JP2001160509A - Complex electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a complex electronic part which is possessed of a noise filtering function and a self-reset overcurrent protective function, small in size, and adaptable to high-density mounting. SOLUTION: Conductor patterns 12 and 22 are each formed on insulating layers 11 and 21 for the formation of a first inductor 1 and a second inductor 2. An overcurrent protective device 3 includes a conductive polymer layer 31 which has a positive resistance-temperature characteristics. The inductors 1 and 2 and the overcurrent protective device 3 are laminated and electrically connected together in series.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a composite electronic component. The composite electronic component according to the present invention is typically used as a noise filter or a fuse element in an interface circuit that connects a personal computer and its peripheral devices.

[0002]

2. Description of the Related Art A personal computer defined by the USB standard, IEEE 1394 standard and the like. In the interface, a digital transmission system using a balanced transmission line is adopted. This balanced transmission line is usually constituted by a cable containing a pair signal line, a power supply line and a ground line. In this case, noise suppression is required for any line included in the balanced transmission line. Conventionally, as a noise countermeasure, a noise removing element such as a chip bead or a chip filter made of a magnetic material has been inserted into the line. In addition, since there is a risk that an abnormal current (overcurrent) flows in the power supply line, it is necessary to take an overcurrent protection measure in addition to a noise measure, and an overcurrent protection element such as a fuse is added to the line. There is a need. Conventionally, the noise elimination element and the overcurrent protection element have been separate and independent components. For this reason, the mounting area is large and high-density mounting personal computers. In some cases, it could not be handled in an interface circuit or the like.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to provide a composite electronic component which is small and can be adapted to high-density mounting.

Another object of the present invention is to provide a composite electronic component having a self-recovery type overcurrent protection function.

Another object of the present invention is to provide a composite electronic component which is easy to manufacture.

Another object of the present invention is to provide a composite electronic component having a noise filter function and an overcurrent protection function.

[0007]

In order to solve the above-described problems, a composite electronic component according to the present invention includes at least one passive circuit element and an overcurrent protection element. The passive circuit element has a conductor pattern formed on an insulating layer containing an organic component. The overcurrent protection element includes a conductive polymer layer having a positive resistance temperature characteristic. The passive circuit element and the overcurrent protection element are stacked on each other and are electrically connected in series.

As described above, the composite electronic component according to the present invention includes at least one passive circuit element and the overcurrent protection element, and the passive circuit element and the overcurrent protection element are stacked on each other. Therefore, it is small and occupies a small area when mounted on a device. Suitable for high-density mounting.

[0009] Moreover, the overcurrent protection element includes a conductive polymer layer having a positive resistance temperature characteristic. This overcurrent protection element operates as a low-resistance element at a steady temperature (room temperature). However, when an overcurrent flows, the resistance value sharply increases due to self-heating. This provides an overcurrent protection effect. When the overcurrent state disappears and the current value returns to the normal value, the resistance value decreases to the original low value. Therefore, a composite electronic component having a self-recovering overcurrent protection function can be obtained.

Further, the passive circuit element has a conductor pattern formed on an insulating layer containing an organic component, and the overcurrent protection element has a conductive polymer layer. That is, both the passive circuit element and the overcurrent protection element are made of organic materials. For this reason, manufacturing conditions such as heat treatment conditions, lamination conditions, and processing conditions are close to each other, so that manufacturing is easy.

The passive circuit element functions as a filter element according to the selection of the material forming the insulating layer and the selection of the shape of the conductor pattern. Such techniques are well known in the art. In the composite electronic component according to the present invention, such a passive circuit element and the overcurrent protection element are electrically connected in series. Therefore, a composite electronic component having a noise filter function and an overcurrent protection function can be obtained.

[0012] Specifically, the passive circuit element can include an inductance element. This inductance element functions as a filter element. The inductance element can be configured to have a coil on a composite magnetic insulating layer containing a resin and ferromagnetic powder. The composite magnetic insulating layer containing the resin and the ferromagnetic powder has improved surface properties.
For this reason, a fine coil pattern can be formed.

Further, by selecting the type of resin or the type, content, or compounding ratio of the ferromagnetic powder, necessary characteristics can be obtained. For example, a noise filter exhibiting excellent noise absorption characteristics in a high frequency region of 1 GHz or more can be obtained.

More specifically, the inductance element is
It can include a first inductance element and a second inductance element. In this case, it is preferable that the overcurrent protection element is arranged between the first inductance element and the second inductance element. Thereby, the first inductance element and the second inductance element can be separated by the overcurrent protection element, and each can be individually operated to obtain excellent noise absorption characteristics.

Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. The accompanying drawings are merely examples.

