JPH0679559U - Stamp device - Google Patents

Abstract

(57) [Summary] [Purpose] P of the stencil base paper of the stencil printing master plate when perforating the plate.
(EN) Provided is a stamping device in which ET does not fuse to a thermal head heating element and stable piercing unevenness does not occur. [Structure] The stamping device comprises a transporting device for transporting a stencil printing plate, and a punching device provided with a guide having a shape higher than the thickness of the thermal head heating element and less frictional at the tip of the thermal head in the transport direction. There is.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a stamp device.

[0002]

[Prior art]

 FIG. 3, FIG. 6, FIG. 7, FIG. 8 and FIG. 9 show an example of a conventional stamp device.

A conventional stamping device is composed of a plate making device 1 and a stamp section 60 housed in the plate making device 1. An operation unit 1a is formed on the upper surface of the plate making apparatus 1, and a keyboard 2, on which characters and the like are displayed, a liquid crystal display 3, a plate making key 4, and an on / off switch 5 are provided on the operation unit 1a. An insertion port 6 is formed on the side surface 1b of the stamping device, and the master plate 50A for stencil printing is inserted into the transport path in the plate making device 1 through the insertion port 6.

The stencil printing plate 50A has a frame 61 as shown in FIG. 9, and rails 62, 62 are formed on the left and right sides of the frame 61 (only one frame is shown in the figure). Is shown). An impregnation body 73 impregnated with ink is held on the lower surface of the frame body 61, and the lower surface of the impregnation body 73 is covered with a heat-sensitive stencil sheet 74. The stencil printing plate 50A is attached to the lower surface of the stamp portion 60 after the heat-sensitive stencil sheet 74 is heated and perforated by the heat treatment in the plate making apparatus 1. The stamp part 60 has a support plate 65, and a grip 64 is fixed to the center of the support plate 65 (FIG. 6). An adhesive 63 is attached to the support plate 65 via a cushion layer 162, and the stencil printing plate 50A that has been prepressed in the plate making apparatus 1 is attached to the adhesive 63. The stamp section 60 is housed in the stamp section housing section 7, and at the time of use, the stamp section 60 is taken out from the stamp section housing section 7 while holding the stencil printing plate 50A and used.

In FIG. 6, an upper conveyance guide plate 11 a is provided on the upper left side of the insertion port 6. A lower conveyance guide plate 11b is provided in the plate making apparatus 1 corresponding to the upper conveyance guide plate 11a, and the interval between the upper and lower conveyance guide plates 11a and 11b is set to be wider than the thickness of the stencil printing plate 50A. ing.

A platen 12 is provided on the left side of the upper transport guide plate 11 a in the figure, and an upper transport roller 13 a forming one of a pair of transport rollers is provided on the left side of the platen 12. As shown in FIG. 9, the platen 12 is in contact with the central portion of the frame 61, and the upper conveying rollers 13a are in contact with the surfaces of the left and right rails 62 of the frame 61 to convey the stencil printing plate 50A. A thermal head unit 15 is arranged below the lower conveyance guide plate 11b, and a thermal head holding plate 16 holding a thermal head 15b having an aluminum heat radiating plate 15a attached to the back side thereof has a shaft 17 as a center. It is swingable. (FIG. 7) The thermal head holding plate 16 is urged clockwise by a tension spring 18 in the figure, and the thermal head holding plate 16 is operated by a cam mechanism (not shown) to insert the thermal head 15b into the stencil plate. The printing base plate 50A is swung between a perforation position in contact with the heat-sensitive stencil sheet 74 and a standby position shown in FIG.

On the left side of the thermal head holding plate 16, a transport roller holding plate 19 that interlocks with the thermal head holding plate 16 via a connecting wire 14 is provided so as to be able to perform a seesaw movement about a shaft 21. As shown in FIG. 8, the upper end of the connecting wire 14 is engaged with the shaft 180 of the lower conveying roller 13b, and the lower conveying roller 13b is provided at the other end of the conveying roller holding plate 19 with two left and right upper conveying rollers. 13a is pivotally held so as to correspond to 13a. A discharge roller 23 is provided on the opposite side of the shaft 21 from the lower transport roller 13b via a shaft 23a. A tension spring 24 is provided at the lower end of the transport roller holding plate 19, and the tension roller 24 biases the transport roller holding plate 19 counterclockwise in FIG.

