JPH0681139U - Surface acoustic wave device - Google Patents
Surface acoustic wave deviceInfo
- Publication number
- JPH0681139U JPH0681139U JP1956393U JP1956393U JPH0681139U JP H0681139 U JPH0681139 U JP H0681139U JP 1956393 U JP1956393 U JP 1956393U JP 1956393 U JP1956393 U JP 1956393U JP H0681139 U JPH0681139 U JP H0681139U
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- frame
- base
- wave element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
(57)【要約】
【目的】弾性表面波素子に歪みが発生することが無い弾
性表面波装置を得る。
【構成】弾性表面波素子１とベース２との間に枠４を介
在させる。枠４と弾性表面波素子裏面５とベース表面６
とにより形成される空間に接着剤３を充填し弾性表面波
素子１とベース２とを接着固定する。
(57) [Abstract] [Purpose] To obtain a surface acoustic wave device in which no distortion occurs in a surface acoustic wave element. [Structure] A frame 4 is interposed between a surface acoustic wave element 1 and a base 2. Frame 4, back surface 5 of surface acoustic wave device, and base surface 6
The space formed by and is filled with the adhesive 3, and the surface acoustic wave element 1 and the base 2 are bonded and fixed.
Description
【０００１】[0001]
本考案はフィルターあるいは共振子として機能する弾性表面波装置に関し、詳 しくは弾性表面波素子をベースへ接着固定しても、弾性表面波素子においては歪 みの発生及び歪みの変化が小さい弾性表面波装置に関する。 The present invention relates to a surface acoustic wave device that functions as a filter or a resonator, and more specifically, even if the surface acoustic wave element is adhered and fixed to a base, the surface acoustic wave element is small in strain and changes in strain. Regarding wave device.
【０００２】[0002]
従来の弾性表面波装置に於ける弾性表面波素子のベースへの接着固定構造は２ 種類に大別される。概略は、１．弾性表面波素子の主面に対向する裏面のほぼ全 面をベースに接着固定する構造と２．ベースの一部に微少面積の突出部を設けて 弾性表面波素子の裏面を突出部へ接着固定する構造である。本考案は、分類上は 後者に属する。 The structure for bonding and fixing the surface acoustic wave element to the base in the conventional surface acoustic wave device is roughly classified into two types. The outline is 1. 1. A structure in which almost the entire back surface facing the main surface of the surface acoustic wave element is adhesively fixed to the base. In this structure, a protrusion having a small area is provided on a part of the base and the back surface of the surface acoustic wave element is bonded and fixed to the protrusion. The present invention belongs to the latter in classification.
【０００３】 ２．の弾性表面波装置例としては実公平４−３２８１７号公報が有る。実公平 ４−３２８１７号公報によれば、圧電基板（本考案の弾性表面波素子に相当する 。）を載置するベース平面に接着部分としての微少面積のランドを設けることに より、圧電基板のベースへの接着固定面積を最小限にすることで、１．の欠点で ある圧電基板に於ける歪みの発生を最小限にしたものである。2. As an example of the surface acoustic wave device, there is JP-B-4-32817. According to Japanese Utility Model Publication No. 4-32817, by providing a land having a small area as an adhesive portion on a base plane on which a piezoelectric substrate (corresponding to the surface acoustic wave element of the present invention) is placed, the piezoelectric substrate By minimizing the adhesive fixing area to the base, 1. It is the one that minimizes the occurrence of distortion in the piezoelectric substrate, which is a drawback of the.
【０００４】[0004]
１．弾性表面波素子の主面に対向する裏面のほぼ全面をベースへ接着固定する 場合の課題を説明する。（１）弾性表面波装置を構成する部材の熱膨張率は一般 的には一致しないので、温度変動にともない弾性表面波素子の歪み状態が変動す る。従って、歪み状態の変動により弾性表面波装置の特性が変動してしまう課題 を有する。（２）一般的に封止工程及び弾性表面波装置を回路基板に実装する工 程及び回路基板の変形等により、弾性表面波素子を載置するベースは変形作用を 受ける。ベースの変形により弾性表面波素子も変形作用を受ける。従って、（１ ）と同様の課題を有する。 1. Described below is the problem in the case where almost the entire back surface of the surface acoustic wave element facing the main surface is adhered and fixed to the base. (1) Since the coefficients of thermal expansion of the members constituting the surface acoustic wave device do not generally match, the strain state of the surface acoustic wave element changes with temperature changes. Therefore, there is a problem in that the characteristics of the surface acoustic wave device change due to changes in the strain state. (2) Generally, the base on which the surface acoustic wave element is mounted is deformed by the sealing process, the process of mounting the surface acoustic wave device on the circuit board, and the deformation of the circuit board. The surface acoustic wave element is also deformed by the deformation of the base. Therefore, it has the same problem as (1).
