JPH0673887B2 - Injection molding mold and method of molding disk substrate using the mold - Google Patents
Injection molding mold and method of molding disk substrate using the moldInfo
- Publication number
- JPH0673887B2 JPH0673887B2 JP63317267A JP31726788A JPH0673887B2 JP H0673887 B2 JPH0673887 B2 JP H0673887B2 JP 63317267 A JP63317267 A JP 63317267A JP 31726788 A JP31726788 A JP 31726788A JP H0673887 B2 JPH0673887 B2 JP H0673887B2
- Authority
- JP
- Japan
- Prior art keywords
- sprue
- mold
- heat medium
- molding
- temperature control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 34
- 238000001746 injection moulding Methods 0.000 title claims description 23
- 238000000465 moulding Methods 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 11
- 239000011347 resin Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 32
- 238000001816 cooling Methods 0.000 claims description 16
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 22
- 238000010438 heat treatment Methods 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2642—Heating or cooling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
- B29C2045/2753—Heating means and cooling means, e.g. heating the runner nozzle and cooling the nozzle tip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C2045/7343—Heating or cooling of the mould heating or cooling different mould parts at different temperatures
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は、プラスチック成形品の射出成形用金型及びこ
の金型を使用したディスク基板の成形方法に関する。Description: TECHNICAL FIELD The present invention relates to a mold for injection molding of plastic molded products and a method for molding a disc substrate using the mold.
[従来の技術] 光ディスク基板、ビデオディスク基板等の成形には、通
常、射出成形法が用いられている。従来の射出成形用金
型を使用した射出成形法によれば、射出成形の際、キャ
ビティに沿って可動金型と固定金型にそれぞれ形成され
た熱媒体流路に所定温度の熱媒体、例えば水を流して、
キャビティ内に射出された溶融樹脂とスプルー内の溶融
樹脂の冷却固化を行っている。[Prior Art] Generally, an injection molding method is used for molding an optical disk substrate, a video disk substrate and the like. According to the conventional injection molding method using a mold for injection molding, at the time of injection molding, a heat medium having a predetermined temperature, for example, in a heat medium flow path formed in each of the movable mold and the fixed mold along the cavity is formed. Pour water,
The molten resin injected into the cavity and the molten resin in the sprue are cooled and solidified.
[発明が解決しようとする課題] 前記射出成形法において、スプルーの外周近傍に形成さ
れた熱媒体流路に流す水の温度を低温(例えば10〜40
℃)に設定した場合には、スプルー内の溶融樹脂も速や
かに冷却固化するため、成形サイクルの短縮化を図るこ
とができる。しかし、逆にキャビティ内で冷却される樹
脂の内外周部における温度分布が不均一化になるため、
得られた基板の複屈折の分布がばらついたり、反りが生
じたりして、光学特性と機械的特性に関して問題が生じ
る。また、スプルー外周が冷却されているため、ゲート
部の型温度も比較的低くなり、射出された樹脂が冷却さ
れ、その粘度上昇に基づくゲート部の昇圧により、シル
バーストリークが発生するという問題もある。[Problems to be Solved by the Invention] In the injection molding method, the temperature of water flowing in the heat medium passage formed in the vicinity of the outer periphery of the sprue is set to a low temperature (for example, 10 to 40).
(° C), the molten resin in the sprue is also rapidly cooled and solidified, so that the molding cycle can be shortened. However, on the contrary, since the temperature distribution in the inner and outer peripheral parts of the resin cooled in the cavity becomes non-uniform,
The birefringence distribution of the obtained substrate varies and warpage occurs, which causes problems with respect to optical properties and mechanical properties. Further, since the outer periphery of the sprue is cooled, the mold temperature of the gate portion is also relatively low, the injected resin is cooled, and the pressure rise of the gate portion due to the increase in viscosity causes a silver streak. .
