JPH0677684A - Printed-circuit board and its manufacture - Google Patents
Printed-circuit board and its manufactureInfo
- Publication number
- JPH0677684A JPH0677684A JP22587292A JP22587292A JPH0677684A JP H0677684 A JPH0677684 A JP H0677684A JP 22587292 A JP22587292 A JP 22587292A JP 22587292 A JP22587292 A JP 22587292A JP H0677684 A JPH0677684 A JP H0677684A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- insulating layer
- conductive layer
- noise
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、絶縁層と導電層とから
成るプリント基板に関し、さらに詳しくは、ノイズ耐性
に優れかつ実装される電子部品のリード線へのフォーミ
ング加工を必要としないプリント基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board composed of an insulating layer and a conductive layer, and more particularly to a printed circuit board which is excellent in noise resistance and does not require a forming process for a lead wire of an electronic component to be mounted. Regarding
【０００２】[0002]
【従来の技術】従来、電子機器の回路を構成する為に、
個々の電子部品を電気的に結合する手段としてフェノー
ル樹脂やガラス繊維入エポキシ板上に所望の回路を形成
する銅箔をはりつけて成るプリント基板が一般的に使用
されてきた。2. Description of the Related Art Conventionally, in order to configure a circuit of an electronic device,
As a means for electrically connecting individual electronic parts, a printed circuit board which is made by pasting a copper foil for forming a desired circuit on a phenol resin or glass fiber-containing epoxy board has been generally used.
【０００３】しかし、近年の電子機器への小型化、高速
化の要求から回路中で取扱う電気信号が微小化、高周波
数化するのに伴い、形成された回路への外来ノイズの侵
入や回路からのノイズの放散の防止がクローズアップさ
れてきた。また電子機器の小型化、高性能化によりその
使用環境も多様化し、移動体通信等の様に耐震性が要求
される用途も広がっている。However, due to the demand for miniaturization and high speed of electronic devices in recent years, with the miniaturization and high frequency of electric signals handled in the circuit, intrusion of external noise into the formed circuit and from the circuit. Prevention of noise emission has been highlighted. In addition, the miniaturization and high performance of electronic devices have diversified the environment in which they are used, and the applications requiring earthquake resistance such as mobile communications are also expanding.
【０００４】この様な観点から、耐ノイズ性について
は、電子機器の筐体を金属製として電気的、磁気的なシ
ールドを施したり、入出力ラインへインダクタンス素子
の挿入等の対策が講じられている。From this point of view, with respect to noise resistance, measures such as electrically and magnetically shielding the housing of the electronic equipment and inserting an inductance element in the input / output line are taken. There is.
【０００５】一方、耐震性については、個々の電子部品
の入出力ラインであるリード線に湾曲部を設けるいわゆ
るフォーミング加工により、外来振動を吸収する方策が
とられている。On the other hand, regarding the earthquake resistance, a measure for absorbing an external vibration is taken by a so-called forming process in which a lead wire which is an input / output line of each electronic component is provided with a curved portion.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上述し
たノイズの防止策では、筐体内部でのノイズの侵入、放
散が防止出来ず、さらに耐震性対策では個々の電子部品
のリード線へフォーミング加工する際の工程数が増加す
るという欠点が有った。However, the above-mentioned measures for preventing noise cannot prevent the noise from invading and dissipating inside the housing, and the seismic resistance measures form the lead wire of each electronic component. There is a drawback that the number of steps is increased.
【０００７】そこで、本発明の技術的課題は、プリント
基板間でのノイズの入出を防止し、かつ耐震性に優れた
プリント基板及びその製造方法を提供することに有る。Therefore, a technical object of the present invention is to provide a printed circuit board which prevents noise from entering and exiting between the printed circuit boards and is excellent in earthquake resistance, and a manufacturing method thereof.
【０００８】[0008]
【課題を解決するための手段】本発明のプリント基板
は、軟磁性粉末と熱可塑性ポリマーとから成る絶縁層及
び熱硬化性ポリマーと金属膜とから成り前記絶縁層に接
着された導電層を含むことを特徴とする。A printed circuit board of the present invention includes an insulating layer made of soft magnetic powder and a thermoplastic polymer, and a conductive layer made of a thermosetting polymer and a metal film and bonded to the insulating layer. It is characterized by
【０００９】本発明のプリント基板の製造方法は、軟磁
性粉末と熱可塑性ポリマーとを混合、混練して絶縁材料
を得る第一の工程、前記絶縁材料を押出し成形法を用い
てシート状の絶縁層になす第二の工程、及び熱硬化性ポ
リマーと金属膜とから成る導電層に前記絶縁層を接着す
る第三の工程を含むことを特徴とする。The printed circuit board manufacturing method of the present invention comprises a first step of mixing and kneading a soft magnetic powder and a thermoplastic polymer to obtain an insulating material, and a sheet-like insulation using an extrusion molding method of the insulating material. The method is characterized by including a second step of forming a layer and a third step of adhering the insulating layer to a conductive layer composed of a thermosetting polymer and a metal film.
