JPH0676236A - Production of magnetic head - Google Patents

Abstract

PURPOSE:To prevent shorting between terminals even if there is a deviation in mounting positions by providing the rear surface of a chip-shaped body with an insulating layer. CONSTITUTION:Grooves 41 are formed at equal intervals by machining on a rectangular parallelepiped block 40. Glass in a molten state is then injected into these grooves 41 to form the glass insulating layers 42. The insulating layer 13, main magnetic poles 11, coils 12, a protective insulating layer 14 and terminals 4, 6 are successively formed of thin films on this block 40. The block 40 is cut along line 43, by which magnetic head blocks 44 are cut out. The blocks 44 are polished from the direction of the arrow 45 and the direction of the arrow 46, by which the finished magnetic head blocks 47 having the glass insulating layers 30 are obtd. One end of the blocks 47 are worked to a roof type to obtain the twin chip-shaped magnetic heads 48. The heads are connected on twin supports 49 by solder and are fixed by a resin adhesive to connect the terminals to each other and the heads are cut along lines 50, by which the magnetic heads 1A are obtd. The positioning accuracy of the chip-shaped magnetic head elements with the supports 49 can thereby be relieved, thereby the yield is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a magnetic head, and more particularly to a method of manufacturing a magnetic head incorporated in a magnetic disk device. In recent years, there has been a further demand for higher density recording in magnetic disk devices. At present, the magnetic head device used in the magnetic disk device is a flying type using a head slider, and the flying height is on the order of submicron.

Here, if the flying height is reduced, the recording density is further increased.

To reduce the flying height, it is possible to increase the pressure applied to the head slider.

However, if this is done, the damage to the magnetic disk surface at the time of starting will be severe. In addition, the degree of damage at the time of head crash becomes worse.

[0005]

Therefore, the present applicant has previously proposed a contact type magnetic head which solves the above-mentioned problem of damage and further reduces the flying height.

FIG. 8 shows the magnetic head device 1.

In this magnetic head 1, a chip-shaped magnetic head element 2 is fixed on a flexible support 3 and a terminal 4 is provided.
5 and the terminals 6 and 7 are connected by conductive pressure-sensitive adhesives 8 and 9 made of a relatively soft conductive material such as Au and Cu.

The chip-shaped magnetic head element 2 has about 5 sides.
The shape is a very small cubic shape of 0 μm.

Reference numeral 10 denotes a chip-shaped main body made of Al ₂ O ₃ -TiC, which has conductivity.

On one side surface 10b side of the chip-shaped main body 10, a CoZrNb main magnetic pole 11 ₁ for recording / reproducing, a coil 12, and an Al ₂ O ₃ for insulating the main magnetic pole 11 and the coil 12 from the main body 10 are provided. The insulating layer 13, the main magnetic pole 11, and the Al ₂ O ₃ protective insulating layer 14 for protecting the coil 12 and the terminals 4 and 6 are formed.

The support 3 is provided on the SUS plate 20, the polyimide insulating layer 21, the Cu lead pattern 22, the terminals 5, and the like.
7 and the polyimide protective film 23 are formed.

A support 3 is attached to the tip of a head actuator (not shown), and the magnetic head 2 contacts the magnetic disk (not shown) and relatively moves the magnetic disk (not shown) with an arrow. Scan in 28 directions.

The magnetic head element 2 is bonded by bonding the lower surface 10a, which is the conductive surface of the chip-shaped main body 10, to the support body 3.

[0014]

When the magnetic head element 2 is bonded to the support 3, the chip-shaped main body 10 is slightly displaced from the position shown in FIG. 8 in the direction of arrow 25. The lower surface 10a of the above contacts the terminals 5 and 7.

Since the lower surface 10a of the chip-shaped main body 10 is a conductive surface, if it comes into contact with the terminals 5 and 7, the terminals 5 and 7 are short-circuited, and the magnetic head device becomes defective.

It is therefore an object of the present invention to provide a method of manufacturing a magnetic head device which realizes an improvement in yield by preventing a defect even if there is a positioning error of a magnetic head element with respect to a support.