一方、熱媒体流路に流す水の温度を高温(例えば50〜90
℃)に設定した場合には、キャビティ内で冷却された樹
脂の内外周部における温度分布が均一化されるため、光
学特性と機械的特性が共に優れた基板を得ることができ
る。しかし、スプルー内の溶融樹脂にとっては、樹脂の
冷却固化が遅くなるためサイクルタイムが長くなるばか
りでなく、スプルーの冷却不足による離型不良が発生し
やすく、基板の連続成形が不可能になるという問題が生
じる。On the other hand, the temperature of the water flowing in the heat medium passage is set to a high temperature (for example, 50 to 90
C.), the temperature distribution in the inner and outer peripheral portions of the resin cooled in the cavity is made uniform, so that it is possible to obtain a substrate having both excellent optical characteristics and mechanical characteristics. However, for the molten resin in the sprue, the cooling and solidification of the resin becomes slow, so not only the cycle time becomes long, but also mold release failure easily occurs due to insufficient cooling of the sprue, which makes continuous molding of the substrate impossible. The problem arises.
なお、特開昭61−217225号公報によれば、スプルー近傍
にこのスプルーを加熱する手段と冷却する手段とを設け
るようにした射出成形金型が開示されている。しかし、
この構成によれば、i.加熱と冷却の切り換え操作が必要
であり、その際の応答が遅いため、成形サイクルが長く
なって連続生産に不利である。ii.温度の制御や安定化
が困難である、iii.基盤中心部を含むスプルーブッシュ
全体の温度が均一に冷却されるため、樹脂が冷却されす
ぎて、センター穴の形成が困難になるという問題が伴
う。Incidentally, Japanese Patent Laid-Open No. 61-217225 discloses an injection molding die in which a means for heating the sprue and a means for cooling the sprue are provided in the vicinity of the sprue. But,
According to this configuration, i. The switching operation between heating and cooling is required, and the response at that time is slow, and the molding cycle becomes long, which is disadvantageous to continuous production. ii. It is difficult to control and stabilize the temperature. iii. Since the temperature of the entire sprue bush including the center of the substrate is cooled uniformly, the resin is cooled too much and it becomes difficult to form the center hole. Is accompanied by.
本発明は、光学特性と機械的特性が良好な成形品が得ら
れ、且つ成形サイクルを短縮することができる射出成形
用金型及びこの金型を用いたディスク基板の成形方法を
提供することを目的とする。The present invention provides a mold for injection molding capable of obtaining a molded product having good optical properties and mechanical properties and shortening the molding cycle, and a method of molding a disk substrate using this mold. To aim.
[課題を解決するための手段] 本発明は、固定金型と可動金型との突き合わせ面に形成
されるキャビティと、樹脂が溶融射出されるスプルー
と、このスプルーから前記キャビティに前記樹脂を導入
するゲート部を有する射出成形用金型において、前記ス
プルー近傍に設けられた冷却用の第1の温度制御手段
と、前記ゲート部近傍に設けられた保温用の第2の温度
制御手段とを備えたことを特徴とする。MEANS FOR SOLVING THE PROBLEM The present invention is to introduce a cavity into the abutting surface of a fixed die and a movable die, a sprue into which a resin is melt-injected, and introduce the resin into the cavity from the sprue. An injection-molding die having a gate portion, comprising: a first temperature control means for cooling, provided near the sprue; and a second temperature control means for keeping heat, provided near the gate portion. It is characterized by that.
スプルー近傍に設けられた冷却用の第1の温度制御手段
は、例えば熱媒体流路として、ここに所定温度の水等の
熱媒体を流すことにより構成したり、ペルチェ効果素子
等の加熱冷却素子を配置して構成することができる。The first temperature control means for cooling provided in the vicinity of the sprue is constituted by, for example, as a heat medium passage, by flowing a heat medium such as water having a predetermined temperature therethrough, or a heating and cooling element such as a Peltier effect element. Can be arranged and configured.
また、ゲート部近傍に設けられた保温用の第2の温度制
御手段は、例えば熱媒体流路として、ここに所定温度の
水等の熱媒体を流したり、加熱吸熱素子を配置したり、
又は前記スプルー近傍部に設けた温度制御手段との間に
断熱層を形成して、前記スプルー部の冷却により、ゲー
ト部が冷却されないような構造としてある。ここで、断
熱層としては、空気、ガラスバルーン、各種発泡体など
熱伝導率の低い材料の層を介在させることにより構成す
ることができる。Further, the second temperature control means for keeping heat provided near the gate portion is, for example, as a heat medium flow path, a heat medium such as water having a predetermined temperature is allowed to flow therein, or a heat absorbing element is arranged,
Alternatively, a heat insulating layer is formed between the sprue portion and a temperature control means provided near the sprue portion so that the gate portion is not cooled by cooling the sprue portion. Here, the heat insulating layer can be formed by interposing a layer of a material having a low thermal conductivity such as air, glass balloons or various foams.