[0016]

FIG. 1 is an exploded perspective view of a composite electronic component according to the present invention, FIG. 2 is a plan view showing a completed form of the composite electronic component shown in FIG. 1, and FIG. It is sectional drawing along line 3-3. The illustrated composite electronic component includes passive circuit elements 1 and 2 and an overcurrent protection element 3.

The passive circuit elements 1 and 2 have conductor patterns 12 and 22 formed on insulating layers 11 and 21 containing an organic component. The passive circuit elements 1 and 2 may include an inductor, a capacitor, or a network of an inductor and a capacitor. At least one of these elements or networks is provided.

In the illustrated embodiment, the passive circuit elements 1, 2
Includes a first inductance element 1 and a second inductance element 2. First inductance element 1
Has a first composite magnetic insulating layer 11 and a first conductor pattern 12. The first composite magnetic insulating layer 11 contains a resin and a ferromagnetic powder. The thickness of the first composite magnetic insulating layer 11 is, for example, about 0.4 mm.

The first conductor pattern 12 is formed in a spiral shape on the first composite magnetic insulating layer 11 with an appropriate number of turns. The outer end 13 of the first conductor pattern 12
On one side of the first composite magnetic insulating layer 11, a lead electrode 13 having a predetermined width is formed along one edge thereof.
It is continuous. The first composite magnetic insulating layer 11 has an arc-shaped concave portion extending along the thickness direction substantially in the middle of one end edge on which the lead electrode 13 is to be provided. In the concave portion, the terminal electrode 41 is attached. I have. The lead electrode 13 is electrically and mechanically connected to the terminal electrode 41. Further, the first conductor pattern 12 has an inner end 14 which is formed on the other side of the first composite magnetic insulating layer 11 through a first through-hole conductor 15 penetrating the first composite magnetic insulating layer 11 in the thickness direction. It is led to the surface side.

The second inductance element 2 has a second composite magnetic insulating layer 21 and a second conductor pattern 22. The second composite magnetic insulating layer 21 contains a resin and a ferromagnetic powder. The thickness of the second composite magnetic insulating layer 21 is, for example, about 0.4 mm.

The second conductor pattern 22 is formed in a spiral shape on the second composite magnetic insulating layer 21 with an appropriate number of turns. The outer end 23 of the second conductor pattern 22 is continuous with the lead electrode 23 formed with a predetermined width along one end edge on one surface side of the second composite magnetic insulating layer 21. . The second composite magnetic insulating layer 21 is provided with an arc-shaped concave portion extending along the thickness direction substantially in the middle of one edge where the lead electrode 23 is to be provided, and the terminal electrode 42 is attached in the concave portion. ing. The lead electrode 23 is electrically and mechanically connected to the terminal electrode 42. The second conductor pattern 22 has an inner end 24 which is formed on the other side of the second composite magnetic insulating layer 21 through a second through-hole conductor 25 penetrating the second composite magnetic insulating layer 21 in the thickness direction. It is led to the surface side.

The first and second conductor patterns 12, 22 can be made of copper. When the first and second conductor patterns 12 and 22 are made of copper, a Ni film having a thickness of about 2 μm and an Au film having a thickness of about 1 μm are adhered on the surface, and oxidation is performed. It is preferable to use a prevention film.

The first inductance element 1 and the second inductance element 2 are composed of first and second conductor patterns 1
The other surface opposite to the surface provided with 2, 22 is arranged to face each other. The first conductor pattern 12 and the second conductor pattern 22 are the same as viewed from the other surface side of the first composite magnetic insulating layer 11 in a state where the first inductance element 1 and the second inductance element 2 are overlapped. It is wound in the direction.

The overcurrent protection element 3 includes a conductive polymer layer 31 having a positive resistance temperature characteristic. The conductive polymer layer 31 has a thickness of, for example, 0.2 mm. The conductive polymer sheet first and second inductance elements 1 and 2 and the overcurrent protection element 3 are stacked on each other and electrically connected in series. In the illustrated embodiment, the overcurrent protection element 3 has electrodes 32 and 33 on both surfaces of a conductive polymer layer 31. Each of the electrodes 32 and 33 is connected to the first through-hole conductor 15 of the first inductance element 1 and the second through-hole conductor 25 of the second inductance element 2.

Conductive polymers having a positive resistance temperature characteristic are already known. In the present invention, an appropriate polymer can be selected from these known conductive polymers and used.

Lead electrode 13 of first conductor pattern 12
The external terminal 41 to which the lead electrode 23 of the second conductor pattern 22 is connected and the external terminal 41 to which the lead electrode 23 of the second conductor pattern 22 is connected are used as soldering parts when mounted on a circuit board or the like.