On the other hand, an operating pin 22 is provided in the vicinity of the shaft 21, and the operating pin 22 is a contact surface of a neck portion of the stop frame 80 rotatably supported by the shaft 26 and extending in a substantially vertical direction. Cooperate with 25a. Further, the upper end of the stop frame 80 is urged upward by a tension spring 27, and the tension spring 27 urges the stop frame 80 about the shaft 26 counterclockwise in the figure. A stop plate portion 25b extending substantially vertically is formed at the right end of the stop frame 80 in the figure, and a stop plate 25c is provided at the center of the stop frame 80. The contact plate 25c abuts the upper guide plate 90 from below in FIG. 6 to bias the rotation of the stop frame 80. Further, a lower guide plate 91 is provided at a position facing the upper guide plate 90 so as not to interfere with the movement of the discharge roller 23.

Next, the operation of the conventional stamp device will be described.

The stencil printing plate 50A is supplied from the insertion port 6 into the transport path in the plate making apparatus 1 before the start of the punching operation. The state at this time is shown in FIG. 6, and the insertion front end of the stencil printing plate 50A is in contact with the stop plate portion 25b of the stop frame and stopped. Further, in FIG. 6, when the plate making key 4 (FIG. 3) is pressed, the thermal head holding plate 16 swings clockwise about the shaft 17 by a cam mechanism (not shown). 13b contacts the lower surface of the rail 62 of the stencil printing plate 50A, and the preparation for transporting the stencil printing plate 50A by the transport rollers 13a and 13b is completed.

As the thermal head holding plate 16 swings upward, the transport roller holding plate 19 rotates counterclockwise in the figure, and the operating pin 22 also swings counterclockwise as a result. Since it moves, the stop frame 80 swings clockwise in the drawing to open the conveyance path. In this state, the conveyance of the stencil printing plate 50A is started, the thermal head 15b is energized to start the piercing operation, and when the piercing operation is completed, the discharge roller 23 causes the stencil printing plate 50A to be transferred to the stamp part storing section. It is sent out within 7. The master plate 50A for stencil printing sent out into the stamp part housing part 7 is attached to the stamp part 60 and drawn out to be used.

[0012]

[Problems to be solved by the device]

 However, in the conventional stamping apparatus, PET 100, which is one of the constituent elements of the heat-sensitive stencil sheet 74 of the stencil printing master plate 50A, is installed in the thermal head 15b when the master head 50A is punched by the thermal head 15b. It sometimes fused to the thermal head heating element 115.

The cause of the fusion of the PET 100 will be described with reference to FIGS. 10 (a) to 10 (c) in which the thermal head 15b and the heat-sensitive stencil sheet 74 are enlarged in the vicinity of the thermal head heating element 115 during press-making. First, the stencil printing plate 50A is conveyed to a predetermined position, and the heat generated by the thermal head heating element 115 melts and shrinks the PET 100 on the thermal head heating element 115. The shaded area in the figure is the porous support 101 which is one of the components of the heat-sensitive stencil sheet 74.

Next, although the heat-sensitive stencil sheet 74 should be conveyed by a predetermined amount, it is caught by a sharp edge on the end face of the thermal head 15b or a minute burr generated during manufacturing of the end surface thermal head and conveyed by a predetermined amount. However, the previously melted and shrunk portion is heated again by the thermal head heating element 115, and the thermal head heating element 115 is conveyed in the conveying direction (hereinafter, the conveying direction is the sub-scanning direction, and the direction perpendicular to the conveying direction is the main scanning direction). The fusion of the PET 100 occurs because the PET 100 remains on the end face side. Most of the fusion occurs on the end surface side of the thermal head heating element 115 shown in the bottom view of FIG. 10 in the sub-scanning direction.

The present invention has been made in order to solve the above-mentioned problems, and there is no fusion of PET to the thermal head during perforation of a stencil printing master plate, and for stencil printing without perforation unevenness. An object of the present invention is to provide a stamping device capable of making a master plate.

[0016]

[Means for Solving the Problems]

 In order to achieve this purpose, the stamping device of the present invention feeds a stencil printing plate, in which the surface of an impregnated body impregnated with ink is covered with a stencil sheet, from the insertion port of a plate making device composed of a thermal head and a conveying device. A stamping device for forming a punched image by carrying out heating punching while being conveyed by a guide having a height higher than the thickness of the thermal head and a smooth end at the tip of the thermal head of the plate making apparatus in the feeding direction. It has a means.

[0017]

[Action]

 In the stamping device of the present invention having the above-mentioned configuration, the stencil printing base plate in which the surface of the impregnated body impregnated with ink is covered with the stencil base paper The ink impregnated in the impregnated body is prepared by punching with a thermal head equipped with a guide with low friction, mounting the master plate for stencil printing on the stamp member, and then pressing the stamp member against the printing paper. Bleeds from the perforated portion of the stencil sheet and performs stencil printing.