この射出成形用金型によって成形されるプラスチック成
形品は、特に限定されるものではなく、例えば光ディス
ク基板、ビデオディスク基板、眼鏡レンズ等任意である
が、特に光学部材用成形品が好適である。The plastic molded product molded by this injection molding die is not particularly limited and may be, for example, an optical disk substrate, a video disk substrate, an eyeglass lens, or the like, but a molded product for an optical member is particularly preferable.
また、本発明は、上記射出成形金型を使用し、固定金型
と可動金型との突き合わせ面に形成されるディスク状キ
ャビティに、スプルーからゲート部を介して溶融樹脂を
射出するディスク基板の成形方法において、前記スプル
ー近傍に設けた第1の温度制御手段によるスプルーを冷
却する温度制御と、前記ゲート部近傍に設けた第2の温
度制御手段によるゲート部を保温する温度制御とをそれ
ぞれ独立に行うことを特徴とする。Further, the present invention uses the above-mentioned injection molding die, and a disk substrate for injecting a molten resin from a sprue through a gate portion into a disk-shaped cavity formed on a butting surface of a fixed die and a movable die. In the molding method, the temperature control for cooling the sprue by the first temperature control means provided in the vicinity of the sprue and the temperature control for maintaining the temperature of the gate portion by the second temperature control means provided in the vicinity of the gate portion are independent of each other. It is characterized in that
ここで、ポリカーボネート樹脂光ディスク基板〔例えば
厚み1.2mm、径130mm〕を成形する場合には、例えばスプ
ルー近傍に設ける第1の温度制御手段を熱媒体流路とし
て、ここに熱媒体を20〜70/minの流量で流し、その温
度を20〜40℃とするのが適当である。Here, in the case of molding a polycarbonate resin optical disk substrate [for example, thickness 1.2 mm, diameter 130 mm], for example, the first temperature control means provided in the vicinity of the sprue is used as the heat medium flow path, and the heat medium is placed at 20 to 70 / It is suitable to flow it at a flow rate of min and set its temperature to 20-40 ° C.
ゲート部近傍に設ける第2の温度制御手段を熱媒体流路
として、ここに熱媒体を流す構成とした場合、その熱媒
体の温度設定は、40℃以上とし、好ましくは80〜130℃
とする。熱媒体の流量としては、20〜70/minが適当で
ある。When the second temperature control means provided in the vicinity of the gate portion is used as a heat medium flow path and the heat medium is made to flow there, the temperature of the heat medium is set to 40 ° C. or higher, preferably 80 to 130 ° C.
And A suitable flow rate of the heat medium is 20 to 70 / min.
次に、前記第2の温度制御手段の熱媒体流路に変えて、
断熱層を形成した構造とした場合には、ゲート部近傍
は、第1の温度制御手段によって冷却される影響を受け
ることが少なくなると共に、高温樹脂の流れによって通
常80℃以上に保たれる。なお、本発明にあっては、断熱
層の形成と熱媒体流路を設ける二つの構成とすることに
より、成形制御がより可能となる。Next, changing to the heat medium flow path of the second temperature control means,
When the structure having the heat insulating layer is formed, the vicinity of the gate portion is less affected by being cooled by the first temperature control means, and is usually kept at 80 ° C. or higher by the flow of the high temperature resin. In addition, in the present invention, forming control becomes more possible by adopting the two configurations of forming the heat insulating layer and providing the heat medium flow passage.
スプルーから溶融射出される樹脂は、温度を310〜350℃
とし、圧力を250〜350kg/cm2とするのが適当である。The resin melt-injected from the sprue has a temperature of 310-350 ° C.
And a pressure of 250 to 350 kg / cm 2 is suitable.
可動金型と固定金型にキャビティに沿ってそれぞれ形成
された熱媒体流路に流す熱媒体は、温度を100〜130℃と
し、流量は20〜70/minとするのが適当である。また、
キャビティに射出された溶融樹脂の冷却時間は、10〜18
秒が適当である。The heat medium flowing through the heat medium flow paths formed in the movable mold and the fixed mold along the cavity, respectively, has a temperature of 100 to 130 ° C. and a flow rate of 20 to 70 / min. Also,
The cooling time of the molten resin injected into the cavity is 10-18
Seconds are appropriate.