Further, in the illustrated embodiment, the coil portions of the first conductor pattern 12 and the coil portions of the second conductor pattern 22 are covered with protective films 51 and 52, respectively. The protective films 51 and 52 are preferably made of the same material as the first and second composite magnetic insulating layers 11 and 21. The thickness is set to about 50 μm.

FIG. 4 is an electrical equivalent circuit diagram of the composite electronic component shown in FIGS. As shown in FIGS.
Is represented as a circuit in which an overcurrent protection element 3 made of a conductive polymer layer 31 having a positive resistance temperature characteristic is inserted between a first inductance element 1 and a second inductance element 2. Is done.

As described above, the composite electronic component according to the embodiment includes the first inductance element 1, the second inductance element 2, and the overcurrent protection element 3, and includes the first and second inductance elements. Since the inductance elements 1 and 2 and the overcurrent protection element 3 are stacked on each other, the size is small and the occupied area when mounted on the device is small. Therefore,
Suitable for high-density mounting.

Further, the overcurrent protection element 3 includes a conductive polymer layer 31 having a positive resistance temperature characteristic. The overcurrent protection element 3 operates as a low-resistance element at normal temperature (room temperature), but when an overcurrent flows, the resistance value sharply increases due to self-heating. This provides an overcurrent protection effect. When the overcurrent state disappears and the current value returns to the normal value, the resistance value decreases to the original low value. Therefore, a composite electronic component having a self-recovering overcurrent protection function can be obtained.

The conductive polymer layer 31 having a positive resistance temperature characteristic has a considerable initial resistance (normal temperature resistance) unlike ceramics having a positive temperature coefficient of resistance, for example, barium titanate-based semiconductor ceramics. Lower. For this reason, at the time of normal operation that is not an overcurrent, the resistance value of the overcurrent protection element 1 can be kept low, and the loss can be reduced.

FIG. 5 is a diagram showing an example of the current-time characteristic of the overcurrent protection element 3 using the conductive polymer layer 31 having a positive resistance temperature characteristic. This data was obtained by applying a current of about 5 A. The conductive polymer layer 31
Immediately after the current is supplied, it operates as a low-resistance element. FIG.
According to the data shown in FIG.
Current flows. This current causes the conductive polymer 31 constituting the overcurrent protection element 3 to generate heat. The resistance value of the conductive polymer 31 rapidly increases due to self-heating. As a result, the current sharply decreases, and an overcurrent protection action is obtained. According to the data of FIG. 5, a current interruption time of about 8 seconds is obtained.

In the embodiment shown in FIGS. 1 to 3, the circuit elements 1, 2
Is constituted by first and second inductance elements 1 and 2, and the first and second inductance elements 1 and 2 and the overcurrent protection element 3 are electrically connected in series. Therefore, it is possible to obtain a composite electronic component having a noise filter function based on the characteristics of the first and second inductance elements 1 and 2 and the overcurrent protection element 3 and an overcurrent protection function using the overcurrent protection element 3. .

FIG. 6 is a diagram showing an example of the impedance-frequency characteristic of the composite electronic component according to the present invention. In the figure, the horizontal axis indicates frequency (MHz), and the vertical axis indicates impedance (Ω). A curve X indicates a reactance, a curve R indicates a resistance, and a curve Z indicates an impedance determined by the reactance X and the resistance R.

As shown, according to the present invention, a noise filter function can be obtained by combining the characteristics of the first and second inductance elements 1 and 2 and the characteristic of the overcurrent protection element 3. Specifically, in a high frequency range of 1 GHz to 4 GHz, the impedance Z is significantly increased,
A composite electronic component that operates as a noise filter in this high frequency region can be obtained. The overcurrent protection function of the overcurrent protection element 3 is as described with reference to FIG.

First and second inductance elements 1 and 2
Has first and second conductive patterns 12 and 22 formed on first and second composite magnetic insulating layers 11 and 21 containing a resin as an organic component. Therefore, necessary characteristics can be obtained by selecting the type of resin constituting the first and second composite magnetic insulating layers 11 and 21 or the type, content, or compounding ratio of the ferromagnetic powder. FIG. 6 mentioned above shows one example.

Further, the first and second inductance elements 1 and 2 are formed on the first and second composite magnetic insulating layers 11 and 21 containing a resin which is an organic component, by forming first and second conductor patterns. 12 and 22 are formed, and the overcurrent protection element 3 includes a conductive polymer layer 31. That is, both the passive circuit elements 1 and 2 and the overcurrent protection element 3 are made of an organic material. For this reason, manufacturing conditions such as heat treatment conditions, lamination conditions, and processing conditions are close to each other, so that manufacturing is easy.

In the embodiment, the first and second inductance elements are formed on the first and second composite magnetic insulating layers 11 and 21 each containing a resin and a ferromagnetic powder. It has 12 and 22. The first and second composite magnetic insulating layers 12 and 22 containing the resin and the ferromagnetic powder have good surface properties. For this reason, a fine conductor pattern can be formed.