【００１０】ここで、本発明において、軟磁性粉末とし
ては、Ｎｉ−ＺｎフェライトやＮｉ−Ｃｕ−Ｚｎフェラ
イト等の軟磁性セラミックス粉末や電解鉄、パーマロイ
等の軟磁性粉末が例示できるが、電気的絶縁性や対象ノ
イズ帯域により、さらに限定されず種々選択され得る。In the present invention, examples of the soft magnetic powder include soft magnetic ceramic powder such as Ni-Zn ferrite and Ni-Cu-Zn ferrite, and soft magnetic powder such as electrolytic iron and permalloy. Various selections can be made without further limitation depending on the insulation property and the target noise band.
【００１１】また、本発明において熱可塑性ポリマーと
しては、各種ポリオレフィン、コポリマー等が使用でき
るが、軟磁性粉末との親和性や電気的絶縁性などを考慮
して適宜選択される。Further, in the present invention, as the thermoplastic polymer, various polyolefins, copolymers and the like can be used, but they are appropriately selected in consideration of the affinity with the soft magnetic powder and the electrical insulating property.
【００１２】[0012]
【実施例】次に本発明の実施例について、図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１３】（実施例１）図１は、本発明の第１の実施
例を示す斜視図である。(Embodiment 1) FIG. 1 is a perspective view showing a first embodiment of the present invention.
【００１４】図１において、絶縁層２は、各々０．５μ
ｍ以下の粒径を持つ酸化ニッケル（ＮｉＯ）、酸化亜鉛
（ＺｎＯ）及び酸化鉄（α−Ｆｅ2 Ｏ3 ）を配合し、ボ
ールミルを使用して２０時間湿式混合を行った後、大気
中で急熱急冷にて７５０〜１２００℃で焼成し、さらに
ボールミルにて解砕して得られた粒径５μｍ以下、化学
組成比が２０ＮｉＯ・３３Ｚｎ・４８Ｆｅ2 Ｏ3 なる軟
磁性粉末を、占積率５５％となる様に平均重合度１００
０の軟質ポリ塩化ビニルと混合した後、１６０℃の温度
下で二軸ニーダにて混練して得られた絶縁材料を、１８
０℃の温度下で押出し成形機により厚さ１．０ｍｍのシ
ート状に押出し成形し、ついで、ピッチ２．５４ｍｍ、
穴径１．６ｍｍの穴４を打穴きプレスによりあけ、得
た。ついで、１．０ｍｍ厚で、ピッチ２．５４ｍｍ、穴
径１．６ｍｍの穴４′を持つフェノール樹脂板１１の片
面に、前記穴４′を中心として位置する外径２ｍｍ、内
径１．６ｍｍのリング状の銅箔１２を有する導電層３に
対し、導電層３の銅箔１２と逆の面に対し穴４、穴４′
が重なる位置に前記絶縁層２をエポキシ系接着剤を用い
て接着し、プリント基板１を得た。In FIG. 1, the insulating layer 2 has a thickness of 0.5 μm.
Nickel oxide (NiO) having a particle diameter of m or less, zinc oxide (ZnO) and iron oxide (α-Fe 2 O 3 ) were mixed and wet-mixed for 20 hours using a ball mill, and then in the air. A space factor of a soft magnetic powder having a grain size of 5 μm or less and a chemical composition ratio of 20NiO · 33Zn · 48Fe 2 O 3 obtained by calcination at 750 to 1200 ° C. with rapid heating and quenching and further crushing with a ball mill. The average degree of polymerization is 100 so that it becomes 55%.
After mixing with a soft polyvinyl chloride of 0 and kneading with a biaxial kneader at a temperature of 160 ° C., 18
Extruded into a sheet having a thickness of 1.0 mm by an extruder at a temperature of 0 ° C., and then a pitch of 2.54 mm,
Hole 4 having a hole diameter of 1.6 mm was obtained by punching with a punching press. Then, on one surface of the phenolic resin plate 11 having holes 4'having a thickness of 1.0 mm, a pitch of 2.54 mm, and a hole diameter of 1.6 mm, an outer diameter of 2 mm and an inner diameter of 1.6 mm centered on the hole 4 '. For the conductive layer 3 having the ring-shaped copper foil 12, holes 4 and 4'are provided on the surface of the conductive layer 3 opposite to the copper foil 12.