上記熱媒体流路に流す熱媒体としては、水等を使用する
ことができる。Water or the like can be used as the heat medium flowing through the heat medium flow path.
使用する成形用樹脂は、ボリカーボネート樹脂(Mv:120
00〜18000)が好ましいが、アクリル樹脂、非晶性ポリ
オレフィン等任意である。The molding resin used is polycarbonate resin (Mv: 120
00 to 18000) is preferable, but acrylic resin, amorphous polyolefin, etc. are optional.
なお、本発明において、射出成形には、射出圧縮成形の
場合を含むものである。In the present invention, injection molding includes the case of injection compression molding.
[作用] 本発明の成形方法によれば、スプルー近傍に第1の温度
制御手段を設けると共に、ゲート部近傍に第2の温度制
御手段を設けたことにより、スプルー近傍に設けた第1
の温度制御手段はスプルー外周を冷却し、ゲート部近傍
に設けた第2の温度制御手段はゲート部近傍を保温する
というように、異なる温度制御をそれぞれ独立に行うこ
とが可能になる。この結果、キヤビィティ内に射出され
た樹脂がゲート部で冷却されることなくキャビティに充
填されるため、基板の内外周部における樹脂の温度分布
が均一になり、光学特性と機械的特性の良好な基板が得
られる。同時に、射出成形後、スプルー内の溶融樹脂は
速やかに冷却固化するため、成形サイクルの短縮化を図
ることができる。[Operation] According to the molding method of the present invention, the first temperature control means is provided in the vicinity of the sprue, and the second temperature control means is provided in the vicinity of the gate portion.
The temperature control means for cooling the outer circumference of the sprue and the second temperature control means provided near the gate portion keep the temperature near the gate portion, so that different temperature controls can be independently performed. As a result, the resin injected into the cavity is filled in the cavity without being cooled in the gate portion, so that the temperature distribution of the resin in the inner and outer peripheral portions of the substrate becomes uniform, and good optical and mechanical characteristics are achieved. A substrate is obtained. At the same time, after injection molding, the molten resin in the sprue is quickly cooled and solidified, so that the molding cycle can be shortened.
[実施例] 第1図を参照して、本発明の一実施例に係る射出成形用
金型及びこの金型を用いたディスク基板の成形方法を説
明する。[Embodiment] With reference to FIG. 1, an injection molding die according to an embodiment of the present invention and a method of molding a disk substrate using this die will be described.
この射出成形用金型は、固定側ダイプレート1に取り付
けられた固定金型2と可動側ダイプレート3に取り付け
られた可動金型4とを有し、スペーサ16,17を介してこ
れらの固定金型2と可動金型4とが突き合わされた面に
形成されるディスク状の隙間が光ディスク基板等を成形
するためのキャビティ5となる。This injection molding die has a fixed die 2 attached to a fixed die plate 1 and a movable die 4 attached to a movable die plate 3, and these are fixed via spacers 16 and 17. The disk-shaped gap formed on the surface where the mold 2 and the movable mold 4 are abutted with each other becomes a cavity 5 for molding an optical disk substrate or the like.
固定金型2の中央部には、円筒状のスプルーブッシュ6
を埋設し、このスプルーブッシュ6の中心線に沿って溶
融樹脂が射出されるスプルー7を形成する。また、この
固定金型2内には、キャビティ5から適当な距離をおい
て複数の環状熱媒体流路15を形成しておく。A cylindrical sprue bush 6 is provided at the center of the fixed mold 2.
To form a sprue 7 along which the molten resin is injected along the center line of the sprue bush 6. A plurality of annular heat medium flow passages 15 are formed in the fixed mold 2 at appropriate distances from the cavity 5.
他方の可動金型4の中央部には、円筒状のセンター部材
8を埋設し、このセンター部材8の中心線に沿ってカッ
トピン9を配する。可動金型4の内端鏡面には記録担体
となるピット、溝等が形成されたスタンパー10を設け、
このスタンパー10をスタンパーホルダー11で固定する。
また、この可動金型4内にも、キャビティ5から適当な
距離をおいて複数の環状熱媒体流路15を形成しておく。A cylindrical center member 8 is embedded in the center of the other movable mold 4, and a cut pin 9 is arranged along the center line of the center member 8. On the inner mirror surface of the movable mold 4, there is provided a stamper 10 having pits, grooves, etc., which will be record carriers,
This stamper 10 is fixed with a stamper holder 11.