Further, in the embodiment, a first inductance element 1 and a second inductance element 2 are included, and the overcurrent protection element 3 is provided between the first inductance element 1 and the second inductance element 2. Are located in As a result, the first inductance element 1 and the second inductance element 2 are separated by the overcurrent protection element 3, and each of them can be operated individually to obtain excellent noise absorption characteristics.

When the protective film 51 is made of the same material as that of the first composite magnetic insulating layer 11, the protective film 51 is not affected by a magnetic field caused by a current flowing through the first conductor pattern 12.
In addition, since the closed magnetic path is formed by the first composite magnetic insulating layer 11, the magnetic efficiency is increased. The same applies to the case where the protective film 52 is made of the same material as the second composite magnetic insulating layer 21.

Next, the conductive polymer layer 31 forming the overcurrent protection element 3 and the first and second composite magnetic insulating layers 11 and 21 forming the first and second inductance elements 1 and 2 are formed. A specific example will be described.

<Regarding the Conductive Polymer Layer> The conductive polymer layer 31 of the overcurrent protection element 3 is made of a composite material containing a crystalline resin and a conductive powder. As the crystalline resin, polyvinylidene fluoride, polyethylene, polypropylene, polyvinyl acetate, or a copolymer thereof can be used. Further, as the conductive powder, carbon black powder, nickel powder, tungsten carbide powder, or the like can be used. The content of the conductive powder is preferably in the range of 20 to 50 vol% in any case.

Table 1 illustrates conductive polymers that can be used in the present invention. However, in the present invention, it goes without saying that other than the conductive polymers exemplified in Table 1 can be used. In Table 1, PVDF in the column of organic polymer is polyvinylidene fluoride.
E is polyethylene, and EVA is a polyvinyl acetate copolymer. Table 2 shows the characteristics of the overcurrent protection element 3 using the conductive polymer having the composition shown in Table 1.

As shown in Table 1, conductive polymer samples 1 to 8 having different specific resistances are obtained depending on the type of the organic polymer (crystalline resin), the type of the conductive powder, and the amount of the conductive powder added. be able to.

Then, as shown in Table 2, by using the conductive polymer samples 1 to 8 shown in Table 1,
Samples 11 to 18 of the overcurrent protection elements 3 having different room temperature resistances R25 (Ω) and current interruption times (seconds) can be obtained.

<Regarding the Composite Magnetic Insulating Layer> First and Second
Of the first and second inductance elements 1 and 2
In the composite magnetic insulating layers 11 and 21, the type of resin or the type, content, or compounding ratio of the ferromagnetic powder is as follows:
The selection according to the required characteristics is as described above. For example, when the purpose is to improve high-frequency characteristics, at least one of an epoxy resin, a polyimide resin, a phenol resin, a bismaleimide triazine resin, and a fluorine resin can be used. Preferably, a polyfunctional epoxy and a bisphenol A type polymer epoxy are used, and a bisphenol A type novolak can be used as a curing agent.

As the ferromagnetic powder, Ni / Zn ferrite, planar ferrite or Mn / Zn ferrite can be used. Further, as a ferromagnetic powder, F
e, at least one ferromagnetic metal selected from Ni or Co, or an alloy thereof can be used. Examples of alloys include FeCo alloys, FeNi alloys, NiCo alloys, FeCoNi alloys, FeSi alloys, and FeMn alloys. Next, a specific example will be described.

(A) Composition of Ferromagnetic Powder The Ni / Cu / Zn ferrite composition was heat-treated at 800 ° C. for 2 hours and pulverized to a predetermined particle size. As a specific composition, Fe ₂ O ₃ = 64.33 wt%, NiO
= 10.92 wt%, CuO = 6.13 wt%, ZnO = 1
At a mixing ratio of 8.62 wt%, a ferrite magnetic powder having a relative magnetic permeability μ = 230 was obtained.

(B) Composition of Resin Epoxy resin was used as the resin constituting the first and second composite magnetic insulating layers 11 and 21. Specifically, a polyfunctional epoxy resin, a bisphenol resin, and a bisphenol A type polymer epoxy resin were used. As a curing agent, a bisphenol A type novolak resin was used. These resins are disclosed in JP-A-9-59486.

More specifically, a polyfunctional epoxy resin is
８０80 wt%, 10-40 wt% of bisphenol A type polymer epoxy resin, and 5３５35 wt% of tetraphenylolethane type epoxy resin. Based on 100 parts by weight of the main component, as a curing agent, pisphenol A type novolak 5 to 30 parts by weight of the resin and 0.1 to 5 parts by weight of imidazole as a curing accelerator were added.

