JPH0676948A - Manufacture of electroluminescence lamp - Google Patents

Manufacture of electroluminescence lamp

Info

Publication number
JPH0676948A
JPH0676948A JP4226809A JP22680992A JPH0676948A JP H0676948 A JPH0676948 A JP H0676948A JP 4226809 A JP4226809 A JP 4226809A JP 22680992 A JP22680992 A JP 22680992A JP H0676948 A JPH0676948 A JP H0676948A
Authority
JP
Japan
Prior art keywords
bag
vacuum
electroluminescent
electroluminescent element
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4226809A
Other languages
Japanese (ja)
Inventor
Masato Hayashi
正人 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP4226809A priority Critical patent/JPH0676948A/en
Publication of JPH0676948A publication Critical patent/JPH0676948A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide an electroluminescence lamp manufacturing method by which downsizing can be realized by preventing bubbles from being contained between an electroluminescence element and skin films. CONSTITUTION:In the first place, two skin films 2 and an electroluminescence element 1 sandwiched between them are packed in a bag 5 under vacuum. Next, in order to seal electroluminescence element 1 between the skin films 2 in a condition of being put in this bag 5, the element is passed between a pair of hot rolls 22, and the outer peripheral parts of the skin films are press- fitted thermally. After the electroluminescence element 1 is sealed between the skin films 2, it is taken out from the vacuum-packing bag 5.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は電界発光灯の製造方法に
関し、特に、扁平な電界発光素子と外皮フィルムとの間
に気泡を含まない小型化が図れる電界発光灯の製造方法
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electroluminescent lamp, and more particularly to a method for manufacturing an electroluminescent lamp which does not include bubbles between a flat electroluminescent element and a skin film.

【0002】[0002]

【従来の技術】電界発光灯は、文字や図形等の静止ディ
スプレイや液晶ディスプレイパネルのバックライト等に
利用されるもので、その構造を図3を参照して説明す
る。
2. Description of the Related Art An electroluminescent lamp is used for a stationary display of characters and figures, a backlight of a liquid crystal display panel, etc., and its structure will be described with reference to FIG.

【0003】電界発光灯10は、扁平な矩形の電界発光
素子1の表裏を吸湿フィルムを介してい2枚の外皮フィ
ルム2,2でサンドイッチ式に挟んで封止したものであ
る。電界発光素子1は、裏面側から表面側へ、アルミ箔
からなる背面電極、反射絶縁層、蛍光体を含む発光層、
透明電極を積層したもので、上記背面電極と透明電極の
一辺から2本の電極引出し用のリード3,3が導出され
ている。外皮フィルム2,2の外周部2a,2aを熱圧
着して電界発光素子1を封止する。
The electroluminescent lamp 10 is a flat rectangular electroluminescent element 1 which is sandwiched between two front and back outer films 2 and 2 with a moisture absorbing film interposed therebetween and sealed. The electroluminescent device 1 includes, from the back side to the front side, a back electrode made of aluminum foil, a reflective insulating layer, a light emitting layer containing a phosphor,
The transparent electrodes are laminated, and two leads 3 for electrode extraction are led out from one side of the back electrode and the transparent electrode. The outer peripheral portions 2a, 2a of the outer skin films 2, 2 are thermocompression bonded to seal the electroluminescent element 1.

【0004】このような電界発光灯10は、図4に示す
ような装置により製造される。この装置は、長尺な帯状
外皮フィルム20,20を巻装した一対のロール21,
21と2本の帯状外皮フィルム20,20を熱圧着する
一対の熱ロール22,22とを具備したものである。
Such an electroluminescent lamp 10 is manufactured by an apparatus as shown in FIG. This device comprises a pair of rolls 21 around which a long strip-shaped outer film 20, 20 is wound,
21 and a pair of heat rolls 22 and 22 for thermocompression bonding the two strip-shaped skin films 20 and 20.

【0005】2本の帯状外皮フィルム20,20間に電
界発光素子1が供給されて、帯状外皮フィルム20,2
0が熱ロール22,22によって熱圧着されると、帯状
外皮フィルム20,20内に電界発光素子が封止され
る。そして、それぞれに切断することにより、電界発光
灯10が完成する。
The electroluminescent element 1 is supplied between the two strip-shaped skin films 20, 20 to form the strip-shaped skin films 20, 2.
When 0 is thermocompression-bonded by the heat rolls 22 and 22, the electroluminescent element is sealed in the strip-shaped skin films 20 and 20. Then, the electroluminescent lamp 10 is completed by cutting into each.