In addition, a plurality of annular heat medium flow paths 15 are formed in the movable mold 4 at appropriate distances from the cavity 5.
固定金型2と可動金型4とが突き合わされた際、これら
のスプルーブッシュ6とセンター部材8とによって形成
された空隙が、スプルー7からキャビティ5に溶融樹脂
を導入するゲート部12となる。When the fixed mold 2 and the movable mold 4 are butted against each other, the gap formed by the sprue bush 6 and the center member 8 becomes a gate portion 12 for introducing the molten resin from the sprue 7 into the cavity 5.
そして、スプルー7近傍であってゲート部12から離れた
位置のスプルーブッシュ6内にスプルー7の外周を囲む
ように冷却用の第1の温度制御手段である第1の環状熱
媒体流路13を形成すると共に、ゲート部12近傍のスプル
ーブッシュ6内に保温用の第2の温度制御手段である第
2の環状熱媒体流路14を形成する。また、センター部材
8内にも、カットピン9近傍であってゲート部12から離
れた位置に冷却用の第3の環状熱媒体流路13Aを形成す
ると共に、ゲート部12近傍に保温用の第4の環状熱媒体
流路14Aを形成する。Then, a first annular heat medium passage 13 which is a first temperature control means for cooling is provided in the sprue bush 6 at a position near the sprue 7 and away from the gate portion 12 so as to surround the outer periphery of the sprue 7. At the same time as the formation, the second annular heat medium flow passage 14 which is the second temperature control means for keeping heat is formed in the sprue bush 6 near the gate portion 12. In addition, a third annular heat medium flow passage 13A for cooling is formed in the center member 8 in the vicinity of the cut pin 9 and away from the gate portion 12, and a heat insulating first annular heat medium passage 13A is formed in the vicinity of the gate portion 12. The four annular heat medium flow paths 14A are formed.
次に、上記射出成形用金型を用いた光ディスク基板の成
形方法を説明する。Next, a method of molding an optical disk substrate using the injection molding die will be described.
第1図に示すように、固定金型2と可動金型4とを突き
合わせ、固定金型2と可動金型4の熱媒体流路15に、12
0℃の加圧水を40/minの流量で流しておく。また、ス
プルーブッシュ6とセンター部材8の第2、第4の熱媒
体流路14,14Aには、80℃の水を40/minの流量で流して
おく。As shown in FIG. 1, the fixed mold 2 and the movable mold 4 are abutted against each other, and the heat medium flow path 15 of the fixed mold 2 and the movable mold 4 is
Flow pressurized water at 0 ℃ at a flow rate of 40 / min. Water of 80 ° C. is flown at a flow rate of 40 / min through the second and fourth heat medium flow passages 14 and 14A of the sprue bush 6 and the center member 8.
そして、溶融した330℃のポリカーボネート樹脂(Mv:14
800)を射出シリンダー17から300kg/cm2の圧力でスプル
ー7内に射出し、ゲート部12を介してこの溶融樹脂をキ
ャビティ5内に導入する。このキャビティ5内に射出さ
れた溶融樹脂は、固定金型2と可動金型4の熱媒体流路
15内に流れる加圧水によって12.5秒で冷却固化させる。Then, the melted polycarbonate resin of 330 ° C (Mv: 14
800) is injected from the injection cylinder 17 into the sprue 7 at a pressure of 300 kg / cm 2 , and this molten resin is introduced into the cavity 5 through the gate portion 12. The molten resin injected into the cavity 5 is a heat medium flow path of the fixed mold 2 and the movable mold 4.
It is cooled and solidified in 12.5 seconds by pressurized water flowing in 15.
一方、スプルーブッシュ6とセンター部材8の第1、第
3の熱媒体流路13,13Aに35℃の水を40/minの流量で常
時流すことにより、スプルー7内の溶融樹脂を冷却固化
させる。On the other hand, the molten resin in the sprue 7 is cooled and solidified by constantly flowing water at 35 ° C. at a flow rate of 40 / min through the first and third heat medium flow passages 13 and 13A of the sprue bush 6 and the center member 8. .