【０００５】 ２．ベースに微少面積の突出部を設けて、弾性表面波素子の主面に対向する裏 面の一部分をベースに接着固定する場合の課題を、従来の実施例を示す図６を用 いて説明する。微少面積の突出部６０の面の平坦性及びベース２に対する平行性 を確保することはコストとの関係で難しい。従って、弾性表面波素子１をベース ２に対して平行に接着することは接着剤の収縮固化も加わり困難であり、弾性表 面波素子１の端部が容易にベース２に当接してしまい、ベース２の変形に伴い弾 性表面波素子１が歪められてしまう。従って、１．の（１）で述べた様に弾性表 面波素子１の歪み状態の変動により弾性表面波装置の特性が変動してしまう課題 を有する。実公平４−３２８１７号公報に於いては、弾性表面波素子の周縁部を 非接着状態で支持するための突起を設けることにより弾性表面波素子とべースと の平行を得る方法が開示されている。この方法によれば、ベースの凸方向の変形 に於いては弾性表面波素子に歪みが発生すること及び変化することはない。しか し、ベースの凹方向の変形に伴う弾性表面波素子とベースとの当接により、弾性 表面波素子に歪みが発生する。2. A problem in the case where a protrusion having a small area is provided on the base and a part of the back surface facing the main surface of the surface acoustic wave element is bonded and fixed to the base will be described with reference to FIG. 6 showing a conventional embodiment. It is difficult to secure the flatness of the surface of the protrusion 60 having a small area and the parallelism with the base 2 in terms of cost. Therefore, it is difficult to adhere the surface acoustic wave element 1 to the base 2 in parallel with shrinkage and solidification of the adhesive, and the end of the surface acoustic wave element 1 easily abuts on the base 2. As the base 2 is deformed, the elastic surface wave element 1 is distorted. Therefore, 1. As described in (1) above, there is a problem that the characteristics of the surface acoustic wave device change due to changes in the strain state of the surface acoustic wave element 1. Japanese Utility Model Publication No. 4-32817 discloses a method of obtaining parallelism between a surface acoustic wave element and a base by providing a protrusion for supporting the peripheral edge portion of the surface acoustic wave element in a non-bonded state. There is. According to this method, the deformation of the surface in the convex direction does not cause or change the strain of the surface acoustic wave element. However, due to the contact between the surface acoustic wave element and the base due to the deformation of the base in the concave direction, the surface acoustic wave element is distorted.
【０００６】 本考案は、前述したように弾性表面波素子裏面とベースとの接着固定により発 生する前記課題を解決する目的でなされたものである。すなわち、弾性表面波素 子裏面を局部的かつ均一面積でベースへ接着固定し、かつ素子とベースとの平行 性を良好に保つことにより、弾性表面波装置が熱的或いは機械的ストレスに さ れても弾性表面波素子に歪みが発生することが無い信頼性の高い弾性表面波装置 を得ることを目的とする。The present invention has been made for the purpose of solving the above-mentioned problems caused by the adhesive fixing of the back surface of the surface acoustic wave element and the base as described above. That is, by bonding and fixing the back surface of the surface acoustic wave element to the base locally and in a uniform area, and maintaining good parallelism between the element and the base, the surface acoustic wave device is protected from thermal or mechanical stress. Even if the surface acoustic wave element is not distorted, the object is to obtain a highly reliable surface acoustic wave device.