[0017]

According to a first aspect of the present invention, there is provided a chip-shaped magnetic head element having an electromagnetic conversion element portion and a terminal formed on a side surface of a conductive chip-shaped main body on a flexible support. In a method of manufacturing a magnetic head, which is joined to connect the terminal of the chip-shaped magnetic head element and the terminal on the support, the chip-shaped magnetic head element is provided with an insulating layer on the lower surface of the chip-shaped main body. In this configuration, the insulating layer side of the chip-shaped magnetic head element having the insulating layer is fixed to the support.

According to a second aspect of the present invention, a chip-shaped magnetic head element having an electromagnetic conversion element portion and a terminal on a side surface is joined to a support having a terminal, and the terminals are in a positional relationship such that they face each other. In a method of manufacturing a magnetic head in which a head assembly is supported on a V-block, a conductive pressure-sensitive adhesive is pressed by a pressure-bonding rod, and the terminals are electrically connected by the conductive pressure-sensitive adhesive, the pressure-bonding rod is pressed against the pressure-bonding rod at the time of pressing. The force acting in the horizontal direction is detected, and the V block is finely moved in the direction in which the horizontal force is reduced.

[0019]

The insulating layer provided on the lower surface of the chip-shaped main body according to claim 1 acts so as not to short-circuit the terminals on the support even if the mounting position is displaced.

According to the second aspect of the present invention, the structure in which the V block is finely moved in the direction in which the horizontal force of the crimping rod is reduced acts so as to eliminate the need for highly accurate positioning of the V block.

[0021]

1 shows a method of manufacturing a magnetic head according to the present invention.

FIG. 1A shows a chip-shaped magnetic head element 2.
The state immediately before joining A on the flexible support body 3 is shown. FIG. 2B shows a state in which the chip-shaped magnetic head element 2A is bonded with a predetermined position P ₀ displaced by a dimension δ.

In each figure, the same reference numerals are given to the parts corresponding to the parts shown in FIG.

The chip-shaped magnetic head element 2A is the same as the chip-shaped magnetic head element 2 of FIG. 8 except that the glass insulating layer 30 is formed on the lower surface 10a of the chip-shaped main body 10. The insulating layer 30 is made of glass and is easily formed as described later.

The flexible support 3 is exactly the same as that of FIG.

Here, the chip-shaped magnetic head element 2A is
Originally, it is positioned and bonded at the position shown by the chain double-dashed line. However, it is assumed that the position has been shifted by a dimension δ in the direction of arrow 25.

In this case, in the conventional case, the terminals 5, 7 are
It will be short-circuited. However, in this embodiment, the glass insulating layer 30 contacts the terminals 5 and 7, and the terminals 5 and 7 are not short-circuited.

The conductive pressure-sensitive adhesives 8 and 9 made of Au or the like are used for the side surface 1 of the chip-shaped magnetic head element 2A among the terminals 5 and 7.
It is connected to the portions 5a and 7a protruding from 0b.

Therefore, the magnetic head 1A shown in FIG.
It is a good product.

The terminals 5b and 7b among the terminals 5 and 7 are
This is a portion covered by the glass insulating layer 30 of the chip-shaped magnetic head element 2A.

Next, a method for manufacturing the chip-shaped magnetic head element 2A, particularly a method for forming the glass insulating layer 30, will be described.
This will be described with reference to FIGS. 2 and 3.

First, as shown in FIG. 2A, grooves 41 are formed at equal intervals on a rectangular parallelepiped block 40 by machining.

Next, as shown in FIG. 3B, molten glass is injected into the groove 41 to form a glass insulating layer 42 in the groove 41.

Next, as shown in FIG. 3C, the insulating layer 13, the main magnetic pole 11, the coil 12, the protective insulating layer 14, and the terminals 4 and 6 are sequentially formed on the block 40 as thin films.

Next, the block 40 is cut along the line 43 to cut out the magnetic head block 44 shown in FIG.

Next, the cut out magnetic head block 4
4 is polished in the direction of arrow 45 and polished in the direction of arrow 46 to obtain a finished magnetic head block 47 having the glass insulating layer 30 shown in FIG.

Next, one end of the head block 47 is processed into a roof shape to obtain a dual chip magnetic head 48 shown in FIG. 3 (B).

Next, as shown in FIG. 7C, this is solder-connected to a double support body 49, and is reinforcingly adhered and fixed by a resin adhesive so that the terminals are connected to each other as described later. Connect and finally cut along line 50
The magnetic head 1A shown in (D) is obtained.