【0006】[0006]

【発明が解決しようとする課題】従来の電界発光灯の製
造方法では、図5に示すように電界発光素子1と外皮フ
ィルム2との間に気泡4が生じる。この気泡4は、電界
発光素子1の周縁部に目立って発生し、外皮フィルム2
の封止性能の劣化等を引き起こすという不具合を生じ
る。現状では、気泡4が生じても封止性能が低下しない
ように、外皮フィルム2の熱圧着部分である封止部2a
の幅Wを拡大することにより、電界発光素子の封止性を
確保している。しかし、外皮フィルム2の封止部2aは
非発光部であるから、製品を小型化するためには、外皮
フィルム2の封止部2aの幅Wを拡大することは好まし
くない。
In the conventional method for manufacturing an electroluminescent lamp, a bubble 4 is generated between the electroluminescent element 1 and the outer cover film 2 as shown in FIG. The air bubbles 4 are conspicuously generated in the peripheral portion of the electroluminescent element 1 and the outer film 2
This causes a problem such as deterioration of the sealing performance of the above. At present, the sealing portion 2a, which is a thermocompression-bonded portion of the outer cover film 2, is formed so that the sealing performance does not deteriorate even if the bubbles 4 are generated.
By enlarging the width W, the sealing property of the electroluminescent element is secured. However, since the sealing portion 2a of the outer covering film 2 is a non-light emitting portion, it is not preferable to increase the width W of the sealing portion 2a of the outer covering film 2 in order to downsize the product.

【0007】そこで、本発明は電界発光素子1と外皮フ
ィルム2との間に気泡が生じないようにして、その分上
記外周部の幅を縮小し、小型化を図った電界発光灯の製
造方法を提供することを目的とする。
Therefore, according to the present invention, a method for manufacturing an electroluminescent lamp in which air bubbles are not generated between the electroluminescent element 1 and the outer cover film 2 and the width of the outer peripheral portion is reduced accordingly and the size is reduced. The purpose is to provide.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
の手段は、電界発光素子を挟持した外皮フィルムを袋に
収納する工程と、該袋を真空に排気する工程と、袋を気
密に仮封止して前記電界発光素子を真空パックする工程
と、該真空パックした袋ごと熱圧着する工程とを具備す
ることを特徴とする。
[Means for Solving the Problems] Means for achieving the above-mentioned object are as follows: a step of accommodating an outer skin film sandwiching an electroluminescent element in a bag, a step of evacuating the bag to a vacuum, and an airtight case The method is characterized by comprising a step of vacuum-packing the electroluminescent element by sealing and a step of thermocompression bonding the entire vacuum-packed bag.

【0009】また、電界発光素子を挟持した外皮フィル
ムを袋に収納する工程と、該袋を排気しながら熱圧着す
る工程とを具備することを特徴とする。
Further, the method is characterized by comprising a step of accommodating the outer skin film sandwiching the electroluminescent element in a bag and a step of thermocompression bonding while exhausting the bag.

【0010】[0010]

【作用】真空雰囲気中で外皮フィルムの外周部を熱圧着
するので、外皮フィルムと電界発光素子との間に気泡を
含まず、このため封止幅を小さくできて小型化した電界
発光灯を得ることができる。また、電界発光素子を挟持
した外皮フィルムを袋に収納し、真空に排気し、袋ごと
熱圧着するので、製造装置が簡便であり製造コストが低
減する。また、袋に収納したまま保管することができ
て、電界発光灯の劣化を防止することができる。
Since the outer peripheral portion of the outer cover film is thermocompression-bonded in a vacuum atmosphere, air bubbles are not included between the outer cover film and the electroluminescent element, so that the sealing width can be reduced and a miniaturized electroluminescent lamp can be obtained. be able to. Further, since the outer film having the electroluminescent element sandwiched therein is housed in a bag, the bag is evacuated, and the bag is thermocompression bonded, the manufacturing apparatus is simple and the manufacturing cost is reduced. In addition, it can be stored as it is in the bag, and deterioration of the electroluminescent lamp can be prevented.

【0011】[0011]

【実施例1】本発明に係る電界発光灯の製造方法を図1
乃至図2を参照して説明する。
Embodiment 1 FIG. 1 shows a method for manufacturing an electroluminescent lamp according to the present invention.
It will be described with reference to FIGS.