【０００７】[0007]
本考案の弾性表面波装置は、金属薄膜電極が形成された主面と該主面に対向す る裏面を有する弾性表面波素子と該弾性表面波素子を載置するベースとの間に枠 を介在させ、該枠と該素子裏面と該ベースとにより形成される空間に接着剤を充 填し、該弾性表面波素子と該ベースとを接着固定したことを特徴とする。 The surface acoustic wave device of the present invention has a frame between a surface acoustic wave element having a main surface on which a metal thin film electrode is formed and a back surface facing the main surface, and a base on which the surface acoustic wave element is mounted. An adhesive is filled in a space formed by the frame, the back surface of the element, and the base, and the surface acoustic wave element and the base are adhesively fixed.
【０００８】 さらに、前記枠の外周部に凹部を有することを特徴とする。Further, it is characterized in that it has a concave portion on the outer peripheral portion of the frame.
【０００９】 さらに、前記ベースに前記枠の枠形状と概ね同一形状の溝若しくは前記枠の平 面形状と概ね同一形状の穴を設け、前記枠を該若しくは該穴に装着したことを特 徴とする。Further, it is characterized in that a groove having substantially the same shape as the frame shape of the frame or a hole having substantially the same shape as the plane shape of the frame is provided in the base, and the frame is attached to the hole or the hole. To do.
【００１０】 さらに、前記ベースに前記枠の開口形状と概ね同一形状の突起部を設け、前記 枠を該突起部に装着したことを特徴とする。Further, the base is provided with a protrusion having substantially the same shape as the opening shape of the frame, and the frame is mounted on the protrusion.
【００１１】[0011]
以下本考案の実施例を説明する。 An embodiment of the present invention will be described below.
【００１２】 図１は弾性表面波素子１とベース２との間に接着剤３を充填した枠４を介在さ せ、弾性表面波素子１とベース２とを接着固定した状態を示した組み立て断面図 である。弾性表面波素子裏面５に当接する枠４の端面及びベース表面６に当接す る枠４の端面とは互いに平行に加工されている。代表的な工順を以下に説明する 。FIG. 1 is an assembly cross-section showing a state in which a frame 4 filled with an adhesive 3 is interposed between a surface acoustic wave element 1 and a base 2, and the surface acoustic wave element 1 and the base 2 are adhesively fixed. It is a figure. The end surface of the frame 4 abutting on the back surface 5 of the surface acoustic wave element and the end surface of the frame 4 abutting on the base surface 6 are processed in parallel with each other. A typical route is explained below.
【００１３】 １．ベース２上に枠４を載置する。1. The frame 4 is placed on the base 2.
【００１４】 ２．枠４の中へ接着剤３を注入する。2. The adhesive 3 is poured into the frame 4.
【００１５】 ３．弾性表面波素子１を枠４上へ載置する。3. The surface acoustic wave element 1 is placed on the frame 4.
【００１６】 ４．接着剤３の硬化処理を行なう。[0016] 4. The adhesive 3 is cured.
【００１７】 ５．アルミニュウム或いは銅或いは金等の金属細線７を用いて主面８上の電極９ と外部への導出電極１０とを接続する。5. An electrode 9 on the main surface 8 and a lead-out electrode 10 to the outside are connected by using a metal thin wire 7 such as aluminum, copper or gold.
【００１８】 ６．抵抗溶接或いは接着等の手段を用いて蓋１１とベース２との間を封止する。 以上述べた工程を経て、接着剤の厚みが一定均一で、弾性表面波素子を接着固定 する面積が一定均一で、弾性表面波素子をベースに対して枠を用いて平行保持し て接着固定した弾性表面波装置を得る。弾性表面波素子裏面５と弾性表面波素子 裏面５が当接する枠４の端面の仕上げ状態をベース表面６の仕上げ状態よりも良 好にすることにより、弾性表面波素子１を枠４に載置する際発生する極僅かな余 剰接着剤は枠４とベース表面６との間に浸透させることができる。換言すれば、 弾性表面波素子裏面５の接着面積をより一定均一にすることができる。6. The lid 11 and the base 2 are sealed by means such as resistance welding or adhesion. Through the steps described above, the thickness of the adhesive is uniform and the area where the surface acoustic wave element is bonded and fixed is uniform, and the surface acoustic wave element is bonded and fixed in parallel to the base using a frame. Obtain a surface acoustic wave device. The surface acoustic wave element back surface 5 and the surface acoustic wave element The surface acoustic wave element 1 is placed on the frame 4 by making the finished state of the end surface of the frame 4 with which the back surface 5 abuts is better than the finished state of the base surface 6. A slight amount of surplus adhesive that is generated during this process can be penetrated between the frame 4 and the base surface 6. In other words, the adhesion area of the back surface 5 of the surface acoustic wave element can be made more uniform.
