 2014-06-09 | Sumitomo Electric Ind Ltd | Quantitative analysis method of aluminum plating liquid and method for manufacturing aluminium plating product |
| CN109868448A (en) * | 2017-12-04 | 2019-06-11 | 天虹科技股份有限公司 | The aluminium attaching method and vacuum of metallic film coating machine transmit cavity configuration |
| KR20190084867A (en) | 2016-11-22 | 2019-07-17 | 가부시키가이샤 유에이씨제이 | Electrolytic aluminum foil and its manufacturing method |
-
1992
- 1992-08-28 JP JP4254145A patent/JP3023395B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6423389B1 (en) * | 1997-04-10 | 2002-07-23 | Occ Corporation | Metal tube armored linear body, metal tube armoring linear body, method and apparatus for manufacturing metal tube armored linear body |
| JP2014106066A (en) * | 2012-11-27 | 2014-06-09 | Sumitomo Electric Ind Ltd | Quantitative analysis method of aluminum plating liquid and method for manufacturing aluminium plating product |
| KR20190084867A (en) | 2016-11-22 | 2019-07-17 | 가부시키가이샤 유에이씨제이 | Electrolytic aluminum foil and its manufacturing method |
| US11035047B2 (en) | 2016-11-22 | 2021-06-15 | Uacj Corporation | Electrolytic aluminum foil and method of manufacturing same |
| CN109868448A (en) * | 2017-12-04 | 2019-06-11 | 天虹科技股份有限公司 | The aluminium attaching method and vacuum of metallic film coating machine transmit cavity configuration |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3023395B2 (en) | 2000-03-21 |
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