上記成形方法により得られた光ディスク基板について、
熱処理前と80℃、2時間の熱処理後の複屈折を測定した
結果を第2図に示す。同図で、曲線Aが熱処理前の複屈
折、曲線Bが熱処理後の複屈折である。Regarding the optical disk substrate obtained by the above molding method,
The results of measuring the birefringence before heat treatment and after heat treatment at 80 ° C. for 2 hours are shown in FIG. In the figure, curve A is the birefringence before heat treatment, and curve B is the birefringence after heat treatment.
また、比較例として、スプールブッシュ6とセンター部
材8に第2、第4の熱媒体流路14,14Aを形成していない
射出成形用金型を用いて上記実施例と同様にして光ディ
スク基板を射出成形した。この光ディスク基板について
も同様に熱処理前と熱処理後の複屈折を測定した結果を
第3図に示す。同図で、曲線Cが熱処理前の複屈折、曲
線Dが熱処理後の複屈折である。Further, as a comparative example, an optical disk substrate was prepared in the same manner as in the above-mentioned embodiment by using an injection molding die in which the second and fourth heat medium passages 14 and 14A were not formed in the spool bush 6 and the center member 8. Injection molded. Similarly, the results of measuring the birefringence of this optical disk substrate before and after the heat treatment are shown in FIG. In the figure, curve C is the birefringence before heat treatment, and curve D is the birefringence after heat treatment.
第2図の曲線Aより、実施例に係る熱処理前の光ディス
ク基板の場合、第2の熱媒体流路14によってキャビティ
5内に射出された樹脂の温度分布が均一化したため、複
屈折のばらつきは、±10nm(ダブルパス)以内に抑えら
れ、基板の内周部から外周部まで略均一であった。From the curve A in FIG. 2, in the case of the optical disc substrate before the heat treatment according to the example, the temperature distribution of the resin injected into the cavity 5 by the second heat medium flow passage 14 was made uniform, so that the dispersion of the birefringence was small. , Was kept within ± 10 nm (double pass), and was substantially uniform from the inner peripheral portion to the outer peripheral portion of the substrate.
また、曲線A,Bより、熱処理前と80℃、2時間の熱処理
後の複屈折の変化は、キャビティ5内の樹脂の温度分布
が均一化して、熱応力が低下したため、内周部で20nm
(ダブルパス)以下程度の変化量しかなかった。Also, from curves A and B, the change in birefringence before heat treatment and after heat treatment at 80 ° C. for 2 hours shows that the temperature distribution of the resin in the cavity 5 becomes uniform and the thermal stress is reduced.
(Double pass) The amount of change was less than the following.
更に、複屈折の経時変化は、室温で1週間経過した後で
も、殆ど変化は見られなかった。Furthermore, the change in birefringence with time hardly changed even after 1 week at room temperature.
これに対して、第3図の曲線Cより、比較例に係る熱処
理前の光ディスク基板の場合、内周部の複屈折が+32nm
(ダブルパス)、外周部の複屈折が−20nm(ダブルパ
ス)と半径方向のばらつきが著しく大きく、光学特性が
不良であることがわかる。On the other hand, according to the curve C in FIG. 3, in the case of the optical disc substrate before the heat treatment according to the comparative example, the birefringence of the inner peripheral portion is +32 nm.
(Double pass), the birefringence of the outer peripheral part is -20 nm (double pass), the radial variation is extremely large, and it can be seen that the optical characteristics are poor.
また、曲線C,Dより、熱処理前と80℃、2時間の熱処理
後の複屈折の変化は、キャビティ内の樹脂の温度分布が
不均一で、熱応力が高いため、内周部の変化量が40〜50
nm(ダブルパス)と非常に大きかった。Also, from curves C and D, the change in birefringence before heat treatment and after heat treatment at 80 ° C for 2 hours shows that the temperature distribution of the resin in the cavity is not uniform and the thermal stress is high. Is 40-50
It was very large with nm (double pass).
更に、複屈折の経時変化は、室温で24時間経過後におい
て、内周部で5〜10nm(ダブルパス)もの変化量が見ら
れた。Further, with respect to the change with time of the birefringence, a change amount of 5 to 10 nm (double pass) was observed at the inner peripheral portion after 24 hours at room temperature.