【００１９】 図２は本考案の別の実施例を説明するための要部組み立て断面図である。工順 は図１の実施例と同様である。ベース２の凸及び凹方向の変形に伴い枠４のベー ス表面６に当接する端面部分が変形しても、枠４の外周部の凹部２０により変形 は吸収され、弾性表面波素子１は変形作用を受けない。FIG. 2 is an assembled sectional view of an essential part for explaining another embodiment of the present invention. The work order is similar to that of the embodiment shown in FIG. Even if the end surface portion of the frame 4 that abuts the base surface 6 is deformed due to the deformation of the base 2 in the convex and concave directions, the deformation is absorbed by the concave portion 20 in the outer peripheral portion of the frame 4, and the surface acoustic wave element 1 is deformed. Not affected.
【００２０】 図３、図４は本考案の別の実施例を説明するための要部組み立て断面図である 。工順は図１の実施例と同様である。枠４をベース２へ載置する際には枠４を溝 ３０（図３）或いは穴４０（図４）にかん合させ、枠４の位置決めを行なうので 作業性が向上しかつ弾性表面波素子の接着位置精度も向上する。FIG. 3 and FIG. 4 are assembly sectional views of main parts for explaining another embodiment of the present invention. The work order is similar to that of the embodiment shown in FIG. When the frame 4 is placed on the base 2, the frame 4 is engaged with the groove 30 (FIG. 3) or the hole 40 (FIG. 4) to position the frame 4, so that the workability is improved and the surface acoustic wave element is mounted. The bonding position accuracy of is also improved.
【００２１】 図５は本考案の別の実施例を説明するための要部組み立て断面図である。工順 は図１の実施例と同様である。枠４をベース２へ載置する際には枠４を突起５０ にかん合させるので、図３の場合と同じ効果を得ることができる。FIG. 5 is an assembled sectional view of an essential part for explaining another embodiment of the present invention. The work order is similar to that of the embodiment shown in FIG. When the frame 4 is placed on the base 2, the frame 4 is engaged with the protrusion 50, so that the same effect as in the case of FIG. 3 can be obtained.
【００２２】 実施例のいずれの場合においても枠は剛体である必要はなく、可撓性を有する 材質でもよい。尚この場合には接着剤も可撓性を有することが望ましい。前記組 み合わせを用いれば、ベースが変形しても枠及び接着剤が変形を吸収することに より、弾性表面波素子の受ける変形作用はより小さくなる。In any of the embodiments, the frame does not have to be a rigid body and may be a flexible material. In this case, it is desirable that the adhesive also has flexibility. If the combination is used, the deformation action of the surface acoustic wave element is further reduced because the frame and the adhesive absorb the deformation even if the base is deformed.
【００２３】[0023]
【考案の効果】 以上実施例において述べたように枠を用いることにより、弾性表面波素子をベ ースに対して局部的な一定均一接着面積かつ一定均一接着剤厚みで接着すること ができ、弾性表面波素子をベースに対して平行に保持することができることによ り弾性表面波素子の端部がベースへ当接する課題も解決でき、特性が一定均一で 信頼性が高い弾性表面波装置を得ることができる。EFFECTS OF THE INVENTION By using the frame as described in the above embodiments, the surface acoustic wave element can be locally adhered to the base with a constant uniform adhesive area and a constant uniform adhesive thickness, Since the surface acoustic wave element can be held parallel to the base, the problem that the end of the surface acoustic wave element abuts on the base can be solved, and a surface acoustic wave device with uniform characteristics and high reliability can be provided. Obtainable.
【図１】本考案に関わる実施例を示す組み立て断面図で
ある。FIG. 1 is an assembled sectional view showing an embodiment related to the present invention.
【図２】本考案に関わる他の実施例を示す要部組み立て
断面図である。FIG. 2 is an assembled sectional view of a main part showing another embodiment related to the present invention.
【図３】本考案に関わる他の実施例を示す要部組み立て
断面図である。FIG. 3 is an assembled sectional view of a main part showing another embodiment related to the present invention.