Here, after the block of FIG. 2C is cut, an insulating layer corresponding to the glass insulating layer 30 can be formed on the end face of the cut block by a thin film technique. However, in this case, it is necessary to put the block in the vacuum chamber again and work, which is inefficient.

Next, connection between terminals using a conductive pressure-sensitive adhesive will be described.

FIG. 4 shows an inter-terminal connecting device 60.

Reference numeral 61 is a V block, which is fixed on the stage 62.

Reference numeral 63 is a crimping device, which comprises a crimping bar 64, a crimping force applying mechanism 65, a crimping force detecting sensor 66, and horizontal force detecting sensors 67 and 68.

Reference numeral 69 is a stage drive mechanism.

Reference numeral 70 denotes a control circuit, which is composed of a microcomputer.

In the terminal connecting work, the magnetic head assembly 71 in which the chip-shaped magnetic head 2 is fixed on the support 3 and the terminals are not connected is set obliquely on the V block 61 and supported. Then, the V block 61 is roughly positioned, and the crimping rod 64 having the ball-shaped conductive adhesive 72 at its tip is gradually lowered, and in this process, the position is adjusted as described later.

The relationship between the direction of displacement of the V block 61 with respect to the crimping rod 64 and the outputs of the sensors 67 and 68 will be described.

When the V block 61 is displaced to the left, when the crimping bar 64 is lowered, as shown in FIG.
The ball-shaped conductive pressure-sensitive adhesive 72 at the tip hits the inclined side surface 10b of the magnetic head 2, and a leftward horizontal force F ₁ acts on the pressure-bonding rod 64.

The sensor 67 detects this force F ₁ .

The sensor 66 detects the force of pressing the crimping bar 64 downward.

Contrary to the above, when the V block 61 is displaced to the right, when the crimping bar 64 is lowered, as shown in FIG.
As shown in, the ball-shaped conductive pressure-sensitive adhesive 72 at the tip abuts on the inclined support body 3, and a rightward force F ₂ acts on the pressure-bonding rod 64.

The sensor 68 detects this force F ₂ .

Next, the operation of the microcomputer when connecting terminals will be described with reference to FIG.

First, a crimping rod descending signal is output (ST
1).

As a result, the mechanism 65 operates and the crimping bar 64 having the crimping agent 72 attached to the tip thereof starts to descend.

Then, the sensor 67 also outputs the output of 68 to the first
It is determined whether or not the predetermined value has been exceeded (ST2).

Here, the first predetermined value is an output value when the forces F ₁ and F _{2 in} FIGS. 5 and 6 reach about 10 g (before the pressure-sensitive adhesive 72 is crushed).

When the result of the determination is "NO", it is determined in step ST3 whether or not the output of the sensor 66 exceeds the second predetermined value.

The second predetermined value is an output value corresponding to the force required to crush the pressure-sensitive adhesive 72, for example, 100 gr.

When the result of the determination in step ST3 is "NO", the process returns to step ST1.

The operation of returning to ST1 via ST1, ST2 and ST3 is repeated, and when the result of determination in ST3 is "YES", a crimping rod lowering stop signal is output (ST4).

As a result, the crimping agent 72 is crimped across the terminals 5 and 7.

The above is the operation when the V block 61 originally has no positional deviation.

When the V block 61 is displaced as shown in FIG. 5 or 6, the operation is as follows.

When the crimping rod 64 descends, it is
As shown, the force F is applied to the crimping bar 64. ₁Or F₂Works
Finally, the determination result of ST2 is "YES". Judgment
When the result is "YES", a crimping rod lowering stop signal is output
(ST5). Then, in ST6, the sensor 67
It is determined whether the signal exceeds a first predetermined value.

When the result of the determination is "YES", a signal for slightly driving the stage 62 in the direction of the arrow X ₁ is output to the stage drive mechanism 69 (ST7).

Then, it is determined whether or not the output of the sensor 67 has become less than or equal to the first predetermined value (ST8).

As long as the determination result is "NO", ST7
Continue to operate. As a result, the displacement of the V block 61 with respect to the crimp rod 64 is corrected.

When the result of the determination is "YES", the operation of ST1 is performed, and after ST2, ST3, the operation of ST4 is performed, and the crimping is completed.