次に、これらの実施例と比較例に係る光ディスク基板の
機械的特性を測定した。この機械的特性の測定は、反
り、面振れ、スキュー角及び面振れ加速度について行っ
たものである。その測定結果を下記の表1に示す。Next, the mechanical characteristics of the optical disk substrates according to these examples and comparative examples were measured. The measurement of the mechanical characteristics is performed for warpage, surface wobbling, skew angle, and surface wobbling acceleration. The measurement results are shown in Table 1 below.
この測定結果より、実施例の光ディスク基板は、比較例
の光ディスク基板と比べて、反り、面振れ、スキュー角
及び面振れ加速度のいずれの値も小さく、良好な機械的
特性を有していることがわかる。 From the measurement results, the optical disk substrate of the example has smaller mechanical warp, surface wobbling, skew angle, and surface wobbling acceleration than the optical disk substrate of the comparative example, and has good mechanical characteristics. I understand.
また、本実施例によれば、スプルーブッシュ6内のスプ
ルー7近傍に形成した第1の熱媒体流路13によって、ス
プルー7内の溶融樹脂が速やかに冷却固化したため、成
形時間が短縮化するという効果も得られた。また、第1
の熱媒体流路には、常時一定の温度の熱媒体を流してい
るので、射出樹脂の温度は一定しており、成形されたデ
ィスク基板の性能もばらつきがなく、安定したものであ
った。Further, according to the present embodiment, the molten resin in the sprue 7 is rapidly cooled and solidified by the first heat medium passage 13 formed in the sprue bush 6 in the vicinity of the sprue 7, so that the molding time is shortened. The effect was also obtained. Also, the first
Since the heat medium having a constant temperature is constantly flowing in the heat medium flow passage of No. 3, the temperature of the injection resin is constant, and the performance of the molded disk substrate is stable and stable.
更に、ゲート部12での昇圧が小さかったため、シルバー
ストリークの発生は見られなかった。Furthermore, since the pressure rise at the gate portion 12 was small, no silver streak was observed.
なお、上記実施例では、センター部材8内にも、冷却用
の第3の熱媒体流路13Aを形成すると共に、保温用の第
4の熱媒体流路14Aを形成したが、これらは設けず、第
1の熱媒体流路13と第2の熱媒体流路14とを、スプルー
ブッシュ6内だけに形成するようにしてもよい。In the above embodiment, the third heat medium passage 13A for cooling and the fourth heat medium passage 14A for keeping heat are formed in the center member 8 as well, but these are not provided. The first heat medium flow passage 13 and the second heat medium flow passage 14 may be formed only in the sprue bush 6.
[発明の効果] 本発明に係る射出成形用金型によれば、光学特性と機械
的特性が良好なプラスチック成形品が得られ、且つ成形
サイクルを短縮することができる。そして、この金型を
用いたディスク基板の成形方法によれば、複屈折のばら
つきと経時変化が小さく、また反り、面振れ等に関する
機械的特性の良好なディスク基板が得られる。EFFECTS OF THE INVENTION According to the injection molding die of the present invention, a plastic molded product having excellent optical characteristics and mechanical characteristics can be obtained, and the molding cycle can be shortened. Then, according to the method of molding a disk substrate using this mold, it is possible to obtain a disk substrate having a small variation in birefringence and a change with time, and good mechanical characteristics such as warpage and surface wobbling.