The above-mentioned insulating layer 2 was adhered to the overlapping position with an epoxy adhesive to obtain a printed circuit board 1.
【００１５】図２は、上述した本発明のプリント基板１
と本発明を実施しない導電層３のノイズの電界強度をノ
イズの周波数に対して測定したグラフである。また絶縁
層２と導電層３の表面硬度はそれぞれロックウェルＭ５
５とＭ１１０であり本発明の有用性は明らかである。FIG. 2 is a printed circuit board 1 of the present invention described above.
3 is a graph in which the electric field strength of noise of the conductive layer 3 not implementing the present invention is measured with respect to the frequency of noise. The surface hardnesses of the insulating layer 2 and the conductive layer 3 are respectively Rockwell M5.
5 and M110, the utility of the present invention is clear.
【００１６】（実施例２）図３は、本発明の第２の実施
例を示す斜視図である。(Second Embodiment) FIG. 3 is a perspective view showing a second embodiment of the present invention.
【００１７】図３において、絶縁層６は、実施例１と同
様にして得られた軟磁性粉末を、占積率６０％となる様
に酢酸ビニル含量が１４％であって平均分子量が１２０
０００なるエチレン−酢酸ビニル共重合体と混合した
後、１３０℃の温度下で２軸ニーダにて混練して得られ
た絶縁材料を１３０℃の温度下で押出し成形機により厚
さ１．６ｍｍのシート状に押出し成形し、ついで、ピッ
チ２．５４ｍｍ、穴径１．６ｍｍの穴８を打穴きプレス
によりあけ、得た。In FIG. 3, the insulating layer 6 is the soft magnetic powder obtained in the same manner as in Example 1 with a vinyl acetate content of 14% and an average molecular weight of 120 so that the space factor is 60%.
000 ethylene-vinyl acetate copolymer, and then kneaded with a twin-screw kneader at a temperature of 130 ° C. to obtain an insulating material. The sheet was extruded into a sheet, and then holes 8 having a pitch of 2.54 mm and a hole diameter of 1.6 mm were punched by a punching press to obtain a sheet.
【００１８】ついで、１．６ｍｍ厚でピッチ２．５４ｍ
ｍ、穴径１．６ｍｍの穴８′を持つガラス繊維入エポキ
シ板２１の片面に前記穴８′を中心として位置する外径
２ｍｍ、内径１．６ｍｍのリング状の銅箔２２を有する
導電層７の銅箔２２と逆の面に対し穴８，８′が重なる
位置に前記絶縁層６を重ねた後、１００℃の温度下で５
ｋｇｆ／ｃｍ2 の圧力で熱溶着し、プリント基板５を得
た。Next, the thickness is 1.6 mm and the pitch is 2.54 m.
m, a conductive layer having a ring-shaped copper foil 22 having an outer diameter of 2 mm and an inner diameter of 1.6 mm, which is located around the hole 8'on one side of a glass fiber-containing epoxy plate 21 having a hole 8'having a hole diameter of 1.6 mm. After the insulating layer 6 was superposed on the surface of the copper foil 22 opposite to the copper foil 22 at the position where the holes 8 and 8 ′ were overlapped with each other, 5 at a temperature of 100 ° C.
The printed circuit board 5 was obtained by heat welding at a pressure of kgf / cm 2 .
【００１９】図４は、第２の実施例のプリント基板５と
本発明を実施しない導電層７のノイズの電界強度をノイ
ズの周波数に対して測定したグラフである。また、絶縁
層６と導電層７の表面硬度はそれぞれロックウェルＭ６
０とＭ１１０であり、本発明の有用性は明らかである。FIG. 4 is a graph in which the electric field strength of the noise of the printed circuit board 5 of the second embodiment and the conductive layer 7 not embodying the present invention is measured with respect to the frequency of the noise. In addition, the surface hardness of the insulating layer 6 and the conductive layer 7 are respectively Rockwell M6.
0 and M110, the utility of the present invention is clear.
【００２０】[0020]
【発明の効果】以上説明したように、本発明によれば、
電子部品と回路形成用の金属膜の間に軟磁性体層が形成
できるのでノイズ遮断性に優れ、かつ柔軟で防震性を具
備するプリント基板及びその製造方法を得ることができ
るので工業上極めて有益である。As described above, according to the present invention,
A soft magnetic material layer can be formed between an electronic component and a metal film for forming a circuit, so that it is possible to obtain a printed circuit board that is excellent in noise insulation, flexible, and earthquake-proof, and a manufacturing method thereof, which is extremely useful in industry. Is.