As the polyfunctional epoxy resin, an epipis type epoxy resin (Ebicoat 100 manufactured by Yuka Shell Epoxy Co., Ltd.)
1 and shrimp coat 1007) were each 26.9 wt.
%, And a pisphenol A type polymer epoxy resin (Shrimpcoat 122 manufactured by Yuka Shell Epoxy Co., Ltd.)
5) is 23.1 wt%, and as an epoxy resin having a special skeleton, a tetraphenylolethane type epoxy resin (Shrimpcoat 1031S manufactured by Yuka Shell Epoxy Co., Ltd.) is 23.1%.
wt.% each as a main component, and a pisphenol A type novolak resin (Ym129B65 manufactured by Yuka Shell Epoxy Co., Ltd.) added as a curing agent, and an imidazole compound (2E4MZ manufactured by Shikoku Chemical Industry Co., Ltd.) added as a curing accelerator. Was used.

(C) Molding of Composite Magnetic Insulating Layer In molding the first and second composite magnetic insulating layers 11 and 21, the above-described resin and ferromagnetic powder are mixed at a predetermined ratio and dissolved in an organic solvent. After mixing and dispersion, the mixture was formed into a sheet by a doctor blade method, and further dried.
Thereafter, a predetermined number of sheets were pressed and heated to a thickness of 0.4 mm or less. According to such a method, unlike ferrite, it is not brittle, so that the layer thickness can be reduced. Also,
Since the surface properties are good, a fine conductor pattern can be formed.

(D) Impedance Characteristics Table 3 shows the impedance characteristic data of the first and second composite magnetic insulating layers 11 and 21 obtained as described above. In Table 3, the resins used in Samples 21 to 26 are the epoxy resins described above,
The ferromagnetic powder is the above-mentioned Ni / Cu / Zn-based ferrite. In sample 27, using the above-described epoxy resin,
Carbonyl iron was used as the ferromagnetic powder. The addition amount of the ferromagnetic powder is as described in Table 3. In Table 3, the impedance is the structure illustrated in FIGS.
This was obtained with a composite electronic component having a planar shape of 3.2 × 1 × 0.6 (mm).

As shown in Table 3, sample 2 using Ni / Cu / Zn ferrite as ferromagnetic powder
In Nos. 1 to 25, as the addition amount of the ferromagnetic powder increases, the relative magnetic permeability and the impedance increase, and an excellent noise filter action can be obtained. However, in Sample 25 in which the addition amount of the Ni / Cu / Zn-based ferrite was 95 wt%,
Could not be molded. In consideration of the data in Table 3 and actual mass production, it is preferable to set the addition amount of the Ni / Cu / Zn-based ferrite in a range of 10 to 90 wt%.

The sample 26 in which the amount of the Mn / Zn-based ferrite added was 70 wt% as the ferromagnetic powder was Ni / C
In comparison with Sample 23 in which the amount of the u / Zn-based ferrite added was 70 wt%, the relative magnetic permeability and the impedance were slightly higher.

As the ferromagnetic powder, Sample 27 in which the addition amount of carbonyl iron was 70 wt% was Sample 23 in which the addition amount of Ni / Cu / Zn-based ferrite was 70 wt%, and Sample 27 in which the addition amount of Mn / Zn-based ferrite was 70 wt%. The relative permeability and the impedance are further improved in comparison with the sample 26 set to%.

<Mixing of Inorganic Component> The first composite magnetic insulating layer 11 and the second composite magnetic insulating layer 21 may further contain an inorganic component. The inorganic component can include at least one of glass cloth, glass nonwoven fabric, and aramid nonwoven fabric.

Table 4 shows the mixing of the inorganic component, the type of the inorganic component to be mixed, and the relationship between the non-mixing and the number of defective occurrences. In obtaining the data of Table 4, the first composite magnetic insulating layer 11 (or the second composite magnetic insulating layer 21)
Ten samples were prepared for each data collection sample. The thickness of the first composite magnetic insulating layer 11 (or the second composite magnetic insulating layer 21) was 200 μm. This first composite magnetic insulating layer 1
1 (or the second composite magnetic insulating layer 21), the first conductive pattern 12 (or the second conductive pattern 22)
Was formed through a photolithography step and an etching step. Table 4 shows the number of the first composite magnetic insulating layers 11 (or the second composite magnetic insulating layers 21) in which chipping occurred in this process as the number of defects.

As shown in Table 4, in the samples containing no inorganic component, 2 out of 10 samples were defective due to chipping of the substrate. On the other hand, in the sample in which glass cloth, glass nonwoven fabric, or aramid nonwoven fabric was mixed as the inorganic component, the number of defects was zero. From this data, it is clear that the yield can be significantly improved by mixing an inorganic component into the first composite magnetic insulating layer 11 (or the second composite magnetic insulating layer 21). Therefore, it is possible to contribute to cost reduction by improving the yield.