第1図は本発明の実施例に係る射出成形用金型の断面
図、第2図は実施例に係る光ディスク基板の熱処理前と
熱処理後の複屈折を測定したグラフ、第3図は比較例に
係る光ディスク基板の熱処理前と熱処理後の複屈折を測
定したグラフである。 2……固定金型、4……可動金型、5……キャビティ、
6……スプルーブッシュ、7……スプルー、12……ゲー
ト部、13……第1の熱媒体流路、14……第2の熱媒体流
路。1 is a cross-sectional view of an injection molding die according to an embodiment of the present invention, FIG. 2 is a graph showing birefringence of an optical disk substrate according to the embodiment before and after heat treatment, and FIG. 3 is a comparative example. 6 is a graph in which the birefringence of the optical disc substrate according to FIG. 2 ... Fixed mold, 4 ... Movable mold, 5 ... Cavity,
6 ... Sprue bush, 7 ... Sprue, 12 ... Gate part, 13 ... First heat medium flow passage, 14 ... Second heat medium flow passage.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭57−64531(JP,A) 特開 昭57−203530(JP,A) 特開 昭61−3716(JP,A) 実開 昭61−8115(JP,U) ─────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-57-64531 (JP, A) JP-A-57-203530 (JP, A) JP-A-61-3716 (JP, A) Actual development Sho-61- 8115 (JP, U)
Claims (2)
成されるキャビティと、樹脂が溶融射出されるスプルー
と、このスプルーから前記キャビティに前記樹脂を導入
するゲート部を有する射出成形用金型において、 前記スプルー近傍に設けられた冷却用の第1の温度制御
手段と、前記ゲート部近傍に設けられた保温用の第2の
温度制御手段とを備えたことを特徴とする射出成形用金
型。1. A mold for injection molding, comprising a cavity formed on an abutting surface of a fixed mold and a movable mold, a sprue for melting and injecting a resin, and a gate portion for introducing the resin into the cavity from the sprue. The injection molding is characterized in that the mold comprises a first temperature control means for cooling provided near the sprue and a second temperature control means for heat retention provided near the gate portion. Mold for.
し、固定金型と可動金型との突き合わせ面に形成される
ディスク状キャビティに、スプルーからゲート部を介し
て溶融樹脂を射出するディスク基板の成形方法におい
て、 前記スプルー近傍に設けた第1の温度制御手段による前
記スプルーを冷却する温度制御と、前記ゲート部近傍に
設けた第2の温度制御手段による前記ゲート部を保温す
る温度制御とをそれぞれ独立に行うことを特徴とするデ
ィスク基板の成形方法。2. Using the injection molding die according to claim 1, molten resin is spun from a sprue through a gate into a disk-shaped cavity formed on the abutting surface of a fixed die and a movable die. In a method of molding a disk substrate for injection, temperature control for cooling the sprue by a first temperature control means provided in the vicinity of the sprue and heat retention of the gate portion by a second temperature control means provided in the vicinity of the gate portion. A method of molding a disk substrate, wherein the temperature control is performed independently of each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63317267A JPH0673887B2 (en) | 1988-12-14 | 1988-12-14 | Injection molding mold and method of molding disk substrate using the mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63317267A JPH0673887B2 (en) | 1988-12-14 | 1988-12-14 | Injection molding mold and method of molding disk substrate using the mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02160525A JPH02160525A (en) | 1990-06-20 |
JPH0673887B2 true JPH0673887B2 (en) | 1994-09-21 |
Family
ID=18086331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63317267A Expired - Fee Related JPH0673887B2 (en) | 1988-12-14 | 1988-12-14 | Injection molding mold and method of molding disk substrate using the mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0673887B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100783651B1 (en) * | 2005-02-25 | 2007-12-07 | 스미도모쥬기가이고교 가부시키가이샤 | Mold apparatus, molded product, method of molding the same, molding machine and bush |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10286843A (en) * | 1997-04-11 | 1998-10-27 | Meiki Co Ltd | Stringing prevention structure for injection molding equipment |
JP4684423B2 (en) * | 2001-01-17 | 2011-05-18 | 三井化学株式会社 | Synthetic resin injection mold and injection molding method using the same |
WO2005030468A1 (en) * | 2003-09-30 | 2005-04-07 | Zeon Corporation | Thick flat-plate molded product and method of producing the same |
US20050220928A1 (en) * | 2004-03-31 | 2005-10-06 | Yuichi Inada | Mold apparatus, molded product, method of molding the same, and molding machine |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5764531A (en) * | 1980-10-08 | 1982-04-19 | Toshiba Mach Co Ltd | Metal mold for injection molding thermosetting resin and injection molding process using the same |
US4394117A (en) * | 1981-06-10 | 1983-07-19 | Discovision Associates | Hot sprue sleeve valve assembly for an injection molding machine |
-
1988
- 1988-12-14 JP JP63317267A patent/JPH0673887B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100783651B1 (en) * | 2005-02-25 | 2007-12-07 | 스미도모쥬기가이고교 가부시키가이샤 | Mold apparatus, molded product, method of molding the same, molding machine and bush |
Also Published As
Publication number | Publication date |
---|---|
JPH02160525A (en) | 1990-06-20 |
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