When the result of the determination in ST6 is "NO", the stage 62 is finely driven in the arrow X ₂ direction and a signal is output to the stage drive mechanism 69 (ST9).

Next, it is determined whether or not the output of the sensor 68 has become less than or equal to the first predetermined value (ST10).

As long as the judgment result is "NO", ST7
Continue to operate. As a result, the displacement of the V block 61 with respect to the crimp rod 64 is corrected.

When the result of the determination is "YES", the operation of ST1 is performed, the operation of ST4 is performed through ST2 and ST3, and the crimping is completed.

As a result, it becomes unnecessary to position the V block 61 with high precision, and the magnetic head can be manufactured with high efficiency.

[0075]

As described above, according to the first aspect of the invention, the positioning accuracy of the chip-shaped magnetic head element with respect to the support can be relaxed, and the yield can be improved.

According to the second aspect of the invention, even if the V block is displaced, the crimp connection by the conductive crimping agent between the terminal on the chip-shaped magnetic head element and the terminal on the support is reliable. It can be performed with good performance and certainty.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a method of manufacturing a magnetic head according to the present invention.

FIG. 2 is a diagram showing a method of manufacturing a chip-shaped magnetic head.

FIG. 3 is a diagram showing the manufacturing method following FIG. 2;

FIG. 4 is a diagram showing an inter-terminal connection device.

FIG. 5 is a diagram showing a case where a V block is displaced to the left.

FIG. 6 is a diagram showing a case where a V block is displaced to the right.

FIG. 7 is a flowchart of a pressure-bonding operation of a conductive pressure-sensitive adhesive.

FIG. 8 is a diagram showing a magnetic head previously proposed by the applicant.

[Explanation of symbols]

1A magnetic head 2A chip like magnetic head element 3 flexible support 4-8 terminal 5a, 7a protruding to have portions 5b, 7b covered by parts 8,9 conductive bonding agent is 10 Al ₂ O ₃ -TiC made chips Body 10a lower surface 10b side surface 11 CoZrNb main magnetic pole 12 coil 13 Al ₂ O ₃ insulating layer 14 Al ₂ O ₃ protective insulating layer 20 SUS plate 21 polyimide insulating layer 22 Cu lead pattern 23 polyimide protective film 30 glass insulating layer 41 groove 42 glass Insulation layer 60 Terminal connection device 61 V block 62 Stage 63 Crimping device 64 Crimping rod 65 Crimping force applying mechanism 66 Crimping force detection sensor 67,68 Horizontal force detection sensor 69 Stage drive mechanism 70 Control circuit 71 Magnetic head assembly 72 Ball Conductive adhesive

Claims (2)

[Claims] 1. A chip-shaped magnetic head element (2) in which an electromagnetic conversion element part (11, 12) and terminals (4, 6) are formed on a side surface (10b) of a conductive chip-shaped main body (10).
A) is joined to a flexible support (3) to connect the terminals (4,5) of the chip-shaped magnetic head element and the terminals (5, 7) on the support (3). A method of manufacturing a magnetic head according to claim 1, wherein the chip-shaped magnetic head element (2A) is configured such that an insulating layer (30) is provided on a lower surface (10a) of the chip-shaped main body (10). Chip-shaped magnetic head element (2
A method of manufacturing a magnetic head, characterized in that the insulating layer (30) side of (A) is fixed to the support (3). 2. The electromagnetic conversion element portion (1) on the side surface (10b).
A chip-shaped magnetic head element (2A) having terminals (1, 12) and terminals (4, 6) is bonded onto a support (3) having terminals (5, 7), and the terminals (4,5; 7) A magnetic head assembly (71) having a positional relationship in which the two are opposed to each other is supported on a V block (61), and a pressure-bonding rod (6)
4) The conductive pressure-sensitive adhesive (72) is pressed by the conductive pressure-sensitive adhesive (72), and the terminals (4, 5; 6, 7) are pressed by the conductive pressure-sensitive adhesive (72).
In a method of manufacturing a magnetic head in which the two are electrically connected to each other, the forces (F ₁ , F ₂ ) acting on the crimping rod in the horizontal direction at the time of pressing are detected, and the V block is finely moved in the direction in which the horizontal force is reduced. A method of manufacturing a magnetic head having a structure.