In this stamping device, the stencil sheet melted and shrunk by the heat generated by the thermal head is conveyed by the guide means in a fixed amount without being caught by a minute burr on the end face of the thermal head.

[0019]

【Example】

 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

The same members as the conventional members are designated by the same reference numerals, and detailed description thereof will be omitted.

The structure will be described with reference to FIG. 2 which is a vertical sectional view of the stamp device of the present invention and FIG. 1 which is an enlarged vertical sectional view of the thermal head unit 15. The thermal head 15b is attached to the end face side in the scanning direction with an aluminum guide heat radiating plate 110 having a semi-cylindrical guide having a smooth surface with the same height as the thermal head heating element 115 and less friction. And a thermal head holding plate 16 holding the thermal head 15b are swingably provided around a shaft 17.

The thermal head holding plate 16 is biased clockwise by a tension spring 18 in the figure.

Further, both end faces in the main scanning direction of the guide part of the heat dissipation plate with guide 110 are pressed against the stencil printing plate 50A while being conveyed, and the heat-sensitive stencil sheet 74 of the stencil printing plate 50A is scratched. A smooth R finish is applied to prevent it (Fig. 4).

A detailed description of a series of operations of the stamp device 1 of the present invention, that is, the process of pressing the plate-making key-4 to make the stencil printing plate 50A, making the plate, attaching it to the stamp block 60, pulling it out to the outside and using it. Are omitted because they are the same as in the prior art.

Next, referring to FIG. 5, which is an enlarged view of the vicinity of the thermal head heating element 115, the PET100 support which is one of the constituent elements of the heat-sensitive stencil sheet 74 of the stencil sheet 50A during plate making. The perforation conveyance state in the vicinity of the round head heating element 115 will be described.

When the thermal head 15b is pressed, the PET 100 makes contact with the thermal head heating element 115 and the guide portion of the heat dissipation plate 110 with a guide. Therefore, it is inevitable that the end surface type thermal head is not manufactured. PET100 does not contact the burr. The PET 100 melted and shrunk by the heat generated by the thermal head heating element 115 is conveyed by a predetermined amount without being caught by a minute burr on the end face of the thermal head 15b.

As described above in detail, the PET 100 of the heat-sensitive stencil sheet 74 is not fused to the thermal head heating element 115 when the stencil sheet 50A is punched, and the stencil sheet 50A has no perforation unevenness. It is possible to provide the stamp device 1 that enables plate making.

The present invention is not limited to such an embodiment and can be implemented in various modes without departing from the gist of the present invention.

[0029]

[Effect of device]

 As is clear from the above description, according to the present invention, there is no fusion of the stencil sheet to the thermal head of the plate making apparatus during perforation, there is no unevenness of perforation, and the life of the thermal head due to the fusion is further improved. It is possible to provide a stamp device that is not affected.

[Brief description of drawings]

FIG. 1 is an enlarged vertical sectional view of a thermal head unit of this embodiment.

FIG. 2 is a vertical sectional view of the stamp device according to the present embodiment.

FIG. 3 is an external perspective view of a stamp device.

FIG. 4 is a top view and a side view in the vicinity of a thermal head heating element.

FIG. 5 is an enlarged view of the vicinity of a thermal head heating element during perforation conveyance.

FIG. 6 is a vertical sectional view of a conventional stamp device.

FIG. 7 is an enlarged vertical sectional view of a thermal head unit of a conventional stamp device.

FIG. 8 is a perspective view showing a configuration inside a plate making apparatus of a conventional stamp apparatus.

FIG. 9 is a perspective view showing a state in which a platen, a conveying roller, and a stencil printing plate of a conventional stamp device are engaged with each other.

FIG. 10 is an enlarged view of the vicinity of a thermal head heating element during punching conveyance of a conventional stamping device.

[Explanation of symbols]

 50A stencil printing plate 74 heat-sensitive stencil sheet 15b thermal head 110 heat sink with guide

Claims (1)

[Scope of utility model registration request] 1. A stencil printing original plate in which the surface of an impregnated body impregnated with ink is covered with a stencil original paper is fed from an insertion port of a plate making device composed of a thermal head and a conveying device and heated and punched while being conveyed. A stamping apparatus for forming an image, wherein a stamper having a height higher than a thickness of the thermal head and a smooth end is provided at a leading end of the thermal head of the plate making apparatus in a conveying direction.