<Example of Use> FIG. 7 is an electric circuit diagram showing an example of use of the composite electronic component according to the present invention. In the figure, IE
A DC power supply controlled by a DC power supply circuit 62 having a DC / DC converter circuit is supplied to a one-chip microcomputer 61 conforming to the EE1394 standard. An interface circuit 63 is provided before the one-chip microcomputer 61 and the DC power supply circuit 62. The interface circuit 63 receives a digital signal from the balanced transmission line 64. Balanced transmission line 6
Reference numeral 4 denotes a cable including a pair of signal lines 641 and 642, a power supply line 644, and a ground line 643. In this case, noise suppression is required for any of the lines included in the balanced transmission line 64.
More specifically, noise removing elements L21, L22, L31, and L32 made of magnetic chip beads, chip filters, and the like are inserted into the pair signal lines 641 and 642. A similar noise removing element L11 is also inserted into the ground line 644.

Since there is a risk that an abnormal current (overcurrent) flows in the power supply line 644, an overcurrent protection measure is required in addition to the noise measure. Therefore, the composite electronic component 65 according to the present invention is connected to the power supply line 644.
Insert The composite electronic component according to the present invention is connected to a DC power supply circuit 62. Accordingly, it is possible to secure an overcurrent protection effect in the power supply line 644, as well as a noise elimination effect, a noise elimination effect of removing noise entering from the power supply line 644 or a noise externally coming from the power supply line 644. In the composite electronic component 65 according to the present invention, since the noise elimination element and the overcurrent protection element are integrated as one component, a high-density mounting personal computer. It can sufficiently cope with the interface circuit 63. In FIG. 7, the interface circuit 6
Reference numeral 3 includes resistors R1 to R5 and capacitors C2 and C3. Reference numerals L1 to L3 are inductance elements, CL1
Is a clock oscillation element, C1 and C4 are capacitors, and R6 is a resistor. However, the composite electronic component 65 according to the present invention
It goes without saying that the application is not limited to the illustrated application.

<Manufacturing Method> Next, a method for manufacturing a composite electronic component according to the present invention will be described with reference to FIGS.

(A) Production of Inductance Element FIG. 8 shows a first example of the composite electronic component shown in FIGS.
FIG. 7 is a diagram for explaining a process of manufacturing the second inductance elements 1 and 2.

First, as shown in FIG. 8A, a composite magnetic insulating sheet 100 is manufactured. Composite magnetic insulating sheet 10
0 has a planar shape that can take a large number of composite electronic component elements Q1. The composite magnetic insulating sheet 100 is obtained by forming the composite magnetic insulating paste into a sheet by a doctor blade method or the like. Composite magnetic insulating paste, resin and ferromagnetic powder, mixed in a predetermined organic solvent,
It is obtained by dissolving the resin and dispersing the ferromagnetic powder in the dissolved resin. The type of resin or the type, content, or compounding ratio of the ferromagnetic powder is as described above. As described above, inorganic components such as glass cloth, glass nonwoven fabric, and aramid nonwoven fabric can be added.

The sheet obtained by the doctor blade method or the like can be dried and used as it is as a composite magnetic insulating sheet. When a thickness greater than that obtained by the doctor blade method is required, a plurality of sheets obtained by the doctor blade method are laminated and pressure-bonded. Thereby, a composite magnetic insulating sheet having an arbitrary thickness can be obtained. When obtaining the composite electronic component shown in FIGS. 1 to 3, the thickness of the composite magnetic insulating sheet 100 is set to about 0.4 mm.

Next, as shown in FIG. 8B, a conductor layer 101 is formed on one or both surfaces of the composite magnetic insulating sheet 100. The conductor layer 101 can be formed, for example, by attaching a copper foil or the like. When attaching the copper foil, it is preferable to roughen the surface to be attached, pressurize and heat.

Next, as shown in FIG. 8C, a through hole 102 is provided in the composite magnetic insulating sheet 100. The composite magnetic insulating sheet 100 includes a plurality of composite electronic component elements Q.
1 are arranged in a plane so that through holes 1
Reference numeral 02 denotes a composite magnetic insulating sheet 100, which is provided substantially at the center of each composite electronic component element Q1.
Drilling based on numerical control,
It can be formed by means such as mechanical punching or laser processing.

Next, as shown in FIG.
A conductive film 103 is adhered to the surface of the substrate 01 and the inner surface of the through hole 102 by an electroless plating method. Conductive film 1
03 can be typically formed by a copper electroless plating method.