【図４】本考案に関わる他の実施例を示す要部組み立て
断面図である。FIG. 4 is an assembled sectional view of essential parts showing another embodiment of the present invention.
【図５】本考案に関わる他の実施例を示す要部組み立て
断面図である。FIG. 5 is an assembled sectional view of an essential part showing another embodiment of the present invention.
【図６】従来の実施例を示す要部組み立て断面図であ
る。FIG. 6 is an assembled sectional view of a main part showing a conventional example.
Claims (4)
対向する裏面を有する弾性表面波素子と該弾性表面波素
子を載置するベースとの間に枠を介在させ、該枠と該弾
性表面波素子裏面と該ベースとにより形成される空間に
接着剤を充填し、該弾性表面波素子と該ベースとを接着
固定したことを特徴とする弾性表面波装置。1. A frame is interposed between a surface acoustic wave element having a main surface on which a metal thin film electrode is formed and a back surface facing the main surface, and a base on which the surface acoustic wave element is mounted, and the frame. A surface acoustic wave device characterized in that a space formed by the back surface of the surface acoustic wave element and the base is filled with an adhesive, and the surface acoustic wave element and the base are bonded and fixed.
とする請求項１記載の弾性表面波装置。2. The surface acoustic wave device according to claim 1, wherein the outer peripheral portion of the frame has a recess.
状の溝若しくは前記枠の平面形状と概ね同一形状の穴を
設け、前記枠を溝若しくは該穴に装着したことを特徴と
する請求項１記載の弾性表面波装置。3. A groove having substantially the same shape as the frame shape of the frame or a hole having substantially the same shape as the plane shape of the frame is provided in the base, and the frame is mounted in the groove or the hole. Item 2. The surface acoustic wave device according to item 1.
形状の突起部を設け、前記枠を該突起部に装着したこと
を特徴とする請求項１記載の弾性表面波装置。4. The surface acoustic wave device according to claim 1, wherein the base is provided with a protrusion having substantially the same shape as the opening of the frame, and the frame is attached to the protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1956393U JPH0681139U (en) | 1993-04-16 | 1993-04-16 | Surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1956393U JPH0681139U (en) | 1993-04-16 | 1993-04-16 | Surface acoustic wave device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0681139U true JPH0681139U (en) | 1994-11-15 |
Family
ID=12002773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1956393U Pending JPH0681139U (en) | 1993-04-16 | 1993-04-16 | Surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0681139U (en) |
-
1993
- 1993-04-16 JP JP1956393U patent/JPH0681139U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5939817A (en) | Surface acoustic wave device | |
| EP0896427A3 (en) | Surface acoustic wave device | |
| JP2002005951A (en) | Semiconductor dynamical quantity sensor and its manufacturing method | |
| GB2254278A (en) | Method of mounting silicon chips on metallic mounting surfaces | |
| KR20010081032A (en) | Surface acoustic wave device and method of producing the same | |
| JP3579740B2 (en) | Manufacturing method of electronic components | |
| JPH0681139U (en) | Surface acoustic wave device | |
| JP2002026679A (en) | Package for piezoelectric vibration device | |
| JP2634249B2 (en) | Semiconductor integrated circuit module | |
| JP3048141B2 (en) | Optical component equipment | |
| JPH04367111A (en) | Plezoelectric oscillator and production of the same | |
| JP2906756B2 (en) | Substrate for mounting electronic components | |
| JPH07154185A (en) | Surface acoustic wave device and its manufacture | |
| JPH1041431A (en) | Package for airtight sealing | |
| TWI835299B (en) | Piezoelectric vibration device | |
| JPH10209469A (en) | Semiconductor pressure sensor | |
| JP3265488B2 (en) | Manufacturing method of force / moment detecting device | |
| JPH056714Y2 (en) | ||
| JP2854286B2 (en) | Surface mount type pressure sensor and its manufacturing method | |
| JPS631109A (en) | Electronic parts and their production | |
| JPH0411440Y2 (en) | ||
| JPH0432817Y2 (en) | ||
| JPH05332863A (en) | Semiconductor pressure sensor | |
| JPH1126897A (en) | Substrate mounting structure | |
| JP2588849Y2 (en) | Semiconductor envelope |