【0012】但し、従来と同一相当部分は同一符号を付
して、その説明を省略する。
However, the same components as those of the conventional one are designated by the same reference numerals, and the description thereof will be omitted.

【0013】まず、図1(a)に示したように、電界発
光素子を外皮フィルム2の間に入れて、サンドイッチ式
に挟み込んだ状態のものを、一辺に開口部5aを有する
袋5の中に入れる。袋5は、例えば、ビニール,ポリエ
チレンなど、真空が簡単に破れず、柔軟性を有し、熱圧
着の際に熱が効率よく伝導する材料が望ましい。
First, as shown in FIG. 1 (a), an electroluminescent element is put between outer skin films 2 and sandwiched between them, and the sandwiched state is placed in a bag 5 having an opening 5a on one side. Put in. The bag 5 is preferably made of a material such as vinyl or polyethylene that does not easily break in a vacuum, has flexibility, and conducts heat efficiently during thermocompression bonding.

【0014】次に、図1(b)に示すように、袋5の開
口部5aにロータリーポンプ(R.P.)などの真空装
置(図示せず)の排気管7を取り付けて排気し、袋5内
を真空状態にする。次に図1(c)に示したように、袋
5の開口部5a側を熱圧着して仮封止し(8は仮封止
部)、外皮フィルム2,2とその間に挟んだ電界発光素
子1を袋5内に真空パックする。次に、仮封止部8の外
端をA−A線に沿って袋を切断する。
Next, as shown in FIG. 1 (b), an exhaust pipe 7 of a vacuum device (not shown) such as a rotary pump (RP) is attached to the opening 5a of the bag 5 for exhausting, The bag 5 is evacuated. Next, as shown in FIG. 1C, the opening 5a side of the bag 5 is thermocompression-bonded to be temporarily sealed (8 is a temporary sealing portion), and the electroluminescent film sandwiched between the outer films 2 and 2 is provided. The element 1 is vacuum packed in the bag 5. Next, the outer end of the temporary sealing portion 8 is cut along the line AA.

【0015】次に、図1(d)に示すように袋5に入れ
た状態で、電界発光素子1を外皮フィルム2,2間に封
止するために、袋ごと一対の熱ロール22,22の間に
通して、外皮フィルム2,2の外周部を熱圧着する。
Next, as shown in FIG. 1 (d), a pair of heat rolls 22, 22 together with the bag is placed in the bag 5 in order to seal the electroluminescent element 1 between the skin films 2 and 2. And the outer peripheral portions of the outer skin films 2 and 2 are thermocompression bonded.

【0016】電界発光素子1を外皮フィルム2,2間に
封止後、真空パックしていた袋5から取り出すことによ
り、気泡4を含まず、かつ,外皮フィルム2の外周部2
aを必要最小限とした小型の電界発光灯を完成すること
が出来る。
After the electroluminescent device 1 is sealed between the outer skin films 2 and 2, it is taken out from the vacuum-packed bag 5, so that the air bubble 4 is not contained and the outer peripheral portion 2 of the outer skin film 2 is contained.
It is possible to complete a small-sized electroluminescent lamp in which a is a necessary minimum.

【0017】[0017]

【実施例2】本発明の第2の実施例について説明する。Second Embodiment A second embodiment of the present invention will be described.

【0018】これは図2に示したように袋を仮封止せ
ず、袋5の開口部5aから真空引きしながら熱圧着する
もので、一対のロール23,23で空気を押出ながら排
気するので、袋5内の真空度が向上し、気泡4の除去が
さらに確実になる。
This is one in which the bag is not temporarily sealed as shown in FIG. 2, but thermocompression bonding is performed while drawing a vacuum from the opening 5a of the bag 5, and the air is pushed out by the pair of rolls 23, while being exhausted. The degree of vacuum in the bag 5 is improved, and the removal of the bubbles 4 is further ensured.

【0019】[0019]

【発明の効果】電界発光素子と外皮フィルムとの間に気
泡を含まないために、外皮フィルムの封止性能を確保し
たまま、封止部の幅を減少できるために、電界発光灯の
小型化を図ることができる。
EFFECTS OF THE INVENTION Since no bubbles are contained between the electroluminescent element and the envelope film, the width of the encapsulating portion can be reduced while the encapsulating performance of the envelope film is ensured. Can be achieved.