Next, a conductor film 104 is formed on the surface of the conductor film 103 formed by the electroless plating method. The conductor film 104 is formed by an electroplating method. Typically, it is formed as a copper electrolytic plating film. FIG. 8E shows a state after the conductor film 104 is formed.

Next, the conductor film 104 is patterned on both sides of the composite magnetic insulating sheet 100 to form the conductor pattern 10.
5, 301 are formed. The conductor pattern 105 on one side of the composite magnetic insulating sheet 100 is to be the first (or second) conductor pattern 12 or 22 in FIGS. 1 to 3 and is patterned in a coil shape. The conductor pattern 301 on the other side of the composite magnetic insulating sheet 100 is
In FIG. 1 to FIG. 3, the electrode 32 or 33 of the overcurrent protection element 3 is patterned in a plane. As the patterning means, a high-precision pattern forming technique including a photolithography step, an etching step, and the like is applied. By applying this high-precision pattern forming technology, for example, a line width of 80 μm, a space between lines of 80 μm,
A highly accurate conductor pattern 105 having a thickness of about 25 μm is formed.

In the case where the conductor pattern 105 is made of copper, a Ni film having a thickness of about 2 μm and an Au film having a thickness of about 1 μm are then deposited on the surface of the conductor pattern 105. It is preferable to use an antioxidant film.

(B) Manufacturing Process of Overcurrent Protection Element As described above, in the present invention, various materials can be used as a material for forming the conductive polymer layer 31 having a positive resistance temperature characteristic. . Here, as an organic polymer, polyvinylidene fluoride (PVDF) (Kyner 7 manufactured by Elf Atochem North America, USA) is used.
An example using 11) will be described. To 100 parts by weight of this organic polymer, 10 parts by weight of a silane coupling agent (KBC1003 manufactured by Shin-Etsu Chemical Co., Ltd.) was added.

Further, 1 part by weight of 2,5-dimethyl and 2,5-di (t-butylperoxin) hexane-3, which are organic peroxides, were added.

While heating the above composition to 200 ° C., a graph and a resin were prepared using a twin-screw extruder.

Next, WC powder (WC-F manufactured by Nippon Shinkin Co., Ltd., average particle size 0.65 μm) was added to the above graft resin.
Were mixed at a rate of 20 vol% and kneaded with a kneader while heating at a temperature of 200 ° C. The kneading conditions are 25
The rotation speed of RPM was set at 1 hour.

Next, the kneaded material obtained through the above-described kneading step is pressed from above and below with a press plate heated to 200 ° C.
It was held for 15 minutes while applying a pressure of × 9.8 × 10 ⁴ Pa. Thus, a conductive polymer sheet having a thickness of 0.2 mm was obtained.

(C) Laminating Step Next, the composite magnetic insulating sheet 10 obtained through the above steps
0 and a conductive polymer sheet. FIG. 9 is a diagram showing this laminating step.

First, as shown in FIG. 9A, two composite magnetic insulating sheets 1 obtained through the process shown in FIG.
00 and a conductive polymer sheet 300 prepared in advance are laminated and pressed. In stacking and crimping, the conductive polymer sheet 300 is placed between the two composite magnetic insulating sheets 100.
Is pressed and heated in a state where is positioned and arranged. As an example, the pressure is 30 × 9.8 × 10 ⁴ P
The heating temperature is about 200 ° C., and the pressure and heating conditions are maintained for about 10 minutes.

Next, as shown in FIG. 9B, the composite magnetic insulating sheets 100 and 100 and the conductive polymer sheet 3
The through-hole 106 is provided in the layered product of No. 00. The through-hole 106 is formed in the laminate by the composite electronic component element Q1.
On the boundary of The through hole 106 can be formed by means such as drilling, mechanical punching, or laser processing based on numerical control. The hole diameter of the through hole 106 is, for example, about 0.3 mm.

Next, a conductive film such as copper is adhered to the inner surface of the through hole 106 by an electroless plating method.
By depositing a conductive film such as copper on the surface by an electrolytic plating method, as shown in FIG.
01 and 402 are formed. As an antioxidant film, it is preferable to attach a Ni film having a thickness of about 2 μm on the surfaces of the terminal electrode films 401 and 402, and further attach an Au film having a thickness of about 1 μm thereon.

Next, as shown in FIG. 9D, protective films 501 and 502 are attached to each of the composite electronic component elements Q1 on both surfaces of the laminate. Protective films 501, 50
2 can be formed using the same material as the composite magnetic insulating sheet 100. Its thickness is, for example, about 50 μm.

Next, by cutting along a cutting line X1-X1 substantially along the center line of the through hole 106, FIG.
As shown in (e), the composite electronic component according to the present invention is obtained. This composite electronic component is, for example, 3.2 mm × 1.
It has a planar shape of 6 mm.