【図１】本発明の実施例１に於けるプリント基板の斜視
図である。FIG. 1 is a perspective view of a printed circuit board according to a first embodiment of the present invention.
【図２】実施例１のプリント基板と本発明を実施しない
導電層のノイズの電界強度をノイズの周波数に対して測
定したグラフである。FIG. 2 is a graph in which the electric field strength of noise of the printed circuit board of Example 1 and the conductive layer not embodying the present invention is measured with respect to the frequency of noise.
【図３】本発明の実施例２に於けるプリント基板の斜視
図である。FIG. 3 is a perspective view of a printed circuit board according to a second embodiment of the present invention.
【図４】実施例２のプリント基板と本発明を実施しない
導電層のノイズの電界強度をノイズの周波数に対して測
定したグラフである。FIG. 4 is a graph in which the electric field strength of noise of a printed circuit board of Example 2 and a conductive layer not embodying the present invention is measured with respect to the frequency of noise.
１，５ プリント基板 ２，６ 絶縁層 ３，７ 導電層 ４，４′，８，８′ 穴 １１ フェノール樹脂板 ２１ ガラス繊維入エポキシ板 １２，２２ 銅箔 1,5 Printed circuit board 2,6 Insulating layer 3,7 Conductive layer 4,4 ', 8,8' Hole 11 Phenolic resin plate 21 Glass fiber-containing epoxy plate 12,22 Copper foil
Claims (2)
る絶縁層及び熱硬化性ポリマーと金属膜とから成り前記
絶縁層に接着された導電層を含むことを特徴とするプリ
ント基板。1. A printed circuit board comprising: an insulating layer made of soft magnetic powder and a thermoplastic polymer; and a conductive layer made of a thermosetting polymer and a metal film adhered to the insulating layer.
合、混練して絶縁材料を得る第一の工程、前記絶縁材料
を押出し成形法を用いてシート状の絶縁層になす第二の
工程、及び熱硬化性ポリマーと金属膜とから成る導電層
に前記絶縁層を接着する第三の工程を含むことを特徴と
するプリント基板の製造方法。2. A first step of mixing and kneading a soft magnetic powder and a thermoplastic polymer to obtain an insulating material, and a second step of forming the insulating material into a sheet-like insulating layer by an extrusion molding method. And a third step of adhering the insulating layer to a conductive layer composed of a thermosetting polymer and a metal film, the method for producing a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22587292A JP3234956B2 (en) | 1992-08-25 | 1992-08-25 | Printed circuit board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22587292A JP3234956B2 (en) | 1992-08-25 | 1992-08-25 | Printed circuit board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0677684A true JPH0677684A (en) | 1994-03-18 |
| JP3234956B2 JP3234956B2 (en) | 2001-12-04 |
Family
ID=16836179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22587292A Expired - Fee Related JP3234956B2 (en) | 1992-08-25 | 1992-08-25 | Printed circuit board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3234956B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07212079A (en) * | 1994-01-20 | 1995-08-11 | Tokin Corp | Electromagnetic wave interference suppressor |
| JPH0846386A (en) * | 1994-07-29 | 1996-02-16 | Tokin Corp | Printed wiring board |
| JP2006237167A (en) * | 2005-02-23 | 2006-09-07 | Sankyo Kasei Co Ltd | Method for manufacturing circuit component |
| WO2013162238A1 (en) * | 2012-04-24 | 2013-10-31 | Sk Innovation Co., Ltd. | Flexible metal clad laminate |
-
1992
- 1992-08-25 JP JP22587292A patent/JP3234956B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07212079A (en) * | 1994-01-20 | 1995-08-11 | Tokin Corp | Electromagnetic wave interference suppressor |
| JPH0846386A (en) * | 1994-07-29 | 1996-02-16 | Tokin Corp | Printed wiring board |
| JP2006237167A (en) * | 2005-02-23 | 2006-09-07 | Sankyo Kasei Co Ltd | Method for manufacturing circuit component |
| JP4500179B2 (en) * | 2005-02-23 | 2010-07-14 | 三共化成株式会社 | Circuit component manufacturing method |
| WO2013162238A1 (en) * | 2012-04-24 | 2013-10-31 | Sk Innovation Co., Ltd. | Flexible metal clad laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3234956B2 (en) | 2001-12-04 |
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Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20010815 |
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| LAPS | Cancellation because of no payment of annual fees |