【0020】熱圧着ロールを真空チャンバ内に保持する
ことなく、簡易に電界発光灯を真空封止することができ
る。
The electroluminescent lamp can be easily vacuum-sealed without holding the thermocompression bonding roll in the vacuum chamber.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の第1の実施例の電界発光灯の製造方
法を説明するための概略図。 (a)は、外皮フィルムに挟持された電界発光素子を袋
に収納する工程を示す (b)は、袋を真空に排気する工程を示す (c)は、排気後、袋を仮封止して真空パックする工程
を示す (d)は、cの袋を熱圧着する工程を示す 図2】 本発明の第2の実施例の電界発光灯の製造方法
を説明するための概略図。
FIG. 1 is a schematic diagram for explaining a method of manufacturing an electroluminescent lamp according to a first embodiment of the present invention. (A) shows the process of accommodating the electroluminescent element sandwiched by the outer film in a bag (b) shows the process of evacuating the bag to vacuum (c) shows the bag being temporarily sealed after evacuation (D) shows a step of thermocompression-bonding the bag of c. FIG. 2 is a schematic diagram for explaining a method for manufacturing an electroluminescent lamp according to a second embodiment of the present invention.

【図3】 従来の電界発光灯の一部切欠き斜視図。FIG. 3 is a partially cutaway perspective view of a conventional electroluminescent lamp.

【図4】 従来の電界発光灯の製造装置の概略図。FIG. 4 is a schematic view of a conventional apparatus for manufacturing an electroluminescent lamp.

【図5】 従来の電界発光灯の課題を説明するための横
断面図。
FIG. 5 is a transverse cross-sectional view for explaining the problems of the conventional electroluminescent lamp.

【符号の説明】[Explanation of symbols]

1 電界発光素子 2 外皮フィルム 2a 封止部 3 取り出し電極 4 気泡 5 袋 5a 開口部 7 排気管 8 仮封止部 20 帯状外皮フィルム 21,23 ロール 22 熱ロール DESCRIPTION OF SYMBOLS 1 Electroluminescent element 2 Skin film 2a Sealing part 3 Extraction electrode 4 Bubbles 5 Bag 5a Opening 7 Exhaust pipe 8 Temporary sealing part 20 Band-shaped skin film 21,23 Roll 22 Heat roll

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】電界発光素子を挟持した外皮フィルムを袋
に収納する工程と、該袋を真空に排気する工程と、袋を
気密に仮封止して前記電界発光素子を真空パックする工
程と、該真空パックした袋ごと熱圧着する工程とを具備
することを特徴とする電界発光灯の製造方法。
1. A step of accommodating an outer skin film sandwiching an electroluminescent element in a bag, a step of evacuating the bag to a vacuum, and a step of temporarily sealing the bag airtightly to vacuum-pack the electroluminescent element. And a step of thermocompression bonding the vacuum-packed bag together with the vacuum-packed bag.
【請求項2】電界発光素子を挟持した外皮フィルムを袋
に収納する工程と、該袋を真空に排気しながら熱圧着す
る工程とを具備することを特徴とする電界発光灯の製造
方法。
2. A method of manufacturing an electroluminescent lamp, comprising: a step of accommodating an outer skin film sandwiching an electroluminescent element in a bag; and a step of thermocompression bonding while evacuating the bag to a vacuum.
JP4226809A 1992-08-26 1992-08-26 Manufacture of electroluminescence lamp Pending JPH0676948A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4226809A JPH0676948A (en) 1992-08-26 1992-08-26 Manufacture of electroluminescence lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4226809A JPH0676948A (en) 1992-08-26 1992-08-26 Manufacture of electroluminescence lamp

Publications (1)

Publication Number Publication Date
JPH0676948A true JPH0676948A (en) 1994-03-18

Family

ID=16850947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4226809A Pending JPH0676948A (en) 1992-08-26 1992-08-26 Manufacture of electroluminescence lamp

Country Status (1)

Country Link
JP (1) JPH0676948A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6822391B2 (en) 2001-02-21 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic equipment, and method of manufacturing thereof
US7067976B2 (en) 2001-07-03 2006-06-27 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6822391B2 (en) 2001-02-21 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic equipment, and method of manufacturing thereof
US6956325B2 (en) 2001-02-21 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, electronic equipment, and method of manufacturing thereof
US7443097B2 (en) 2001-02-21 2008-10-28 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic equipment
US7067976B2 (en) 2001-07-03 2006-06-27 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment
US7129102B2 (en) 2001-07-03 2006-10-31 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment
US7372200B2 (en) 2001-07-03 2008-05-13 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment

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