[0083]

As described above, according to the present invention, the following effects can be obtained. (A) It is possible to provide a composite electronic component which is small and can be adapted to high-density mounting. (B) A composite electronic component having a self-recovering overcurrent protection function can be provided. (C) A composite electronic component that can be easily manufactured can be provided. (D) A composite electronic component having a noise filter function and an overcurrent protection function can be provided.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a composite electronic component according to the present invention.

FIG. 2 is a plan view of a completed product of the composite electronic component shown in FIG.

FIG. 3 is an enlarged sectional view taken along line 3-3 in FIG. 2;

FIG. 4 is an electrical equivalent circuit diagram of the composite electronic component shown in FIGS.

FIG. 5 is a diagram showing an example of a current-time characteristic of an overcurrent protection element using a conductive polymer layer having a positive resistance temperature characteristic.

FIG. 6 is a diagram showing an example of the impedance-frequency characteristic of the composite electronic component according to the present invention.

FIG. 7 is an electric circuit diagram showing a use state of the composite electronic component shown in FIGS.

FIG. 8 is a diagram illustrating a process of manufacturing an inductance element portion in the composite electronic component illustrated in FIGS. 1 to 3;

FIG. 9 is a view showing a step of laminating a composite magnetic insulating sheet and a conductive polymer sheet in the composite electronic component shown in FIGS. 1 to 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st inductance element 2 2nd inductance element 3 overcurrent protection element

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 1/11 H01F 15/00 C

Claims (13)

[Claims] 1. A composite electronic component comprising at least one passive circuit element and an overcurrent protection element, wherein the passive circuit element has a conductive pattern formed on an insulating layer containing an organic component. The overcurrent protection device includes a conductive polymer layer having a positive resistance temperature characteristic, and the passive circuit device and the overcurrent protection device are stacked on each other and electrically connected in series. Composite electronic components. 2. The composite electronic component according to claim 1, wherein the passive circuit element includes an inductance element, and the inductance element includes a composite in which the insulating layer includes a resin and a ferromagnetic powder. A composite electronic component which is a magnetic insulating layer, wherein the conductor pattern is a coil formed on the composite magnetic insulating layer. 3. The composite electronic component according to claim 2, wherein the inductance element includes a first inductance element and a second inductance element, and the overcurrent protection element is A composite electronic component disposed between a first inductance element and the second inductance element. 4. The composite electronic component according to claim 3, wherein the first inductance element includes a first composite magnetic insulating layer and a first conductor pattern, and wherein the first conductor includes a first conductor pattern. The pattern is a coil formed in a spiral shape on one surface of the first composite magnetic insulating layer, wherein the second inductance element includes a second composite magnetic insulating layer and a second conductor pattern, A composite electronic component in which the second conductor pattern is a coil formed in a spiral shape on one surface of the second composite magnetic insulating layer. 5. The composite electronic component according to claim 4, wherein the first conductor pattern has an inner end interposed through a through-hole conductor penetrating the first composite magnetic insulating layer in a thickness direction. The second conductor pattern is guided to the other surface side of the first composite magnetic insulating layer, and the inner end of the second conductor pattern passes through a through-hole conductor penetrating in the thickness direction of the second composite magnetic insulation layer. The first and second inductance elements are guided to the other surface of the second composite magnetic insulating layer, and the other surfaces of the first and second inductance elements face each other. 6. The composite electronic component according to claim 5, wherein the overcurrent protection element has electrodes on both surfaces of the conductive polymer layer, and each of the electrodes is the first electrode. The composite electronic component connected to the first through-hole conductor of the inductance element and the second through-hole conductor of the second inductance element. 7. The composite electronic component according to claim 1, wherein the insulating layer includes at least one of glass cloth, glass nonwoven fabric, and aramid nonwoven fabric. 8. The composite electronic component according to claim 2, wherein the ferromagnetic powder contains at least one of Ni / Zn-based ferrite, planar ferrite, and Mn / Zn-based ferrite. Composite electronic components. 9. The composite electronic component according to claim 2, wherein the ferromagnetic powder includes at least one selected from Fe, Ni, and Co, or an alloy thereof. parts. 10. The composite electronic component according to claim 1, wherein the conductive polymer is a composite composition including a crystalline resin and a conductive powder. . 11. The composite electronic component according to claim 10, wherein the crystalline resin contains polyvinylidene fluoride, polyethylene, polypropylene, polyvinyl acetate, or a copolymer thereof. 12. The composite electronic component according to claim 9, wherein the conductive powder includes at least one selected from a carbon black powder, a nickel powder, and a tungsten carbide powder. parts. 13. The composite electronic component according to claim 12, wherein the content of the conductive powder is in a range of 20 to 50 vol%.